中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

131 records (took 0.031 seconds)

    Micro pick up array alignment encoder
    31.
    发明授权
    Micro pick up array alignment encoder 有权
    微型拾取阵列校准编码器

    公开(公告)号：US09296111B2

    公开(公告)日：2016-03-29

    申请号：US13948039

    申请日：2013-07-22

    Applicant: LuxVue Technology Corporation

    Inventor： Andreas Bibl ,  Paul Argus Parks

    IPC: G01B11/00 ,  B25J15/00 ,  G01D5/347 ,  H01L21/68 ,  H01L21/67

    CPC classification number: B25J15/0085 ,  G01D5/347 ,  H01L21/67144 ,  H01L21/681

    Abstract: Micro pick up arrays and methods for transferring micro devices from a carrier substrate are disclosed. In an embodiment, a micro pick up array alignment encoder detects relative position between a micro pick up array having an encoder scale and a target substrate having a corresponding reference scale. In an embodiment, the micro pick up array alignment encoder facilitates alignment of the micro pick up array with the target substrate.

    Abstract translation: 公开了用于从载体衬底传送微器件的微拾取阵列和方法。 在一个实施例中，微拾取阵列对准编码器检测具有编码器刻度的微拾取阵列和具有相应参考刻度的目标衬底之间的相对位置。 在一个实施例中，微拾取阵列对准编码器有利于微拾取阵列与目标衬底的对准。

    COMPLIANT ELECTROSTATIC TRANSFER HEAD WITH SPRING SUPPORT LAYER
    33.
    发明申请
    COMPLIANT ELECTROSTATIC TRANSFER HEAD WITH SPRING SUPPORT LAYER 有权
    具有弹簧支撑层的合适的静电转印头

    公开(公告)号：US20150364424A1

    公开(公告)日：2015-12-17

    申请号：US14307325

    申请日：2014-06-17

    Applicant: LuxVue Technology Corporation

    Inventor： Dariusz Golda ,  Stephen P. Bathurst ,  John A. Higginson ,  Andreas Bibl ,  Jeffrey Birkmeyer

    IPC: H01L23/538 ,  H01L21/768

    CPC classification number: H01L23/5384 ,  B81C99/002 ,  H01L21/76898 ,  H01L24/75 ,  H01L24/95

    Abstract: A compliant electrostatic transfer head and method of forming a compliant electrostatic transfer head are described. In an embodiment, a compliant electrostatic transfer head includes a cavity in a base substrate, a spring support layer on the base substrate, and a patterned device layer on the spring support layer. The spring support layer includes a spring support layer beam profile that extends over and is deflectable toward the cavity, and the patterned device layer includes an electrode beam profile that is supported by the spring support layer beam profile and extends over and is deflectable toward the cavity.

    Abstract translation: 描述了柔性静电转印头和形成顺应性静电转印头的方法。 在一个实施例中，顺应性静电转印头包括基底衬底中的空腔，在基底衬底上的弹簧支撑层，以及弹簧支撑层上的图案化器件层。 弹簧支撑层包括弹簧支撑层梁轮廓，该弹性支撑层梁型材向空腔延伸并且可偏转，并且图案化的装置层包括由弹簧支撑层梁轮廓支撑并且朝向腔体可偏转的电极梁轮廓 。

    MASS TRANSFER TOOL MANIPULATOR ASSEMBLY WITH REMOTE CENTER OF COMPLIANCE
    35.
    发明申请
    MASS TRANSFER TOOL MANIPULATOR ASSEMBLY WITH REMOTE CENTER OF COMPLIANCE 有权
    具有远程符合性中心的大量传送工具操纵器组件

    公开(公告)号：US20150321338A1

    公开(公告)日：2015-11-12

    申请号：US14273298

    申请日：2014-05-08

    Applicant: LuxVue Technology Corporation

    Inventor： Paul Argus Parks ,  Nile Alexander Light ,  Stephen P. Bathurst ,  John A. Higginson ,  Andreas Bibl

    IPC: B25J7/00

    CPC classification number: B25J7/00 ,  B25J9/0015 ,  B25J18/007 ,  H01L2224/7565 ,  H01L2224/75822 ,  Y10T74/20354

    Abstract: Systems and methods for transferring a micro device or an array of micro devices to or from a substrate are disclosed. In an embodiment, a remote center robot allows on-the-fly alignment between a micro pick up array and a target substrate. The remote center robot may include a plurality of symmetric linkages that move independently and share a remote rotational center. In an embodiment, the remote rotational center may be positioned at a surface of the micro pick up array to prevent damage to the array of micro devices during transfer.

    Abstract translation: 公开了用于将微器件或微阵列阵列转移到衬底或从衬底传送微阵列的系统和方法。 在一个实施例中，远程中心机器人允许微拾取阵列和目标基板之间的即时对准。 远程中心机器人可以包括独立移动并共享远程旋转中心的多个对称联动。 在一个实施例中，远程旋转中心可以定位在微拾取阵列的表面处，以防止在传送期间损坏微器件阵列。

    RFID TAG AND MICRO CHIP INTEGRATION DESIGN
    38.
    发明申请
    RFID TAG AND MICRO CHIP INTEGRATION DESIGN 有权
    RFID标签和微芯片集成设计

    公开(公告)号：US20150235121A1

    公开(公告)日：2015-08-20

    申请号：US14183427

    申请日：2014-02-18

    Applicant: LuxVue Technology Corporation

    Inventor： Vikram Pavate ,  Andreas Bibl

    IPC: G06K19/077 ,  H05K3/20 ,  H05K3/14 ,  H05K3/34 ,  H05K3/12

    CPC classification number: G06K19/07783 ,  H05K1/0293 ,  H05K1/165 ,  H05K2201/10098 ,  H05K2203/107 ,  H05K2203/175 ,  Y10T29/49144 ,  Y10T29/53174

    Abstract: An integrated micro chip, method of integrating a micro chip, and micro chip integration system are described. In an embodiment, a micro chip such as a micro RFID chip or integrated passive device (IPD) is electrostatically transferred and bonded to a conductive pattern including a line break. In an embodiment, the line break is formed by a suitable cutting technique such as laser laser ablation, ion beam etching, or photolithography with chemical etching to accommodate the micro chip.

    Abstract translation: 描述了集成微芯片，集成微芯片的方法和微芯片集成系统。 在一个实施例中，诸如微型RFID芯片或集成无源器件（IPD）的微芯片被静电转印并结合到包括断线的导电图案。 在一个实施例中，线断裂通过合适的切割技术形成，例如激光激光烧蚀，离子束蚀刻或具有化学蚀刻的光刻以适应微芯片。

Patent Agency Ranking