公开(公告)号：US20090117418A1

公开(公告)日：2009-05-07

申请号：US11996433

申请日：2006-07-13

申请人： Takeshi Obata ,  Hideaki Sasaki ,  Yoshinori Watanabe ,  Shin Nakamura ,  Takashi Manako

发明人： Takeshi Obata ,  Hideaki Sasaki ,  Yoshinori Watanabe ,  Shin Nakamura ,  Takashi Manako

IPC分类号： H01M8/00 ,  H01M8/10 ,  H01M8/04

CPC分类号： H01M8/1011 ,  H01M8/04186 ,  H01M8/04223 ,  H01M8/04225 ,  H01M8/04302 ,  H01M8/04753 ,  H01M8/04798 ,  H01M2250/30 ,  Y02B90/18 ,  Y02E60/523

摘要： The present invention is a driving method of a fuel cell in which power is generated from a liquid fuel containing fuel and oxidant by a fuel cell main assembly 5. In order to suppress the degradation of the output characteristics after the stop and storage, a start-up operation S1 which is started after a stop state in which a load is not connected the fuel cell main assembly; a recovery operation S3 in which the liquid fuel is supplied to the fuel cell main assembly 5 such that an electrode of the fuel cell main assembly is reduced after the start-up operation S1; and a normal operation S4 in which the power is supplied to an external load 20.

摘要翻译： 本发明是一种燃料电池的驱动方法，其中燃料电池主组件5由含有燃料和氧化剂的液体燃料产生动力。为了抑制停止和储存后的输出特性的劣化，开始 操作S1，其在负载未连接燃料电池主组件的停止状态之后启动; 恢复操作S3，其中液体燃料被供应到燃料电池主组件5，使得燃料电池主组件的电极在启动操作S1之后减小; 以及其中向外部负载20供电的正常操作S4。

公开(公告)号：US20050108342A1

公开(公告)日：2005-05-19

申请号：US10960480

申请日：2004-10-08

申请人： Hideaki Sasaki ,  Shinji Hirao ,  Tadamichi Obinata

发明人： Hideaki Sasaki ,  Shinji Hirao ,  Tadamichi Obinata

IPC分类号： G06F13/00 ,  G06F21/31 ,  G06F15/16

CPC分类号： G06Q10/10

摘要： A terminal operated by a user is connected to a server group, including a management server, a mail server, and a database server, via the Internet. In the database server, current account information, including a mail address of the user for mail exchange is registered. When the user registers a new mail address in the terminal, the new mail address is notified to the mail server and the database server. The database server updates the registered account information and also updates the account information registered in the mail server. The update of the account information in the server group is notified to the terminal. When the update of the account information is notified, the terminal apparatus requests the database server to send the account information. The terminal internally registers the account information sent from the database server in response to the request.

摘要翻译： 由用户操作的终端通过因特网连接到服务器组，包括管理服务器，邮件服务器和数据库服务器。 在数据库服务器中，登记了当前帐户信息，包括邮件交换用户的邮件地址。 当用户在终端中注册新的邮件地址时，新的邮件地址被通知给邮件服务器和数据库服务器。 数据库服务器更新注册的帐户信息，并更新在邮件服务器中注册的帐户信息。 将服务器组中的帐户信息的更新通知给终端。 当通知帐户信息的更新时，终端装置请求数据库服务器发送账号信息。 终端根据请求内部注册从数据库服务器发送的帐户信息。

公开(公告)号：US06705505B2

公开(公告)日：2004-03-16

申请号：US10278917

申请日：2002-10-24

申请人： Fumio Yoshikawa ,  Hideyuki Fukasawa ,  Mitsugu Shirai ,  Hideaki Sasaki ,  Toshitaka Murakawa ,  Kenichi Hamamura

发明人： Fumio Yoshikawa ,  Hideyuki Fukasawa ,  Mitsugu Shirai ,  Hideaki Sasaki ,  Toshitaka Murakawa ,  Kenichi Hamamura

IPC分类号： B23K306

CPC分类号： H05K3/3484 ,  B23K3/0638 ,  B23K2101/42 ,  H05K3/1216 ,  H05K3/1233 ,  H05K3/3415 ,  H05K3/3447 ,  H05K3/42 ,  H05K2201/09572 ,  H05K2203/0143

摘要： A soldering system which reduces the numbers of steps for paste supply and soldering onto a printed circuit board. A printed circuit board has through holes through which a lead of each provided part is to be inserted. A printing mask is matched with the through holes and a paste receiving plate having holes to which solder paste is supplied corresponding to the through holes is disposed. A printing roller is swept by forcibly rotating it to fill with solder paste, then a printing squeegee follows the printing roller to further fill through holes. Parts are loaded on the through holes and reflowing is carried out on the printed circuit board and paste receiving plate, so that the parts are soldered to the printed circuit board.

摘要翻译： 一种焊接系统，其减少了将糊料供应和焊接到印刷电路板上的步骤数量。 印刷电路板具有通孔，每个所提供的部分的引线将被插入。 打印掩模与通孔匹配，并且设置具有孔的糊状物接收板，相应于通孔向其供应焊膏。 通过强力旋转印刷辊以填充焊膏，印刷辊被跟随印刷辊，以进一步填充通孔。 零件加载在通孔上，并在印刷电路板和糊状物接收板上进行回流，从而将零件焊接到印刷电路板上。

公开(公告)号：US06406357B1

公开(公告)日：2002-06-18

申请号：US09522464

申请日：2000-03-09

申请人： Shinichi Kazui ,  Kazuo Shirase ,  Kenji Morita ,  Hideaki Sasaki ,  Hitoshi Odashima

发明人： Shinichi Kazui ,  Kazuo Shirase ,  Kenji Morita ,  Hideaki Sasaki ,  Hitoshi Odashima

IPC分类号： B24B100

CPC分类号： B28D5/0094 ,  B24B37/042 ,  H01L21/6838

摘要： A surface of a wafer (semiconductor substrate) is subjected to grinding by rotating it and bringing it into contact with a rotating grinding wheel. The grinding wheel is rotated in a first direction at a rotating speed N1. The wafer is rotated in a second direction which is opposite to the first direction at a rotating speed N2, wherein a value of N2/N1 is in the range of 0.006 to 0.025. The wafer is then carried from the grinding process to a dicing process while being maintained in a horizontal position by using a wafer handling jig to prevent the breakage of the wafer. A flash etching process may also be used at the end of the grinding process.

摘要翻译： 通过使晶片（半导体基板）的表面旋转并使其与旋转的砂轮接触来进行研磨。 砂轮以第一方向以转速N1旋转。 晶片以与第一方向相反的第二方向以旋转速度N2旋转，其中N 2 / N 1的值在0.006至0.025的范围内。 然后通过使用晶片处理夹具将晶片从研磨过程运送到切割工艺，同时保持在水平位置以防止晶片的破损。 在研磨过程结束时也可以使用闪光蚀刻工艺。

公开(公告)号：US06340109B2

公开(公告)日：2002-01-22

申请号：US09755106

申请日：2001-01-08

申请人： Yutaka Hashimoto ,  Hideaki Sasaki ,  Mamoru Kobayashi ,  Shinichi Kazui

发明人： Yutaka Hashimoto ,  Hideaki Sasaki ,  Mamoru Kobayashi ,  Shinichi Kazui

IPC分类号： B23K3112

CPC分类号： H05K13/08 ,  G01B11/0608 ,  H01L22/12

摘要： A work having a number of solder bumps on a substrate is mounted on a work positioning mechanism, and scanned by an optical micro head to measure errors of a mount posture of the work. Each stage is controlled to correct the errors, and thereafter, the apex positions of the bumps are scanned and measured. The measurement results are collected by a personal computer, and the measurement results together with control data of each axis are sent to a main personal computer and displayed on its screen. An error of an apex position of each bump from a regression plane is calculated, and if the error is smaller than a reference value, the work is judged to be good.

摘要翻译： 在基板上具有多个焊料凸块的工件安装在工件定位机构上，并由光学微头扫描，以测量工件的安装姿势的误差。 控制每个阶段以校正误差，然后扫描和测量凸块的顶点位置。 测量结果由个人计算机收集，测量结果连同每个轴的控制数据发送到主个人计算机并显示在其屏幕上。 计算出每个凸起从回归平面的顶点位置的误差，如果误差小于参考值，则判断为良好。

公开(公告)号：US06203655B1

公开(公告)日：2001-03-20

申请号：US09197464

申请日：1998-11-23

申请人： Keiji Fujikawa ,  Yutaka Hashimoto ,  Isamu Takaoka ,  Shinichi Kazui ,  Hideaki Sasaki ,  Hitoshi Odashima ,  Mitsugu Shirai

发明人： Keiji Fujikawa ,  Yutaka Hashimoto ,  Isamu Takaoka ,  Shinichi Kazui ,  Hideaki Sasaki ,  Hitoshi Odashima ,  Mitsugu Shirai

IPC分类号： B32B3120

CPC分类号： G06K19/0775 ,  G06K19/07749 ,  H01L23/49855 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/45144 ,  H01L2224/83192 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K3/284 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T156/1089 ,  H01L2924/00 ,  H01L2224/05599

摘要： Electric conductor patterns including antenna coils are formed on one surface of a film. Electronic components are fixed onto the film by a temporary fixing material. A cover film is laminated on the film so that the electrically conductive patterns and the electronic components are covered with the cover film. Simultaneously with the lamination, the electronic components are connected to the electric conductor patterns.

摘要翻译： 在膜的一个表面上形成包括天线线圈的电导体图案。 电子部件通过临时固定材料固定在膜上。 覆盖膜层压在膜上，使得导电图案和电子部件被覆盖膜覆盖。 与层压同时，电子部件连接到电导体图案。

公开(公告)号：US5968382A

公开(公告)日：1999-10-19

申请号：US679661

申请日：1996-07-12

申请人： Takashi Matsumoto ,  Shinichi Kazui ,  Hideaki Sasaki ,  Tateoki Miyauchi ,  Tatsuji Sakamoto

发明人： Takashi Matsumoto ,  Shinichi Kazui ,  Hideaki Sasaki ,  Tateoki Miyauchi ,  Tatsuji Sakamoto

IPC分类号： B28D5/00 ,  B23K26/00 ,  B23K26/03 ,  B23K26/40 ,  B23K26/42 ,  B23K31/00 ,  H01L21/301 ,  H05K3/00

CPC分类号： H05K3/0029 ,  B23K26/034 ,  B23K26/064 ,  B23K26/40 ,  B23K26/60 ,  B23K2203/52 ,  B23K2203/56 ,  Y10T225/304

摘要： A cutting system for cutting a workpiece by laser emission relies upon local cooling of the workpiece at the point at which cutting starts and ends. Optionally, local cooling can also be provided at a cross point where two cutting lines intersect. Relying upon the difference in thermal stress between the laser beam incidence point and the surrounding cooled portion, an initial crack can be generated in a specified direction, whereby the initial crack is propagated to form the desired cutting line. In one embodiment, the cooling is provided by a low temperature solid such as a Peltier cooling plate and the temperature of the workpiece near a point of incidence of the laser beam is determined. The determination can be made by measuring the temperature of a plasma generated near the point of incidence, or by directly measuring the temperature of the portion of the workpiece near the point of incidence.

摘要翻译： 用于通过激光发射切割工件的切割系统依赖于在切割开始和结束时的工件的局部冷却。 可选地，也可以在两条切割线相交的交叉点处设置局部冷却。 依靠激光束入射点和周围冷却部分之间的热应力差，可以在指定方向上产生初始裂纹，由此初始裂纹传播形成所需的切割线。 在一个实施例中，冷却由诸如珀尔帖冷却板的低温固体提供，并且确定靠近激光束的入射点的工件的温度。 可以通过测量在入射点附近产生的等离子体的温度，或通过直接测量靠近入射点的工件的部分的温度来进行测定。

公开(公告)号：US5868817A

公开(公告)日：1999-02-09

申请号：US571859

申请日：1996-07-15

申请人： Masataka Yano ,  Yuji Ogawa ,  Masayuki Arai ,  Fumio Koizumi ,  Noriyuki Masumitsu ,  Hideaki Sasaki ,  Hiroshi Hirata ,  Yoshiaki Kusano ,  Hirobumi Maede, deceased ,  by Noriko Kawai ,  by Keiko Ikemizu

发明人： Masataka Yano ,  Yuji Ogawa ,  Masayuki Arai ,  Fumio Koizumi ,  Noriyuki Masumitsu ,  Hideaki Sasaki ,  Hiroshi Hirata ,  Yoshiaki Kusano ,  Hirobumi Maede, deceased ,  by Noriko Kawai ,  by Keiko Ikemizu

IPC分类号： C21C1/02 ,  C21C5/28 ,  C21C5/35 ,  C21C5/56 ,  C21C7/064

CPC分类号： C21C1/02 ,  C21C5/28 ,  C21C5/35 ,  C21C5/567 ,  C21C7/064

摘要： The present invention provides a process for efficiently dephosphorizing, dephosphorizing and decarbonizing, or desulfurizing, dephosphorizing and decarbonizing a hot metal in a converter. The amount of flux to be charged and the amount of bottom-blown gas are adjusted so that the bottom-blowing agitation power and the CaO/SiO.sub.2 ratio subsequent to the treatment become at least 0.1 kW/ton and from 0.7 to 2.5, respectively and the hot metal temperature at the treatment end point becomes from 1,200.degree. to 1,450.degree. C. Furthermore, the operation of the process is controlled so that the sum of a T.Fe concentration and a MnO concentration in the slag subsequent to the treatment becomes from 10 to 35% by weight by adjusting the top-blown oxygen feed rate, the flow rate of bottom-blown gas or the top-blowing lance height.

摘要翻译： PCT No.PCT / JP94 / 01070 Sec。 371日期：1996年7月15日 102（e）1996年7月15日PCT 1994年6月30日PCT公布。 公开号WO95 / 01458 日期1995年1月12日本发明提供了一种在转化器中有效脱磷脱磷脱碳脱硫脱硫脱碳脱碳的方法。 对被充电的通量和底吹气体的量进行调节，使得处理后的底吹搅拌力和CaO / SiO 2比分别变得至少为0.1kW / ton和0.7至2.5， 处理终点处的铁水温度为1200〜1450℃。此外，控制处理的操作，使得处理后的炉渣中的T.Fe浓度与MnO浓度的和变为 10至35重量％，通过调节最高的氧气进料速率，底吹气体的流量或顶吹喷枪的高度。

公开(公告)号：US5801350A

公开(公告)日：1998-09-01

申请号：US619186

申请日：1996-03-21

申请人： Tsutomu Shibuya ,  Kaoru Katayama ,  Mitugu Shirai ,  Shinichi Kazui ,  Hideaki Sasaki ,  Yasuhiro Iwata

发明人： Tsutomu Shibuya ,  Kaoru Katayama ,  Mitugu Shirai ,  Shinichi Kazui ,  Hideaki Sasaki ,  Yasuhiro Iwata

IPC分类号： C08J7/00 ,  H01L21/56 ,  H01L21/60 ,  H01L21/68 ,  H05K3/22 ,  H05K3/30 ,  H05K3/34

CPC分类号： H01L21/6835 ,  H01L21/563 ,  H01L24/81 ,  H05K3/305 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K2201/0154 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2203/0783 ,  H05K2203/107 ,  H05K3/22 ,  H05K3/303 ,  H05K3/3436 ,  H05K3/3452 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T428/24917 ,  Y10T428/2809

摘要： A surface reformation method of a high polymer material irradiates an excimer-laser beam to only a predetermined area in which electronic parts and the like are temporarily immobilized by a liquid on a substrate which has a high polymer layer on the surface. The wettability of the liquid for temporary immobilization only with respect to the predetermined area is improved. After the electronic parts are temporarily immobilized on the substrate by using the method, the electronic parts can be durably soldered by fluxless reflow soldering.

摘要翻译： 高分子材料的表面改性方法仅将准分子激光束照射到表面上具有高聚合物层的基板上的液体暂时固定电子部件等的预定区域。 仅用于临时固定的液体相对于预定面积的润湿性提高。 通过使用该方法将电子部件临时固定在基板上之后，可以通过无流动回流焊接耐久地焊接电子部件。

公开(公告)号：US5709338A

公开(公告)日：1998-01-20

申请号：US636186

申请日：1996-04-22

申请人： Mitugu Shirai ,  Hideaki Sasaki ,  Takeshi Takahashi

发明人： Mitugu Shirai ,  Hideaki Sasaki ,  Takeshi Takahashi

IPC分类号： B23K1/00 ,  B23K35/26 ,  H05K3/34 ,  B23K1/19 ,  B23K35/14 ,  B23K35/24

CPC分类号： B23K1/0016 ,  B23K35/26 ,  H05K3/3463 ,  B23K2201/36 ,  B23K35/262 ,  B23K35/268 ,  H05K2201/10992 ,  H05K3/341 ,  H05K3/3457

摘要： A soldering is performed in such a manner that two solder portions having different melting points are put between a metallization on a substrate for joining and a part. The chip portion having a higher melting point is made thicker than a solder foil portion having a lower melting point. Initially, the part is held to the metallization by the solder chip having the higher melting point. The solder foil having the lower melting point is first melted in such a state and, after that, the solder chip having the higher melting point is melted. By such a soldering method, a reliable soldering can be performed, without causing a void on the undersurface of a part joint section, by one soldering operation, so that a presoldering operation becomes unnecessary.

摘要翻译： 以这样的方式进行焊接，使得具有不同熔点的两个焊料部分放置在用于接合的基板上的金属化和一部分之间。 使具有较高熔点的芯片部分比具有较低熔点的焊料箔部分厚。 最初，通过具有较高熔点的焊料芯片将部件保持在金属化之上。 具有较低熔点的焊料箔在这种状态下首先被熔化，之后熔化熔点较高的焊料芯片。 通过这样的焊接方法，可以通过一次焊接操作来进行可靠的焊接，而不会在部分接合部的下表面上产生空隙，从而不需要预焊工艺。