公开(公告)号：US20130153269A1

公开(公告)日：2013-06-20

申请号：US13665550

申请日：2012-10-31

Applicant: Michimasa TAKAHASHI ,  Teruyuki ISHIHARA

Inventor： Michimasa TAKAHASHI ,  Teruyuki ISHIHARA

IPC: H05K1/11 ,  H05K1/03 ,  B32B37/12 ,  H05K1/00

CPC classification number: H05K1/0298 ,  H05K1/0278 ,  H05K1/028 ,  H05K1/111 ,  H05K1/115 ,  H05K1/141 ,  H05K1/144 ,  H05K1/182 ,  H05K3/368 ,  H05K3/46 ,  H05K3/4691 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T156/10

Abstract: A wiring board includes a first multilayer wiring board having first conductive layers and having a surface, a second multilayer wiring board having second conductive layers and positioned such that the second multilayer wiring board has a surface facing the surface of the first multilayer wiring board, and an adhesive layer including an adhesive sheet and interposed between the first multilayer wiring board and the second multilayer wiring board such that the adhesive layer is adhering the first multilayer wiring board and the second multilayer wiring board. The first multilayer wiring board has a first pad on the surface of the first multilayer wiring board, the second multilayer wiring board has a second pad on the surface of the second multilayer wiring board, and the first pad and the second pad are positioned such that the first pad and the second pad face each other across the adhesive layer.

Abstract translation: 布线基板包括具有第一导电层并具有表面的第一多层布线板，具有第二导电层的第二多层布线板并且定位成使得第二多层布线板具有面向第一多层布线板的表面的表面，以及 粘合剂层，其包括粘合剂片，并且介于所述第一多层布线板和所述第二多层布线板之间，使得所述粘合剂层粘合所述第一多层布线板和所述第二多层布线板。 第一多层布线板在第一多层布线板的表面上具有第一焊盘，第二多层布线板在第二多层布线板的表面上具有第二焊盘，第一焊盘和第二焊盘定位成使得 第一垫和第二垫彼此面对粘合剂层。

公开(公告)号：US20130014982A1

公开(公告)日：2013-01-17

申请号：US13483587

申请日：2012-05-30

Applicant: Hiroshi SEGAWA ,  Nobuyuki NAGANUMA ,  Michimasa TAKAHASHI ,  Teruyuki ISHIHARA

Inventor： Hiroshi SEGAWA ,  Nobuyuki NAGANUMA ,  Michimasa TAKAHASHI ,  Teruyuki ISHIHARA

IPC: H05K1/14 ,  H05K3/36

CPC classification number: H05K1/141 ,  H05K1/142 ,  H05K3/305 ,  H05K3/3452 ,  H05K3/368 ,  H05K2201/09972 ,  H05K2203/1189 ,  Y10T29/49126

Abstract: A wiring board has a first wiring board having a first solder-resist layer, a second wiring board connected to the first wiring board and positioned in a first opening portion formed in the first solder-resist layer of the first wiring board, and a third wiring board connected to the first wiring board and positioned in a second opening portion formed in the first solder-resist layer of the first wiring board such that the second wiring board and the third wiring board are on the same side of the first wiring board. The first opening portion of the first wiring board and the second opening portion of the first wiring board form either a common opening portion accommodating the second and third wiring boards in the first solder-resist layer or separate opening portions separately accommodating the second wiring board and the third wiring board in the first solder-resist layer.

Abstract translation: 布线基板具有第一布线基板，其具有第一阻焊层，第二布线基板与第一布线基板连接，位于形成于第一布线基板的第一阻焊层的第一开口部， 连接到第一布线板并且位于形成在第一布线板的第一阻焊层中的第二开口部分中，使得第二布线板和第三布线板位于第一布线板的同一侧。 第一布线板的第一开口部分和第一布线板的第二开口部分形成在第一阻焊层中容纳第二和第三布线板的公共开口部分或分离容纳第二布线板的单独开口部分， 第一阻焊层中的第三布线板。

公开(公告)号：US20120012368A1

公开(公告)日：2012-01-19

申请号：US13242043

申请日：2011-09-23

Applicant: Michimasa TAKAHASHI

Inventor： Michimasa TAKAHASHI

IPC: H05K1/02 ,  H05K3/36

CPC classification number: H05K3/4691 ,  H05K1/0218 ,  H05K1/142 ,  H05K3/36 ,  H05K3/4602 ,  H05K2201/0187 ,  H05K2201/0715 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/096

Abstract: A wiring board including a main substrate including a base material and having an opening portion, and a flex-rigid printed wiring board connected to the main substrate in the opening portion of the main substrate and including a rigid substrate and a flexible substrate, the rigid substrate including a non-flexible base material, the flexible substrate including a flexible base material.

Abstract translation: 一种布线基板，包括：具有基材的主基板和具有开口部分;以及柔性刚性印刷布线板，其与主基板连接在主基板的开口部分中，并且包括刚性基板和柔性基板，刚性 基材包括非柔性基材，柔性基材包括柔性基材。

公开(公告)号：US20110296679A1

公开(公告)日：2011-12-08

申请号：US13215653

申请日：2011-08-23

Applicant: Michimasa TAKAHASHI ,  Masakazu Aoyama

Inventor： Michimasa TAKAHASHI ,  Masakazu Aoyama

IPC: H05K3/36

CPC classification number: H05K3/4691 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05568 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2924/00014 ,  H05K1/0366 ,  H05K1/148 ,  H05K3/0052 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0187 ,  H05K2201/0191 ,  H05K2201/0209 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09845 ,  H05K2203/1536 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/05599 ,  H01L2224/05099

Abstract: A method of manufacturing a wiring board including forming a first wiring board, the forming of the first board including forming a substrate, forming a first insulation layer on a surface of the substrate and a second insulating layer on the opposite surface of the substrate, forming a via in one of the layers, and cutting the first layer in a first area and cutting the second layer in a second area offset from the first area to form a first substrate laminated to a second substrate with the substrate interposed therebetween, the second substrate having a smaller mounting area than that of the first substrate such that the first substrate extends beyond edge of the second substrate, connecting a pliable member to the substrate, and connecting the member to a second wiring board to connect the first and second boards. One or more insulation layers are a non-pliable layer.

Abstract translation: 一种制造布线板的方法，包括形成第一布线板，第一板的形成包括形成基板，在基板的表面上形成第一绝缘层，在基板的相对表面上形成第二绝缘层，形成 在一个层中的通孔，并且在第一区域中切割第一层，并且在与第一区域偏移的第二区域中切割第二层，以形成层压到第二基板的第一基板，其中介于其间的基板，第二基板 具有比第一基板更小的安装面积，使得第一基板延伸超过第二基板的边缘，将柔性构件连接到基板，并且将构件连接到第二布线板以连接第一和第二板。 一个或多个绝缘层是非柔性层。

公开(公告)号：US20100018634A1

公开(公告)日：2010-01-28

申请号：US12574309

申请日：2009-10-06

Applicant: Michimasa TAKAHASHI ,  Masakazu Aoyama

Inventor： Michimasa TAKAHASHI ,  Masakazu Aoyama

IPC: H05K3/46

CPC classification number: H05K3/4691 ,  H05K1/0218 ,  H05K3/0035 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4652 ,  H05K3/4664 ,  H05K2201/0187 ,  H05K2201/0715 ,  H05K2201/09127 ,  H05K2201/09509 ,  H05K2201/096 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: A method of manufacturing a flex-rigid wiring board including disposing a flexible board comprising a flexible substrate and a conductor pattern formed over the flexible substrate and a non-flexible substrate adjacent to each other, covering a boundary between the flexible board and the non-flexible substrate with an insulating layer comprising an inorganic material, providing a conductor pattern on the insulating layer, forming a via hole opening which passes through the insulating layer and reaches the conductor pattern of the flexible board, and plating the via hole opening to form a via connecting the conductor pattern of the flexible board and the conductor pattern on the insulating layer.

Abstract translation: 一种挠性刚性布线板的制造方法，其特征在于，在柔性基板和柔性基板上形成的柔性基板和导体图案之间设置柔性基板，以及相互邻接的非柔性基板， 具有包含无机材料的绝缘层的柔性基板，在绝缘层上提供导体图案，形成穿过绝缘层并到达柔性板的导体图案的通孔开口，以及电镀通孔开口形成 通过连接柔性板的导体图案和绝缘层上的导体图案。

公开(公告)号：US20100000087A1

公开(公告)日：2010-01-07

申请号：US12555305

申请日：2009-09-08

Applicant: Yasuhiro WATANABE ,  Michimasa TAKAHASHI ,  Masakazu AOYAMA ,  Takenobu NAKAMURA ,  Hiroyuki YANAGISAWA

Inventor： Yasuhiro WATANABE ,  Michimasa TAKAHASHI ,  Masakazu AOYAMA ,  Takenobu NAKAMURA ,  Hiroyuki YANAGISAWA

IPC: H05K3/02

CPC classification number: H05K1/113 ,  H01L23/49816 ,  H01L23/49822 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/114 ,  H05K3/243 ,  H05K3/28 ,  H05K3/282 ,  H05K3/4614 ,  H05K2201/0391 ,  H05K2201/10674 ,  H05K2203/0574 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49204 ,  H01L2224/0401

Abstract: This invention provides a multilayer printed wiring board in which electric connectivity and functionality are obtained by improving reliability and particularly, reliability to the drop test can be improved. No corrosion resistant layer is formed on a solder pad 60B on which a component is to be mounted so as to obtain flexibility. Thus, if an impact is received from outside when a related product is dropped, the impact can be buffered so as to protect any mounted component from being removed. On the other hand, land 60A in which the corrosion resistant layer is formed is unlikely to occur contact failure even if a carbon pillar constituting an operation key makes repeated contacts.

Abstract translation: 本发明提供了一种通过提高可靠性而获得电连接性和功能性的多层印刷线路板，特别是可提高落下试验的可靠性。 在要安装部件的焊料垫60B上没有形成耐腐蚀层，以获得柔性。 因此，如果在相关产品掉线时从外部接收到冲击，则可以缓冲影响，以保护所安装的组件不被移除。 另一方面，即使构成操作键的碳柱重复接触，也可能不形成耐腐蚀层的焊盘60A不会发生接触故障。

公开(公告)号：US20120008290A1

公开(公告)日：2012-01-12

申请号：US13238429

申请日：2011-09-21

Applicant: Michimasa TAKAHASHI ,  Masakazu Aoyama

Inventor： Michimasa TAKAHASHI ,  Masakazu Aoyama

IPC: H05K1/00

CPC classification number: H05K3/4691 ,  H05K1/0218 ,  H05K3/0035 ,  H05K3/4652 ,  H05K3/4664 ,  H05K2201/0187 ,  H05K2201/0715 ,  H05K2201/09127 ,  H05K2201/09509 ,  Y10T29/49124 ,  Y10T29/49165

Abstract: A flex-rigid wiring board includes a flexible board including a flexible substrate and a conductor pattern formed over the flexible substrate, a non-flexible substrate disposed adjacent to the flexible board, an insulating layer covering the flexible board and the non-flexible substrate and exposing one or more portions of the flexible board, a conductor pattern formed on the insulating layer, and a plating layer connecting the conductor pattern of the flexible board and the conductor pattern on the insulating layer.

Abstract translation: 弹性刚性布线板包括柔性基板，该柔性基板包括形成在柔性基板上的柔性基板和导体图案，邻近柔性基板设置的非柔性基板，覆盖柔性基板和非柔性基板的绝缘层，以及 暴露柔性板的一个或多个部分，形成在绝缘层上的导体图案，以及将柔性板的导体图案和导体图案连接在绝缘层上的镀层。

公开(公告)号：US20110220407A1

公开(公告)日：2011-09-15

申请号：US13112016

申请日：2011-05-20

Applicant: Michimasa TAKAHASHI ,  Masakazu Aoyama

Inventor： Michimasa TAKAHASHI ,  Masakazu Aoyama

IPC: H05K9/00 ,  H05K1/00

CPC classification number: H05K3/4691 ,  H05K1/0218 ,  H05K3/0035 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4652 ,  H05K3/4664 ,  H05K2201/0187 ,  H05K2201/0715 ,  H05K2201/09127 ,  H05K2201/09509 ,  H05K2201/096 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: A flex-rigid wiring board includes a flexible board including a flexible substrate and a conductor pattern formed over the flexible substrate, a non-flexible substrate disposed adjacent to the flexible board, an insulating layer including an inorganic material and covering the flexible board and the non-flexible substrate, the insulating layer exposing at least one portion of the flexible board, a conductor pattern formed on the insulating layer, and a plating layer connecting the conductor pattern of the flexible board and the conductor pattern on the insulating layer.

Abstract translation: 弹性刚性布线板包括柔性基板，该柔性基板包括柔性基板和形成在柔性基板上的导体图案，邻近柔性基板设置的非柔性基板，包括无机材料并覆盖柔性基板的绝缘层和 非柔性基板，绝缘层暴露柔性板的至少一部分，形成在绝缘层上的导体图案，以及将柔性基板的导体图案与导体图案连接在绝缘层上的镀层。

公开(公告)号：US20090014207A1

公开(公告)日：2009-01-15

申请号：US12111256

申请日：2008-04-29

Applicant: Michimasa TAKAHASHI

Inventor： Michimasa TAKAHASHI

IPC: H05K1/11 ,  B32B38/04

CPC classification number: H05K3/4602 ,  H05K1/0366 ,  H05K3/4652 ,  H05K2201/09536 ,  H05K2201/0959 ,  Y10T29/4913 ,  Y10T29/49165 ,  Y10T156/1062

Abstract: A wiring board has a base substrate, a conductive pattern formed on the base substrate, an insulation layer formed on the conductive pattern and the base substrate and including a resin-impregnated inorganic cloth, a conductive pattern formed on the insulating layer, a via formed in the insulation layer and connecting the conductive pattern formed on the base substrate and the conductive pattern formed on the insulating layer, and a through-hole connected to the conductive pattern formed on the base substrate, penetrating through the base substrate and having a hole diameter in a range of 10 μm to 150 μm.

Abstract translation: 布线板具有基底基板，形成在基底基板上的导电图案，形成在导电图案和基底基板上的绝缘层，并且包括树脂浸渍的无机布，形成在绝缘层上的导电图案，形成的通孔 在所述绝缘层中并且连接形成在所述基底基板上的导电图案和形成在所述绝缘层上的导电图案，以及连接到形成在所述基底基板上的所述导电图案的通孔，穿过所述基底基板，并具有孔直径 在10个到150个妈妈的范围内。

公开(公告)号：US20120106108A1

公开(公告)日：2012-05-03

申请号：US13344913

申请日：2012-01-06

Applicant: Sotaro ITO ,  Michimasa TAKAHASHI ,  Yukinobu MIKADO

Inventor： Sotaro ITO ,  Michimasa TAKAHASHI ,  Yukinobu MIKADO

IPC: H05K1/18

CPC classification number: H01L24/83 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/32 ,  H01L25/105 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/8385 ,  H01L2224/92 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/351 ,  H05K1/185 ,  H05K3/0035 ,  H05K3/4652 ,  H05K2201/096 ,  H05K2201/10477 ,  H05K2201/10674 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49167 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2924/01049 ,  H01L2924/01083 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/13111 ,  H01L2224/13109

Abstract: A multilayered printed circuit board or a substrate for mounting a semiconductor device includes a semiconductor device, a first resin insulating layer accommodating the semiconductor device, a second resin insulating layer provided on the first resin insulating layer, a conductor circuit provided on the second resin insulating layer, and via holes for electrically connecting the semiconductor device to the conductor circuit, wherein the semiconductor device is accommodated in a recess provided in the first resin insulating layer, and a metal layer for placing the semiconductor device is provided on the bottom face of the recess. A multilayered printed circuit board in which the installed semiconductor device establishes electrical connection through the via holes is provided.

Abstract translation: 用于安装半导体器件的多层印刷电路板或基板包括半导体器件，容纳半导体器件的第一树脂绝缘层，设置在第一树脂绝缘层上的第二树脂绝缘层，设置在第二树脂绝缘层上的导体电路 层和用于将半导体器件电连接到导体电路的通孔，其中半导体器件容纳在设置在第一树脂绝缘层中的凹部中，并且用于放置半导体器件的金属层设置在 休息。 提供了一种多层印刷电路板，其中安装的半导体器件通过通孔建立电连接。