Abstract:
An article comprises a body and a conformal protective layer on at least one surface of the body. The conformal protective layer is a plasma resistant rare earth oxide film having a thickness of less than 1000 μm, wherein the plasma resistant rare earth oxide has a composition of 40-45 mol % of Y2O3, 5-10 mol % of ZrO2, 35-40 mol % of Er2O3, 5-10 mol % of Gd2O3, and 5-15 mol % of SiO2.
Abstract:
An component of a processing chamber comprises an aerosol deposited coating on the component, the aerosol deposited coating comprising a first type of metal oxide nanoparticle and a second type of metal oxide nanoparticle.
Abstract:
A component for a manufacturing chamber comprises a cold spray coating and an anodization layer on the cold spray coating. The anodization layer has a thickness of about 2-10 mil. The anodization layer comprises a low porosity bottom layer portion having a porosity that is less than about 40-50% and a porous columnar top layer portion having a porosity of about 40-40% and comprising a plurality of columnar nanopores having a diameter of about 10-50 nm.
Abstract:
An additive manufacturing system includes a platen, a feed material dispenser apparatus configured to deliver a feed material over the platen, a laser configured to produce a laser beam, a controller configured to direct the laser beam to locations specified by data stored in a computer-readable medium to cause the feed material to fuse, and a plasma source configured to produce ions that are directed to substantially the same location on the platen as the laser beam.
Abstract:
A chamber component for a processing chamber comprises a metallic article that comprises impurities. The chamber component further comprises a first anodization layer on the metallic article, the first anodization layer having a thickness greater than about 100 nm. The first anodization layer comprises a dense barrier layer portion and a porous columnar layer portion over the dense barrier layer portion, wherein the porous columnar layer portion comprises a plurality of pores that are free from moisture. The chamber component further comprises an aluminum coating on the first anodization layer, the aluminum coating being substantially free from impurities.
Abstract:
A method for coating a component for use in a semiconductor chamber for plasma etching includes providing a component for use in a semiconductor manufacturing chamber, loading the component into a deposition chamber, cold spray coating a metal powder onto the component to form a coating on the component, and anodizing the coating to form an anodization layer.
Abstract:
Embodiments of showerheads having a detachable gas distribution plate are provided herein. In some embodiments, a showerhead for use in a semiconductor processing chamber may include a base having a first side and a second side; a gas distribution plate disposed proximate the second side of the base; a clamp disposed about a peripheral edge of the gas distribution plate to removably couple the gas distribution plate to the base; and a thermal gasket disposed between the base and gas distribution plate.
Abstract:
An article comprises a plasma resistant ceramic material comprising 40 mol % to less than 100 mol % of Y2O3, above 0 mol % to 60 mol % of ZrO2, and above 0 mol % to 5 mol % of Al2O3.
Abstract translation:一种制品包括含有40mol%至小于100mol%的Y 2 O 3,高于0mol%至60mol%的ZrO 2和高于0mol%至5mol%的Al 2 O 3的耐等离子体陶瓷材料。
Abstract:
A method including immersing a ceramic coated article into a bath including an HF acid solution having NH4F with a molar concentration of about 0.1M to 1.0M for a time period to remove a deposition, and rinsing the ceramic coated article.
Abstract:
Disclosed herein are methods for fabricating layered ceramic materials via field assisted sintering technology. A method includes forming a ceramic green body on a surface of a substrate, and sintering the ceramic green body using a field-assisted sintering process to form a ceramic layer joined to the substrate.