摘要:
A semiconductor device includes two or more memory chips electrically coupled. Each of the memory chips includes global lines, a MUX unit, a selection unit, and an output unit. The global lines transmit data stored in memory cells. The MUX unit receives the data loaded onto the global lines to output a test data. The selection unit is inserted into two or more of the global lines and configured to output the test data instead of the data loaded onto the two or more global lines, in a test mode. The output unit is coupled to the global lines and is configured to output the data in a normal mode, and output the test data received from any one of the two or more global lines connected to the selection unit to an I/O pad based on information about the memory chip in a test mode.
摘要:
A memory system includes a memory controller configured to replace a memory block including a failed memory cell with a unit cache block of a cache memory in response to detection of the failed memory cell in the memory block. The unit cache block is smaller than a minimum size of a memory cell array capable of being blocked by an operating system, and the unit cache block has substantially the same storage capacity as the memory block.
摘要:
A semiconductor device may include a memory array including vertical memory cells connected to a digit line, word lines, and a body connection line. A row or column of the memory array may include one or more pillars connected to the body connection line. A voltage may be applied to the body connection line through at least one pillar connected to the body connection line. Application of the voltage to the body connection line may reduce floating body effects. Methods of forming a connection between at least one pillar and a voltage supply are disclosed. Semiconductor devices including such connections are also disclosed.
摘要:
A memory module includes a first rank, a second rank and a test control unit. The first rank includes a plurality of semiconductor memory devices configured to operate in response to a first chip selection signal. The second rank includes a plurality of semiconductor memory devices configured to operate in response to a second chip selection signal. The test control unit is configured to simultaneously enable the first and second chip selection signals to test the first and second ranks in a test mode.
摘要:
Methods, systems, and structures for generating a target reference voltage are provided. A circuit includes a voltage adjuster, a switch, and a current source. The switch selectively connects the current source to circuit paths in the voltage adjuster. A first of the circuit paths incrementally decreases the target reference voltage with respect to the input voltage. A second of the circuit paths incrementally increases the target voltage with respect to the input voltage.
摘要:
A semiconductor device includes a first controlled chip and a control chip stacked therewith. The first controlled chip includes a first circuit outputting a data signal in response to a synchronization signal, an input/output circuit outputting the data signal to a data terminal in synchronization with a delayed synchronization signal, and a replica circuit replicating an output circuit and outputting a replica signal to a first replica terminal in synchronization with the delayed synchronization signal. The control chip includes a first control circuit outputting a synchronization signal and receiving a data signal, a delay adjustment circuit delaying the synchronization signal and outputting the same as a delayed synchronization signal, a phase comparator circuit comparing the phases of the replica signal and the synchronization signal, and a delay control circuit controlling the delay amount of the delay adjustment circuit based on a comparison result of the phase comparator circuit.
摘要:
Provided is a semiconductor storage device with which it is possible to write information to individual memory cells in which a storage node is configured with an oxide semiconductor insulated-gate FET source and a terminal of a capacitor element being connected. A storage node is configured by connecting a source of a first transistor to one terminal of a capacitor element. A drain of the first transistor and a source of a second transistor are connected to each other. A drain of the second transistor is a data input terminal. A first control terminal, which is formed by a gate of the first transistor being connected to another terminal of the capacitor element, is connected to a wordline, which extends in the row direction. A second control terminal, which is formed of a gate of the second transistor terminal, is connected to a write control line, which extends in the column direction. The storage node is connected to a gate of a third transistor, and a current flowing between a drain and a source of the third transistor is controlled according to a voltage level of the storage node.
摘要:
A method includes selectively creating a first breakdown condition and a second breakdown condition at a semiconductor transistor structure. The first breakdown condition is between a source overlap region of the semiconductor transistor structure and a gate of the semiconductor transistor structure. The second breakdown condition is between ad rain overlap region of the semiconductor transistor structure and the gate.
摘要:
While the supply of power is stopped, a data signal that has been held in a volatile memory section can be held in a nonvolatile memory section. In the nonvolatile memory section, a transistor having an extremely low off-state current allows a data signal to be held in the capacitor for a long period of time. Thus, the nonvolatile memory section can hold the logic state even while the supply of power is stopped. When the supply of power is started again, the data signal that has been held in the capacitor while the supply of power has been stopped is set at such a potential that malfunction does not occur by turning on the reset circuit.
摘要:
A memory array that includes a SOI substrate and lateral bipolar junction transistors (BJTs) fabricated on the SOI substrate. The BJTs form first and second inverters cross coupled to form a memory cell. A read circuit outputs the binary state of the memory cell. A power supply is configured to supply a Vdd voltage to the read circuit and to supply a Vcc and a Vee voltage to the first set of lateral bipolar transistors and the second set of lateral bipolar transistors, wherein the Vee voltage is at least zero volts and the Vcc voltage is greater than the Vee voltage and is equal to or less than the Vdd voltage.