公开(公告)号：US20160293517A1

公开(公告)日：2016-10-06

申请号：US15069404

申请日：2016-03-14

申请人： FUJI ELECTRIC CO., LTD.

发明人： Tetsuya INABA ,  Yoshinari IKEDA ,  Motohito HORI ,  Daisuke KIMIJIMA

IPC分类号： H01L23/473 ,  H01L25/07 ,  H01L23/00 ,  H01L29/78

CPC分类号： H01L23/473 ,  H01L24/72 ,  H01L25/074 ,  H01L29/7813

摘要： A semiconductor module includes a semiconductor element having a gate electrode and source electrode on the front surface, and a drain electrode on the rear surface, the drain electrode being electrically connected to the front surface of a drain plate; a laminated substrate having, on the front surface of an insulating plate, a first circuit plate to which the gate electrode is electrically connected, and a second circuit plate to which the source electrode is electrically connected, and which is disposed on the front surface of the drain plate; a gate terminal disposed on the first circuit plate; a source terminal disposed on the second circuit plate; and a cover disposed opposite to the front surface of the drain plate, and having an opening in which the gate terminal and the source terminal are positioned and a guide groove contacting the opening and extending to the outer peripheral portion.

摘要翻译： 半导体模块包括在前表面上具有栅电极和源电极的半导体元件和在后表面上的漏电极，漏电极电连接到排水板的前表面; 层叠基板，其在绝缘板的前表面上具有电连接所述栅电极的第一电路板和所述源电极电连接的第二电路板，并且所述第二电路板设置在所述栅电极的前表面上 排水板; 设置在所述第一电路板上的栅极端子; 设置在所述第二电路板上的源极端子; 以及与排水板的前表面相对设置的盖，并且具有开口，栅极端子和源极端子定位在该开口中，以及与开口接触并延伸到外周部分的引导槽。

公开(公告)号：US20160263714A1

公开(公告)日：2016-09-15

申请号：US15162513

申请日：2016-05-23

申请人： INTEL CORPORATION

发明人： Jin YANG ,  David SHIA

IPC分类号： B23P15/26

CPC分类号： B23P15/26 ,  B23P2700/09 ,  F28D15/02 ,  F28D15/0241 ,  F28F2013/005 ,  F28F2280/08 ,  H01L23/427 ,  H01L23/4338 ,  H01L24/72 ,  H01L2224/16225 ,  H01L2224/73251 ,  H01L2224/73253 ,  H01L2924/0002 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2224/16 ,  H01L2224/72

摘要： Assemblies and methods are described. One assembly includes a first plate and a second plate. The assembly also includes an adjustable heat pipe positioned between the first plate and the second plate, the adjustable heat pipe being in thermal contact with the first plate and the second plate. In another aspect, a plurality of springs may be positioned between the first plate and the second plate. Other embodiments are described and claimed.

摘要翻译： 描述装配和方法。 一个组件包括第一板和第二板。 组件还包括位于第一板和第二板之间的可调热管，可调热管与第一板和第二板热接触。 在另一方面，多个弹簧可以位于第一板和第二板之间。 描述和要求保护其他实施例。

公开(公告)号：US20160240949A1

公开(公告)日：2016-08-18

申请号：US15135413

申请日：2016-04-21

申请人： Sanka Ganesan ,  Ram S. Viswanath

发明人： Sanka Ganesan ,  Ram S. Viswanath

IPC分类号： H01R12/79 ,  H05K1/14 ,  H01L23/367 ,  H01L23/498 ,  H01L23/00

CPC分类号： H01R12/79 ,  H01B7/04 ,  H01L23/3675 ,  H01L23/49811 ,  H01L23/49838 ,  H01L24/17 ,  H01L24/72 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01R12/62 ,  H05K1/142 ,  H05K1/147 ,  H05K3/361 ,  H05K2201/10318 ,  H05K2201/10325 ,  H05K2201/10424 ,  H05K2201/10674 ,  H05K2201/10681 ,  H05K2201/2009 ,  H01L2224/0401

摘要： An integrated circuit package is presented. In an embodiment, the integrated circuit package has contact pads formed on the top side of a package substrate, a die electrically attached to the contact pads, and input/output (I/O) pads formed on the top side of the package substrate. The I/O pads are electrically connected to the contact pads. The integrated circuit package also includes a flex cable receptacle electrically connected to the I/O pads on the top side of the package substrate. The flex cable receptacle is non-compressively attachable to a flex cable connector and includes receptacle connection pins electrically connected to the I/O pads.

摘要翻译： 介绍了一种集成电路封装。 在一个实施例中，集成电路封装具有形成在封装基板的顶侧上的接触焊盘，电连接到接触焊盘的管芯，以及形成在封装基板的顶侧上的输入/输出（I / O）焊盘。 I / O焊盘电连接到接触焊盘。 集成电路封装还包括电连接到封装衬底的顶侧上的I / O焊盘的挠性电缆插座。 柔性电缆插座不可压缩地附接到柔性电缆连接器，并且包括电连接到I / O焊盘的插座连接引脚。

公开(公告)号：US09397021B2

公开(公告)日：2016-07-19

申请号：US14538352

申请日：2014-11-11

申请人： LOTES CO., LTD

发明人： Ted Ju

IPC分类号： H01L23/32 ,  H01L23/498 ,  H01L23/00

CPC分类号： H01L23/32 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49866 ,  H01L24/13 ,  H01L24/72 ,  H01L24/73 ,  H01L24/81 ,  H01L24/90 ,  H01L24/91 ,  H01L2224/13076 ,  H01L2224/13111 ,  H01L2224/13205 ,  H01L2224/13209 ,  H01L2224/13339 ,  H01L2224/13347 ,  H01L2224/1339 ,  H01L2224/13409 ,  H01L2224/13411 ,  H01L2224/13418 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/73251 ,  H01L2224/8114 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81405 ,  H01L2224/81409 ,  H01L2224/81505 ,  H01L2224/81509 ,  H01L2224/81639 ,  H01L2224/81647 ,  H01L2224/8169 ,  H01L2224/81709 ,  H01L2224/81711 ,  H01L2224/81718 ,  H01L2224/81901 ,  H01L2924/3841 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/0105 ,  H01L2924/01031 ,  H01L2924/013 ,  H01L2924/01049 ,  H01L2224/72 ,  H01L2224/16

摘要： An electrical connector for electrically connecting a chip module to a circuit board, includes an insulating body, multiple conducting bodies, and multiple pieces of low melting point metal. The insulating body has multiple accommodating spaces. Each accommodating space runs through upper and lower surfaces of the insulating body. The multiple conducting bodies are respectively received in the accommodating spaces. Two ends of each conducting body are exposed on the upper and lower surfaces of the insulating body. The low melting point metal is gallium or gallium alloy. Each piece of the low melting point metal is correspondingly arranged at at least one end of one of the conducting bodies. The low melting point metal protrudes from the insulating body, and is electrically connected to the chip module.

摘要翻译： 用于将芯片模块电连接到电路板的电连接器包括绝缘体，多个导电体和多片低熔点金属。 绝缘体具有多个容纳空间。 每个容纳空间穿过绝缘体的上表面和下表面。 多个导电体分别容纳在容纳空间中。 每个导电体的两端暴露在绝缘体的上表面和下表面上。 低熔点金属是镓或镓合金。 每片低熔点金属相应地布置在一个导电体的至少一端。 低熔点金属从绝缘体突出并与芯片模块电连接。

公开(公告)号：US20160079210A1

公开(公告)日：2016-03-17

申请号：US14952191

申请日：2015-11-25

申请人： SK hynix Inc.

发明人： Jung Tae JEONG ,  Il Hwan CHO

IPC分类号： H01L25/065 ,  H01L23/48 ,  H01L23/538

CPC分类号： H01L25/0657 ,  H01L23/13 ,  H01L23/481 ,  H01L23/49805 ,  H01L23/5386 ,  H01L23/64 ,  H01L24/01 ,  H01L24/05 ,  H01L24/72 ,  H01L25/50 ,  H01L2224/02371 ,  H01L2224/02372 ,  H01L2224/06187 ,  H01L2224/16198 ,  H01L2224/32225 ,  H01L2225/06517 ,  H01L2225/06551 ,  H01L2225/06565 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00

摘要： A semiconductor package includes a substrate and a plurality of semiconductor chips stacked on the substrate. Each of the semiconductor chips has a front surface, a rear surface opposite to the front surface, a sidewall surface connecting the front surface to the rear surface, a vertical through electrode extending from the front surface toward the rear surface with a predetermined depth, and a horizontal through electrode laterally extending from the sidewall surface to be connected to the vertical through electrode. At least one connection member is disposed on the sidewall surfaces of the semiconductor chips to connect the horizontal through electrodes of the semiconductor chips to each other. Related methods are also provided.

摘要翻译： 半导体封装包括衬底和堆叠在衬底上的多个半导体芯片。 每个半导体芯片具有前表面，与前表面相对的后表面，连接前表面和后表面的侧壁表面，以预定深度从前表面向后表面延伸的垂直通孔，以及 从侧壁表面横向延伸以连接到垂直通过电极的水平通过电极。 至少一个连接构件设置在半导体芯片的侧壁表面上，以将半导体芯片的水平通过电极彼此连接。 还提供了相关方法。

公开(公告)号：US09271670B2

公开(公告)日：2016-03-01

申请号：US14685304

申请日：2015-04-13

申请人： Abbott Diabetes Care Inc.

发明人： Mohammad E. Moein ,  Louis G. Pace ,  Udo Hoss ,  Phu X. Le ,  Samuel M. Curry

IPC分类号： H05K5/00 ,  A61B5/1473 ,  A61B5/00 ,  A61B5/145 ,  A61B5/1468 ,  A61B5/1486 ,  H05K3/32 ,  H01L23/00 ,  H05K3/36

CPC分类号： A61B5/1486 ,  A61B5/14532 ,  A61B5/14546 ,  A61B5/1468 ,  A61B5/1473 ,  A61B5/4839 ,  A61B5/6848 ,  A61B2562/227 ,  H01L24/72 ,  H01L2924/07811 ,  H01L2924/12042 ,  H05K3/325 ,  H05K3/365 ,  H05K2201/053 ,  H05K2201/10151 ,  H05K2201/10401 ,  H05K2201/10409 ,  Y10T29/4913 ,  H01L2924/00

摘要： Analyte sensor connectors that connect analyte sensors, e.g., conductive members of analyte sensors, to other devices such as sensor electronics units, e.g., sensor control units, are provided. Also provided are systems that include analyte sensors, analyte sensor connectors, and analyte sensor electronics units, as well as methods of establishing and maintaining connections between analyte sensors and analyte sensor electronics units, and methods of analyte monitoring/detection. Also provided are methods of making analyte sensor connectors and systems that include analyte sensor connectors.

公开(公告)号：US20150360158A1

公开(公告)日：2015-12-17

申请号：US14000981

申请日：2013-02-14

申请人： Todd MENKHAUS ,  Hao FONG ,  NANOPAREIL, LLC

发明人： Todd MENKHAUS ,  Hao FONG

IPC分类号： B01D39/16 ,  D01D5/00

CPC分类号： B01D39/1615 ,  B01D15/327 ,  B01D15/361 ,  B01D15/3804 ,  B01D15/3809 ,  B01D39/1623 ,  B01D39/1676 ,  B01D2239/025 ,  B01D2239/0414 ,  B01J20/24 ,  B01J20/28007 ,  B01J20/28038 ,  B01J20/3212 ,  B01J20/3217 ,  B01J20/3248 ,  B01J20/3293 ,  C07K1/22 ,  D01D5/0007 ,  D01D5/003 ,  D01F2/24 ,  D01F6/44 ,  D01F6/88 ,  H01L23/48 ,  H01L24/16 ,  H01L24/72 ,  H01L24/73 ,  H01L24/90 ,  H01L24/91 ,  H01L25/0652 ,  H01L25/50 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/73201 ,  H01L2224/81138 ,  H01L2224/81815 ,  H01L2224/9211 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06531 ,  H01L2225/06562 ,  H01L2225/06593 ,  H01L2924/0002 ,  H01L2924/15153 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/3511 ,  H01L2924/37001 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2224/16 ,  H01L2224/72 ,  H01L2224/81 ,  H01L2224/90 ,  H01L2924/00014 ,  H01L2924/00012

摘要： The present invention relates generally to compositions for use in biological and chemical separations, as well as other applications. More specifically, the present invention relates to hybrid felts fabricated from electrospun nanofibers with high permeance and high capacity. Such hybrid felts utilize derivatized cellulose, and at least one non-cellulose-based polymer that may be removed from the felt by subjecting it to moderately elevated temperatures and/or solvents capable of dissolving the non-cellulose-based polymer to leave behind a porous nanofiber felt having more uniform pore sizes and other enhanced properties when compared to single component nanofiber felts.

摘要翻译： 本发明一般涉及用于生物和化学分离以及其它应用的组合物。 更具体地说，本发明涉及由具有高渗透性和高容量的电纺丝纳米纤维制成的混合毡。 这样的混合毛毡使用衍生的纤维素和至少一种非纤维素基聚合物，其可以通过使其适度升高的温度和/或能够溶解非纤维素基聚合物的溶剂留在多孔 与单组分纳米纤维毡相比，纳米纤维毡具有更均匀的孔径和其它增强的性能。

公开(公告)号：US09153460B2

公开(公告)日：2015-10-06

申请号：US14011218

申请日：2013-08-27

申请人： International Business Machines Corporation

发明人： Evan G. Colgan ,  Michael A. Gaynes ,  Jeffrey A. Zitz

IPC分类号： H01L23/00 ,  H01L21/50 ,  H01L23/433 ,  H01L23/31

CPC分类号： H01L21/50 ,  H01L23/3128 ,  H01L23/433 ,  H01L24/16 ,  H01L24/32 ,  H01L24/72 ,  H01L24/73 ,  H01L24/90 ,  H01L24/92 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2224/81815 ,  H01L2224/83104 ,  H01L2224/83901 ,  H01L2224/921 ,  H01L2924/10253 ,  H01L2924/15787 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2224/90 ,  H01L2924/014

摘要： An assembly process for a heatsink attachment module for a chip packaging apparatus is provided and includes attaching a semiconductor chip to a substrate to form a module subassembly, placing a load frame and shim in a fixture, dispensing adhesive to the load frame and loadably placing the module subassembly chip face down in the fixture.

摘要翻译： 提供了一种用于芯片封装设备的散热器连接模块的组装过程，包括将半导体芯片附接到基板以形成模块子组件，将负载框架和垫片放置在固定装置中，将粘合剂分配到负载框架并且可负载地将 模块组件芯片正面朝下。

公开(公告)号：US20150279768A1

公开(公告)日：2015-10-01

申请号：US14408338

申请日：2013-03-14

申请人： HSIO TECHNOLOGIES, LLC

发明人： James Rathburn

IPC分类号： H01L23/498 ,  H01L23/00 ,  H01L21/48 ,  H01L23/66

CPC分类号： H01L23/49811 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49861 ,  H01L23/50 ,  H01L23/5222 ,  H01L23/642 ,  H01L23/66 ,  H01L24/16 ,  H01L24/72 ,  H01L25/0657 ,  H01L2223/6616 ,  H01L2223/6666 ,  H01L2223/6677 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81192 ,  H01L2224/81385 ,  H01L2224/81801 ,  H01L2224/81901 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06531 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/12042 ,  Y10T29/49204 ,  H01L2924/00 ,  H01L2224/05599

摘要： A semiconductor socket including a substrate with a plurality of through holes extending from a first surface to a second surface. A conductive structure is disposed within the through holes A plurality of discrete contact members are located in the plurality of the through holes, within the conductive structure. The plurality of contact members each include a proximal end accessible from the second surface, and a distal end extending above the first surface. The conductive structure can be electrically coupled to circuit geometry. At least one dielectric layer is bonded to the second surface of the substrate with recesses corresponding to desired circuit geometry. A conductive material deposited in at least a portion of the recesses to form conductive traces redistributing terminal pitch of the proximal ends of the contact members.

摘要翻译： 一种半导体插座，包括具有从第一表面延伸到第二表面的多个通孔的基板。 导电结构设置在通孔内，在导电结构内，多个离散接触构件位于多个通孔中。 多个接触构件各自包括可从第二表面接近的近端和在第一表面上方延伸的远端。 导电结构可以电耦合到电路几何形状。 至少一个电介质层与基板的第二表面结合，凹槽对应于所需的电路几何形状。 沉积在至少一部分凹陷中的导电材料以形成重新分布接触构件的近端的端子间距的导电迹线。

公开(公告)号：US20150235930A1

公开(公告)日：2015-08-20

申请号：US14620762

申请日：2015-02-12

申请人： MITSUBISHI ELECTRIC CORPORATION

发明人： Jeffrey EWANCHUK ,  Stefan MOLLOV ,  Guillaume LEFEVRE

IPC分类号： H01L23/495 ,  H02M7/537

CPC分类号： H01L23/49568 ,  H01L21/4846 ,  H01L23/16 ,  H01L23/345 ,  H01L23/36 ,  H01L23/3735 ,  H01L23/473 ,  H01L23/49575 ,  H01L23/5385 ,  H01L24/72 ,  H01L25/072 ,  H01L25/115 ,  H01L2224/06181 ,  H02M7/537

摘要： The present invention concerns a package of power dies composed of a first part and a second part, the first part including a plaque having cavities on which dies are placed, the plaque is placed on a first, a second, and a third metallic plates placed on an electric insulation substrate placed on a fourth metallic plate, the second part including a fifth and a sixth metallic plates placed on another electric insulation substrate placed on a seventh metallic plate, the dies are divided into a first group of dies and a second group of dies and wherein the first and second plate are a positive and negative DC voltage connections, the third plate is a gate connection of the second group of dies, the fourth plate is an AC voltage connection and the fifth plate is a gate connection of the first group of dies.

摘要翻译： 本发明涉及由第一部分和第二部分组成的动力模具的包装，第一部分包括具有空腔的板，其上放置有模具，该板放置在第一，第二和第三金属板上， 在放置在第四金属板上的电绝缘基板上，第二部分包括置于第七金属板上的另一电绝缘基板上的第五和第六金属板，模具分为第一组模具和第二组 并且其中所述第一和第二板是正和负的DC电压连接，所述第三板是所述第二组模具的栅极连接，所述第四板是AC电压连接，并且所述第五板是所述第二板的栅极连接 第一组死亡。