摘要:
A system and method for detecting parallel marketing of an item, include forming at least one of a coating and a code on the item, interrogating the at least one of the coating and said code, and determining from the interrogating whether the item has been transferred from an authorized merchant to an unauthorized merchant.
摘要:
A structure and method for forming a tamper respondent electronic circuit enclosure that includes an integrated circuit structure, a mesh structure surrounding the integrated circuit structure, and a sealed enclosure surrounding the mesh structure. The mesh structure includes a layer of flexible dielectric having a first side and a second side, a screen-printed pattern of flexible electrically conductive first circuit lines forming a first resistor network on the first side, and a photo lithographically-formed pattern of flexible electrically conductive second circuit lines forming a second resistor network on the second side.
摘要:
The present invention is a method to eliminate the influence of clamp dimensional changes on the displacement measurement during the measurement of the coefficient of thermal expansion (CTE) of samples in tension. In a first embodiment clamp dimensional changes can be eliminated by making clamps from a material with near zero CTEs. In another embodiment clamp dimensional changes can be reduced by minimizing the CTE of the clamp material. Finally clamp dimensional changes are taken into account. This is achieved directly by subtracting a prerecorded baseline from the measurements; or by determining the CTE measurement for various sample lengths and obtaining the slope of a straight line through the points on a MD (measured displacement)/DT (temperature range of displacement measurement) versus sample length plot. The slope is the corrected CTE. Clamp dimensional changes can also be taken into account indirectly by obtaining a clamp displacement contribution (CDC) factor which allows to correct measured displacements to result the correct CTE.
摘要:
A flex or TAB product suitable for chip carrier applications wherein the flex reliability problems caused by copper dendrite growth and lead bending during power and thermal cycling are reduced by application of special coatings to lead areas of the flex tape.
摘要:
Polyimide is etched by contacting the polyimide with an aqueous solution of a metal hydroxide followed by contact with an acid followed by contact with an aqueous solution of a metal hydroxide. Etching of chemically cured polyimide can be enhanced by employing a presoaking in hot water. Also, partially etched chemically cured polyimide is removed with a concentrated acid solution.In preparing a metal coated polyimide structure for subsequent gold plating, two flash etching steps with the polyimide etch between are employed after developing the photoresist.
摘要:
Solder bumps of uniform height are provided on a substrate through the use of injection molded solder. Copper pillars or ball limiting metallurgy are formed over I/O pads within the channels of a patterned layer of photoresist. Solder is injected over the pillars or BLM, filling the channels. The solder, which does not contain flux, is allowed to solidify. It forms a plurality of solder structures (bumps) of equal heights. Solder injection and solidification are preferably carried out in a nitrogen environment or a forming gas environment. Molten solder can be injected in channels formed in round wafers without spillage using a carrier assembly that accommodates such wafers and a fill head.
摘要:
A process comprises forming a first electrical interconnect structure on a surface of a singulated semiconductor chip having an alignment pattern, which is scanned and stored in a scanning device prior to application of a curable underfill coating to the surface of the singulated semiconductor chip. A curable underfill coating is applied to the surface of the singulated semiconductor chip to produce a coated semiconductor chip. The scanned and stored alignment pattern is delivered to an alignment and joining device positioned adjacent to and operatively associated with a substrate having a second electrical interconnect structure alignable to make electrical contact with the first electrical interconnect structure. The coated semiconductor chip is placed in the alignment and joining device so that when the scanned and stored alignment pattern is activated the alignment and joining device positions the coated semiconductor chip so that the first electrical interconnect structure is aligned to make electrical contact with the second electrical interconnect structure. The alignment and joining device is activated to join the coated semiconductor chip to the substrate.
摘要:
A method for measuring the fracture and fatigue crack growth behavior of a material includes heating at least one sample having a first end and a second end and a pre-applied crack between the first end and the second end; heating a fixture having a lower coefficient of thermal expansion than said at least one sample; attaching the first end and the second end of the at least one sample to the fixture; cooling the at least one sample and fixture; recording the temperature at which propagation of the pre-applied crack through the width of the at least one sample occurs as the critical fracture temperature; for a plurality of samples, each sample having a different ratio of pre-applied crack length to sample width, determining the critical fracture temperature as a function of said ratio; and ranking materials by the critical fracture temperature.
摘要:
A single-mode optical waveguide with a core, surrounded by a cladding consisting of an inner soft layer and an outer harder layer is described. The outer layer has a grating structure on its inner surface, whose spatial frequency is the same as that of the guided mode. The thickness of the inner cladding is sufficient to keep the grating outside the mode field in undeformed regions of the waveguide, so that normally no out-coupling of the light results. Connections are made by crossing two such waveguides at an angle and pressing them together. This results in deformation of the two waveguides such that the gratings are brought into proximity with the cores. Light is coupled out of one waveguide and into the other in the deformed region, resulting in a self-aligning optical connection. The out-coupled light propagates normal to the waveguide axis, so errors in the crossing angle cause little change in efficiency. Because the cladding system is sufficiently resilient to recover after deformation, the connection is remakeable.
摘要:
A method of manufacturing a thermal paste, in which the method includes feeding the thermal paste into a chamber of an extruder; mixing the thermal paste at elevated temperatures; de-airing the thermal paste; and extruding the thermal paste out of the chamber through a die as a pre-form or into a cartridge, such that air channels and pseudo-grain boundaries are prevented from forming in the thermal paste.