Semiconductor image sensor and method for fabricating the same
    36.
    发明授权
    Semiconductor image sensor and method for fabricating the same 有权
    半导体图像传感器及其制造方法

    公开(公告)号:US07745834B2

    公开(公告)日:2010-06-29

    申请号:US11471659

    申请日:2006-06-21

    IPC分类号: H01L27/148

    摘要: A semiconductor image sensor includes: a semiconductor imaging element including an imaging area, a peripheral circuit area, and an electrode area; cylindrical electrodes provided on electrode terminals so as to be electrically connected with an external device; and a transparent resin layer provided on the upper surface of the semiconductor imaging element. The upper surface of each cylindrical electrode and the upper surface of the transparent resin layer are substantially of the same height.

    摘要翻译: 半导体图像传感器包括:半导体成像元件,包括成像区域,外围电路区域和电极区域; 设置在电极端子上以与外部装置电连接的圆柱形电极; 以及设置在半导体摄像元件的上表面上的透明树脂层。 每个圆柱形电极的上表面和透明树脂层的上表面基本上具有相同的高度。

    Solid-state imaging device
    37.
    发明授权
    Solid-state imaging device 有权
    固态成像装置

    公开(公告)号:US07719585B2

    公开(公告)日:2010-05-18

    申请号:US12510562

    申请日:2009-07-28

    摘要: A solid-state imaging-device includes a base, frame-shaped ribs provided on the base and forming an internal space, a plurality of wiring members for electrically leading the internal space of a housing formed by the base and the ribs to an external portion, an imaging element fixed to the base inside the internal space, a transparent plate fixed to an upper surface of the ribs, and connecting members electrically connecting electrodes of the imaging element to the wiring members, wherein a plurality of protrusions are provided in a region of the base that faces the imaging element, and the imaging element is fixed by adhesive to the base while being supported by the protrusions. The protrusions enable the imaging element to avoid distortion caused by following the surface of the base, thereby suppressing the effect on electrical properties of the imaging element.

    摘要翻译: 固态成像装置包括基部,设置在基部上并形成内部空间的框状肋,多个布线构件,用于将由基部和肋形成的壳体的内部空间电引导到外部部分 ,固定在内部空间内的基座的成像元件,固定到肋的上表面的透明板,以及将成像元件的电极电连接到布线构件的连接构件,其中在区域中设置多个突起 面向成像元件的基部,并且成像元件通过粘合剂固定到基部,同时由突起支撑。 突起使得成像元件能够避免由于跟随基底的表面引起的变形,从而抑制对成像元件的电性能的影响。