公开(公告)号：US20060005947A1

公开(公告)日：2006-01-12

申请号：US10887601

申请日：2004-07-09

申请人： Mehmet Arik ,  Stanton Weaver

发明人： Mehmet Arik ,  Stanton Weaver

IPC分类号： F28D15/00

CPC分类号： H01L33/648 ,  F21K9/00 ,  F21W2131/103 ,  H01L25/0753 ,  H01L2224/48091 ,  H01L2224/48464 ,  H05K1/0203 ,  H05K1/05 ,  H01L2924/00014

摘要： A light emitting apparatus (10, 110, 210, 310, 410) includes one or more light emitting chips (12, 112, 212, 312, 412) and a support (13, 14, 114, 214, 314, 414) on which the light emitting chips are disposed. The support includes a first side on which the light emitting chips are attached and a second side opposite the first side. A thermally superconducting heat transfer medium (22, 122, 222, 322, 422) is disposed in an interior volume of the support and thermally connects the first and second sides of the support. The thermally superconducting heat transfer medium has a thermal conductivity at least 1500 times greater than the thermal conductivity of copper.

摘要翻译： 发光装置（10,110,210,310,410）包括一个或多个发光芯片（12,112,212,312,412）和支撑件（13,14,144,214,314,414），所述支撑件 发光芯片设置在其上。 支撑件包括附接有发光芯片的第一侧和与第一侧相对的第二侧。 热超导传热介质（22,122,222,322,422）设置在支撑件的内部容积中并且热连接支撑件的第一和第二侧。 热超导传热介质具有比铜的热导率至少大1500倍的导热系数。

公开(公告)号：US20050264172A1

公开(公告)日：2005-12-01

申请号：US10854596

申请日：2004-05-26

申请人： Robert Wojnarowski ,  Stanton Weaver ,  Steven LeBoeuf

发明人： Robert Wojnarowski ,  Stanton Weaver ,  Steven LeBoeuf

IPC分类号： H01J1/62 ,  H01L33/08 ,  H01L33/20 ,  H01L33/24 ,  H01L33/00

CPC分类号： H01L33/20 ,  H01L33/08 ,  H01L33/24

摘要： The present invention is directed towards a source of ultraviolet energy, wherein the source is a UV-emitting LED. In an embodiment of the invention, the UV-LED is characterized by a base layer material including a substrate, a p-doped semiconductor material, a multiple quantum well, a n-doped semiconductor material, upon which base material a p-type metal resides and wherein the LED's are provided with a rounded mesa configuration. In a specific embodiment, the p-type metal is positioned upon a rounded mesa, such as a parabolic mesa, formed out of the base structure materials.

摘要翻译： 本发明涉及一种紫外线能量源，其中源是紫外线发射的LED。 在本发明的一个实施例中，UV-LED的特征在于包括衬底，p掺杂半导体材料，多量子阱，n掺杂半导体材料的基底材料，基底材料是p型金属 并且其中LED具有圆形台面构造。 在具体实施例中，p型金属位于由基底结构材料形成的圆形台面（例如抛物面台面）上。

公开(公告)号：US20050006754A1

公开(公告)日：2005-01-13

申请号：US10614497

申请日：2003-07-07

申请人： Mehmet Arik ,  Stanton Weaver ,  James Carnahan ,  Charles Becker ,  William Gerstler

发明人： Mehmet Arik ,  Stanton Weaver ,  James Carnahan ,  Charles Becker ,  William Gerstler

IPC分类号： F28F13/18 ,  H01L23/373 ,  H01L23/473 ,  H01L23/485 ,  H01L33/62 ,  H01L33/64 ,  H01L23/10

CPC分类号： F28F13/185 ,  B82Y10/00 ,  H01L23/373 ,  H01L23/473 ,  H01L24/10 ,  H01L24/13 ,  H01L24/81 ,  H01L33/62 ,  H01L33/648 ,  H01L2224/0401 ,  H01L2224/06102 ,  H01L2224/13 ,  H01L2224/1308 ,  H01L2224/13084 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2224/13166 ,  H01L2224/1703 ,  H01L2224/81193 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/81894 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/19042 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00

摘要： A semiconductor device die (10, 116) is disposed on a heat-sinking support structure (30, 100). Nanotube regions (52, 120) contain nanotubes (54, 126) are arranged on a surface of or in the heatsinking support structure (30, 100). The nanotube regions (52, 120) are arranged to contribute to heat transfer from the semiconductor device die (10, 116) to the heat-sinking support structure (30, 100). In one embodiment, the semiconductor device die (10) includes die electrodes (20, 22), and the support structure (30) includes contact pads (40, 42) defined by at least some of the nanotube regions (52). The contact pads (40, 42) electrically and mechanically contact the die electrodes (20, 22). In another embodiment, the heat-sinking support structure (100) includes microchannels (120) arranged laterally in the support structure (100). At least some of the nanotube regions are disposed inside the microchannels (100).

摘要翻译： 半导体器件管芯（10,116）设置在散热支撑结构（30,100）上。 纳米管区域（52,120）包含纳米管（54,126）布置在散热支撑结构（30,100）的表面上或散热支撑结构（30,100）中。 纳米管区域（52,120）被布置成有助于从半导体器件管芯（10,116）到散热支撑结构（30,100）的热传递。 在一个实施例中，半导体器件管芯（10）包括管芯电极（20,22），并且支撑结构（30）包括由至少一些纳米管区域（52）限定的接触焊盘（40,42）。 接触焊盘（40,42）与管芯电极（20,22）电接触和机械接触。 在另一个实施例中，散热支撑结构（100）包括在支撑结构（100）中侧向设置的微通道（120）。 至少一些纳米管区域设置在微通道（100）的内部。

公开(公告)号：US20080042163A1

公开(公告)日：2008-02-21

申请号：US11925396

申请日：2007-10-26

申请人： Stanton Weaver

发明人： Stanton Weaver

IPC分类号： H01L29/40 ,  H05K3/00

CPC分类号： F25B21/00 ,  F25B2321/003 ,  Y02B30/66 ,  Y10T29/49147

摘要： A thermal transfer device having a first substrate layer, a second substrate layer and first and second electrodes disposed between the first substrate layer and the second substrate layer. The thermal transfer device also includes a release layer disposed between the first electrode and the second electrode and an actuator disposed adjacent the first and second electrodes. The actuator is adapted to separate the first and second electrodes from the release layer to open a thermotunneling gap between the first and second electrodes, and wherein the actuator is adapted to actively control the thermotunneling gap.

摘要翻译： 一种热转印装置，具有第一基底层，第二基底层和设置在第一基底层和第二基底层之间的第一和第二电极。 热转印装置还包括设置在第一电极和第二电极之间的释放层和邻近第一和第二电极设置的致动器。 致动器适于将第一和第二电极与释放层分开以打开第一和第二电极之间的热电穿孔间隙，并且其中致动器适于主动地控制热电穿孔间隙。

公开(公告)号：US20070114557A1

公开(公告)日：2007-05-24

申请号：US11654165

申请日：2007-01-16

申请人： Bryan Shelton ,  Sebastien Libon ,  Hari Venugopalan ,  Ivan Eliashevich ,  Stanton Weaver ,  Chen-Lun Chen ,  Thomas Soules ,  Steven LeBoeuf ,  Stephen Arthur

发明人： Bryan Shelton ,  Sebastien Libon ,  Hari Venugopalan ,  Ivan Eliashevich ,  Stanton Weaver ,  Chen-Lun Chen ,  Thomas Soules ,  Steven LeBoeuf ,  Stephen Arthur

IPC分类号： H01L33/00

CPC分类号： H01L33/62 ,  H01L24/81 ,  H01L33/38 ,  H01L2224/0345 ,  H01L2224/03462 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05005 ,  H01L2224/05023 ,  H01L2224/05027 ,  H01L2224/0508 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05564 ,  H01L2224/05568 ,  H01L2224/05611 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/1357 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/3003 ,  H01L2224/73103 ,  H01L2224/73203 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/83205 ,  H01L2224/8321 ,  H01L2224/8323 ,  H01L2224/83815 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2224/05552 ,  H01L2924/00 ,  H01L2924/00012

摘要： A light emitting diode (10) has a backside and a front-side with at least one n-type electrode (14) and at least one p-type electrode (12) disposed thereon defining a minimum electrodes separation (delectrodes). A bonding pad layer (50) includes at least one n-type bonding pad (64) and at least one p-type bonding pad (62) defining a minimum bonding pads separation (dpads) that is larger than the minimum electrodes separation (delectrodes). At least one fanning layer (30) interposed between the front-side of the light emitting diode (10) and the bonding pad layer (50) includes a plurality of electrically conductive paths passing through vias (34, 54) of a dielectric layer (32, 52) to provide electrical communication between the at least one n-type electrode (14) and the at least one n-type bonding pad (64) and between the at least one p-type electrode (12) and the at least one p-type bonding pad (62).

公开(公告)号：US20070097366A1

公开(公告)日：2007-05-03

申请号：US11262210

申请日：2005-10-31

申请人： Steven LeBoeuf ,  Alexei Vertiatchikh ,  Stanton Weaver ,  Radislav Potyrailo ,  Xian-An Cao

发明人： Steven LeBoeuf ,  Alexei Vertiatchikh ,  Stanton Weaver ,  Radislav Potyrailo ,  Xian-An Cao

IPC分类号： G01N21/00

CPC分类号： G01N21/6486 ,  G01N21/15 ,  G01N21/532 ,  G01N21/645

摘要： Embodiments of the invention include a particle detection system that includes a light emitting source, a non-collimating reflector, a collimating reflector, and a detector. Light from the light emitting source is directed by the non-collimating reflector to an area through which a particle stream may be transmitted. Fluorescent light from the light striking particles is redirected to the collimating reflector and then on to the detector. Other embodiments include a single pump used to pull a pair of fluid flows through the detection system. Other embodiments include a plurality of light emitting sources whose light is directed to a particle stream by a single reflector. Other embodiments include a method for detecting particles.

摘要翻译： 本发明的实施例包括一种粒子检测系统，其包括发光源，非准直反射器，准直反射器和检测器。 来自发光源的光由非准直反射器引导到可以传播颗粒物流的区域。 来自光撞击颗粒的荧光被重定向到准直反射器，然后被引导到检测器上。 其他实施例包括用于拉动一对流体流过检测系统的单个泵。 其他实施例包括多个发光源，其光通过单个反射器被引导到颗粒流。 其他实施方案包括用于检测颗粒的方法。

公开(公告)号：US20060068611A1

公开(公告)日：2006-03-30

申请号：US10955639

申请日：2004-09-30

申请人： Stanton Weaver ,  James Bray ,  Ahmed Elasser ,  Seth Taylor

发明人： Stanton Weaver ,  James Bray ,  Ahmed Elasser ,  Seth Taylor

IPC分类号： H05K1/00 ,  C23C14/00 ,  B32B37/00 ,  H01S4/00

CPC分类号： H01J45/00 ,  B32B2310/024 ,  H01L35/00 ,  Y10T29/49002

摘要： A method of manufacturing a heat transfer device including providing first and second thermally conductive substrates that are substantially atomically flat, providing a patterned electrical barrier on the first or second thermally conductive substrates and disposing a low work function material on the first or second thermally conductive substrates in an area oriented between the patterned electrical barrier in a configuration in which the first and second thermally conductive substrates are positioned opposite from one another. The method also includes bonding the first and second thermally conductive substrates in the configuration and extracting a plurality of units having opposite sections of the first and second thermally conductive substrates, each unit having a portion of the patterned electrical barrier disposed about the low work function material.

摘要翻译： 一种制造传热装置的方法，包括提供基本上原子上平坦的第一和第二导热基板，在第一或第二导热基板上提供图案化的电阻挡层，并将低功函数材料设置在第一或第二导热基板上 在其中第一和第二导热基板彼此相对定位的构造中的图案化电阻挡之间的区域中。 该方法还包括将第一导热基板和第二导热基板结合在一起并且提取具有第一和第二导热基板的相对部分的多个单元，每个单元具有围绕低功函数材料设置的图案化电阻挡部分 。

公开(公告)号：US20050258438A1

公开(公告)日：2005-11-24

申请号：US10851273

申请日：2004-05-21

申请人： Mehmet Arik ,  Stanton Weaver ,  Charles Becker

发明人： Mehmet Arik ,  Stanton Weaver ,  Charles Becker

IPC分类号： F21K99/00 ,  H01L21/00 ,  H01L25/075 ,  H01L33/64 ,  H01L33/00

CPC分类号： F21V29/51 ,  F21K9/00 ,  H01L25/0753 ,  H01L33/648 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A light emitting apparatus (10, 110, 210, 310, 410) includes one or more light emitting diode chips (12, 112, 212, 312, 412) disposed on a chip support wall (16, 116, 216) including printed circuitry (34, 134, 234, 360, 362, 460, 462) connecting with the light emitting diode chips. A heat pipe (24, 124, 224, 324, 424) has a sealed volume (22, 122, 222, 322, 422) defined by walls including the chip support wall and at least one additional wall (18, 20, 118, 120, 218). The heat pipe further includes a heat transfer fluid (26, 226, 326, 426) disposed in the sealed volume.

摘要翻译： 发光设备（10,110,210,310,410）包括设置在芯片支撑壁（16,116,216）上的一个或多个发光二极管芯片（12,112,212,312,412），其包括印刷电路 （34,134,234,360,362,460,462），与发光二极管芯片连接。 热管（24,124,224,324,424）具有由包括芯片支撑壁和至少一个附加壁（18,20,28）的壁限定的密封体积（22,122,222,322,422） 120,218）。 热管还包括设置在密封体积中的传热流体（26,226,326,426）。

公开(公告)号：US20050239227A1

公开(公告)日：2005-10-27

申请号：US10831862

申请日：2004-04-26

申请人： Srinath Aanegola ,  James Petroski ,  Emil Radkov ,  Stanton Weaver

发明人： Srinath Aanegola ,  James Petroski ,  Emil Radkov ,  Stanton Weaver

IPC分类号： H01L21/00 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L25/075 ,  H01L27/15 ,  H01L29/267 ,  H01L31/12 ,  H01L33/48 ,  H01L33/52 ,  H01L33/58 ,  H01L33/00

CPC分类号： H01L33/52 ,  H01L25/0753 ,  H01L33/507 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2924/00

摘要： A light emitting package (8, 8′, 8″, 208, 408) includes a printed circuit board (10, 10′, 10″, 210, 410) supporting at least one light emitting die (12, 12″, 14, 16, 212, 412). A light transmissive cover (60, 60′, 60″, 260, 460) is disposed over the at least one light emitting die. The cover has an open end defining a cover perimeter (62, 62′, 62″, 262, 462) connected with the printed circuit board. An inside surface of the cover together with the printed circuit board defines an interior volume (70, 70″, 270, 470) containing the at least one light emitting die. An encapsulant (76, 76″, 276, 278, 476) is disposed in the interior volume and covers at least the light emitting die.

摘要翻译： 发光封装（8,8'，8“，208,408）包括支撑至少一个发光管芯（12,12”，“10”）的印刷电路板（10,10'，10“，210,410） ，14,16,212,412）。 透光罩（60,60'，60“，260,460）设置在所述至少一个发光管芯上。 盖具有限定与印刷电路板连接的盖周长（62,62'，62“，262,462）的开口端。 与印刷电路板一起，盖的内表面限定包含至少一个发光管芯的内部容积（70,70“，270,470）。 密封剂（76,76“，276,278,476）设置在内部体积中并且至少覆盖发光管芯。

公开(公告)号：US20050227388A1

公开(公告)日：2005-10-13

申请号：US10813338

申请日：2004-03-30

申请人： Anant Setlur ,  Joseph Shiang ,  Alok Srivastava ,  Holly Comanzo ,  Stanton Weaver ,  Charles Becker

发明人： Anant Setlur ,  Joseph Shiang ,  Alok Srivastava ,  Holly Comanzo ,  Stanton Weaver ,  Charles Becker

IPC分类号： C09K11/66 ,  C09K11/77 ,  H01J1/62 ,  H01J63/04 ,  H01L21/00 ,  H01L33/50

CPC分类号： C09K11/7734 ,  C09K11/665 ,  C09K11/7739 ,  C09K11/774 ,  C09K11/7774 ,  H01L33/504 ,  H01L2933/0041

摘要： A method of applying at least two phosphors to an LED, wherein a first phosphor material having a lower absorption, shorter luminescence decay time, and/or lower thermal quenching than a second phosphor material is positioned closer to the LED than the second phosphor. Such an arrangement provides a light emitting device with improved lumen output and color stability over a range of drive currents.

摘要翻译： 一种向LED施加至少两种荧光体的方法，其中具有比第二荧光体材料更低的吸收，更短的发光衰减时间和/或更低的热淬灭的第一荧光体材料被定位成比第二荧光体更靠近LED。 这种布置提供了在驱动电流范围内具有改进的流明输出和颜色稳定性的发光器件。