公开(公告)号：US06963438B2

公开(公告)日：2005-11-08

申请号：US10714330

申请日：2003-11-14

Applicant: Bradley L. Busscher ,  Bradley L. Northman ,  Kenton J. Ypma ,  Randall J. Beute ,  John K. Roberts ,  Wayne M. Jordan ,  Edward L. DeNave ,  Daniel J. Bostwick ,  Randall S. Braun ,  Gregory A. Bosch ,  Timothy A. Bonardi

Inventor： Bradley L. Busscher ,  Bradley L. Northman ,  Kenton J. Ypma ,  Randall J. Beute ,  John K. Roberts ,  Wayne M. Jordan ,  Edward L. DeNave ,  Daniel J. Bostwick ,  Randall S. Braun ,  Gregory A. Bosch ,  Timothy A. Bonardi

IPC: B60Q1/26 ,  B60R1/07 ,  B60R1/08 ,  H05K1/02 ,  H05K1/18 ,  H05K3/00 ,  G02F1/15 ,  B60R1/12

CPC classification number: B60R1/0602 ,  B60Q1/2665 ,  B60R1/07 ,  B60R1/072 ,  B60R1/088 ,  B60R1/1207 ,  B60R2001/1215 ,  G02B5/08 ,  H05K1/02 ,  H05K1/18 ,  H05K1/189 ,  H05K3/0058 ,  H05K2201/09072 ,  H05K2201/09081 ,  H05K2201/10106 ,  H05K2201/10484

Abstract: A mirror assembly includes a housing, an angularly adjustable power pack, wires for supplying power and mirror angle control, an electrochromic mirror subassembly including a heater, and a turn signal device. The components include individual connectors that plug into a multi-prong connector on the bundle of wires, or that piggyback into each other. Optionally, the heater incorporates an internal wire with end connectors for communicating power to opposite sides of the heater, and also includes layers of light-transmitting/diffusing material for diffusing light passing from the turn signal device through the diffusing material. A printed circuit board fits into a pocket in the panel-shaped carrier, and an integral retainer releasably secures the printed circuit board. The power pack is attached to the carrier via a ring of resilient fingers, and a continuous hoop flange prevents distortion of the carrier and in turn of the glass elements in the mirror subassembly.

Abstract translation: 反射镜组件包括壳体，角度可调节的电源组，用于供电和镜角控制的电线，包括加热器的电致变色镜子组件和转向信号装置。 这些组件包括插入电线束上的多插头连接器或彼此搭载的单独连接器。 可选地，加热器包括具有端部连接器的内部导线，用于将功率传递到加热器的相对侧，并且还包括用于漫射从转向信号装置通过扩散材料的光的透光/扩散材料层。 印刷电路板装配在面板形载体中的凹槽中，并且整体的保持器可释放地固定印刷电路板。 电源组通过一个弹性手指环连接到载体上，连续的环形凸缘可防止载体和反射镜组件中的玻璃元件的变形。

公开(公告)号：US20050226023A1

公开(公告)日：2005-10-13

申请号：US11157610

申请日：2005-06-20

Applicant: Robert Wallace ,  Robert Norman ,  Eliyahou Harari

Inventor： Robert Wallace ,  Robert Norman ,  Eliyahou Harari

IPC: G06F3/06 ,  G06F12/00 ,  G06F13/00 ,  G06F13/38 ,  G06K7/00 ,  G11C5/00 ,  G11C5/02 ,  G11C7/00 ,  G11C16/04 ,  G11C16/06 ,  H05K1/14

CPC classification number: G06F3/0601 ,  G06F13/385 ,  G06F2003/0694 ,  G06K7/0047 ,  G06K19/07732 ,  G06K19/07741 ,  G06K19/07743 ,  G11C5/04 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83385 ,  H05K1/141 ,  H05K3/3421 ,  H05K7/1431 ,  H05K2201/10159 ,  H05K2201/10462 ,  H05K2201/10484 ,  H05K2203/1572 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A very small computer memory card is densely packed with a large number of flash EEPROM integrated circuit chips. A computer memory system provides for the ability to removably connect one or more of such cards with a common controller circuit that interfaces between the memory cards and a standard computer system bus. Alternately, each card can be provided with the necessary controller circuitry and thus is connectable directly to the computer system bus. An electronic system is described for a memory system and its controller within a single memory card. In a preferred physical arrangement, the cards utilize a main circuit board with a plurality of sub-boards attached thereto on both sides, each sub-board carrying several integrated circuit chips.

公开(公告)号：US20050078458A1

公开(公告)日：2005-04-14

申请号：US10958379

申请日：2004-10-06

Applicant: Reinhard Lecheler ,  Oskar Schallmoser

Inventor： Reinhard Lecheler ,  Oskar Schallmoser

IPC: H05K7/20 ,  G12B15/06 ,  H05B37/00 ,  H05B41/02 ,  H05K1/00 ,  H05K1/18 ,  H05K3/30

CPC classification number: H05B41/02 ,  H05K3/301 ,  H05K2201/066 ,  H05K2201/10166 ,  H05K2201/10484

Abstract: The invention relates to a circuit for operation of a lamp with a component 4 to be cooled and with a heat sink 6, 6′ which includes an angle of 10°-70° with a circuit board 1.

Abstract translation: 本发明涉及一种用于操作具有要冷却的部件4和具有与电路板1成10°-70°角的散热片6,6'的灯的电路。

公开(公告)号：US20040017707A1

公开(公告)日：2004-01-29

申请号：US10628746

申请日：2003-07-28

Inventor： Robert F. Wallace ,  Robert D. Norman ,  Eliyahou Harari

IPC: G11C007/00

CPC classification number: G06F3/0601 ,  G06F13/385 ,  G06F2003/0694 ,  G06K7/0047 ,  G06K19/07732 ,  G06K19/07741 ,  G06K19/07743 ,  G11C5/04 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83385 ,  H05K1/141 ,  H05K3/3421 ,  H05K7/1431 ,  H05K2201/10159 ,  H05K2201/10462 ,  H05K2201/10484 ,  H05K2203/1572 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A very small computer memory card is densely packed with a large number of flash EEPROM integrated circuit chips. A computer memory system provides for the ability to removably connect one or more of such cards with a common controller circuit that interfaces between the memory cards and a standard computer system bus. Alternately, each card can be provided with the necessary controller circuitry and thus is connectable directly to the computer system bus. An electronic system is described for a memory system and its controller within a single memory card. In a preferred physical arrangement, the cards utilize a main circuit board with a plurality of sub-boards attached thereto on both sides, each sub-board carrying several integrated circuit chips.

Abstract translation: 一个非常小的电脑记忆卡密集地装有大量的闪存EEPROM集成电路芯片。 计算机存储器系统提供了将一个或多个这样的卡可拆卸地连接到存储卡与标准计算机系统总线之间接口的公共控制器电路的能力。 或者，每个卡都可以提供必要的控制器电路，因此可以直接连接到计算机系统总线。 描述了一种用于存储系统及其控制器在单个存储卡内的电子系统。 在优选的物理布置中，卡片利用其两侧附着有多个子板的主电路板，每个子板承载多个集成电路芯片。

公开(公告)号：US06594152B2

公开(公告)日：2003-07-15

申请号：US09409978

申请日：1999-09-30

Applicant: David Dent

Inventor： David Dent

IPC: H01R1216

CPC classification number: H05K1/148 ,  H01R12/52 ,  H05K1/142 ,  H05K3/321 ,  H05K3/3405 ,  H05K3/3442 ,  H05K3/366 ,  H05K2201/1028 ,  H05K2201/10484 ,  H05K2203/049

Abstract: A first printed circuit board has a contact area, and a second printed circuit board has a contact area. An electrically conductive band is to couple the contact area of the first printed circuit board to the contact area of the second printed circuit board. The conductive band may be selected from the group consisting essentially of a band formed from solder, a band coupled by a weld, a band coupled by a wire bond, a band comprising conductive adhesive, a band comprising conductive film, a band comprising conductive tape, and a band comprising conductive rope. The conductive band may couple the first printed circuit board and the second printed circuit board in a substantially coplanar position.

Abstract translation: 第一印刷电路板具有接触区域，第二印刷电路板具有接触区域。 导电带将第一印刷电路板的接触区域耦合到第二印刷电路板的接触区域。 导电带可以选自基本上由从焊料形成的带，由焊缝耦合的带，通过引线键耦合的带，包括导电粘合剂的带，包括导电膜的带，包括导电带的带 ，以及包括导电绳的带。 导电带可以将第一印刷电路板和第二印刷电路板耦合在基本共面的位置。

公开(公告)号：US20020171906A1

公开(公告)日：2002-11-21

申请号：US09862414

申请日：2001-05-21

Inventor： Bradley L. Busscher ,  Bradley L. Northman ,  Kenton J. Ypma ,  Randall J. Beute ,  John K. Roberts ,  Wayne M. Jordan ,  Edward L. DeNave ,  Daniel J. Bostwick ,  Randall S. Braun ,  Gregory A. Bosch ,  Timothy A. Bonardi

IPC: G02F001/15 ,  G02F001/153

CPC classification number: B60R1/0602 ,  B60Q1/2665 ,  B60R1/07 ,  B60R1/072 ,  B60R1/088 ,  B60R1/1207 ,  B60R2001/1215 ,  G02B5/08 ,  H05K1/02 ,  H05K1/18 ,  H05K1/189 ,  H05K3/0058 ,  H05K2201/09072 ,  H05K2201/09081 ,  H05K2201/10106 ,  H05K2201/10484

Abstract: A mirror assembly includes a housing, an angularly adjustable power pack, wires for supplying power and mirror angle control, an electrochromic mirror subassembly including a heater, and a turn signal device. The components include individual connectors that plug into a multi-prong connector on the bundle of wires, or that piggyback into each other. Optionally, the heater incorporates an internal wire with end connectors for communicating power to opposite sides of the heater, and also includes layers of light-transmitting/diffusing material for diffusing light passing from the turn signal device through the diffusing material. A printed circuit board fits into a pocket in the panel-shaped carrier, and an integral retainer releasably secures the printed circuit board. The power pack is attached to the carrier via a ring of resilient fingers, and a continuous hoop flange prevents distortion of the carrier and in turn of the glass elements in the mirror subassembly.

Abstract translation: 反射镜组件包括壳体，角度可调节的电源组，用于供电和镜角控制的电线，包括加热器的电致变色镜子组件和转向信号装置。 这些组件包括插入电线束上的多插头连接器或彼此搭载的单独连接器。 可选地，加热器包括具有端部连接器的内部导线，用于将功率传递到加热器的相对侧，并且还包括用于漫射从转向信号装置通过扩散材料的光的透光/扩散材料层。 印刷电路板装配在面板形载体中的凹槽中，并且整体的保持器可释放地固定印刷电路板。 电源组通过一个弹性手指环连接到载体上，连续的环形凸缘可防止载体和反射镜组件中的玻璃元件的变形。

公开(公告)号：US20010005643A1

公开(公告)日：2001-06-28

申请号：US09765191

申请日：2001-01-18

Inventor： Robert M. Kalis

IPC: H05K001/00 ,  H01R012/00

CPC classification number: H05K1/148 ,  H01R12/52 ,  H01R43/0263 ,  H01R43/205 ,  H05K1/0215 ,  H05K3/3447 ,  H05K9/0039 ,  H05K2201/096 ,  H05K2201/10484 ,  H05K2201/10924

Abstract: A circuit board assembly is provided for electrically coupling together two or more circuit boards, with one circuit board oriented at an acute angle relative to the other circuit board. The assembly includes a first circuit board having a first edge and a plurality of connecting holes disposed therethrough adjacent the first edge. Each of the holes is electrically isolated from the others and each is electrically connected to electronic circuitry printed on the first circuit board. The assembly further includes a second circuit board having a first edge and a plurality of connecting holes disposed therethrough adjacent the first edge. Each of the holes of the second board is electrically isolated from the others and is electrically connected to electronic circuitry printed on the second circuit board. The assembly also includes a conductive support plate having a plurality of connecting legs extending therefrom along a first edge thereof. The second circuit board is placed in registry with the plate, with the legs extending through the connecting holes of the second circuit board. The legs also extend through the connecting holes of the first circuit board, with the plate and the second circuit board being oriented at an angle with respect to the first circuit board. The legs are adapted to be soldered to the first circuit board and the second circuit board, and are adapted to be severed from the plate to form an electrical connection between the first circuit board and the second circuit board.

Abstract translation: 提供一种电路板组件，用于将两个或多个电路板电耦合在一起，其中一个电路板相对于另一个电路板定向成锐角。 组件包括第一电路板，其具有第一边缘和邻近第一边缘穿过其设置的多个连接孔。 每个孔与其它孔电隔离，并且每个孔电连接到印刷在第一电路板上的电子电路。 组件还包括第二电路板，其具有第一边缘和邻近第一边缘穿过其设置的多个连接孔。 第二板的每个孔与其它板电气隔离并且电连接到印刷在第二电路板上的电子电路。 组件还包括导电支撑板，其具有沿其第一边缘从其延伸的多个连接腿。 第二电路板被放置在与板对准的位置，腿部延伸穿过第二电路板的连接孔。 腿部还延伸穿过第一电路板的连接孔，其中板和第二电路板相对于第一电路板成一角度定向。 腿适于焊接到第一电路板和第二电路板，并且适于从板上切断以在第一电路板和第二电路板之间形成电连接。

公开(公告)号：US06169325A

公开(公告)日：2001-01-02

申请号：US09210883

申请日：1998-12-15

Applicant: Shuichiro Azuma ,  Takayuki Okinaga ,  Takashi Emata ,  Tomoaki Kudaishi ,  Tamaki Wada ,  Kunihiko Nishi ,  Masachika Masuda ,  Toshio Sugano

Inventor： Shuichiro Azuma ,  Takayuki Okinaga ,  Takashi Emata ,  Tomoaki Kudaishi ,  Tamaki Wada ,  Kunihiko Nishi ,  Masachika Masuda ,  Toshio Sugano

IPC: H01L2302

CPC classification number: H05K3/303 ,  H01L25/105 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2924/0002 ,  H05K2201/09781 ,  H05K2201/10462 ,  H05K2201/10484 ,  H05K2201/10568 ,  H05K2201/10681 ,  H05K2201/1078 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2924/00

Abstract: To realize low-profile electronic apparatus (a memory module and a memory card) of a large storage size by mounting tape carrier packages (TCPs) with a memory chip encapsulated onto a wiring board in high density. To be more specific, a TCP is composed of an insulating tape, leads formed on one side thereof, a potting resin with a semiconductor chip encapsulated, and a pair of support leads arranged on two opposite short sides. The pair of support leads function to hold the TCP at a constant tilt angle relative to the mounting surface of the wiring board. By varying the length vertical to the mounting surface, the TCP can be mounted to a desired tilt angle.

Abstract translation: 通过将具有以高密度封装在布线板上的存储芯片的载带封装（TCP）安装在一起，实现了大型存储尺寸的小型电子设备（存储器模块和存储卡）。 更具体地说，TCP由绝缘带，在其一侧形成的引线，封装有半导体芯片的灌封树脂和布置在两个相对的短边上的一对支撑引线构成。 一对支撑引线用于将TCP保持在相对于布线板的安装表面的恒定倾斜角度。 通过改变垂直于安装表面的长度，可以将TCP安装到期望的倾斜角度。

公开(公告)号：US5920770A

公开(公告)日：1999-07-06

申请号：US837960

申请日：1997-04-14

Applicant: Masatoshi Yasunaga ,  Shin Nakao ,  Shinji Baba ,  Mitsuyasu Matsuo ,  Hironori Matsushima

Inventor： Masatoshi Yasunaga ,  Shin Nakao ,  Shinji Baba ,  Mitsuyasu Matsuo ,  Hironori Matsushima

IPC: H01L21/60 ,  H01L21/56 ,  H01L21/68 ,  H01L23/12 ,  H01L23/28 ,  H01L23/31 ,  H01L23/32 ,  H01L23/485 ,  H01L25/10 ,  H05K3/30 ,  H05K3/34 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC classification number: H01L21/568 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/3107 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L25/10 ,  H01L25/105 ,  H05K3/303 ,  H01L2224/0231 ,  H01L2224/0233 ,  H01L2224/02333 ,  H01L2224/02335 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/1131 ,  H01L2224/11332 ,  H01L2224/11334 ,  H01L2224/1147 ,  H01L2224/1191 ,  H01L2224/12105 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/131 ,  H01L2224/13116 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16105 ,  H01L2224/16108 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/4813 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/812 ,  H01L2224/81801 ,  H01L2224/83104 ,  H01L2225/1005 ,  H01L2225/1035 ,  H01L2225/107 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/07802 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/351 ,  H05K2201/09909 ,  H05K2201/10454 ,  H05K2201/10484 ,  H05K2201/2036 ,  H05K3/3442 ,  Y02P70/613

Abstract: Bonding pads are formed on a main surface of a semiconductor chip. An insulating layer having openings located on the bonding pads is formed on the main surface of the semiconductor chip. Base metal layers are formed on the bonding pads. A buffer coat film having a portion laid on a periphery of the base metal layer is formed on the insulating layer. Connection layers are formed on the base metal layers. First conductors are formed on the connection layers. A seal resin exposing only top surfaces of the first conductors is formed. Lumpish second conductors are formed on the top surfaces of the first conductor. Thereby, a resin seal semiconductor package can be made compact and it has improved electrical characteristics and high reliability.

Abstract translation: 接合焊盘形成在半导体芯片的主表面上。 在半导体芯片的主表面上形成具有位于接合焊盘上的开口的绝缘层。 在接合焊盘上形成基底金属层。 在绝缘层上形成具有放置在基底金属层周围的部分的缓冲涂膜。 连接层形成在基底金属层上。 第一导体形成在连接层上。 形成仅露出第一导体的顶表面的密封树脂。 在第一导体的顶表面上形成笨重的第二导体。 因此，可以使树脂密封半导体封装紧凑并且具有改善的电特性和高可靠性。

公开(公告)号：US5663901A

公开(公告)日：1997-09-02

申请号：US527254

申请日：1995-09-12

Applicant: Robert F. Wallace ,  Robert D. Norman ,  Eliyahou Harari

Inventor： Robert F. Wallace ,  Robert D. Norman ,  Eliyahou Harari

IPC: G06F3/06 ,  G06F12/00 ,  G06F13/00 ,  G06F13/38 ,  G06K7/00 ,  G11C5/00 ,  G11C5/02 ,  G11C7/00 ,  G11C16/04 ,  G11C16/06 ,  H05K1/14

CPC classification number: G06F3/0601 ,  G06F13/385 ,  G06K19/07732 ,  G06K19/07741 ,  G06K19/07743 ,  G06K7/0047 ,  G11C5/04 ,  H05K1/141 ,  H05K7/1431 ,  G06F2003/0694 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83385 ,  H05K2201/10159 ,  H05K2201/10462 ,  H05K2201/10484 ,  H05K2203/1572 ,  H05K3/3421

Abstract: A very small computer memory card is densely packed with a large number of flash EEPROM integrated circuit chips. A computer memory system provides for the ability to removably connect one or more of such cards with a common controller circuit that interfaces between the memory cards and a standard computer system bus. Alternately, each card can be provided with the necessary controller circuitry and thus is connectable directly to the computer system bus. An electronic system is described for a memory system and its controller within a single memory card. In a preferred physical arrangement, the cards utilize a main circuit board with a plurality of sub-boards attached thereto on both sides, each sub-board carrying several integrated circuit chips.

Abstract translation: 一个非常小的电脑记忆卡密集地装有大量的闪存EEPROM集成电路芯片。 计算机存储器系统提供了将一个或多个这样的卡可拆卸地连接到存储卡与标准计算机系统总线之间接口的公共控制器电路的能力。 或者，每个卡可以提供必要的控制器电路，并且因此可以直接连接到计算机系统总线。 描述了一种用于存储系统及其控制器在单个存储卡内的电子系统。 在优选的物理布置中，卡片利用其两侧附着有多个子板的主电路板，每个子板承载多个集成电路芯片。