公开(公告)号：US20140353009A1

公开(公告)日：2014-12-04

申请号：US13975276

申请日：2013-08-23

申请人： NANCHANG O-FILM TECH CO., LTD. ,  SHENZHEN O-FILM TECH CO., LTD. ,  SUZHOU O-FILM TECH CO., LTD.

发明人： YUNHUA ZHAO ,  YULONG GAO ,  YUNLIANG YANG ,  YING GU

IPC分类号： H05K1/03 ,  H05K1/02

CPC分类号： H05K3/361 ,  G06F3/044 ,  G06F2203/04103 ,  H05K1/0228 ,  H05K1/036 ,  H05K1/0393 ,  H05K3/107 ,  H05K3/1258 ,  H05K2201/0108 ,  H05K2201/0129 ,  H05K2201/053 ,  H05K2201/09036 ,  H05K2201/09681 ,  H05K2201/09827 ,  H05K2203/1572

摘要： A transparent conductive film, includes: a transparent substrate, wherein a transparent substrate includes a body and a flexible board, a width of flexible board is less than that of the body, and the body includes a sensing area and a border area located at an edge of the sensing area; a conduction line, disposed on a transparent flexible substrate; a first conductive layer and a second conductive layer, disposed on two sides of the sensing area opposite to each other; a first electrode trace and a second electrode trace, disposed on the border area, and the first conductive layer and the conduction line are electrically connected through a first electrode trace; the second conductive layer and the conduction line are electrically connected through a second electrode trace. The production efficiency of the above transparent conductive film is improved.

摘要翻译： 一种透明导电膜，包括：透明基板，其中透明基板包括主体和柔性板，柔性板的宽度小于主体的宽度，并且主体包括感测区域和位于 传感区域的边缘; 导线，设置在透明柔性基板上; 第一导电层和第二导电层，设置在彼此相对的感测区域的两侧; 设置在边界区域上的第一电极迹线和第二电极迹线以及第一导电层和导电线通过第一电极迹线电连接; 第二导电层和导线通过第二电极迹线电连接。 上述透明导电膜的制造效率提高。

公开(公告)号：US20140339094A1

公开(公告)日：2014-11-20

申请号：US14337264

申请日：2014-07-22

申请人： Furukawa Electric Co., Ltd.

发明人： Hajime WATANABE ,  Sadao ISHIHAMA ,  Kiyoteru YAMAMOTO ,  Takahiro IMAI ,  Toshihiro OYOSHI

IPC分类号： C25D5/02 ,  H05K3/00 ,  C25D7/00

CPC分类号： C25D5/02 ,  C25D3/38 ,  C25D5/10 ,  C25D5/18 ,  C25D5/34 ,  C25D5/48 ,  C25D7/00 ,  C25D17/00 ,  C25F3/02 ,  H05K1/056 ,  H05K3/0085 ,  H05K3/384 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/0723 ,  H05K2203/1572 ,  Y10S205/92 ,  Y10T428/12361

摘要： PROBLEMS TO BE SOLVED: To provide a process for roughening both sides of a copper plate by forming a protrusion with a fine bump shape on the both sides of the copper plate, and then to provide a process for a deterioration of an electroplating solution for plating copper to become hard to progress therein.MEANS FOR SOLVING THE PROBLEMS: First of all, there is designed to be arranged electrodes (3, 3) as a similar pole for therebetween to be opposed to each other in an electroplating copper solution 2, and then to be arranged a copper plate 4 at therebetween. And then at first there becomes to be performed an anodic treatment for generating a copper fine particles on both surfaces of the copper plate 4, by performing an electrolytic process with the copper plate 4 as a positive electrode and the electrodes 3 as negative electrodes. And then thereafter there becomes to be performed a cathodic treatment, by performing an electroplating of copper with the copper plate 4 as a negative electrode and the electrodes 3 as positive electrodes, for the copper fine particles to be fixed onto the surfaces of the copper plate 4. Furthermore, there becomes to be formed the above mentioned protrusion with the fine bump shape thereon, by performing the anodic treatment and then the cathodic treatment as not less than one cycle thereof.

摘要翻译： 要解决的问题：提供一种通过在铜板的两面上形成具有微小凸起形状的突起来提供铜板两侧粗糙化的方法，然后提供用于电镀的电镀液的劣化的工艺 铜变得难以进展。 解决问题的手段：首先，设计为在电镀铜溶液2中彼此相对地设置作为相似的极的电极（3,3），然后设置为铜板4 在它们之间。 首先，通过以铜板4为正极进行电解处理，将电极3作为负极进行电镀处理，在铜板4的两面上进行阳极处理，生成铜微粒。 然后，进行阴极处理，通过以铜板4作为负极进行铜的电镀，将电极3作为正极进行阴极处理，将铜微粒固定在铜板的表面上 此外，通过进行阳极处理，然后阴极处理为不止一个循环，形成上述具有微小凸起形状的突起。

公开(公告)号：US08890000B2

公开(公告)日：2014-11-18

申请号：US13422884

申请日：2012-03-16

申请人： Tomoyuki Ikeda

发明人： Tomoyuki Ikeda

IPC分类号： H05K1/11 ,  H05K3/00 ,  H05K3/42

CPC分类号： H05K3/0026 ,  C25D5/02 ,  H05K1/119 ,  H05K3/0032 ,  H05K3/0094 ,  H05K3/422 ,  H05K3/423 ,  H05K3/427 ,  H05K2201/09827 ,  H05K2201/09836 ,  H05K2201/09854 ,  H05K2203/1572 ,  Y10T29/49124 ,  Y10T29/49126

摘要： A printed wiring board has an insulating resin substrate having a first surface and a second surface, the insulating resin substrate having one or more penetrating-holes passing through the insulating resin substrate from the first surface to the second surface, a first conductor formed on the first surface of the insulating resin substrate, a second conductor formed on the second surface of the insulating resin substrate, and a through-hole conductor structure formed in the penetrating-hole of the insulating resin substrate and electrically connecting the first conductor and the second conductor. The penetrating-hole has a first portion having an opening on the first surface and a second portion having an opening on the second surface. The first portion and the second portion are connected such that the first portion and the second portion are set off from each other.

摘要翻译： 印刷电路板具有具有第一表面和第二表面的绝缘树脂基板，所述绝缘树脂基板具有从所述第一表面到所述第二表面穿过所述绝缘树脂基板的一个或多个贯穿孔，形成在所述绝缘树脂基板上的第一导体 绝缘树脂基板的第一表面，形成在绝缘树脂基板的第二表面上的第二导体和形成在绝缘树脂基板的穿透孔中的通孔导体结构，并将第一导体和第二导体 。 所述贯穿孔具有在所述第一表面上具有开口的第一部分和在所述第二表面上具有开口的第二部分。 第一部分和第二部分被连接成使得第一部分和第二部分彼此脱离。

公开(公告)号：US08878228B2

公开(公告)日：2014-11-04

申请号：US13968317

申请日：2013-08-15

申请人： Young Seob Lee

发明人： Young Seob Lee

IPC分类号： H01L33/64 ,  F21V29/00 ,  H05K1/02 ,  H05K3/00 ,  F21K99/00 ,  F21Y101/02 ,  F21W131/103

CPC分类号： H01L33/647 ,  F21K9/00 ,  F21V29/20 ,  F21V29/70 ,  F21V29/89 ,  F21W2131/103 ,  F21Y2115/10 ,  H01L33/642 ,  H01L2224/48091 ,  H05K1/0206 ,  H05K3/0047 ,  H05K3/0061 ,  H05K2201/0305 ,  H05K2201/09854 ,  H05K2201/10106 ,  H05K2203/1572 ,  H01L2924/00014

摘要： A method of packaging a power light emitting diode (LED). The method may include providing a printed circuit board (PCB) wherein first and second copper (Cu) thin films are formed on both faces of the PCB respectively, forming a single upper opening through an entire thickness of the first Cu thin film and an partial thickness of the PCB, forming a plurality of lower openings, each lower opening extending vertically from the upper opening to the second Cu thin film, forming solder pads on the first Cu thin film, filing a cream solder in the upper opening and the plurality of lower openings so as to be in-plane with the solder pads, mounting a power LED on the PCB so that lead frames of the LED are aligned with the solder pads and a heat-discharge region of the LED is aligned with the cream solder, and soldering the cream solder.

摘要翻译： 一种封装功率发光二极管（LED）的方法。 该方法可以包括提供印刷电路板（PCB），其中分别在PCB的两个表面上形成第一和第二铜（Cu）薄膜，通过第一Cu薄膜的整个厚度形成单个上部开口， PCB的厚度，形成多个下开口，每个下开口从上开口垂直延伸到第二Cu薄膜，在第一Cu薄膜上形成焊盘，在上开口中填充膏状焊膏， 下开口以与焊垫在一起，在PCB上安装电源LED，使得LED的引线框架与焊盘对准，并且LED的放热区域与膏状焊料对准， 并焊接奶油焊膏。

公开(公告)号：US20140321087A1

公开(公告)日：2014-10-30

申请号：US13870644

申请日：2013-04-25

申请人： Qinglei Zhang

发明人： Qinglei Zhang

IPC分类号： H05K1/09 ,  H05K3/24

CPC分类号： H05K3/244 ,  H01L21/4857 ,  H01L23/13 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/81191 ,  H01L2224/81444 ,  H01L2224/81801 ,  H01L2924/12042 ,  H05K3/282 ,  H05K3/3436 ,  H05K2201/0376 ,  H05K2201/10378 ,  H05K2201/10734 ,  H05K2203/025 ,  H05K2203/1476 ,  H05K2203/1572 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/014

摘要： Embodiments of the present disclosure are directed towards techniques and configurations for dual surface finish package substrate assemblies. In one embodiment a method includes depositing a first surface finish on one or more electrical routing features located on a first side of a package substrate and on one or more lands located on a second side of the package substrate, the second side being opposite the first side of the substrate. The method may further include removing the first surface finish on the first side of the package substrate; and depositing a second surface finish on the one or more electrical routing features of the first side. The depositing of the second surface finish may be accomplished by one of a Direct Immersion Gold (DIG) process or an Organic Solderability Preservative (OSP) process. Other embodiments may be described and/or claimed.

摘要翻译： 本公开的实施例涉及用于双表面光洁度封装衬底组件的技术和构造。 在一个实施例中，一种方法包括在位于封装衬底的第一侧上的一个或多个电路径特征上以及位于封装衬底的第二侧上的一个或多个焊盘上沉积第一表面光洁度，第二面与第一 侧面。 该方法还可以包括去除封装衬底的第一侧上的第一表面光洁度; 以及在第一侧的一个或多个电路径特征上沉积第二表面光洁度。 第二表面光洁度的沉积可以通过直接浸入金（DIG）工艺或有机可焊性防腐剂（OSP）工艺之一来完成。 可以描述和/或要求保护其他实施例。

公开(公告)号：US08829357B2

公开(公告)日：2014-09-09

申请号：US13307480

申请日：2011-11-30

申请人： Yukinobu Mikado ,  Shunsuke Sakai ,  Mitsuhiro Tomikawa

发明人： Yukinobu Mikado ,  Shunsuke Sakai ,  Mitsuhiro Tomikawa

IPC分类号： H05K1/16 ,  H05K3/00 ,  H05K1/18 ,  H05K3/46 ,  H05K3/42

CPC分类号： H05K1/185 ,  H05K3/0038 ,  H05K3/427 ,  H05K3/4602 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/09854 ,  H05K2201/10015 ,  H05K2203/1476 ,  H05K2203/1572 ,  Y10T29/4913

摘要： A wiring board includes a core substrate having an opening portion and a through hole adjacent to the opening portion, a capacitor positioned in the opening portion, and a through-hole conductor formed in the through hole of the core substrate and having a conductor filling the through hole. The core substrate has a first surface and a second surface on the opposite side of the first surface, the opening portion of the core substrate penetrates from the first surface to the second surface, the through-hole conductor has a first conductive portion and a second conductive portion connected to the first conductive portion in the core substrate, the first conductive portion of the through-hole conductor becomes narrower from the first surface toward the second surface, and the second conductive portion of the through-hole conductor becomes narrower from the second surface toward the first surface.

摘要翻译： 布线基板包括具有开口部分和与开口部分相邻的通孔的核心基板，位于开口部分中的电容器，以及形成在芯基板的通孔中的通孔导体， 通孔。 芯基板具有在第一表面的相对侧的第一表面和第二表面，芯基板的开口部分从第一表面穿透到第二表面，通孔导体具有第一导电部分和第二导电部分 导电部分连接到芯基板中的第一导电部分，通孔导体的第一导电部分从第一表面朝向第二表面变窄，并且通孔导体的第二导电部分从第二导体部分变窄 表面朝向第一表面。

公开(公告)号：US20140202742A1

公开(公告)日：2014-07-24

申请号：US14161310

申请日：2014-01-22

申请人： CAMBRIOS TECHNOLOGIES CORPORATION

发明人： David Jones ,  Paul Mansky ,  Michael A. Spaid

IPC分类号： H05K1/02 ,  H05K3/02

CPC分类号： H05K3/027 ,  B23K26/0006 ,  B23K26/0619 ,  B23K26/18 ,  B23K26/355 ,  B23K2101/34 ,  B23K2101/40 ,  B23K2103/56 ,  G06F3/044 ,  G06F2203/04103 ,  H01L31/1884 ,  H05K1/0326 ,  H05K1/0393 ,  H05K1/097 ,  H05K1/144 ,  H05K2201/0108 ,  H05K2201/0112 ,  H05K2201/0145 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/0162 ,  H05K2201/026 ,  H05K2201/043 ,  H05K2203/108 ,  H05K2203/1142 ,  H05K2203/1572 ,  Y02E10/50

摘要： Disclosed herein are double-sided transparent conductive films suitable for patterning by laser ablation.

摘要翻译： 本文公开了适用于通过激光烧蚀进行图案化的双面透明导电膜。

公开(公告)号：US20140182895A1

公开(公告)日：2014-07-03

申请号：US14143527

申请日：2013-12-30

申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

发明人： Doo Hwan LEE ,  Ho Shik KANG ,  Yee Na SHIN ,  Yul Kyo CHUNG ,  Seung Eun LEE

IPC分类号： H05K1/02 ,  H05K3/30 ,  H05K3/46

CPC分类号： H05K1/0271 ,  H01L21/568 ,  H01L24/18 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/19 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/15311 ,  H01L2924/3511 ,  H05K1/185 ,  H05K3/0097 ,  H05K3/4682 ,  H05K3/4688 ,  H05K2201/0175 ,  H05K2201/068 ,  H05K2203/0152 ,  H05K2203/1572 ,  Y10T29/4913 ,  Y10T29/49155 ,  H01L2224/83005

摘要： A multilayered substrate and a method of manufacturing the same. The multilayered substrate includes a plurality of wiring layers and reinforcing layers disposed at the outermost portions of both surfaces of the multilayered substrate, respectively, in order to decrease warpage of the multilayered substrate and has wiring patterns optimized depending on a scheme in which external electrodes are formed on an electronic component.

摘要翻译： 一种多层基板及其制造方法。 多层基板包括分别设置在多层基板的两个表面的最外部的多个布线层和加强层，以减少多层基板的翘曲，并且具有根据外部电极为 形成在电子元件上。

公开(公告)号：US08710403B2

公开(公告)日：2014-04-29

申请号：US12918187

申请日：2009-02-18

申请人： Philip Thomas Rumsby

发明人： Philip Thomas Rumsby

IPC分类号： B23K26/03 ,  B23K26/04 ,  B23K26/067

CPC分类号： G03F7/70425 ,  G03F7/70383 ,  G03F9/7026 ,  H05K3/0008 ,  H05K3/0026 ,  H05K3/0097 ,  H05K2203/1572

摘要： A system for processing a multi-device panel, comprising a substrate having front and rear surfaces, a first array of device regions located on the front surface and a second array of device regions on the rear surface, by vector direct-write laser ablation, comprising a first processing station comprising a pair of opposedly-mounted processing heads, each processing head comprising a laser beam delivery apparatus comprising a laser beam scanner and a lens unit, and a distance measurement device, mounting device for mounting the panel between the processing heads of the first processing station such that the relative position of the panel and the first processing station can be adjusted so that the processing heads are brought into alignment with selected front-surface and rear-surface device regions to be processed, wherein each processing head is operable to make an estimate of the distance between the lens unit and the surface of the device region to be processed using the distance measurement device, control the focus the lens unit dependent on said estimate and vector direct-write the device region.

摘要翻译： 一种用于处理多器件面板的系统，包括具有前表面和后表面的衬底，位于前表面上的器件区域的第一阵列和后表面上的器件区域的第二阵列，通过矢量直写激光烧蚀， 包括一个包括一对相对安装的处理头的第一处理站，每个处理头包括一个激光束传送装置，该激光束传送装置包括一个激光束扫描器和一个透镜单元，以及一个距离测量装置，用于将面板安装在处理头之间的安装装置 使得可以调整面板和第一处理站的相对位置，使得处理头与要处理的所选择的前表面和后表面设备区域对准，其中每个处理头是 可操作地使用距离来估计透镜单元和要处理的设备区域的表面之间的距离 测量设备，控制镜头单元的焦距取决于所述估计和矢量直写设备区域。

公开(公告)号：US20140092027A1

公开(公告)日：2014-04-03

申请号：US13630805

申请日：2012-09-28

申请人： avct Optical Electronic Co., Ltd

发明人： TING-CHING KUO ,  JYR-DWO LEE ,  SHIH-LIANG CHOU ,  CHIEN-MIN WENG ,  HSUEH-CHIH CHIANG

IPC分类号： H05K3/02 ,  G06F3/041

CPC分类号： G06F3/041 ,  G06F2203/04103 ,  H05K3/06 ,  H05K3/12 ,  H05K2201/0108 ,  H05K2201/0326 ,  H05K2203/1572

摘要： The invention relates to a touch panel. The touch panel includes a plastic film substrate, whose two surfaces are provided in sequence with at least two undercoat layers and a patterned transparent conductive layer and further provided with a patterned metal circuit layer, respectively. The invention also relates to a simplified method for producing a touch panel, in which the conventional lamination process is eliminated, and the touch panel produced thereby has a reduced overall thickness and is free of the conventional image deterioration drawback. Moreover, the method generally pertains to a sheet-by-sheet process and is superior over the conventional roll-to-roll processes in which the thin layers tend to exfoliate due to the occurrence of uneven tension.

摘要翻译： 本发明涉及触摸面板。 触摸面板包括塑料膜基板，其两个表面依次设置有至少两个底涂层和图案化的透明导电层，并且还分别设置有图案化的金属电路层。 本发明还涉及一种用于制造触摸面板的简化方法，其中消除了传统的层压工艺，并且由此产生的触摸面板具有减小的总厚度并且没有常规的图像劣化缺点。 此外，该方法通常涉及逐张制造方法，并且比由于发生不均匀张力而使薄层倾向于剥离的常规卷对卷方法更优越。