公开(公告)号：US07262368B2

公开(公告)日：2007-08-28

申请号：US10917978

申请日：2004-08-13

申请人： Belgacem Haba ,  Masud Beroz ,  David B. Tuckerman ,  Giles Humpston ,  Richard Dewitt Crisp

发明人： Belgacem Haba ,  Masud Beroz ,  David B. Tuckerman ,  Giles Humpston ,  Richard Dewitt Crisp

IPC分类号： H01R12/04 ,  H05K1/11

CPC分类号： H01L23/49838 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K1/115 ,  H05K3/041 ,  H05K3/06 ,  H05K3/202 ,  H05K3/4038 ,  H05K2201/09609 ,  H05K2201/097 ,  H05K2201/09827 ,  H05K2201/09881 ,  H05K2203/0733 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49165 ,  H01L2924/00

摘要： Provided are connection structures for a microelectronic device and methods for forming the structure. A substrate is included having opposing surfaces and a plurality of holes extending through the surfaces. Also included is a plurality of electrically conductive posts. Each post extends from a base to a tip located within a corresponding hole of the substrate. An additional substrate may be provided such that the base of each post is located on a surface thereof. Additional electrically conductive posts may be provided having tips in corresponding holes of the additional substrate. Optionally, a dielectric material may be placed between the substrate and the posts.

摘要翻译： 提供了用于微电子器件的连接结构和用于形成结构的方法。 包括具有相对表面的基板和延伸穿过该表面的多个孔。 还包括多个导电柱。 每个柱从基部延伸到位于基板的相应孔内的尖端。 可以提供另外的基底，使得每个柱的基部位于其表面上。 可以提供额外的导电柱，其具有在附加衬底的相应孔中的尖端。 可选地，介电材料可以放置在基板和柱之间。

公开(公告)号：US20070096312A1

公开(公告)日：2007-05-03

申请号：US11641345

申请日：2006-12-19

申请人： Giles Humpston ,  Belgacem Haba

发明人： Giles Humpston ,  Belgacem Haba

IPC分类号： H01L23/48

CPC分类号： H01L23/3114 ,  B81B2207/095 ,  B81C1/00293 ,  B81C1/00301 ,  B81C2203/0118 ,  B81C2203/0145 ,  B81C2203/019 ,  H01L21/76898 ,  H01L23/04 ,  H01L24/11 ,  H01L24/13 ,  H01L24/48 ,  H01L27/14618 ,  H01L27/14627 ,  H01L27/14636 ,  H01L33/62 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/11 ,  H01L2224/11334 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13169 ,  H01L2224/1401 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16151 ,  H01L2924/16195 ,  H01L2924/16235 ,  H01L2924/3011 ,  H01L2924/3025 ,  H03H3/007 ,  H03H9/0547 ,  H03H9/0585 ,  H03H9/059 ,  H03H9/1057 ,  H03H9/1064 ,  H03H9/1071 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099

摘要： A capped chip is provided in which a cap member has a bottom surface facing a front surface of the chip and a top surface opposite the front surface. A plurality of through holes is desirably provided in the cap member which extend from the bottom surface to the top surface. A plurality of metallic interconnects electrically connected to the chip are provided which project upwardly from the front surface of the chip at least partially through the through holes. Desirably, the metallic interconnects include stud bumps.

摘要翻译： 提供了一种封盖芯片，其中盖构件具有面向芯片的前表面的底表面和与前表面相对的顶表面。 期望地在盖构件中设置有多个通孔，其从底表面延伸到顶表面。 提供电连接到芯片的多个金属互连件，其至少部分地穿过通孔从芯片的前表面向上突出。 理想地，金属互连件包括螺柱凸块。

公开(公告)号：US20060081983A1

公开(公告)日：2006-04-20

申请号：US10711945

申请日：2004-10-14

申请人： Giles Humpston ,  Bruce McWilliams

发明人： Giles Humpston ,  Bruce McWilliams

IPC分类号： H01L23/52

CPC分类号： B81B7/0077 ,  G01N21/3504 ,  H01L21/50 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/4847 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A microelectronic package may include front and rear covers overlying the front and rear surfaces of a microelectronic element such as an infrared sensor and spaces between the microelectronic element and the covers to provide thermal isolation. A sensing unit including a microelectronic package may include a reflector spaced from the front cover to provide an analyte space, and the microelectronic element may include an emitter and a detector so that radiation directed from the emitter will be reflected by the sensor to the detector, and such radiation will be affected by the properties of the analyte in the analyte space. Such a unit provides a compact, economical chemical sensor. Other packages include elements such as valves for passing fluids into and out of the spaces within the package itself.

摘要翻译： 微电子封装可以包括覆盖微电子元件的前表面和后表面的前盖和后盖，例如红外传感器和微电子元件和盖之间的空间，以提供热隔离。 包括微电子封装的感测单元可以包括与前盖隔开以提供分析物空间的反射器，并且微电子元件可以包括发射器和检测器，使得从发射器引导的辐射将被传感器反射到检测器， 并且这种辐射将受分析物空间中分析物的性质的影响。 这种单元提供了紧凑，经济的化学传感器。 其他包装包括诸如用于使流体进入和流出包装内的空间的阀门的元件。

公开(公告)号：US06958446B2

公开(公告)日：2005-10-25

申请号：US10124166

申请日：2002-04-17

申请人： Giles Humpston ,  Yoshikatsu Ichimura ,  Nancy M. Mar ,  Daniel J. Miller ,  Michael J. Nystrom ,  Heidi L. Reynolds ,  Gary R. Trott

发明人： Giles Humpston ,  Yoshikatsu Ichimura ,  Nancy M. Mar ,  Daniel J. Miller ,  Michael J. Nystrom ,  Heidi L. Reynolds ,  Gary R. Trott

IPC分类号： G02B26/08 ,  B23K1/00 ,  B23K35/26 ,  G02B6/12 ,  G02B6/35 ,  G02B6/36 ,  G02B6/42 ,  H01J5/00 ,  H05K5/06

CPC分类号： G02B6/12 ,  B23K1/0016 ,  B23K35/26 ,  B23K2101/40 ,  B23K2103/18 ,  B23K2103/52 ,  B23K2103/54 ,  B23K2103/56 ,  G02B6/3512 ,  G02B6/3582 ,  G02B6/36 ,  G02B6/4248 ,  G02B2006/12104

摘要： A solder joint or seal attaching components having dissimilar coefficients of thermal expansion is made thin (e.g., less than 20 μm and preferably about 5 μm) and of a solder such as an indium-based solder that has a tendency to creep. The solder is toroidal or otherwise shaped to avoid tensile stress in the solder. Axial shearing stress in the solder causes reversible creep without causing failure of the joint or seal. In one embodiment, a toroidal solder seal has a diameter, a footprint, and a thickness in approximate proportions of 5000:200:1.

摘要翻译： 具有不同的热膨胀系数的焊接接头或密封件附接部件被制成薄（例如，小于20μm，优选约5μm）以及具有蠕变趋势的诸如铟基焊料的焊料。 焊料是环形或其他形状，以避免焊料中的拉伸应力。 焊料中的轴向剪切应力引起可逆蠕变，而不会导致接头或密封件的故障。 在一个实施例中，环形焊接密封件的直径，占地面积和厚度约为5000：200：1。

公开(公告)号：US20050085016A1

公开(公告)日：2005-04-21

申请号：US10949847

申请日：2004-09-24

申请人： Bruce McWilliams ,  Giles Humpston

发明人： Bruce McWilliams ,  Giles Humpston

IPC分类号： H01L21/60 ,  H01L23/04 ,  H01L23/10 ,  H01L23/485 ,  H01L27/146 ,  H03H3/007 ,  H03H3/08 ,  H03H9/10 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L23/3114 ,  B81B2207/095 ,  B81C1/00293 ,  B81C1/00301 ,  B81C2203/0118 ,  B81C2203/0145 ,  B81C2203/019 ,  H01L21/76898 ,  H01L23/04 ,  H01L24/11 ,  H01L24/13 ,  H01L24/48 ,  H01L27/14618 ,  H01L27/14627 ,  H01L27/14636 ,  H01L33/62 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/11 ,  H01L2224/11334 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13169 ,  H01L2224/1401 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16151 ,  H01L2924/16195 ,  H01L2924/16235 ,  H01L2924/3011 ,  H01L2924/3025 ,  H03H3/007 ,  H03H9/0547 ,  H03H9/0585 ,  H03H9/059 ,  H03H9/1057 ,  H03H9/1064 ,  H03H9/1071 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099

摘要： A method of making a chip assembly is provided which includes the steps of: (a) assembling (i) a capped chip including a chip, a cap overlying a front surface of the chip and a sacrificial layer overlying the cap with (ii) one or more further components; and (b) after the assembling step, removing the sacrificial layer from the capped chip. A method of making a plurality of capped chip assemblies is provided which includes the steps of: (a) assembling a lid member and a chip member including a plurality of chips to one another so that the lid member overlies the chip member and a top surface of the lid member faces away from the chip member; (b) severing the lid member and chip member to form a plurality of individual units each including one or more of the chips and a portion of the lid member; (c) providing a sacrificial layer overlying the top surface of the lid member prior to the severing step; and (d) removing the sacrificial layer after the severing step.

摘要翻译： 提供了一种制造芯片组件的方法，其包括以下步骤：（a）组装（i）包括芯片的封盖芯片，覆盖在芯片的前表面上的盖和覆盖盖的牺牲层，（ii）一个 或更多的组分; 和（b）在组装步骤之后，从封盖的芯片上去除牺牲层。 提供一种制造多个封盖芯片组件的方法，其包括以下步骤：（a）将包括多个芯片的盖构件和芯片构件彼此组装，使得盖构件覆盖在芯片构件和顶表面 所述盖构件背离所述芯片构件; （b）切断盖部件和芯片部件以形成多个单独的单元，每个单独的单元包括一个或多个芯片和盖部件的一部分; （c）在切割步骤之前提供覆盖盖构件的顶表面的牺牲层; 和（d）在切割步骤之后去除牺牲层。

公开(公告)号：US20050067688A1

公开(公告)日：2005-03-31

申请号：US10949693

申请日：2004-09-24

申请人： Giles Humpston

发明人： Giles Humpston

IPC分类号： H01L21/60 ,  H01L23/04 ,  H01L23/10 ,  H01L23/485 ,  H01L27/146 ,  H03H3/007 ,  H03H3/08 ,  H03H9/10 ,  H01L21/48 ,  H01L29/40

CPC分类号： H01L23/3114 ,  B81B2207/095 ,  B81C1/00293 ,  B81C1/00301 ,  B81C2203/0118 ,  B81C2203/0145 ,  B81C2203/019 ,  H01L21/76898 ,  H01L23/04 ,  H01L24/11 ,  H01L24/13 ,  H01L24/48 ,  H01L27/14618 ,  H01L27/14627 ,  H01L27/14636 ,  H01L33/62 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/11 ,  H01L2224/11334 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13169 ,  H01L2224/1401 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16151 ,  H01L2924/16195 ,  H01L2924/16235 ,  H01L2924/3011 ,  H01L2924/3025 ,  H03H3/007 ,  H03H9/0547 ,  H03H9/0585 ,  H03H9/059 ,  H03H9/1057 ,  H03H9/1064 ,  H03H9/1071 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099

摘要： A capped chip is provided which includes a chip and a cap member, the chip having a front surface and a plurality of bond pads exposed at the front surface, the cap member having a bottom surface facing the front surface of the chip and having a top surface opposite the front surface. A plurality of through holes extend from the bottom surface of the cap member to the top surface. The capped chip assembly further includes a plurality of metallic interconnects extending from the bond pads at least partially through the through holes, the metallic interconnects including stud bumps joined to the bond pads, the stud bumps contacting and engaging at least one of (i) the top surface of the cap member surrounding the through holes and (ii) inner surfaces of the through holes.

摘要翻译： 提供一种封盖芯片，其包括芯片和盖构件，所述芯片具有前表面和暴露在前表面的多个接合焊盘，所述盖构件具有面向芯片的前表面的底表面，并且具有顶部 表面与前表面相对。 多个通孔从盖构件的底表面延伸到顶表面。 所述封装芯片组件还包括多个金属互连件，所述多个金属互连件至少部分地穿过所述通孔从所述接合焊盘延伸，所述金属互连件包括连接到所述接合焊盘的柱形凸块，所述凸块凸块接触并接合（i） 围绕通孔的帽构件的顶表面和（ii）通孔的内表面。

公开(公告)号：US08545599B2

公开(公告)日：2013-10-01

申请号：US12914786

申请日：2010-10-28

申请人： Giles Humpston

发明人： Giles Humpston

IPC分类号： B03C3/40

CPC分类号： G03G21/206 ,  B03C3/06 ,  B03C3/60 ,  B03C2201/14 ,  C23C10/28 ,  C23C14/16 ,  C23C14/5806 ,  C25D7/00

摘要： A thermal management apparatus includes an electrohydrodynamic fluid accelerator in which an emitter electrode and another electrode are energizable to motivate fluid flow. One of the electrodes includes a solid solution formed of a solvent metal having a first performance characteristic and a solute material having a second performance characteristic. The first and second performance characteristics are exhibited substantially independently in the electrode as the solvent metal and solute material remain substantially pure within the solid solution. A method of making an EHD product includes providing an electrode with such a solid solution and positioning the electrode relative to another electrode to motivate fluid flow when energized.

摘要翻译： 热管理装置包括电动液体加速器，其中发射电极和另一电极通电以激励流体流动。 电极之一包括由具有第一性能特性的溶剂金属和具有第二性能特性的溶质材料形成的固溶体。 第一和第二性能特征在电极中基本独立地表现，因为溶剂金属和溶质材料在固溶体中保持基本上纯的。 制造EHD产品的方法包括向电极提供这样的固溶体，并且相对于另一电极定位电极以在通电时激励流体流动。

公开(公告)号：US20110006432A1

公开(公告)日：2011-01-13

申请号：US12670952

申请日：2008-07-25

申请人： Belgacem Haba ,  Giles Humpston ,  David Ovrutsky ,  Laura Mirkarimi

发明人： Belgacem Haba ,  Giles Humpston ,  David Ovrutsky ,  Laura Mirkarimi

IPC分类号： H01L23/538 ,  H01L21/50

CPC分类号： H01L21/50 ,  H01L24/24 ,  H01L24/96 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/02371 ,  H01L2224/04105 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/00

摘要： A stacked microelectronic unit is provided which can include a plurality of vertically stacked microelectronic elements (12, 12A) each having a front surface (117), contacts (22) exposed at the front surface, a rear surface (118) and edges (18, 20) extending between the front and rear surfaces. Traces (24) connected with the contacts may extend along the front surfaces towards edges of the microelectronic elements with the rear surface of at least one of the stacked microelectronic elements being adjacent to a top face (90) of the microelectronic unit. A plurality of conductors (66) may extend along edges of the microelectronic elements from the traces (24) to the top face (90). The conductors may be conductively connected with unit contacts (76) such that the unit contacts overlie the rear surface (118) of the at least one microelectronic element (12A) adjacent to the top face.

摘要翻译： 提供堆叠的微电子单元，其可以包括多个垂直堆叠的微电子元件（12,12A），每个微电子元件具有前表面（117），在前表面暴露的触点（22），后表面（118）和边缘（18 ，20）在前表面和后表面之间延伸。 与触点连接的轨迹（24）可以沿着前表面朝着微电子元件的边缘延伸，其中至少一个堆叠的微电子元件的后表面与微电子单元的顶面（90）相邻。 多个导体（66）可以沿着微电子元件的边缘从迹线（24）延伸到顶面（90）。 导体可以与单元触点（76）导电连接，使得单元触点覆盖邻近顶面的至少一个微电子元件（12A）的后表面（118）。

公开(公告)号：US07858445B2

公开(公告)日：2010-12-28

申请号：US12283710

申请日：2008-09-15

申请人： Kenneth Allen Honer ,  Giles Humpston ,  David B. Tuckerman ,  Michael J. Nystrom

发明人： Kenneth Allen Honer ,  Giles Humpston ,  David B. Tuckerman ,  Michael J. Nystrom

IPC分类号： H01L21/50

CPC分类号： B81B7/0006 ,  B81C1/00269 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2924/00

摘要： A microelectronic device includes a chip having a front surface and a rear surface, the front surface having an active region and a plurality of contacts exposed at the front surface outside of the active region. The device further includes a lid overlying the front surface. The lid has edges bounding the lid, at least one of the edges including one or more outer portions and one or more recesses extending laterally inwardly from the outer portions, with the contacts being aligned with the recesses and exposed through them.

摘要翻译： 微电子器件包括具有前表面和后表面的芯片，前表面具有有源区域和暴露在有源区域外部的前表面处的多个触点。 该装置还包括盖在前表面上的盖。 盖具有边缘边缘，边缘中的至少一个包括一个或多个外部部分和一个或多个从外部部分横向向内延伸的凹部，触头与凹部对准并暴露在其中。

公开(公告)号：US07793414B2

公开(公告)日：2010-09-14

申请号：US11642570

申请日：2006-12-20

申请人： Belgacem Haba ,  Masud Beroz ,  David B. Tuckerman ,  Giles Humpston ,  Richard Dewitt Crisp

发明人： Belgacem Haba ,  Masud Beroz ,  David B. Tuckerman ,  Giles Humpston ,  Richard Dewitt Crisp

IPC分类号： H01R9/00 ,  H01R12/04

CPC分类号： H01L23/49838 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K1/115 ,  H05K3/041 ,  H05K3/06 ,  H05K3/202 ,  H05K3/4038 ,  H05K2201/09609 ,  H05K2201/097 ,  H05K2201/09827 ,  H05K2201/09881 ,  H05K2203/0733 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49165 ,  H01L2924/00

摘要： Provided are connection structures for a microelectronic device and methods for forming the structure. A substrate is included having opposing surfaces and a plurality of holes extending through the surfaces. Also included is a plurality of electrically conductive posts. Each post extends from a base to a tip located within a corresponding hole of the substrate. An additional substrate may be provided such that the base of each post is located on a surface thereof. Additional electrically conductive posts may be provided having tips in corresponding holes of the additional substrate. Optionally, a dielectric material may be placed between the substrate and the posts.

摘要翻译： 提供了用于微电子器件的连接结构和用于形成结构的方法。 包括具有相对表面的基板和延伸穿过该表面的多个孔。 还包括多个导电柱。 每个柱从基部延伸到位于基板的相应孔内的尖端。 可以提供另外的基底，使得每个柱的基部位于其表面上。 可以提供额外的导电柱，其具有在附加衬底的相应孔中的尖端。 可选地，介电材料可以放置在基板和柱之间。