公开(公告)号：US09537199B2

公开(公告)日：2017-01-03

申请号：US14662610

申请日：2015-03-19

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  Duixian Liu ,  Jean-Olivier Plouchart ,  Alberto Valdes-Garcia

IPC: H01P5/107 ,  H01P5/02 ,  H01P3/16 ,  H01P3/12

CPC classification number: H01P5/107 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/66 ,  H01L24/16 ,  H01L25/0655 ,  H01L2223/6616 ,  H01L2223/6627 ,  H01L2223/6633 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/17181 ,  H01L2924/10253 ,  H01L2924/1421 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/19031 ,  H01L2924/19032 ,  H01L2924/19033 ,  H01L2924/19039 ,  H01P3/08 ,  H01P3/121 ,  H01P3/16 ,  H01P5/02 ,  H01P5/08 ,  H01P5/087 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q1/50 ,  H05K1/0243 ,  H05K2201/037 ,  H05K2201/10522

Abstract: Embodiments include package structures having integrated waveguides to enable high data rate communication between package components. For example, a package structure includes a package substrate having an integrated waveguide, and first and second integrated circuit chips mounted to the package substrate. The first integrated circuit chip is coupled to the integrated waveguide using a first transmission line to waveguide transition, and the second integrated circuit chip is coupled to the integrated waveguide using a second transmission line to waveguide transition. The first and second integrated circuit chips are configured to communicate by transmitting signals using the integrated waveguide within the package carrier.

Abstract translation: 实施例包括具有集成波导的封装结构，以实现封装组件之间的高数据速率通信。 例如，封装结构包括具有集成波导的封装衬底和安装到封装衬底的第一和第二集成电路芯片。 第一集成电路芯片使用第一传输线到波导过渡耦合到集成波导，并且第二集成电路芯片使用第二传输线到波导转换耦合到集成波导。 第一和第二集成电路芯片被配置为通过在封装载体内使用集成波导发送信号进行通信。

公开(公告)号：US20160336638A1

公开(公告)日：2016-11-17

申请号：US15222169

申请日：2016-07-28

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  Duixian Liu ,  Jean-Olivier Plouchart ,  Alberto Valdes-Garcia

IPC: H01P5/08 ,  H01L23/66 ,  H01Q1/48 ,  H01L23/498 ,  H01Q1/38 ,  H01Q1/50 ,  H01P3/16 ,  H01L25/065

CPC classification number: H01P5/107 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/66 ,  H01L24/16 ,  H01L25/0655 ,  H01L2223/6616 ,  H01L2223/6627 ,  H01L2223/6633 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/17181 ,  H01L2924/10253 ,  H01L2924/1421 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/19031 ,  H01L2924/19032 ,  H01L2924/19033 ,  H01L2924/19039 ,  H01P3/08 ,  H01P3/121 ,  H01P3/16 ,  H01P5/02 ,  H01P5/08 ,  H01P5/087 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q1/50 ,  H05K1/0243 ,  H05K2201/037 ,  H05K2201/10522

Abstract: Embodiments include package structures having integrated waveguides to enable high data rate communication between package components. For example, a package structure includes a package substrate having an integrated waveguide, and first and second integrated circuit chips mounted to the package substrate. The first integrated circuit chip is coupled to the integrated waveguide using a first transmission line to waveguide transition, and the second integrated circuit chip is coupled to the integrated waveguide using a second transmission line to waveguide transition. The first and second integrated circuit chips are configured to communicate by transmitting signals using the integrated waveguide within the package carrier.

公开(公告)号：US20160336637A1

公开(公告)日：2016-11-17

申请号：US15222230

申请日：2016-07-28

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  Duixian Liu ,  Jean-Olivier Plouchart ,  Alberto Valdes-Garcia

IPC: H01P3/16

CPC classification number: H01P5/107 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/66 ,  H01L24/16 ,  H01L25/0655 ,  H01L2223/6616 ,  H01L2223/6627 ,  H01L2223/6633 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/17181 ,  H01L2924/10253 ,  H01L2924/1421 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/19031 ,  H01L2924/19032 ,  H01L2924/19033 ,  H01L2924/19039 ,  H01P3/08 ,  H01P3/121 ,  H01P3/16 ,  H01P5/02 ,  H01P5/08 ,  H01P5/087 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q1/50 ,  H05K1/0243 ,  H05K2201/037 ,  H05K2201/10522

Abstract: Embodiments include package structures having integrated waveguides to enable high data rate communication between package components. For example, a package structure includes a package substrate having an integrated waveguide, and first and second integrated circuit chips mounted to the package substrate. The first integrated circuit chip is coupled to the integrated waveguide using a first transmission line to waveguide transition, and the second integrated circuit chip is coupled to the integrated waveguide using a second transmission line to waveguide transition. The first and second integrated circuit chips are configured to communicate by transmitting signals using the integrated waveguide within the package carrier.

公开(公告)号：US09472789B2

公开(公告)日：2016-10-18

申请号：US14340253

申请日：2014-07-24

Applicant: International Business Machines Corporation

Inventor： Paul S. Andry ,  Joana Sofia Branquinho Teresa Maria ,  Bing Dang ,  Michael A. Gaynes ,  John U. Knickerbocker ,  Eric P. Lewandowski ,  Cornelia K. Tsang ,  Bucknell C. Webb

IPC: H01L21/336 ,  H01M2/02 ,  G02C7/08 ,  A61B5/145 ,  H01M4/38 ,  H01M4/50 ,  H01M4/66 ,  H01M10/04 ,  C25D5/02 ,  H01M4/42 ,  H01M4/48 ,  C25D1/04 ,  C25D1/22 ,  H01M4/139 ,  H01M4/02 ,  C25D3/22 ,  C25D3/54 ,  C25D3/56 ,  C25D5/10 ,  C25D5/50

CPC classification number: H01M2/0202 ,  A61B5/145 ,  A61B2562/028 ,  C25D1/04 ,  C25D1/22 ,  C25D3/22 ,  C25D3/54 ,  C25D3/56 ,  C25D3/565 ,  C25D5/02 ,  C25D5/10 ,  C25D5/50 ,  G02C7/083 ,  H01M4/139 ,  H01M4/38 ,  H01M4/42 ,  H01M4/48 ,  H01M4/50 ,  H01M4/661 ,  H01M4/664 ,  H01M10/0436 ,  H01M2002/0205 ,  H01M2004/027 ,  H01M2004/028 ,  Y10T29/49108 ,  Y10T29/49115

Abstract: A microsystem with an integrated energy source serves as a platform and ecosystem for a variety of microsystems for implanting into human tissue. The microsystem includes a flexible battery located in an enclosed void. The enclosed void is formed by joining a first dielectric element with a second dielectric element.

Abstract translation: 具有综合能源的微系统作为植入人体组织的各种微系统的平台和生态系统。 微系统包括位于封闭空隙中的柔性电池。 封闭的空隙通过将第一介电元件与第二介电元件接合而形成。

公开(公告)号：US20160233190A1

公开(公告)日：2016-08-11

申请号：US15131171

申请日：2016-04-18

Applicant: International Business Machines Corporation

Inventor： William E. Bernier ,  Bing Dang ,  Mario J. Interrante ,  John U. Knickerbocker ,  Son K. Tran

IPC: H01L23/00 ,  H01L23/367 ,  H01L25/065 ,  H01L23/60 ,  H01L23/552 ,  H01L23/498

CPC classification number: H01L24/81 ,  H01L23/367 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/552 ,  H01L23/60 ,  H01L24/09 ,  H01L25/0655 ,  H01L2224/08238 ,  H01L2224/16225 ,  H01L2224/81192 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/15738 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/19105 ,  H01L2924/00

Abstract: A interposer sandwich structure comprises a top interposer and a bottom interposer enclosing an integrated circuit electronic device that includes means for attaching the device to the bottom interposer, and an interconnection structure connecting the top interposer to the bottom interposer. The top interposer may also be directly connected to a chip carrier in addition to the bottom interposer. The structure provides shielding and protection of the device against Electrostatic Discharge (ESD), Electromagnetic Interference (EMI), and Electromagnetic Conductivity (EMC) in miniaturized 3D packaging.

Abstract translation: 插入器夹层结构包括顶部插入器和封装集成电路电子器件的底部插入器，其包括用于将器件附接到底部插入器的装置，以及将顶部插入件连接到底部插入器的互连结构。 除了底部插入器之外，顶部插入器还可以直接连接到芯片载体。 该结构提供了在小型化3D封装中防止静电放电（ESD），电磁干扰（EMI）和电磁导电（EMC））的器件的屏蔽和保护。

公开(公告)号：US20150132924A1

公开(公告)日：2015-05-14

申请号：US14078990

申请日：2013-11-13

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  Sarah H. Knickerbocker ,  Douglas C. La Tulipe, JR. ,  Spyridon Skordas ,  Cornelia K. Tsang ,  Kevin R. Winstel

IPC: H01L21/683 ,  H01L21/673 ,  H01L21/78

CPC classification number: H01L21/6836 ,  H01L21/6835 ,  H01L21/78 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381

Abstract: A method of removing a handler wafer. There is provided a handler wafer and a semiconductor device wafer having a plurality of semiconductor devices, the semiconductor device wafer having an active surface side and an inactive surface side. An amorphous carbon layer is applied to a surface of the handler wafer. An adhesive layer is applied to at least one of the amorphous carbon layer of the handler wafer and the active surface side of the semiconductor device wafer. The handler wafer is joined to the semiconductor device wafer through the adhesive layer or layers. Laser radiation is applied to the handler wafer to cause heating of the amorphous carbon layer that in turn causes heating of the adhesive layer or layers. The plurality of semiconductor devices of the semiconductor device wafer are then separated from the handler wafer.

Abstract translation: 一种去除处理器晶片的方法。 提供了具有多个半导体器件的处理器晶片和半导体器件晶片，半导体器件晶片具有有源表面侧和非活性表面侧。 将无定形碳层施加到处理器晶片的表面。 将粘合剂层施加到处理器晶片的无定形碳层和半导体器件晶片的有源表面侧中的至少一个。 处理器晶片通过粘合层或多层结合到半导体器件晶片。 将激光辐射施加到处理器晶片，以引起无定形碳层的加热，这又导致粘合剂层或层的加热。 然后将半导体器件晶片的多个半导体器件与处理器晶片分离。

公开(公告)号：US11810893B2

公开(公告)日：2023-11-07

申请号：US17334937

申请日：2021-05-31

Applicant: International Business Machines Corporation

Inventor： William Emmett Bernier ,  Bing Dang ,  John Knickerbocker ,  Son Kim Tran ,  Mario J. Interrante

IPC: H01L23/00 ,  H01L23/552 ,  H01L23/498 ,  H01L25/065 ,  H01L23/367 ,  H01L23/60

CPC classification number: H01L24/81 ,  H01L23/367 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/552 ,  H01L23/60 ,  H01L24/09 ,  H01L25/0655 ,  H01L2224/08238 ,  H01L2224/16225 ,  H01L2224/81192 ,  H01L2924/014 ,  H01L2924/0105 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/1579 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/15738 ,  H01L2924/15787 ,  H01L2924/19105 ,  H01L2924/1461 ,  H01L2924/00

Abstract: An interposer sandwich structure includes a top interposer and a bottom interposer enclosing an integrated circuit electronic device that includes an attachment for attaching the device to the bottom interposer, and an interconnection structure connecting the top interposer to the bottom interposer. The top interposer may also be directly connected to a chip carrier in addition to the bottom interposer. The structure provides shielding and protection of the device against Electrostatic Discharge (ESD), Electromagnetic Interference (EMI), and Electromagnetic Conductivity (EMC) in miniaturized 3D packaging.

公开(公告)号：US20230284965A1

公开(公告)日：2023-09-14

申请号：US17690297

申请日：2022-03-09

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Bing Dang ,  Bo Wen ,  Tian Hao ,  JEFFREY L. ROGERS ,  Erhan Bilal

IPC: A61B5/00 ,  A61B5/0205 ,  A61B5/024 ,  A61B5/0531 ,  G16H10/20

CPC classification number: A61B5/4088 ,  A61B5/0205 ,  A61B5/024 ,  A61B5/0531 ,  A61B5/4064 ,  A61B5/6802 ,  A61B5/7221 ,  G16H10/20

Abstract: A method, a structure, and a computer system for traumatic event detection. The exemplary embodiments may include collecting data using sensors worn by a user and identifying a traumatic event based on applying a model to the data, wherein the model correlates values of the data with traumatic events and traumatic brain injuries. The exemplary embodiments may further include identifying the traumatic brain injury resulting from the traumatic event.

公开(公告)号：US11710669B2

公开(公告)日：2023-07-25

申请号：US16882624

申请日：2020-05-25

Applicant: International Business Machines Corporation

Inventor： John Knickerbocker ,  Bing Dang ,  Qianwen Chen ,  Joshua M. Rubin ,  Arvind Kumar

IPC: H01L21/66 ,  H01L25/00 ,  H01L25/065 ,  H01L25/18

CPC classification number: H01L22/20 ,  H01L25/0657 ,  H01L25/18 ,  H01L25/50 ,  H01L2225/06513 ,  H01L2225/06541

Abstract: One or more die stacks are disposed on a redistribution layer (RDL) to make an electronic package. The die stacks include a die and one or more Through Silicon Via (TSV) dies. Other components and/or layers, e.g. interposes layers, can be included in the structure. An epoxy layer disposed on the RDL top surface and surrounds and attached to all the TSV die sides and all the die sides. Testing circuitry is located in various locations in some embodiments. Locations including in the handler, die, TSV dies, interposes, etc. Testing methods are disclosed, Methods of making including “die first” and “die last” methods are also disclosed. Methods of making heterogenous integrated structure and the resulting structures are also disclosed, particularly for large scale, e.g. wafer and panel size, applications.

公开(公告)号：US11666269B2

公开(公告)日：2023-06-06

申请号：US16874036

申请日：2020-05-14

Applicant: International Business Machines Corporation

Inventor： Rajeev Narayanan ,  Bing Dang ,  Jenna Reinen ,  Jeffrey L. Rogers

IPC: A61B5/00 ,  A61B5/16 ,  A61B5/01 ,  A61B5/11 ,  A61B5/0531 ,  A61B5/30 ,  A61B5/369

CPC classification number: A61B5/4809 ,  A61B5/0059 ,  A61B5/01 ,  A61B5/0531 ,  A61B5/1103 ,  A61B5/163 ,  A61B5/30 ,  A61B5/369 ,  A61B5/6803 ,  A61B2562/0214 ,  A61B2562/0219 ,  A61B2562/0257 ,  A61B2562/0271 ,  A61B2562/166

Abstract: A sleeping mask includes a signal processor for processing sensor data, an infrared light source coupled to the signal processor and configured to emit infrared light toward an eyelid of a user, and an array of infrared sensors coupled to the signal processor and configured to receive infrared light reflected from the eyelid of the user.