公开(公告)号：US07875983B2

公开(公告)日：2011-01-25

申请号：US12591792

申请日：2009-12-01

申请人： Do-Jae Yoo ,  Young-Do Kweon ,  Seog-Moon Choi ,  Bum-Sik Jang ,  Tae-Sung Jeong

发明人： Do-Jae Yoo ,  Young-Do Kweon ,  Seog-Moon Choi ,  Bum-Sik Jang ,  Tae-Sung Jeong

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L25/105 ,  H01L23/3128 ,  H01L24/73 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/19105 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401

摘要： A semiconductor package which includes a first substrate having a pre-designed pattern formed thereon; a first chip mounted by a flip chip method on one side of the first substrate; a support formed to a predetermined thickness on an edge of the first substrate; an interposer having an edge thereof placed on the support, such that the interposer covers the first substrate and forms a cavity between the interposer and the first substrate, and having a pre-designed pattern formed respectively on both sides thereof; a via penetrating the support and the interposer; a second chip mounted on one side of the interposer facing the first substrate; a second substrate placed on the other side of the interposer with at least one conductive ball positioned in-between; and a third chip mounted on the second substrate.

摘要翻译： 一种半导体封装，其包括在其上形成有预先设计的图案的第一基板; 通过倒装芯片方法在所述第一基板的一侧上安装的第一芯片; 在所述第一基板的边缘上形成为预定厚度的支撑件; 插入器，其具有放置在支撑体上的边缘，使得所述插入件覆盖所述第一基板并在所述插入件与所述第一基板之间形成空腔，并且具有分别形成在其两侧的预先设计的图案; 穿过支撑件和插入件的通孔; 第二芯片，安装在所述插入器的面向所述第一基板的一侧上; 放置在所述插入件的另一侧上的第二衬底，其中至少一个导电球定位在其间; 以及安装在所述第二基板上的第三芯片。

公开(公告)号：US20110012252A1

公开(公告)日：2011-01-20

申请号：US12551238

申请日：2009-08-31

申请人： Shan GAO ,  Seog Moon Choi ,  Tae Hyun Kim ,  Ju Pyo Hong ,  Bum Sik Jang ,  Ji Hyun Park

发明人： Shan GAO ,  Seog Moon Choi ,  Tae Hyun Kim ,  Ju Pyo Hong ,  Bum Sik Jang ,  Ji Hyun Park

IPC分类号： H01L23/46 ,  H01L23/48 ,  H01L21/50

CPC分类号： H01L25/072 ,  H01L23/3121 ,  H01L23/3735 ,  H01L23/427 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/071 ,  H01L25/50 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/4846 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： Disclosed herein is a power semiconductor module. The module includes metal plates each having a first through hole, with an anodic oxidation layer formed on a surface of metal plates and an interior of the first through hole. A cooling member has a second through hole at a position corresponding to the first through hole, and the metal plates are attached to both sides of the cooling member. A circuit layer is formed on the anodic oxidation layer and performs an interlayer connection through a via formed in the first and second through holes. A power device is connected to the circuit layer. A resin encapsulant encloses the circuit layer and the power device. A housing is installed to each of the metal plates to form a sealing space for the resin encapsulant.

摘要翻译： 这里公开了功率半导体模块。 模块包括各自具有第一通孔的金属板，阳极氧化层形成在金属板的表面和第一通孔的内部。 冷却构件在与第一通孔对应的位置具有第二通孔，并且金属板附接到冷却构件的两侧。 在阳极氧化层上形成电路层，通过在第一和第二通孔中形成的通孔进行层间连接。 电源设备连接到电路层。 树脂密封剂包围电路层和功率器件。 每个金属板上安装有一个壳体，以形成树脂密封剂的密封空间。

公开(公告)号：US20100295172A1

公开(公告)日：2010-11-25

申请号：US12538042

申请日：2009-08-07

申请人： Shan Gao ,  Seog Moon Choi ,  Do Jae Yoo ,  Tae Hyun Kim ,  Bum Sik Jang ,  Ji Hyun Park

发明人： Shan Gao ,  Seog Moon Choi ,  Do Jae Yoo ,  Tae Hyun Kim ,  Bum Sik Jang ,  Ji Hyun Park

IPC分类号： H01L23/34

CPC分类号： H01L23/467 ,  H01L23/142 ,  H01L23/24 ,  H01L23/3735 ,  H01L23/427 ,  H01L25/071 ,  H01L25/072 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/4846 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

摘要： Disclosed is a power semiconductor module having improved heat dissipation performance, including an anodized metal substrate including a metal plate, an anodized layer formed on a surface of the metal plate, and a circuit layer formed on the anodized layer on the metal plate, a power device connected to the circuit layer, and a housing mounted on the metal plate and for defining a sealing space which accommodates a resin sealing material for sealing the circuit layer and the power device.

摘要翻译： 公开了一种具有改善的散热性能的功率半导体模块，包括阳极化金属基板，其包括金属板，形成在金属板的表面上的阳极氧化层和形成在金属板上的阳极氧化层上的电路层， 连接到电路层的器件，以及安装在金属板上并用于限定容纳用于密封电路层和功率器件的树脂密封材料的密封空间的壳体。

公开(公告)号：US20100294543A1

公开(公告)日：2010-11-25

申请号：US12539527

申请日：2009-08-11

申请人： Young Ho Sohn ,  Seog Moon Choi ,  Sung Keun Park ,  Young Ki Lee ,  Bum Sik Jang ,  Ji Hyun Park

发明人： Young Ho Sohn ,  Seog Moon Choi ,  Sung Keun Park ,  Young Ki Lee ,  Bum Sik Jang ,  Ji Hyun Park

IPC分类号： H05K1/00 ,  B05D5/12

CPC分类号： H05K3/4623 ,  H05K1/056 ,  H05K3/429 ,  H05K3/445 ,  H05K3/4641 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/096

摘要： Disclosed herein is a heat dissipating substrate having a structure in which two two-layered core substrates, each including a metal core functioning to radiate heat, are laminated and connected in parallel to each other, thus accomplishing more improved radiation performance, and a method of manufacturing the same.

摘要翻译： 本发明公开了一种散热基板，其结构是将两个分别包含发热功能的金属芯片的两层芯基板彼此并联并相互并联，从而实现更好的辐射性能， 制造相同。

公开(公告)号：US20100087034A1

公开(公告)日：2010-04-08

申请号：US12591793

申请日：2009-12-01

申请人： Do-Jae Yoo ,  Young-Do Kweon ,  Seog-Moon Choi ,  Bum-Sik Jang ,  Tae-Sung Jeong

发明人： Do-Jae Yoo ,  Young-Do Kweon ,  Seog-Moon Choi ,  Bum-Sik Jang ,  Tae-Sung Jeong

IPC分类号： H01L21/60

CPC分类号： H01L25/105 ,  H01L23/3128 ,  H01L24/73 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/19105 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401

摘要： A method of manufacturing a semiconductor package which includes mounting a first chip on a first substrate by a flip chip method, the first substrate having a pre-designed pattern formed thereon; forming a cavity by etching a center portion of a metal oxide layer; mounting a second chip inside the cavity; forming at least one via such that the via penetrates an edge of the metal oxide layer; placing the metal oxide layer on the first substrate such that the second chip and the first chip face each other; and placing a second substrate on the metal oxide layer, the second substrate having a third chip mounted thereon.

摘要翻译： 一种制造半导体封装的方法，包括通过倒装芯片方法将第一芯片安装在第一衬底上，所述第一衬底在其上形成预先设计的图案; 通过蚀刻金属氧化物层的中心部分形成空腔; 在腔内安装第二芯片; 形成至少一个通孔，使得所述通孔穿过所述金属氧化物层的边缘; 将所述金属氧化物层放置在所述第一基板上，使得所述第二芯片和所述第一芯片彼此面对; 以及将第二衬底放置在所述金属氧化物层上，所述第二衬底具有安装在其上的第三芯片。

公开(公告)号：US20090261356A1

公开(公告)日：2009-10-22

申请号：US12285324

申请日：2008-10-01

申请人： Young-Ki Lee ,  Seog-Moon choi ,  Hyung-Jin Jeon ,  Sang-Hyun Shin

发明人： Young-Ki Lee ,  Seog-Moon choi ,  Hyung-Jin Jeon ,  Sang-Hyun Shin

IPC分类号： H01L33/00 ,  H01L21/50

CPC分类号： H01L25/0753 ,  F21K9/00 ,  H01L33/486 ,  H01L33/62 ,  H01L33/641 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： A sub-mount, a light emitting diode package, and a method of manufacturing thereof are disclosed. A sub-mount, on which multiple light emitting diodes are mounted, can include a multiple number of metal bodies on which the light emitting diodes are respectively mounted, and an oxide wall interposed between the metal bodies such that the adjacent metal bodies are supported by each other but electrically disconnected from each other. By utilizing certain embodiments of the invention, a high heat releasing effect may be obtained, and manufacturing costs may be reduced.

摘要翻译： 公开了一种子安装，发光二极管封装及其制造方法。 其上安装有多个发光二极管的子座可以包括多个金属体，其上分别安装有发光二极管，金属体之间插入氧化物壁，使得相邻的金属体被 彼此相互电气断开。 通过利用本发明的某些实施例，可以获得高的散热效果，并且可以降低制造成本。

公开(公告)号：US20090014827A1

公开(公告)日：2009-01-15

申请号：US12155836

申请日：2008-06-10

申请人： Chang Hyun Lim ,  Seog Moon Choi ,  Dae Jun Kim ,  Won Kyu Jeung ,  Jingli Yuan

发明人： Chang Hyun Lim ,  Seog Moon Choi ,  Dae Jun Kim ,  Won Kyu Jeung ,  Jingli Yuan

IPC分类号： H01L31/0203 ,  H01L31/18

CPC分类号： H01L27/14618 ,  H01L2224/13 ,  H04N5/2257

摘要： Provided is an image sensor module at the wafer level including a wafer; an image sensor mounted on one surface of the wafer; a wireless communication chip formed outside the image sensor on the one surface of the wafer; and a protective cover installed on the one surface of the wafer.

摘要翻译： 提供了包括晶片的晶片级的图像传感器模块; 安装在晶片的一个表面上的图像传感器; 在晶片的一个表面上形成在图像传感器外部的无线通信芯片; 以及安装在晶片的一个表面上的保护盖。

公开(公告)号：US07453093B2

公开(公告)日：2008-11-18

申请号：US11489578

申请日：2006-07-20

申请人： Yong Suk Kim ,  Young Soo Oh ,  Hyoung Ho Kim ,  Taek Jung Lee ,  Seog Moon Choi

发明人： Yong Suk Kim ,  Young Soo Oh ,  Hyoung Ho Kim ,  Taek Jung Lee ,  Seog Moon Choi

IPC分类号： H01L27/15 ,  H01L23/34

CPC分类号： H01L33/642 ,  H01L33/486 ,  H01L33/641 ,  H01L2224/16225

摘要： The invention provides an LED package capable of effectively releasing heat emitted from an LED chip out of the package and a fabrication method thereof. For this purpose, at least one groove is formed on an underside surface of the substrate to package the LED chip and the groove is filled with carbon nanotube material. In the LED package, a substrate having at least one groove on the underside surface is prepared. A plurality of electrodes are formed on a top surface of the substrate. Also, at least the one LED chip is mounted over the substrate to have both terminals electrically connected to the upper electrodes. In addition, carbon nanotube filler is filled in the groove of the substrate.

摘要翻译： 本发明提供一种LED封装，其能够有效地从LED封装中散发从LED芯片发出的热量及其制造方法。 为此，在基板的下侧表面上形成至少一个凹槽以封装LED芯片，并且凹槽填充有碳纳米管材料。 在LED封装中，准备在底面上具有至少一个沟槽的衬底。 多个电极形成在基板的顶表面上。 此外，至少将一个LED芯片安装在基板上，以使两个端子电连接到上电极。 此外，碳纳米管填料填充在基板的槽中。

公开(公告)号：US07371603B2

公开(公告)日：2008-05-13

申请号：US11439189

申请日：2006-05-24

申请人： Yong Suk Kim ,  Seog Moon Choi ,  Hyoung Ho Kim ,  Yong Sik Kim

发明人： Yong Suk Kim ,  Seog Moon Choi ,  Hyoung Ho Kim ,  Yong Sik Kim

IPC分类号： H01L21/00 ,  H01L21/50 ,  H01L21/48 ,  H01L21/44

CPC分类号： H01L33/52 ,  H01L2224/48091 ,  H01L2224/48227 ,  Y10S438/974 ,  H01L2924/00014

摘要： The invention relates to an LED package and proposes a method of fabricating an LED package including steps of providing a package substrate having a mounting area of an LED and a metal pattern to be connected with the LED, and plasma-treating the package substrate to reform at least a predetermined surface area of the package substrate where a resin-molded part will be formed. The method also includes mounting the LED on the mounting area on the substrate package and electrically connecting the LED with the metal pattern, and forming the resin-molded part in the mounting area of the LED to seal the LED package.

摘要翻译： 本发明涉及一种LED封装，并提出一种制造LED封装的方法，包括以下步骤：提供具有与LED连接的LED的安装区域和与LED连接的金属图案的封装基板，以及等离子体处理封装基板以改造 至少形成将形成树脂成型部件的封装基板的预定表面积。 该方法还包括将LED安装在基板封装上的安装区域上，并将LED与金属图案电连接，并在LED的安装区域中形成树脂模制部件以密封LED封装。

公开(公告)号：US20070215894A1

公开(公告)日：2007-09-20

申请号：US11723236

申请日：2007-03-19

申请人： Young Ki Lee ,  Seog Moon Choi ,  Sang Hyun Shin

发明人： Young Ki Lee ,  Seog Moon Choi ,  Sang Hyun Shin

IPC分类号： H01L33/00 ,  H01L21/00

CPC分类号： H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H05K3/28 ,  H05K2203/0315 ,  H05K2203/0542

摘要： An insulation structure for high temperature conditions and a manufacturing method thereof. In the insulation structure, a substrate has a conductive pattern formed on at least one surface thereof for electrical connection of a device. A metal oxide layer pattern is formed on a predetermined portion of the conductive pattern by anodization, the metal oxide layer pattern made of one selected from a group consisting of Al, Ti and Mg.

摘要翻译： 一种用于高温条件的绝缘结构及其制造方法。 在绝缘结构中，衬底具有形成在其至少一个表面上的用于电连接器件的导电图案。 通过阳极氧化在导电图案的预定部分上形成金属氧化物层图案，金属氧化物层图案由选自Al，Ti和Mg的一种形成。