公开(公告)号：US06194786B1

公开(公告)日：2001-02-27

申请号：US09153745

申请日：1998-09-15

申请人： John W. Orcutt

发明人： John W. Orcutt

IPC分类号： H01L2348

CPC分类号： H01L24/85 ,  H01L23/49816 ,  H01L23/50 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48233 ,  H01L2224/48465 ,  H01L2224/4848 ,  H01L2224/48599 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48699 ,  H01L2224/48724 ,  H01L2224/48744 ,  H01L2224/48747 ,  H01L2224/48824 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/49171 ,  H01L2224/8503 ,  H01L2224/85051 ,  H01L2224/85148 ,  H01L2224/85205 ,  H01L2224/85424 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012

摘要： An integrated circuit in a package having a ground and/or power ring and bond wires crossing the ground and/or power ring, the bond wires further coupled to signal traces. A semiconductor integrated circuit is provided in a die cavity in a substrate. Signal traces are formed on the surface of the substrate. At least one conductive area is formed surrounding the die cavity. At least one signal trace is formed on the substrate and electrically isolated from the conductive ring. Bond wires are used to couple the die bond pads to the signal traces. At least some of the bond wires are coupled to signal traces and must cross the conductive ring. The bond wires are raised a clearance distance over the power or ground ring by forming a spacer on the inner end of the signal traces. The spacer formed on the signal trace then provides a clearance spacing to prevent the bond wires which cross the power ring from becoming shorted to the power ring. Typically, the spacer is formed as a bond wire ball placed on the signal trace. Typically the conductive ring is used as a ground ring, or as a voltage supply ring, for the integrated circuit. Multiple power or ground rings are used in some embodiments. Other devices and methods are described.

摘要翻译： 封装中的集成电路具有接地和/或功率环和接合线和/或功率环的接合线，所述接合线还耦合到信号迹线。 半导体集成电路设置在基板的模腔中。 信号迹线形成在基板的表面上。 在模腔周围形成至少一个导电区域。 在衬底上形成至少一个信号迹线，并与导电环电隔离。 接合线用于将管芯接合焊盘耦合到信号迹线。 至少一些接合线耦合到信号迹线并且必须穿过导电环。 通过在信号迹线的内端上形成间隔物，使接合线在功率或接地环上升高间隙距离。 形成在信号迹线上的隔离物然后提供间隙，以防止穿过电源环的接合线变得短路到电源环。 通常，间隔件形成为放置在信号迹线上的接合线球。 通常，导电环用作集成电路的接地环或电源环。 在一些实施例中使用多个功率或接地环。 描述其他设备和方法。

公开(公告)号：US4096983A

公开(公告)日：1978-06-27

申请号：US786389

申请日：1977-04-11

申请人： Loraine F. Beilein ,  Frank S. Burkett, Jr.

发明人： Loraine F. Beilein ,  Frank S. Burkett, Jr.

IPC分类号： B23K20/02 ,  B23K31/00 ,  H01L21/603 ,  H01R43/02 ,  B23K31/02

CPC分类号： H01L24/85 ,  B23K20/025 ,  H01L24/48 ,  H01R12/57 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48455 ,  H01L2224/48463 ,  H01L2224/4847 ,  H01L2224/48475 ,  H01L2224/4848 ,  H01L2224/48499 ,  H01L2224/48599 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48844 ,  H01L2224/49429 ,  H01L2224/85051 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L24/45 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/15787 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/20752 ,  H01L2924/20755 ,  H01L2924/2076 ,  Y10S228/904

摘要： A process for thermocompression bonding a copper wire lead to gold film on alumina ceramic substrate by use of a gold interface. The three step process involves: (1) thermocompressing a gold lead with a die-formed head to the gold film, (2) removing the gold lead to form a gold die-formed head bonding pad, and (3) thermocompressing the copper lead to the gold die-formed head bonding pad.

摘要翻译： 通过使用金界面将铜线引线与氧化铝陶瓷基板上的金膜热压接合的方法。 三步工艺包括：（1）将带有模具头的金铅热压到金膜上，（2）去除金铅以形成金模头焊接垫，（3）热压铜导线 到金模头焊接垫。

公开(公告)号：US20170092628A1

公开(公告)日：2017-03-30

申请号：US15373710

申请日：2016-12-09

申请人： KONINKLIJKE PHILIPS N.V.

发明人： Sze Kuang Lee ,  Paul Scott Martin ,  Albrecht Johannes Kraus ,  Chunheng Kang ,  Hui Ling Pan ,  Long Yin

IPC分类号： H01L25/075 ,  H01L33/56 ,  H01L33/48 ,  H01L33/62

CPC分类号： H01L25/0753 ,  H01L33/486 ,  H01L33/56 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/4848 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： In one embodiment, an LED bulb includes a plurality of metal lead frame strips, including at least a first strip, a second strip, and a third strip. First LED dies have their bottom electrodes electrically and thermally connected to a top surface of the first strip. Second LED dies have their bottom electrodes electrically and thermally connected to a top surface of the second strip. The top electrodes of the first LED dies are wire bonded to the second strip, and the top electrodes of the second LED dies are wire bonded to the third strip to connect the first LED dies and second LED dies in series and parallel. The strips are then bent to cause the LED dies to face different directions to obtain a wide emission pattern in a small space. The strips are then enclosed in a thermally conductive bulb having electrical leads.

公开(公告)号：US09289846B2

公开(公告)日：2016-03-22

申请号：US14085981

申请日：2013-11-21

申请人： Siliconware Precision Industries Co., Ltd

发明人： Wei-Sheng Lin ,  Lung-Tang Hung ,  Meng-Hung Yeh ,  Zhi-Lun Hsieh ,  Yude Chu

IPC分类号： B23K31/02 ,  B23K20/00 ,  H01L23/00

CPC分类号： B23K20/007 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/4848 ,  H01L2224/85012 ,  H01L2224/85051 ,  H01L2224/8517 ,  H01L2224/85205 ,  H01L2224/85206 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2224/05599

摘要： A method for fabricating a wire bonding structure is disclosed, which includes: providing a substrate having a plurality of bonding pads; and foaming a ball end of a bonding wire on at least one of the bonding pads by performing a scrubbing process along a path around a periphery of the bonding pad, thereby preventing delamination of the ball end of small size from the bonding pad.

摘要翻译： 公开了一种用于制造引线接合结构的方法，其包括：提供具有多个接合焊盘的基板; 并且通过沿着焊盘周围的路径进行擦洗处理，使接合线的球端部发泡在至少一个接合焊盘上，从而防止小尺寸的球端部从焊盘剥离。

公开(公告)号：US09136145B2

公开(公告)日：2015-09-15

申请号：US13846584

申请日：2013-03-18

申请人： Seiko Instruments Inc.

发明人： Hirofumi Harada

IPC分类号： H01L21/58 ,  H01L23/00 ,  H01L23/495

CPC分类号： H01L21/58 ,  H01L23/49513 ,  H01L23/4952 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05553 ,  H01L2224/05624 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/4848 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/07802 ,  H01L2924/10161 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/00

摘要： Provided is a semiconductor integrated circuit device having flexible pin arrangement. A semiconductor integrated circuit is bonded to a die pad with an insulating paste, and the potential of the die pad is fixed through a bonding wire from an Al pad provided on the surface of the semiconductor integrated circuit. In the case of a P-type semiconductor substrate, the die pad is set as a terminal other than a terminal having a minimum operating potential of the semiconductor integrated circuit.

摘要翻译： 提供了具有柔性引脚布置的半导体集成电路器件。 利用绝缘膏将半导体集成电路接合到管芯焊盘，并且通过接合线将焊盘的电位从设置在半导体集成电路的表面上的Al焊盘固定。 在P型半导体基板的情况下，将芯片焊盘设定为具有半导体集成电路的最小工作电位的端子以外的端子。

公开(公告)号：US20150123277A1

公开(公告)日：2015-05-07

申请号：US14595476

申请日：2015-01-13

申请人： SEIKO INSTRUMENTS INC.

发明人： Noriyuki KIMURA

IPC分类号： H01L23/00 ,  H01L23/31

CPC分类号： H01L24/14 ,  H01L21/565 ,  H01L23/31 ,  H01L23/3107 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/141 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48229 ,  H01L2224/48465 ,  H01L2224/4848 ,  H01L2224/49171 ,  H01L2224/85207 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/1905 ,  H01L2924/384 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A BGA semiconductor package includes a semiconductor device adhered by adhesive to a substrate, and a conductive micro ball fitted into a through-hole provided in the substrate. A bonding wire electrically connects the semiconductor device and the micro ball to each other. An encapsulation member made of resin encapsulates the semiconductor device, the adhesive, part of the micro ball, and the bonding wire, only on a surface side of the substrate on which the semiconductor device is mounted. At least a part of a bottom surface of the micro ball has an exposed portion as an external connection terminal, which is exposed through the through-hole provided in the substrate as a bottom surface of the encapsulation member.

摘要翻译： BGA半导体封装包括通过粘合剂粘合到基板上的半导体器件和装配到设置在基板中的通孔中的导电微球。 接合线将半导体器件和微球彼此电连接。 由树脂制成的密封构件仅在其上安装半导体器件的基板的表面侧封装半导体器件，粘合剂，微球的一部分和接合线。 微球的底面的至少一部分具有作为外部连接端子的暴露部分，其通过设置在基板中的通孔作为封装构件的底表面露出。

公开(公告)号：US08987063B2

公开(公告)日：2015-03-24

申请号：US13372406

申请日：2012-02-13

申请人： Ryoji Harata ,  Hiroaki Narita

发明人： Ryoji Harata ,  Hiroaki Narita

IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L23/495 ,  H01L23/00 ,  B29C45/14 ,  B29C45/00 ,  H01L23/31

CPC分类号： H01L23/49503 ,  B29C45/0046 ,  B29C45/14655 ,  H01L21/565 ,  H01L21/568 ,  H01L23/28 ,  H01L23/3107 ,  H01L23/49575 ,  H01L23/50 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/85 ,  H01L24/97 ,  H01L29/16 ,  H01L29/20 ,  H01L2224/02166 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/45144 ,  H01L2224/48095 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/4848 ,  H01L2224/48639 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/85207 ,  H01L2224/85439 ,  H01L2224/97 ,  H01L2924/01029 ,  H01L2924/10161 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/1306 ,  H01L2924/13063 ,  H01L2924/13064 ,  H01L2924/13091 ,  H01L2924/1421 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/00

摘要： A manufacturing method of a semiconductor device of a thin resin sealed multichip rectangular package having wire connection between the chips, wherein: at least one chip is fixed to a die pad thinned more than a die pad support lead, the die pad is supported by die pad support leads arranged to respectively connect a pair of long sides of the rectangle, and sealing resin is introduced from one side of the pair of long sides when resin molding is performed.

摘要翻译： 一种在芯片之间具有线连接的薄树脂密封多芯矩形封装的半导体器件的制造方法，其中：至少一个芯片固定在比芯片支撑引线更薄的管芯焊盘上，管芯焊盘由管芯支撑 衬垫支撑引线被布置成分别连接矩形的一对长边，并且当进行树脂模制时，从一对长边的一侧引入密封树脂。

公开(公告)号：US20150028081A1

公开(公告)日：2015-01-29

申请号：US14085981

申请日：2013-11-21

申请人： SILICONWARE PRECISION INDUSTRIES CO., LTD

发明人： Wei-Sheng Lin ,  Lung-Tang Hung ,  Meng-Hung Yeh ,  Zhi-Lun Hsieh ,  Yude Chu

IPC分类号： B23K20/10

CPC分类号： B23K20/007 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/4848 ,  H01L2224/85012 ,  H01L2224/85051 ,  H01L2224/8517 ,  H01L2224/85205 ,  H01L2224/85206 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2224/05599

摘要： A method for fabricating a wire bonding structure is disclosed, which includes: providing a substrate having a plurality of bonding pads; and foaming a ball end of a bonding wire on at least one of the bonding pads by performing a scrubbing process along a path around a periphery of the bonding pad, thereby preventing delamination of the ball end of small size from the bonding pad.

摘要翻译： 公开了一种用于制造引线接合结构的方法，其包括：提供具有多个接合焊盘的基板; 并且通过沿着焊盘周围的路径进行擦洗处理，使接合线的球端部发泡在至少一个接合焊盘上，从而防止小尺寸的球端部从焊盘剥离。

公开(公告)号：US20140291823A1

公开(公告)日：2014-10-02

申请号：US14306243

申请日：2014-06-17

申请人： Infineon Technologies AG

发明人： Tyrone Jon Donato Soller

IPC分类号： H01L23/495 ,  H01L25/00

CPC分类号： H01L23/49568 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49575 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/50 ,  H01L2224/16245 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/4848 ,  H01L2224/49113 ,  H01L2224/73221 ,  H01L2224/73253 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2224/85207 ,  H01L2224/85214 ,  H01L2224/85801 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/12032 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2224/45664 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/37099

摘要： Embodiments provide provides a chip package. The chip package may include a leadframe having a die pad and a plurality of lead fingers; a first chip attached to the die pad, the first chip being bonded to one or more of the lead fingers via a first set of wire bonds; a second chip bonded to one or more of the lead fingers via flip chip; and a heat slug attached to the second chip.

公开(公告)号：US08742559B2

公开(公告)日：2014-06-03

申请号：US13419899

申请日：2012-03-14

申请人： Noriyuki Takahashi

发明人： Noriyuki Takahashi

IPC分类号： H01L23/02 ,  H01L23/495 ,  H01L31/048 ,  H01L23/40

CPC分类号： H01L23/3142 ,  H01L21/50 ,  H01L23/057 ,  H01L23/10 ,  H01L23/4334 ,  H01L23/495 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14621 ,  H01L31/048 ,  H01L2023/4031 ,  H01L2224/05554 ,  H01L2224/0612 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48479 ,  H01L2224/4848 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85181 ,  H01L2224/85207 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2225/06582 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  Y02E10/50 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/48471 ,  H01L2224/45099 ,  H01L2224/48465 ,  H01L2224/4554

摘要： To suppress the reduction in reliability of a resin-sealed semiconductor device. A first cap (member) and a second cap (member) with a cavity (space formation portion) are superimposed and bonded together to form a sealed space. A semiconductor including a sensor chip (semiconductor chip) and wires inside the space is manufactured in the following way. In a sealing step of sealing a joint part between the caps, a sealing member is formed of resin such that an entirety of an upper surface of the second cap and an entirety of a lower surface of the first cap are respectively exposed. Thus, in the sealing step, the pressure acting in the direction of crushing the second cap can be decreased.

摘要翻译： 为了抑制树脂密封型半导体装置的可靠性降低。 具有空腔（空间形成部分）的第一盖（构件）和第二盖（构件）被叠置并结合在一起以形成密封空间。 包括传感器芯片（半导体芯片）和空间内的电线的半导体以下列方式制造。 在密封盖之间的接合部分的密封步骤中，密封件由树脂形成，使得第二盖的整个上表面和第一盖的下表面的整体分别露出。 因此，在密封步骤中，可以减小沿第二盖的粉碎方向作用的压力。