公开(公告)号：US6104087A

公开(公告)日：2000-08-15

申请号：US138858

申请日：1998-08-24

申请人： Thomas H. DiStefano ,  John W. Smith

发明人： Thomas H. DiStefano ,  John W. Smith

IPC分类号： H01L21/60 ,  H01L21/30 ,  H01L21/48 ,  H01L21/603 ,  H01L23/12 ,  H01L23/22 ,  H01L23/48 ,  H01L23/498 ,  H01L23/50 ,  H01L23/64 ,  H01R12/71 ,  H05K1/11 ,  H05K3/36 ,  H05K3/40 ,  H01L23/52

CPC分类号： H01L23/4985 ,  H01L21/4839 ,  H01L23/22 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/642 ,  H01L24/72 ,  H05K3/4084 ,  H01L2224/16 ,  H01L2224/45124 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01066 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/118 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2203/063 ,  H05K3/361 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49158

摘要： A microelectronic connection component includes a dielectric sheet having an area array of elongated, strip-like leads. Each lead has a terminal end fastened to the sheet and a tip end detachable from the sheet. Each lead extends horizontally parallel to the sheet, from its terminal end to its tip end. The tip ends are attached to a second element, such as another dielectric sheet or a semiconductor wafer. The first and second elements are then moved relative to one another to advance the tip end of each lead vertically away from the dielectric sheet and deform the leads into a bent, vertically extensive configuration. The preferred structures provide semiconductor chip assemblies with a planar area array of contacts on the chip, an array of terminals on the sheet positioned so that each terminal is substantially over the corresponding contact, and an array of metal S-shaped ribbons connected between the terminals and contacts. A compliant dielectric material may be provided between the sheet and chip, substantially surrounding the S-shaped ribbons.

摘要翻译： 微电子连接部件包括具有细长带状引线的区域阵列的电介质片。 每个引线具有紧固到片材的终端和从片材可拆卸的尖端。 每个引线从其终端到其尖端水平平行地延伸。 尖端附接到第二元件，例如另一个电介质片或半导体晶片。 然后，第一和第二元件相对于彼此移动，以使每个引线的尖端垂直远离电介质片，并将引线变形成弯曲的垂直广泛配置。 优选的结构提供半导体芯片组件，其具有在芯片上的平面区域阵列的触点，片材上的端子阵列被定位成使得每个端子基本上在相应的触点上方，以及连接在端子之间的金属S形带阵列 和联系人。 柔性电介质材料可以设置在片和芯片之间，基本上围绕S形带。

公开(公告)号：US6002168A

公开(公告)日：1999-12-14

申请号：US978082

申请日：1997-11-25

申请人： Pieter H. Bellaar ,  Thomas H. DiStefano ,  Joseph Fjelstad ,  Christopher M. Pickett ,  John W. Smith

发明人： Pieter H. Bellaar ,  Thomas H. DiStefano ,  Joseph Fjelstad ,  Christopher M. Pickett ,  John W. Smith

IPC分类号： H01L23/498 ,  H05K3/28 ,  H05K3/34 ,  H05K3/40 ,  H01L23/48 ,  H01L23/06 ,  H01L23/52

CPC分类号： H01L23/49816 ,  H01L23/4985 ,  H05K3/3436 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L24/48 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K2201/049 ,  H05K2201/10234 ,  H05K2201/10378 ,  H05K2201/10977 ,  H05K2203/041 ,  H05K3/284 ,  H05K3/4084 ,  Y02P70/613

摘要： A microelectronic component for mounting a rigid substrate, such as a hybrid circuit to a rigid support substrate, such as a printed circuit board. The microelectronic component includes a rigid interposer which may have a chip mounted on its first surface; a pattern of contacts on the rigid interposer; a flexible interposer overlying the second surface of the rigid interposer; a pattern of terminals on the flexible interposer; flexible leads; and solder coated copper balls mounted on the flexible interposer. The microelectronic component may have a socket assembly mounted on the first surface of the rigid interposer. The microelectronic component may be mounted on a rigid support substrate.

摘要翻译： 一种微电子部件，用于将诸如混合电路的刚性基板安装到刚性支撑基板，例如印刷电路板。 微电子部件包括可以在其第一表面上安装芯片的刚性插入器; 刚性插入件上的接触图案; 位于刚性插入件的第二表面上的柔性插入件; 柔性插入器上的端子图案; 柔性线 以及安装在柔性插入件上的焊接铜球。 微电子部件可以具有安装在刚性插入件的第一表面上的插座组件。 微电子部件可以安装在刚性支撑基板上。

公开(公告)号：US5821608A

公开(公告)日：1998-10-13

申请号：US709127

申请日：1996-09-06

申请人： Thomas H. DiStefano ,  Joseph Fjelstad ,  John W. Smith

发明人： Thomas H. DiStefano ,  Joseph Fjelstad ,  John W. Smith

IPC分类号： H01L23/13 ,  H01L23/31 ,  H01L23/498 ,  H01L23/495 ,  H01L23/48 ,  H01L23/52 ,  H01L23/02

CPC分类号： H01L24/48 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L2224/05599 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/85207 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181

摘要： A semiconductor chip package includes a substrate having a first surface and a second surface and a gap extending from the first surface to the second surface. The substrate defines a plane which is substantially parallel to the first and second surfaces. The substrate has conductive terminals accessible and the second surface and bond pads. Conductive leads extend across the gap whereby each lead electrically interconnects one of the conductive terminals and one of the bond pads. Each lead includes an expansion section within the gap which is laterally curved with respect to the plane. A semiconductor chip having a back surface and a face surface is assembled to the substrate. The face surface includes a plurality of contacts on the periphery of the face surface of the chip whereby the chip contracts are electrically connected to the bond pads on the substrate.

摘要翻译： 半导体芯片封装包括具有第一表面和第二表面的衬底以及从第一表面延伸到第二表面的间隙。 衬底限定基本上平行于第一表面和第二表面的平面。 衬底具有可接触的导电端子和第二表面和接合焊盘。 导电引线延伸穿过间隙，由此每个引线将导电端子中的一个导电互连，并且其中一个接合焊盘。 每个引线包括在间隙内的相对于平面横向弯曲的膨胀部分。 将具有背面和表面的半导体芯片组装到基板上。 面表面包括在芯片的表面的周边上的多个触点，由此芯片收缩电连接到衬底上的接合焊盘。

公开(公告)号：US5810609A

公开(公告)日：1998-09-22

申请号：US519828

申请日：1995-08-28

申请人： Anthony B. Faraci ,  James B. Zaccardi ,  Thomas H. DiStefano ,  John W. Smith

发明人： Anthony B. Faraci ,  James B. Zaccardi ,  Thomas H. DiStefano ,  John W. Smith

IPC分类号： H01R13/24 ,  H01R33/74 ,  H05K3/32 ,  H05K3/40 ,  H05K7/10 ,  H01R9/09

CPC分类号： H05K7/1084 ,  H05K3/326 ,  H05K3/4092 ,  H01R12/714 ,  H01R13/24 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49144

摘要： A connector for microelectronic devices having bump leads and methods for fabricating and using the connector. A dielectric substrate has a plurality of posts extending upwardly from a front surface. The posts may be arranged in an array of post groups each group defining a gap therebetween. A generally laminar contact extends from each post top. The bump leads are each inserted within a respective gap thereby engaging the contacts which wipe against the bump lead as it continues to be inserted. Typically, distal portions of the contacts deflect downwardly toward the substrate and outwardly away from the center of the gap as the bump lead is inserted into a gap.

摘要翻译： 具有凸起引线的微电子器件的连接器和用于制造和使用连接器的方法。 电介质基板具有从前表面向上延伸的多个柱。 柱可以以每组在其间限定间隙的一组柱组的形式排列。 大体层状接触从每个顶部延伸。 凸块引线各自插入在相应的间隙内，从而使其接触，当其继续插入时，触头抵靠凸起引线。 通常，当凸块引线插入到间隙中时，触头的远端部分向下偏转朝向基板并向外远离间隙的中心。

公开(公告)号：US5518964A

公开(公告)日：1996-05-21

申请号：US271768

申请日：1994-07-07

申请人： Thomas H. DiStefano ,  John W. Smith

发明人： Thomas H. DiStefano ,  John W. Smith

IPC分类号： H01L21/60 ,  H01L21/30 ,  H01L21/48 ,  H01L21/603 ,  H01L23/12 ,  H01L23/22 ,  H01L23/48 ,  H01L23/498 ,  H01L23/50 ,  H01L23/64 ,  H01R12/71 ,  H05K1/11 ,  H05K3/36 ,  H05K3/40 ,  H01L21/20

CPC分类号： H01L23/4985 ,  H01L21/4839 ,  H01L23/22 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/642 ,  H01L24/72 ,  H05K3/4084 ,  H01L2224/16 ,  H01L2224/45124 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01066 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/118 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2203/063 ,  H05K3/361 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49158

摘要： A microelectronic connection component includes a dielectric sheet having an area array of elongated, strip-like leads. Each lead has a terminal end fastened to the sheet and a tip end detachable from the sheet. Each lead extends horizontally parallel to the sheet, from its terminal end to its tip end. The tip ends are attached to a second element, such as another dielectric sheet or a semiconductor wafer. The first and second elements are then moved relative to one another to advance the tip end of each lead vertically away from the dielectric sheet and deform the leads into a bent, vertically extensive configuration. The preferred structures provide semiconductor chip assemblies with a planar area array of contacts on the chip, an array of terminals on the sheet positioned so that each terminal is substantially over the corresponding contact, and an array of metal S-shaped ribbons connected between the terminals and contacts. A compliant dielectric material may be provided between the sheet and chip, substantially surrounding the S-shaped ribbons.

摘要翻译： 微电子连接部件包括具有细长带状引线的区域阵列的电介质片。 每个引线具有紧固到片材的终端和从片材可拆卸的尖端。 每个引线从其终端到其尖端水平平行地延伸。 尖端附接到第二元件，例如另一个电介质片或半导体晶片。 然后，第一和第二元件相对于彼此移动，以使每个引线的尖端垂直远离电介质片，并将引线变形成弯曲的垂直广泛配置。 优选的结构提供半导体芯片组件，其具有在芯片上的平面区域阵列的触点，片材上的端子阵列被定位成使得每个端子基本上在相应的触点上方，以及连接在端子之间的金属S形带阵列 和联系人。 柔性电介质材料可以设置在片和芯片之间，基本上围绕S形带。

公开(公告)号：US07368818B2

公开(公告)日：2008-05-06

申请号：US11259398

申请日：2005-10-26

申请人： Zlata Kovac ,  Craig S. Mitchell ,  Thomas H. DiStefano ,  John W. Smith

发明人： Zlata Kovac ,  Craig S. Mitchell ,  Thomas H. DiStefano ,  John W. Smith

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/81 ,  H01L21/56 ,  H01L21/563 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/29 ,  H01L24/72 ,  H01L24/97 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2224/83136 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/351 ,  H05K1/118 ,  H05K3/361 ,  H05K3/4084 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2203/063 ,  H01L2224/81 ,  H01L2924/3512 ,  H01L2924/00

摘要： An assembly includes a structure, a plurality of terminals and a plurality of compliant pads disposed between said terminals and said structure. The terminals are aligned with at least some of said pads, with the pads providing a standoff between the structure and the terminals. The compliant pads are preferably made of a non-conductive material such as a silicone elastomer.

摘要翻译： 组件包括设置在所述端子和所述结构之间的结构，多个端子和多个柔性焊盘。 端子与至少一些所述焊盘对准，焊盘在结构和端子之间提供间隔。 柔性衬垫优选地由诸如硅氧烷弹性体的非导电材料制成。

公开(公告)号：US06265759B1

公开(公告)日：2001-07-24

申请号：US09120006

申请日：1998-07-21

申请人： Thomas H. DiStefano ,  Joseph Fjelstad ,  John W. Smith

发明人： Thomas H. DiStefano ,  Joseph Fjelstad ,  John W. Smith

IPC分类号： H01L23495

CPC分类号： H01L24/48 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/85207 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00011 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399

摘要： A semiconductor chip package having an internal laterally curved lead in order to compensate for the CTE mismatch between a semiconductor chip and a supporting substrate, such as a PWB.

摘要翻译： 一种具有内部横向弯曲引线的半导体芯片封装，以补偿半导体芯片和诸如PWB的支撑基板之间的CTE失配。

公开(公告)号：US06255723B1

公开(公告)日：2001-07-03

申请号：US09179273

申请日：1998-10-27

申请人： David Light ,  John W. Smith ,  Thomas H. DiStefano ,  David R. Baker ,  Hung-Ming Wang

发明人： David Light ,  John W. Smith ,  Thomas H. DiStefano ,  David R. Baker ,  Hung-Ming Wang

IPC分类号： H01L23495

CPC分类号： H01L24/50 ,  H01L23/49572 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327

摘要： A layered lead is disclosed including a layer of structural material which has top and bottom sides, a layer of fatigue-resistant material on the top and bottom surfaces and a layer of bonding material covering the fatigue-resistant layer on the bottom surface for connection to a contact on a chip. An asymmetrical distribution of bonding material on the top and bottom sides may be used to provide reinforcement of the lead against stress. The fatigue-resistant material also acts as a barrier against diffusion between the metal layers.

摘要翻译： 公开了一种分层引线，其包括具有顶侧和底侧的结构材料层，在顶表面和底表面上的耐疲劳材料层，以及覆盖底表面上的抗疲劳层的接合材料层，用于连接到 芯片上的一个接触。 可以使用顶部和底部上的接合材料的不对称分布来提供引线抵抗应力的增强。 耐疲劳材料还用作阻挡金属层之间扩散的屏障。

公开(公告)号：US06228685B1

公开(公告)日：2001-05-08

申请号：US09174074

申请日：1998-10-16

申请人： Masud Beroz ,  Thomas H. DiStefano ,  John W. Smith

发明人： Masud Beroz ,  Thomas H. DiStefano ,  John W. Smith

IPC分类号： H01L4400

CPC分类号： H01L23/544 ,  H01L21/4839 ,  H01L21/563 ,  H01L21/6836 ,  H01L23/22 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L23/642 ,  H01L24/50 ,  H01L24/72 ,  H01L24/86 ,  H01L2221/68327 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3025 ,  H05K1/118 ,  H05K3/361 ,  H05K3/4084 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2203/063

摘要： A microelectronic component is fabricated by bonding a flexible sheet in tension on a rigid frame so that the sheet spans an aperture in the frame, and performing one or more operations on features on the flexible sheet which will be incorporated into the finished component. The fame maintains dimensional stability of the sheet and aids in regsitration of the sheet with external elements such as processing tools or other parts which are to be assembled with the sheet. Desirably, the frame has a coefficient of thermal expansion different from that of the sheet so that when the sheet is brought from the bonding temperature to the temperature used in processing, differential thermal expansion or contraction will cause increased tension in the sheet.

摘要翻译： 通过将刚性框架上的张力柔性片粘合在刚性框架上来制造微电子部件，使得片材跨越框架中的孔，并对将被并入成品部件的柔性片材上的特征进行一个或多个操作。 名气维持片材的尺寸稳定性，并有助于片材的外部元件如加工工具或与片材组装的其他部件的注册。 理想地，框架具有与片材不同的热膨胀系数，使得当片材从接合温度提高到加工中使用的温度时，差分热膨胀或收缩将导致片材的张力增加。

公开(公告)号：US5859472A

公开(公告)日：1999-01-12

申请号：US927601

申请日：1997-09-12

申请人： Thomas H. DiStefano ,  John W. Smith

发明人： Thomas H. DiStefano ,  John W. Smith

IPC分类号： H01L21/56 ,  H01L23/498 ,  H05K3/40 ,  H01L23/48 ,  H01L29/06

CPC分类号： H01L21/563 ,  H01L23/49811 ,  H05K3/4092 ,  H01L2224/73203 ,  H01L2924/01079 ,  H01L2924/01322

摘要： A microelectronic assembly includes first and second microelectronic elements having confronting surfaces that are spaced apart from one another. Vertically extensive flexible lead elements interconnect electrical connections on the microelectronic elements. Each of the flexible lead elements may include a plurality of curved conductors that are electrically connected and parallel to one another. The lead elements may initially be formed on a lead bearing surface, and have a terminal end for connection to the first microelectronic element, and a tip end for connection to the second microelectronic element. The terminal end is disposed on the lead bearing surface and fixed to it, while the tip end is releasably connected to the lead bearing surface, and spaced apart from the terminal end on an offset axis. Curved leads interconnect the tip end and the terminal end.

摘要翻译： 微电子组件包括具有彼此间隔开的相对表面的第一和第二微电子元件。 垂直广泛的柔性引线元件互连微电子元件上的电连接。 每个柔性引线元件可以包括电连接并彼此平行的多个弯曲导体。 引线元件可以最初形成在引线轴承表面上，并且具有用于连接到第一微电子元件的终端和用于连接到第二微电子元件的末端。 终端设置在引导轴承表面上并固定在其上，而前端可释放地连接到引导轴承表面，并且在偏移轴线上与终端间隔开。 弯曲导线将尖端和终端互连。