Abstract:
An adapter is interposed between a device having a pattern of pins projecting therefrom and a PCB having contacts connected to various components. The body of the adapter is made of platable dielectric material and is formed with holes corresponding to the pattern of pins of the device and also along one or more edges with pads corresponding in number to the holes. The holes are plated with conductive material which may be used to establish electrical contact with the pins; however, preferably clips are installed in each hole and in electrical contact therewith, the clips having converging fingers which frictionally engage the pins and also electrically contact the same. Electrically conductive traces are located on the body, each having a first end connected to the plating of a hole and a second end leading to one of the pads. The traces may be formed by a plate and etch process similar to that used in PCB fabrication. The pads of the body are plated with a material such as solder and are electrically connected to the second ends of the traces opposite the holes. The pins of the device fit into the holes of the body and the plated pads on the body are soldered to contacts on the PCB.
Abstract:
In circuit modifications of dual in line packaged (DIP) devices are realized by a circuit modification device that interfaces the DIP and its companion device. A first pair of single in line packaged (DIP) header pins are mounted on a printed circuit (PC) board such that they form a socket for the DIP device. A second pair of SIP header pins are mounted adjacent to the first pair and extend through the PC board to form a plug for the companion device. Header pins are interconnected by the printed circuit to effect the desired DIP device circuit reconfiguration. Packaging is accomplished with commercially available components and does not impact system size, weight or power constraints.
Abstract:
A cylindrical circuit board socket with a metal body open at each end having a pair of lead contact fingers extending from one end into the interior of the socket for forming an electrical connection with a lead inserted into the socket and a pair of circuit board contact fingers extending from the other end along the outside of the body for holding the socket in a circuit board hole prior to soldering the socket to printed circuitry at the hole. A seal at each end of the body closes the interior of the body and prevents flux and solder from flowing into the interior of the socket during fluxing and soldering of the socket. A contact lead is easily inserted into the socket through a seal to form an electrical connection with the interior fingers.
Abstract:
Internal printed circuits on multi-layer or laminated circuit boards are electrically connected to resistors, capacitors and the like circuit components by connector pins that abut the internal printed circuit at an end extremity and are frictionally held in a hole in the board that to the exterior of the board only at the component mounting side of the board. The pins have a shoulder that limits the penetration during assembly procedures and another hole in which the lead wire of the circuit component is frictionally engaged.
Abstract:
A stacked output structure of a capacitive power supply for welding equipment, having a plurality of capacitors to be connected in parallel, two electrodes of each capacitor are respectively provided with a pin including a long pin and a short pin; at least two PCB bus plates placed in stack are provided above the capacitor is provided. A lower PCB bus plate is connected with the short pin; and a pass-through hole is provided, at a position corresponds to the long pin, on the lower PCB bus plate. The long pin passes through the pass-through hole in the lower PCB bus plate and is connected with an upper PCB bus plate. There is a gap between the long pin and an inner wall of the pass-through hole.
Abstract:
A single element electrical connector includes a single conductive contact element formed into a cage structure having a wire insert end and a wire contact end along a longitudinal centerline axis of the connector. The cage structure defines an upper pick-up surface having a surface area suitable for placement of a suction nozzle of a vacuum transfer device, as well as a pair of contact tines biased towards the centerline axis to define a contact pinch point for an exposed core of a wire inserted into the connector. A contact surface is defined by a member of the cage structure for electrical mating contact with a respective contact element on a component on which the connector is mounted.
Abstract:
An electric connecting member and an LED lamp using the electric connecting member are provided. The electric connecting member is used for the electric connection between a light source substrate and a driving board of the LED lamp, and comprises an input terminal and an output terminal. The LED lamp comprises the driving board and the light source substrate. The output terminal is provided on the driving board of the LED lamp. The input terminal is disposed upon the light source substrate and is electrically connected to the light source substrate. The output terminal comprises two contacts, and one end of each of the two contacts is electrically connected to the driving board respectively. The input terminal comprises two connection heads which are respectively provided corresponding to the two contacts. One end of each of the two connection heads is electrically connected to the light source substrate respectively.
Abstract:
A power semiconductor device includes power semiconductor elements joined to wiring patterns of a circuit substrate, cylindrical external terminal communication sections, and wiring means for forming electrical connection between, for example, the power semiconductor elements and the cylindrical external terminal communication sections. The power semiconductor elements, the cylindrical external terminal communication sections, and the wiring means are sealed with transfer molding resin. The cylindrical external terminal communication sections are arranged on the wiring patterns so as to be substantially perpendicular to the wiring patterns, such that external terminals are insertable and connectable to the cylindrical external terminal communication sections, and such that a plurality of cylindrical external terminal communication sections among the cylindrical external terminal communication sections are arranged two-dimensionally on each of wiring patterns that act as main circuits.