公开(公告)号：US08013389B2

公开(公告)日：2011-09-06

申请号：US12612125

申请日：2009-11-04

申请人： Jin-Yong Oh ,  Woonkyung Lee ,  Jin-Sung Lee ,  Sunil Shim ,  Hansoo Kim ,  Wonseok Cho ,  Jaehoon Jang ,  Jin-Soo Lim

发明人： Jin-Yong Oh ,  Woonkyung Lee ,  Jin-Sung Lee ,  Sunil Shim ,  Hansoo Kim ,  Wonseok Cho ,  Jaehoon Jang ,  Jin-Soo Lim

IPC分类号： H01L29/66

CPC分类号： H01L27/11578 ,  H01L27/0688 ,  H01L27/11565 ,  H01L27/11582

摘要： Nonvolatile memory devices are provided and methods of manufacturing such devices. In the method, conductive layers and insulating layers are alternatingly stacked on a substrate. A first sub-active bar is formed which penetrates a first subset of the conductive layers and a first subset of the insulating layers. The first sub-active bar is electrically connected with the substrate. A second sub-active bar is formed which penetrates a second subset of the conductive layers and a second subset of the insulating layers. The second sub-active bar is electrically connected to the first sub-active bar. A width of a bottom portion of the second sub-active bar is less than a width of a top portion of the second sub-active bar.

摘要翻译： 提供非易失性存储器件和制造这种器件的方法。 在该方法中，导电层和绝缘层交替堆叠在基板上。 形成第一子活动杆，其穿过导电层的第一子集和绝缘层的第一子集。 第一子活性棒与衬底电连接。 形成第二子活动杆，其穿透导电层的第二子集和绝缘层的第二子集。 第二子活动杆电连接到第一子活动杆。 第二副活性杆的底部的宽度小于第二副活性杆的顶部的宽度。

公开(公告)号：US20110187962A1

公开(公告)日：2011-08-04

申请号：US13087574

申请日：2011-04-15

申请人： Pil-yong Oh ,  Il-yong Jung

发明人： Pil-yong Oh ,  Il-yong Jung

IPC分类号： G02F1/13357

CPC分类号： G02F1/133308 ,  G02F1/133385 ,  G02F1/133528 ,  G02F2001/133311 ,  G02F2001/133562 ,  G02F2201/086 ,  G02F2201/50 ,  G02F2203/11 ,  H05K7/20972

摘要： A liquid crystal display device includes a housing, a liquid crystal panel provided in the housing and comprises first and second transparent substrates spaced from each other at predetermined intervals, a sealing member to seal an internal space formed between the first and second transparent substrates, a liquid crystal to fill the internal space, first and second transparent electrodes formed in the first and second transparent substrates, respectively, and a polarizing plate to transmit light in a predetermined polarizing direction, a backlight unit disposed in the housing to emit surface light to the liquid crystal panel, and a polarizing filter disposed in the housing, and spaced from the liquid crystal panel at predetermined intervals to transmit predetermined polarized light and to block other polarized light of incident light.

摘要翻译： 一种液晶显示装置，包括壳体，设置在壳体中的液晶面板，并且包括以预定间隔彼此间隔开的第一和第二透明基板，用于密封形成在第一和第二透明基板之间的内部空间的密封构件， 分别形成在第一透明基板和第二透明基板中的第一透明电极和第二透明电极;以及偏振片，用于透过预定的偏振方向的光，设置在外壳中的背光单元，以将面光发射到 液晶面板和设置在壳体中的偏振滤光器，并且以预定间隔与液晶面板隔开以透射预定的偏振光并阻挡入射光的其它偏振光。

公开(公告)号：US20100320597A1

公开(公告)日：2010-12-23

申请号：US12805321

申请日：2010-07-26

申请人： Kang-Wook Lee ,  Se-Yong Oh ,  Young-Hee Song ,  Gu-Sung Kim

发明人： Kang-Wook Lee ,  Se-Yong Oh ,  Young-Hee Song ,  Gu-Sung Kim

IPC分类号： H01L23/48

CPC分类号： H01L25/50 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/5389 ,  H01L24/05 ,  H01L24/06 ,  H01L24/16 ,  H01L24/48 ,  H01L24/49 ,  H01L24/94 ,  H01L25/0657 ,  H01L2224/02372 ,  H01L2224/02379 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05009 ,  H01L2224/06181 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06582 ,  H01L2225/06589 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A system-in-package, comprising a wafer level stack structure, including at least one first device chip including a first device region having a plurality of input/output(I/O) pads, and at least one second device chip including a second device region having a plurality of input/output(I/O) pads and a second peripheral region surrounding the second device region, wherein the size of the second device region is different from the size of the first device region, wherein the at least one first device chip and the at least one second device chip have approximately equal size; and a common circuit board to which the wafer level stack structure is connected.

摘要翻译： 一种系统级封装，包括晶片级堆叠结构，其包括至少一个包括具有多个输入/输出（I / O）焊盘的第一器件区域的第一器件芯片，以及包括第二器件芯片的至少一个第二器件芯片 器件区域具有多个输入/输出（I / O）焊盘和围绕第二器件区域的第二外围区域，其中第二器件区域的尺寸不同于第一器件区域的尺寸，其中至少一个 第一器件芯片和至少一个第二器件芯片具有大致相等的尺寸; 以及连接晶片级堆叠结构的公共电路板。

公开(公告)号：US20100174950A1

公开(公告)日：2010-07-08

申请号：US12727859

申请日：2010-03-19

申请人： Young-Min PARK ,  Jun-Ho JANG ,  Keum-Yong OH ,  Hae-Su GWON ,  Gyung-Pyo HONG ,  Young-Soo KANG

发明人： Young-Min PARK ,  Jun-Ho JANG ,  Keum-Yong OH ,  Hae-Su GWON ,  Gyung-Pyo HONG ,  Young-Soo KANG

IPC分类号： H04L9/00 ,  G06F11/07

CPC分类号： H04N21/6543 ,  H04N21/235 ,  H04N21/26291 ,  H04N21/4181 ,  H04N21/435 ,  H04N21/8193

摘要： A method of communicating with a host in a security module providing information necessary for decrypting encrypted broadcast data received by the host, includes if an event occurs, characterizing the event as an event that a user of the host is to be notified about with regard to the decryption of the encrypted broadcast data, generating a user notification message including information about the event that occurred; and transmitting the user notification message to the host.

摘要翻译： 一种与安全模块中的主机进行通信的方法，其提供解密由主机接收的加密广播数据所必需的信息，包括如果发生事件，则将事件表征为关于主机的用户关于 解密加密的广播数据，生成包括关于发生的事件的信息的用户通知消息; 以及将所述用户通知消息发送到所述主机。

公开(公告)号：US20100042738A1

公开(公告)日：2010-02-18

申请号：US12389955

申请日：2009-02-20

申请人： Kwang-hyuk Kim ,  Keum-yong Oh ,  Sung-jin Park

发明人： Kwang-hyuk Kim ,  Keum-yong Oh ,  Sung-jin Park

IPC分类号： G06F15/16

CPC分类号： H04L67/02 ,  H04L67/32

摘要： Provided are a contents receiving apparatus for obtaining application control information and a method thereof, the method comprising: receiving application control information, including effective duration information, from a server; determining whether a current control time point is within a time period represented by the effective duration information; and selectively requesting other application control information from the server in response to the determining.

摘要翻译： 提供一种用于获取应用控制信息的内容接收装置及其方法，该方法包括：从服务器接收包括有效持续时间信息的应用控制信息; 确定当前控制时间点是否在由有效持续时间信息表示的时间段内; 以及响应于所述确定从所述服务器选择性地请求其他应用控制信息。

公开(公告)号：US07637717B2

公开(公告)日：2009-12-29

申请号：US11427916

申请日：2006-06-30

申请人： Pil-yong Oh ,  Jun-seok Park

发明人： Pil-yong Oh ,  Jun-seok Park

IPC分类号： F04D29/66

CPC分类号： F04D29/526 ,  F04D29/668

摘要： A fan assembly includes a fan, a supporting case to support at least a part of the fan along a circumferential direction of the fan, and a vibration-proof member having at least one opening passing through a side thereof and interposed between the fan and the supporting case, to prevent noise from being generated from the fan. The fan assembly can efficiently prevent or dampen vibration generated by the fan and reduce noise.

摘要翻译： 风扇组件包括风扇，支撑壳体，用于沿着风扇的圆周方向支撑风扇的至少一部分;以及防振构件，其具有通过其一侧的至少一个开口并插入在风扇和风扇之间 支撑箱，以防止风扇产生噪音。 风扇组件可以有效地防止或抑制风扇产生的振动并降低噪音。

公开(公告)号：US07524763B2

公开(公告)日：2009-04-28

申请号：US11145994

申请日：2005-06-07

申请人： Soon-Bum Kim ,  Ung-Kwang Kim ,  Keum-Hee Ma ,  Young-Hee Song ,  Sung-Min Sim ,  Se-Yong Oh ,  Kang-Wook Lee ,  Se-Young Jeong

发明人： Soon-Bum Kim ,  Ung-Kwang Kim ,  Keum-Hee Ma ,  Young-Hee Song ,  Sung-Min Sim ,  Se-Yong Oh ,  Kang-Wook Lee ,  Se-Young Jeong

IPC分类号： H01L21/44

CPC分类号： C25D7/12 ,  C25D5/02 ,  H01L21/2885 ,  H01L21/76898 ,  H01L23/3114 ,  H01L23/481 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L2224/02166 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/13009 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00

摘要： A method of fabricating wafer level chip scale packages may involve forming a hole to penetrate through a chip pad of an IC chip. A base metal layer may be formed on a first face of a wafer to cover inner surfaces of the hole. An electrode metal layer may fill the hole and rise over the chip pad. A second face of the wafer may be grinded such that the electrode metal layer in the hole may be exposed through the second face. By electroplating, a plated bump may be formed on the electrode metal layer exposed through the second face. The base metal layer may be selectively removed to isolate adjacent electrode metal layers. The wafer may be sawed along scribe lanes to separate individual packages from the wafer.

摘要翻译： 制造晶片级芯片级封装的方法可包括形成穿透IC芯片的芯片焊盘的孔。 基底金属层可以形成在晶片的第一面上以覆盖孔的内表面。 电极金属层可以填充孔并在芯片垫上升起。 可以研磨晶片的第二面，使得孔中的电极金属层可以通过第二面露出。 通过电镀，可以在通过第二面暴露的电极金属层上形成电镀凸块。 可以选择性地去除贱金属层以隔离相邻的电极金属层。 可以沿着划线锯切晶片以将单独的封装与晶片分开。

公开(公告)号：US20080076248A1

公开(公告)日：2008-03-27

申请号：US11589717

申请日：2006-10-31

申请人： Soon-bum Kim ,  Sung-min Sim ,  Dong-hyeon Jang ,  Jae-sik Chung ,  Se-yong Oh

发明人： Soon-bum Kim ,  Sung-min Sim ,  Dong-hyeon Jang ,  Jae-sik Chung ,  Se-yong Oh

IPC分类号： H01L21/44

CPC分类号： H01L24/11 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05023 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05548 ,  H01L2224/05568 ,  H01L2224/05639 ,  H01L2224/05647 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/19041 ,  H01L2924/00014 ,  H01L2924/013 ,  H01L2924/01028

摘要： Provided is a method of forming conductors (e.g., metal lines and/or bumps) for semiconductor devices and conductors formed from the same. First and second seed metal layers may be formed. At least one mask may be formed on a portion on which a conductor is to be formed. An exposed portion may be oxidized. The oxidized portion may be removed. A conductive structure may be formed on an upper surface of a portion which is not oxidized. The conductors may be metal lines and/or bumps. The conductive structures may be solder balls.

摘要翻译： 提供了形成半导体器件的导体（例如金属线和/或凸块）以及由其形成的导体的方法。 可以形成第一和第二种子金属层。 至少一个掩模可以形成在其上将形成导体的部分上。 暴露部分可能被氧化。 可以除去氧化部分。 可以在未被氧化的部分的上表面上形成导电结构。 导体可以是金属线和/或凸块。 导电结构可以是焊球。

公开(公告)号：US20070238404A1

公开(公告)日：2007-10-11

申请号：US11308603

申请日：2006-04-11

申请人： Seong Park ,  Yong Oh ,  Chang Jang

发明人： Seong Park ,  Yong Oh ,  Chang Jang

IPC分类号： B08B15/02 ,  B01D50/00 ,  A45D29/18

CPC分类号： A45D29/18 ,  B08B15/04

摘要： An apparatus is provided including an air diffuser, a filter, a cover, a fan, and a shade in which the fan is located. The air diffuser may be surrounded by the filter except for a bottom opening in the air diffuser. The cover may surround the filter and the air diffuser except for a bottom opening in the filter and the bottom opening in the air diffuser. The air diffuser and the cover may be attached to the shade. The shade may have a bottom opening. The fan may cause air to flow into the shade through the bottom opening of the shade, then through the bottom opening of the air diffuser, the filter, and a first opening of the cover, then out a set of a plurality of openings in a side of the air diffuser, then through the filter, and then out a set of a plurality of openings in the cover.

摘要翻译： 提供了一种装置，其包括空气扩散器，过滤器，盖子，风扇和风扇所在的阴凉处。 除了空气扩散器中的底部开口之外，空气扩散器可以被过滤器包围。 盖子可以围绕过滤器和空气扩散器，除了过滤器中的底部开口和空气扩散器中的底部开口。 空气扩散器和盖可以附接到阴凉处。 阴凉处可能有一个底部的开口。 风扇可能导致空气通过阴凉处的底部开口流入阴凉处，然后通过空气扩散器的底部开口，过滤器和盖子的第一开口，然后从一组开口 空气扩散器的一侧，然后通过过滤器，然后在盖中排出一组多个开口。

公开(公告)号：US20070158843A1

公开(公告)日：2007-07-12

申请号：US11621042

申请日：2007-01-08

申请人： Shin Kim ,  Se-Yong OH

发明人： Shin Kim ,  Se-Yong OH

IPC分类号： H01L23/48

CPC分类号： H01L23/49816 ,  H01L23/3677 ,  H01L23/49827 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H05K3/3436 ,  H05K2201/09572 ,  H05K2201/10666 ,  H05K2203/1394 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package with improved solder joint reliability, and a method of fabricating the same are provided. The semiconductor package comprises a printed circuit board (PCB) having a plurality of interconnection layers formed on its surface, and having a plurality of through holes connected to the interconnection layers. An adhesive member is attached to an upper surface of the PCB, and a semiconductor chip is electrically connected to the interconnection layers and mounted on an upper surface of the adhesive member. A solder connecting part fills each through hole so as to form a mechanically strong connection that is resistant to breakage during thermal transients and physical impacts.

摘要翻译： 提供了具有改进的焊点可靠性的半导体封装及其制造方法。 半导体封装包括印刷电路板（PCB），其具有在其表面上形成的多个互连层，并且具有连接到互连层的多个通孔。 粘合剂部件附着到PCB的上表面，并且半导体芯片电连接到互连层并且安装在粘合部件的上表面上。 焊接连接部分填充每个通孔，以便形成机械强连接，其在热瞬变和物理冲击期间耐断裂。