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21.发明授权公开(公告)号：US08345444B2
公开(公告)日：2013-01-01
申请号：US12675080
申请日：2008-10-21
IPC分类号： H05K1/11
CPC分类号： H05K3/305 , H01L21/563 , H01L23/295 , H01L25/0657 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2225/06517 , H01L2225/0652 , H01L2225/06572 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/12044 , H01L2924/15151 , H01L2924/18301 , H05K2201/09036 , H05K2201/09072 , H05K2201/10545 , H05K2201/10674 , H05K2201/10734 , H05K2201/10977 , Y02P70/613 , Y10T29/49139 , H01L2924/00
摘要： A structure with electronic component mounted therein includes a wiring board on which an electronic component is mounted at least on its first face, resin provided at least between the electronic component and the wiring board, and a plurality of holes formed in the wiring board at region corresponding to a mounting position of the electronic component. The holes are filled with the resin. This suppresses warpage of the structure with electronic component mounted therein, and also improves reliability by reducing a stress applied to a bonding section between the wiring board and the electronic component.
摘要翻译： 安装有电子部件的结构包括：至少在其第一面上安装有电子部件的布线板，至少设置在电子部件和布线基板之间的树脂，以及在布线基板上形成的多个孔 对应于电子部件的安装位置。 孔用树脂填充。 这抑制了安装有电子部件的结构的翘曲，并且还通过减小施加到布线板和电子部件之间的接合部的应力来提高可靠性。
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公开(公告)号：US08179686B2
公开(公告)日：2012-05-15
申请号：US12259661
申请日：2008-10-28
IPC分类号： H05K7/00
CPC分类号： H05K3/305 , H01L21/563 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/92125 , H01L2924/01079 , H01L2924/15151 , H05K2201/09063 , H05K2201/09781 , H05K2201/10674 , H05K2201/10689 , H05K2201/10719 , H05K2201/10977 , Y02P70/613 , Y10T29/4913 , H01L2924/00
摘要： Including a wiring board having an electronic component mounted at least on a first surface, a resin applied at least between the electronic component and the wiring board, and a through-hole provided in a region corresponding to the mounting position of the electronic component in the wiring board, a protrusion is formed on the wiring board so as to overlap at least with the electronic component, around a region corresponding to the mounting position of the electronic component.
摘要翻译： 包括具有至少安装在第一表面上的电子部件的布线板，至少施加在电子部件和布线板之间的树脂，以及设置在与电子部件的安装位置对应的区域中的通孔 在布线基板上，至少与电子部件重叠，在与电子部件的安装位置对应的区域上形成突起。
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公开(公告)号：US07935892B2
公开(公告)日：2011-05-03
申请号：US11909886
申请日：2006-04-14
IPC分类号： H05K1/16
CPC分类号： H01L24/29 , C09J9/02 , H01L21/6835 , H01L24/83 , H01L24/95 , H01L2221/68354 , H01L2224/2919 , H01L2224/29499 , H01L2224/83101 , H01L2224/83136 , H01L2224/83192 , H01L2224/83859 , H01L2924/01006 , H01L2924/01019 , H01L2924/01027 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01082 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/3011 , H01L2924/3025 , H05K3/284 , H05K3/323 , H05K2201/0108 , H05K2201/0281 , H05K2201/0373 , H05K2201/10636 , H05K2201/10674 , H05K2203/1476 , Y02P70/611 , Y10T29/49147 , Y10T428/24372 , Y10T428/254 , H01L2924/00
摘要： Circuit board having conductor wiring and connection terminal; anisotropic conductive resin layer provided on one surface of circuit board; and plurality of electronic components respectively provided with electrode terminals in positions facing the connection terminal are included. The anisotropic conductive resin layer includes at least one kind of conductive particles selected from coiled conductive particles, fiber fluff conductive particles and conductive particles provided with a plurality of conductive protrusions, and resin binder; electrically couples electrode terminals of plurality of electronic components to connection terminals to each other with conductive particles; mechanically fixes electronic components and circuit board to each other; and protects conductor wiring.
摘要翻译： 具有导线和连接端子的电路板; 设置在电路板的一个表面上的各向异性导电树脂层; 并且包括分别在面向连接端子的位置设置有电极端子的多个电子部件。 各向异性导电性树脂层包括选自线圈状导电性粒子，纤维绒毛状导电性粒子和设置有多个导电性突起的导电性粒子和树脂粘合剂中的至少一种导电性粒子， 将多个电子部件的电极端子与导电颗粒彼此连接到连接端子; 将电子元件和电路板彼此机械固定; 并保护导线。
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24.发明申请ELECTROCONDUCTIVE BONDING MATERIAL AND ELECTRIC/ELECTRONIC DEVICE USING THE SAME 失效电磁接合材料和使用该电极的电子/电子设备公开(公告)号：US20100316794A1
公开(公告)日：2010-12-16
申请号：US12870275
申请日：2010-08-27
IPC分类号： H05K3/10
CPC分类号： H05K1/095 , C08G59/66 , C08G59/687 , C08K5/37 , C09J163/00 , H01B1/22 , H05K3/321 , H05K3/4069 , H05K2201/0224 , H05K2203/122
摘要： A conductive bonding material having an improved preservation stability, and hardens when desired, preferably immediately hardens at a low temperature is provided. In one invention, the conductive bonding material comprises a conductive particle ingredient, an epoxy resin ingredient, and a hardening agent ingredient for said epoxy resin and the hardening agent ingredient for said epoxy resin further comprise a reforming agent having a thiol group. In another invention, a conductive bonding material comprising an epoxy resin hardening ingredient, wherein said epoxy resin hardening ingredient contains a sulfur-containing compound having an end group which can coordinate with a surface of the metallic particles, and the sulfur-containing compound comes to perform as a hardening agent for the epoxy resin by dissociating from the surface of the metallic particles. The conductive bonding material may contain fragrance.
摘要翻译： 提供具有改善的保存稳定性并且当需要时硬化的导电粘合材料优选在低温下立即硬化。 在一个发明中，导电接合材料包括导电颗粒成分，环氧树脂成分和用于所述环氧树脂的硬化剂成分和用于所述环氧树脂的硬化剂成分，还包含具有硫醇基的重整剂。 在另一发明中，包含环氧树脂硬化成分的导电性接合材料，其中所述环氧树脂硬化成分含有具有可与金属粒子表面配位的端基的含硫化合物，含硫化合物进入 通过从金属颗粒的表面离解，作为环氧树脂的硬化剂。 导电接合材料可能含有香料。
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公开(公告)号：US20090173795A1
公开(公告)日：2009-07-09
申请号：US12160541
申请日：2007-02-26
申请人： Shozo Ochi , Osamu Uchida , Shigeaki Sakatani , Daisuke Sakurai , Masato Mori , Hiroshi Sakurai , Hidenobu Nishikawa
发明人： Shozo Ochi , Osamu Uchida , Shigeaki Sakatani , Daisuke Sakurai , Masato Mori , Hiroshi Sakurai , Hidenobu Nishikawa
IPC分类号： G06K19/077 , H01Q1/38 , H01Q7/00 , H05K3/00
CPC分类号： H01Q1/22 , G06K19/07732 , G06K19/07749 , H01Q7/06 , H05K1/0218 , H05K1/144 , H05K1/148 , H05K1/16 , H05K2201/043 , H05K2201/086 , Y10T29/4913
摘要： Card type information device includes wiring board having a wiring pattern with an electronic component mounted on a first face of wiring board and an antenna connecting electrode, antenna board having antenna pattern with antenna terminal electrodes formed on a first face of antenna board, magnetic material placed between wiring board and antenna board confronting each other, flexible wiring board for coupling the antenna connecting electrode to antenna terminal electrode, and housing for accommodating wiring board, antenna board, magnetic material, and flexible wiring board. Wiring board and antenna board are made from one and the same insulating motherboard.
摘要翻译： 卡类型信息装置包括具有安装在布线板的第一面上的电子部件和天线连接电极的布线图案的布线板，天线板天线阵列与天线端子电极形成在天线板的第一面上，磁性材料放置 在布线板和天线板之间，用于将天线连接电极耦合到天线端子电极的柔性布线板和用于容纳布线板，天线板，磁性材料和柔性布线板的壳体。 接线板和天线板由同一个绝缘母板制成。
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公开(公告)号：US20090133900A1
公开(公告)日：2009-05-28
申请号：US11909886
申请日：2006-04-14
CPC分类号： H01L24/29 , C09J9/02 , H01L21/6835 , H01L24/83 , H01L24/95 , H01L2221/68354 , H01L2224/2919 , H01L2224/29499 , H01L2224/83101 , H01L2224/83136 , H01L2224/83192 , H01L2224/83859 , H01L2924/01006 , H01L2924/01019 , H01L2924/01027 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01082 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/3011 , H01L2924/3025 , H05K3/284 , H05K3/323 , H05K2201/0108 , H05K2201/0281 , H05K2201/0373 , H05K2201/10636 , H05K2201/10674 , H05K2203/1476 , Y02P70/611 , Y10T29/49147 , Y10T428/24372 , Y10T428/254 , H01L2924/00
摘要： Circuit board having conductor wiring and connection terminal; anisotropic conductive resin layer provided on one surface of circuit board; and plurality of electronic components respectively provided with electrode terminals in positions facing the connection terminal are included. The anisotropic conductive resin layer includes at least one kind of conductive particles selected from coiled conductive particles, fiber fluff conductive particles and conductive particles provided with a plurality of conductive protrusions, and resin binder; electrically couples electrode terminals of plurality of electronic components to connection terminals to each other with conductive particles; mechanically fixes electronic components and circuit board to each other; and protects conductor wiring.
摘要翻译： 具有导线和连接端子的电路板; 设置在电路板的一个表面上的各向异性导电树脂层; 并且包括分别在面向连接端子的位置设置有电极端子的多个电子部件。 各向异性导电性树脂层包括选自线圈状导电性粒子，纤维绒毛状导电性粒子和设置有多个导电性突起的导电性粒子和树脂粘合剂中的至少一种导电性粒子， 将多个电子部件的电极端子与导电颗粒彼此连接到连接端子; 将电子元件和电路板彼此机械固定; 并保护导线。
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27.发明申请Electroconductive Bonding Material and Electric/Electronic Device Using the Same 审中-公开导电接合材料及使用其的电气/电子设备公开(公告)号：US20090032293A1
公开(公告)日：2009-02-05
申请号：US11886722
申请日：2006-03-22
CPC分类号： H05K1/095 , C08G59/66 , C08G59/687 , C08K5/37 , C09J163/00 , H01B1/22 , H05K3/321 , H05K3/4069 , H05K2201/0224 , H05K2203/122
摘要： A conductive bonding material having an improved preservation stability, and hardens when desired, preferably immediately hardens at a low temperature is provided. In one invention, the conductive bonding material comprises a conductive particle ingredient, an epoxy resin ingredient, and a hardening agent ingredient for said epoxy resin and the hardening agent ingredient for said epoxy resin further comprise a reforming agent having a thiol group. In another invention, a conductive bonding material comprising an epoxy resin hardening ingredient, wherein said epoxy resin hardening ingredient contains a sulfur-containing compound having an end group which can coordinate with a surface of the metallic particles, and the sulfur-containing compound comes to perform as a hardening agent for the epoxy resin by dissociating from the surface of the metallic particles. The conductive bonding material may contain fragrance.
摘要翻译： 提供具有改善的保存稳定性并且当需要时硬化的导电粘合材料优选在低温下立即硬化。 在一个发明中，导电接合材料包括导电颗粒成分，环氧树脂成分和用于所述环氧树脂的硬化剂成分和用于所述环氧树脂的硬化剂成分，还包含具有硫醇基的重整剂。 在另一发明中，包含环氧树脂硬化成分的导电性接合材料，其中所述环氧树脂硬化成分含有具有可与金属粒子表面配位的端基的含硫化合物，含硫化合物进入 通过从金属颗粒的表面离解，作为环氧树脂的硬化剂。 导电接合材料可能含有香料。
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公开(公告)号：US08718109B2
公开(公告)日：2014-05-06
申请号：US13469102
申请日：2012-05-11
IPC分类号： H01S3/04
CPC分类号： H04N9/3111 , H01S5/02 , H01S5/02212 , H01S5/02469 , H01S5/4025 , H04N9/3161 , H04N9/3164
摘要： A laser array light source unit 1 includes: a plurality of semiconductor lasers 2 each including a main body portion 2a and a leg portion 2b with two leading electrodes; a laser holder 3 holding the main body portions 2a, and having through-holes for the leg portions 2b; a pressing member 5 for fixing the semiconductor lasers 2 to the laser holder 3; an insulator 4 including a plurality of electrode insertion portions 4f having through-holes for the leading electrodes; and a wiring base 6 for electrically connecting at least two of the semiconductor lasers 2 in series. The insulator 4 includes a connecting portion 4b for connecting the plurality of electrode insertion portions 4f in the same direction in which the plurality of semiconductor lasers 2 are arranged. The wiring base 6 includes first through-holes into which the leading electrodes of the semiconductor lasers 2 are inserted.
摘要翻译： 激光阵列光源单元1包括：多个半导体激光器2，每个半导体激光器2包括具有两个引导电极的主体部分2a和腿部2b; 保持主体部2a的激光保持器3，并具有用于脚部2b的通孔; 用于将半导体激光器2固定到激光器保持器3的按压部件5; 绝缘体4，包括具有用于引导电极的通孔的多个电极插入部分4f; 以及用于将至少两个半导体激光器2串联连接的布线基座6。 绝缘体4包括连接部分4b，用于在多个半导体激光器2的相同方向上连接多个电极插入部分4f。 布线基底6包括插入半导体激光器2的引导电极的第一通孔。
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公开(公告)号：US08450859B2
公开(公告)日：2013-05-28
申请号：US13000391
申请日：2009-10-27
CPC分类号： H01L23/49894 , H01L21/563 , H01L23/49816 , H01L24/12 , H01L24/16 , H01L24/81 , H01L2224/10126 , H01L2224/13099 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/13566 , H01L2224/16058 , H01L2224/16225 , H01L2224/73203 , H01L2224/812 , H01L2224/81801 , H01L2224/83192 , H01L2224/83194 , H01L2224/83855 , H01L2224/83856 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H05K3/3436 , H05K3/3452 , H05K3/3463 , H05K3/3484 , H05K2201/10977 , H05K2201/10992 , Y02P70/613 , H01L2924/01083 , H01L2924/00014 , H01L2924/0105
摘要： A semiconductor device mounted structure includes a semiconductor device having a plurality of first electrodes, a circuit board having a plurality of second electrodes, a plurality of bumps respectively formed on the plurality of first electrodes, a plurality of bonding members respectively positioned between the bumps and the second electrodes to electrically connect the first electrodes to the second electrodes via the bumps, and a plurality of reinforcing resin members respectively positioned around the bonding members so as to cover at least the bonding members and bonding regions between the bonding members and the bumps. Adjacent reinforcing resin members are spaced away from each other so as not to have contact with each other without being in contact with the semiconductor device. This semiconductor device mounted structure enhances the reliability of joints in impact resistance and makes it easy to repair it.
摘要翻译： 半导体器件安装结构包括具有多个第一电极的半导体器件，具有多个第二电极的电路板，分别形成在多个第一电极上的多个凸块，分别位于凸块之间的多个接合部件和 所述第二电极经由所述凸块将所述第一电极与所述第二电极电连接，以及分别位于所述接合部件周围的多个增强树脂部件，以至少覆盖所述接合部件和所述凸块之间的接合部件和接合部。 相邻的增强树脂构件彼此间隔开，以便不与半导体器件接触而彼此不接触。 该半导体器件安装结构提高了接头在耐冲击性方面的可靠性，并且使其易于修复。
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30.发明授权Electroconductive bonding material and electric/electronic device using the same 失效导电接合材料和使用其的电气/电子设备公开(公告)号：US08012379B2
公开(公告)日：2011-09-06
申请号：US12870275
申请日：2010-08-27
CPC分类号： H05K1/095 , C08G59/66 , C08G59/687 , C08K5/37 , C09J163/00 , H01B1/22 , H05K3/321 , H05K3/4069 , H05K2201/0224 , H05K2203/122
摘要： A conductive bonding material having an improved preservation stability, and hardens when desired, preferably immediately hardens at a low temperature is provided. In one invention, the conductive bonding material comprises a conductive particle ingredient, an epoxy resin ingredient, and a hardening agent ingredient for said epoxy resin and the hardening agent ingredient for said epoxy resin further comprise a reforming agent having a thiol group. In another invention, a conductive bonding material comprising an epoxy resin hardening ingredient, wherein said epoxy resin hardening ingredient contains a sulfur-containing compound having an end group which can coordinate with a surface of the metallic particles, and the sulfur-containing compound comes to perform as a hardening agent for the epoxy resin by dissociating from the surface of the metallic particles. The conductive bonding material may contain fragrance.
摘要翻译： 提供具有改善的保存稳定性并且当需要时硬化的导电粘合材料优选在低温下立即硬化。 在一个发明中，导电接合材料包括导电颗粒成分，环氧树脂成分和用于所述环氧树脂的硬化剂成分和用于所述环氧树脂的硬化剂成分，还包含具有硫醇基的重整剂。 在另一发明中，包含环氧树脂硬化成分的导电性接合材料，其中所述环氧树脂硬化成分含有具有可与金属粒子表面配位的端基的含硫化合物，含硫化合物进入 通过从金属颗粒的表面离解，作为环氧树脂的硬化剂。 导电接合材料可能含有香料。
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