公开(公告)号：US20110291286A1

公开(公告)日：2011-12-01

申请号：US13117340

申请日：2011-05-27

申请人： Agatino Minotti ,  Giuseppe Cristaldi

发明人： Agatino Minotti ,  Giuseppe Cristaldi

IPC分类号： H01L23/52 ,  H01L21/60

CPC分类号： H01L23/49562 ,  H01L23/49524 ,  H01L24/37 ,  H01L24/40 ,  H01L24/48 ,  H01L2224/371 ,  H01L2224/37124 ,  H01L2224/4007 ,  H01L2224/40091 ,  H01L2224/40245 ,  H01L2224/45014 ,  H01L2224/48247 ,  H01L2224/73219 ,  H01L2224/73221 ,  H01L2224/83801 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/84

摘要： An electronic device including a die-pad area, a die fixed to the die-pad area, a connection terminal, and a ribbon of conductive material. The ribbon is electrically connected to the die and to the connection terminal, and has a prevalent dimension along a first axis, a width, measured along a second axis, which is transverse to the first axis, and a thickness, which is negligible with respect to the width; the ribbon moreover has a cross section that defines a concave geometrical shape.

摘要翻译： 一种电子设备，包括芯片焊盘区域，固定到芯片焊盘区域的管芯，连接端子和导电材料带。 带状物电连接到管芯和连接端子，并且具有沿第一轴线的普遍尺寸，沿第二轴线测量的横向于第一轴线的宽度，以及相对于第一轴线可忽略的厚度 到宽度; 该带还具有限定凹形几何形状的横截面。

公开(公告)号：US08040708B2

公开(公告)日：2011-10-18

申请号：US12480112

申请日：2009-06-08

申请人： Yukihiro Sato ,  Tomoaki Uno

发明人： Yukihiro Sato ,  Tomoaki Uno

IPC分类号： H02M1/00

CPC分类号： H01L23/492 ,  H01L23/3107 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49548 ,  H01L23/49575 ,  H01L23/49582 ,  H01L24/05 ,  H01L24/33 ,  H01L24/34 ,  H01L24/36 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/84 ,  H01L24/91 ,  H01L2224/04042 ,  H01L2224/05073 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05644 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/37011 ,  H01L2224/371 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/37599 ,  H01L2224/4007 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48095 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/4847 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/49111 ,  H01L2224/49112 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/73219 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2224/85439 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12044 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/351 ,  H02M7/003 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2224/84 ,  H01L2924/00 ,  H01L2924/00012

摘要： The reliability of a semiconductor device is improved.A package of a semiconductor device internally includes a first semiconductor chip and a second semiconductor chip in which power MOS•FETs are formed and a third semiconductor chip in which a control circuit controlling the first and second semiconductor chips is formed. The first to third semiconductor chips are mounted on die pads respectively. Source electrode bonding pads of the first semiconductor chip on a high side are electrically connected with a first die pad of the die pads via a metal plate. On a top surface of the die pad 7D2, a plated layer formed in a region where the second semiconductor chip is mounted, and another plated layer formed in a region where the metal plate is joined are provided and the plated layers are separated each other with a region where no plated layer is formed in between.

摘要翻译： 提高了半导体器件的可靠性。 半导体器件的封装在内部包括形成功率MOS•FET的第一半导体芯片和第二半导体芯片，以及形成控制第一和第二半导体芯片的控制电路的第三半导体芯片。 第一至第三半导体芯片分别安装在芯片焊盘上。 第一半导体芯片的高侧的源电极接合焊盘通过金属板与管芯焊盘的第一管芯焊盘电连接。 在芯片焊盘7D2的顶面设置有形成在安装有第二半导体芯片的区域中的镀层和形成在金属板接合的区域中的另一个镀层，并且将镀层彼此分离，并且用 在其间不形成镀层的区域。

公开(公告)号：US08035221B2

公开(公告)日：2011-10-11

申请号：US12250525

申请日：2008-10-13

申请人： Randolph Cruz

发明人： Randolph Cruz

IPC分类号： H01L23/12

CPC分类号： H01L23/49575 ,  H01L23/49503 ,  H01L23/49524 ,  H01L23/49541 ,  H01L24/37 ,  H01L24/40 ,  H01L24/48 ,  H01L24/49 ,  H01L24/95 ,  H01L2224/05554 ,  H01L2224/37147 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/45014 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73219 ,  H01L2224/73221 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A leadframe having a die thereon connects a high current conductive area on the die to a leadframe contact using a copper clip that include a structural portion that is received within a recess-like “tub” that is formed in the leadframe contact which tub is shaped to conform to the geometric shape of the clip. In the preferred embodiment, a leadframe structure fabricated by etching includes at least one contact that is a halfetch recess or “tub” that receives one end of the clip structure and is retained in the tub by an adhesive. The end of the clip that is received in the tub is held in place during subsequent handling until the clip and leadframe undergo solder reflow to effect an electrical connection sufficient to handle the current load and also effect a reliable mechanical connection.

摘要翻译： 具有芯片的引线框架使用铜夹将管芯上的高电流导电区域连接到引线框接触件，该铜夹子包括结构部分，该结构部分被容纳在形成在引线框接触件中的凹槽状“ 以符合夹子的几何形状。 在优选实施例中，通过蚀刻制造的引线框架结构包括至少一个触点，其是接收夹结构的一端并通过粘合剂保持在桶中的半凹槽或“凹槽”。 容纳在桶中的夹子的端部在后续处理期间保持就位，直到夹子和引线框架经历回流焊以实现足以处理当前负载的电连接并且还实现可靠的机械连接。

公开(公告)号：US08035206B2

公开(公告)日：2011-10-11

申请号：US12252332

申请日：2008-10-15

申请人： Randolph Cruz

发明人： Randolph Cruz

IPC分类号： H01L23/495

CPC分类号： H01L23/49575 ,  H01L23/49503 ,  H01L23/49524 ,  H01L23/49541 ,  H01L24/37 ,  H01L24/40 ,  H01L24/48 ,  H01L24/49 ,  H01L24/95 ,  H01L2224/05554 ,  H01L2224/37147 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/45014 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73219 ,  H01L2224/73221 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A lead frame having a die thereon connects a high current conductive area on the die to a lead frame contact using a copper clip that includes a structure portion that is received with a recess-like “tub” formed in the lead frame contact. In the preferred embodiment, a lead frame structure fabricated by etching includes at least one contact that is a half-etch recess or “tub” that receives one end of the clip structure and is retained in the tub by solder paste or an adhesive. The end of the clip that is received in the tub is held in place during subsequent handling until the clip and leadframe undergo solder reflow to effect an electrical connection sufficient to handle the current load and a also effect a reliable mechanical connection. One or more solder-holding pockets are formed a surface portion of the tub and/or the end of the clip that is received in the tub so that a volume of liquefied solder formed during the solder reflow step will effect alignment of any mis-aligned parts by “drawing” at least one of the parts against a “stop” surface.

摘要翻译： 具有芯片的引线框架使用铜夹夹住管芯上的高电流导电区域，引线框架接触件包括形成在引线框接触件中的凹陷状“桶”的结构部分。 在优选实施例中，通过蚀刻制造的引线框架结构包括至少一个触点，其是接受夹子结构的一端并通过焊膏或粘合剂保持在桶中的半蚀刻凹槽或“凹槽”。 容纳在桶中的夹子的端部在随后的处理期间保持就位，直到夹子和引线框架经历回流焊，以实现足以处理当前负载的电连接并且还实现可靠的机械连接。 一个或多个焊料保持袋形成在桶的表面部分和/或夹子的端部，其被容纳在桶中，使得在焊料回流步骤期间形成的液化焊料的体积将导致任何错误对准 部件通过将“至少一个”零件“相对于”停止“表面”绘制“。

公开(公告)号：US20110186981A1

公开(公告)日：2011-08-04

申请号：US13019390

申请日：2011-02-02

申请人： Daisuke Fukuoka ,  Takanori Teshima ,  Kuniaki Mamitsu

发明人： Daisuke Fukuoka ,  Takanori Teshima ,  Kuniaki Mamitsu

IPC分类号： H01L23/48 ,  H01L21/56

CPC分类号： H01L21/56 ,  H01L23/48 ,  H01L24/96 ,  H01L2224/04026 ,  H01L2224/0405 ,  H01L2224/04105 ,  H01L2224/2518 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/73219 ,  H01L2224/73267 ,  H01L2224/73269 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/15159 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2924/00

摘要： A semiconductor device includes a plate-shaped semiconductor element and an electrically insulating resin member. The semiconductor element has a front-surface electrode on its front surface and a back-surface electrode on its back surface. The resin member encapsulates the semiconductor element. The front-surface electrode is exposed to a front side of an outer surface of the resin member. The back-surface electrode is exposed to a back side of the outer surface of the resin member. The resin member has an extension portion that covers the entire side surface of the semiconductor element and extends from the side surface of the semiconductor element in a direction parallel to the front surface of the semiconductor element.

摘要翻译： 半导体器件包括板状半导体元件和电绝缘树脂构件。 半导体元件在其前表面具有前表面电极，在其后表面具有背表面电极。 树脂部件封装半导体元件。 前表面电极暴露于树脂构件的外表面的前侧。 背面电极暴露于树脂构件的外表面的背面。 树脂构件具有覆盖半导体元件的整个侧表面的延伸部分，并且在与半导体元件的前表面平行的方向上从半导体元件的侧表面延伸。

公开(公告)号：US20110163431A1

公开(公告)日：2011-07-07

申请号：US12934018

申请日：2009-09-08

申请人： Chie Fujioka ,  Toshiyuki Yokoe ,  Daichi Kumano

发明人： Chie Fujioka ,  Toshiyuki Yokoe ,  Daichi Kumano

IPC分类号： H01L23/495 ,  H01L21/449

CPC分类号： H01L24/40 ,  H01L23/49524 ,  H01L23/49562 ,  H01L24/06 ,  H01L24/16 ,  H01L24/29 ,  H01L24/37 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/84 ,  H01L2224/0401 ,  H01L2224/05553 ,  H01L2224/05624 ,  H01L2224/0603 ,  H01L2224/29339 ,  H01L2224/37124 ,  H01L2224/40091 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48108 ,  H01L2224/48247 ,  H01L2224/48624 ,  H01L2224/73219 ,  H01L2224/73221 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/84205 ,  H01L2224/85375 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/84 ,  H01L2924/00 ,  H01L2924/00012

摘要： Retaining regions 310a and 310b are added to a pad shaped portion 303a of leads and a die pad 302 that are electrically connected via a conductive ribbon 309, so that during the bonding of the ribbon, strong ultrasonic waves can be applied in a state in which the retaining regions 310a and 310b are pressed and fixed. It is therefore possible to reduce a resistance at a joint while firmly bonding the conductive ribbon 309. Further, the bonding strength of the conductive ribbon 309 increases and thus it is possible to eliminate the need for stacking the conductive ribbons 309 and easily reduce a stress caused by ultrasonic waves on a semiconductor chip 306.

摘要翻译： 保持区域310a和310b被添加到通过导电带309电连接的引线和芯片焊盘302的焊盘形部分303a，使得在带状物的接合期间可以在其中施加强超声波 保持区域310a和310b被按压和固定。 因此，可以在牢固地接合导电带309的同时降低接头处的电阻。此外，导电带309的接合强度增加，因此可以消除堆叠导电带309的需要并且容易地减小应力 由半导体芯片306上的超声波引起的。

公开(公告)号：US07872337B2

公开(公告)日：2011-01-18

申请号：US11350827

申请日：2006-02-10

申请人： Tetsujiro Tsunoda

发明人： Tetsujiro Tsunoda

IPC分类号： H01L23/02

CPC分类号： H01L23/49861 ,  H01L23/057 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/73 ,  H01L24/84 ,  H01L24/85 ,  H01L24/90 ,  H01L25/072 ,  H01L25/18 ,  H01L2224/37147 ,  H01L2224/37599 ,  H01L2224/40137 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48247 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2224/73219 ,  H01L2224/73221 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2224/85 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/19043 ,  H01L2924/19107 ,  H01L2924/351 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/05599

摘要： One of the aspects of the present invention is to provide a semiconductor device, which includes a case, and an insulating substrate provided within the case. It also includes a plurality of semiconductor chips mounted on the insulating substrate, each of which has a first chip electrode for receiving a control signal, and a flexible board supported by the case, which includes a body portion and a plurality of lead portions extending from the body portion. Each of the first chip electrodes is electrically connected with the respective one of the lead portions.

摘要翻译： 本发明的一个方面是提供一种包括壳体的半导体器件和设置在壳体内的绝缘基板。 它还包括安装在绝缘基板上的多个半导体芯片，每个半导体芯片具有用于接收控制信号的第一芯片电极和由外壳支撑的柔性板，其包括主体部分和从 身体部位。 每个第一芯片电极与相应的引线部分电连接。

公开(公告)号：US07859089B2

公开(公告)日：2010-12-28

申请号：US11800125

申请日：2007-05-04

申请人： Kunzhong Hu ,  Chuan Cheah

发明人： Kunzhong Hu ,  Chuan Cheah

IPC分类号： H01L23/485

CPC分类号： H01L23/49562 ,  H01L23/49524 ,  H01L24/37 ,  H01L24/40 ,  H01L24/48 ,  H01L2224/0603 ,  H01L2224/37011 ,  H01L2224/37147 ,  H01L2224/4007 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/48247 ,  H01L2224/73219 ,  H01L2224/73221 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A copper strap for a semiconductor device package having a contact electrically connected to a die electrode, a leg portion electrically connected to a lead frame, a web portion positioned between the contact and the leg portion and connected to the leg portion and a connection region connecting the web portion to the contact. The contact includes a body having a plurality of formations, each of the plurality of formations having a concavity and an opposing convexity positioned to generally face the die electrode.

摘要翻译： 一种用于半导体器件封装的铜带，其具有电连接到管芯电极的触点，电连接到引线框架的脚部分，位于触点和腿部之间并连接到腿部的腹板部分和连接到连接部分的连接区域 网页部分到联系人。 触点包括具有多个结构的主体，多个结构中的每一个具有凹部和相对的凸起，其大致面对模具电极。

公开(公告)号：US20100258945A1

公开(公告)日：2010-10-14

申请号：US12756208

申请日：2010-04-08

申请人： NORIKO NUMATA ,  Hiroshi Sato ,  Toru Ueguri

发明人： NORIKO NUMATA ,  Hiroshi Sato ,  Toru Ueguri

IPC分类号： H01L23/488 ,  H01L21/60

CPC分类号： H01L29/7813 ,  H01L23/4824 ,  H01L23/49524 ,  H01L23/49562 ,  H01L23/544 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/77 ,  H01L24/78 ,  H01L24/84 ,  H01L24/85 ,  H01L24/97 ,  H01L29/41766 ,  H01L29/4236 ,  H01L29/42372 ,  H01L29/42376 ,  H01L29/456 ,  H01L29/66719 ,  H01L29/7811 ,  H01L2223/54486 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/0603 ,  H01L2224/32245 ,  H01L2224/37124 ,  H01L2224/40091 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48132 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/49171 ,  H01L2224/73219 ,  H01L2224/73221 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/78 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/85205 ,  H01L2224/85399 ,  H01L2224/92 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2224/83 ,  H01L2224/84 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00015 ,  H01L2924/00012

摘要： In a method for manufacturing a semiconductor device involving the step of bonding a metallic ribbon to a pad of a semiconductor chip, breakage of the metallic ribbon is to be prevented while ensuring the bonding strength even when the metallic ribbon becomes thin with reduction in size of the semiconductor chip. In bonding an Al ribbon to a pad of a semiconductor chip by bringing a pressure bonding surface of a wedge tool into pressure contact with the Al ribbon while applying ultrasonic vibration to the ribbon positioned over the pad, recesses 10a are formed beforehand at both end portions respectively of the wedge tool lest both end portions in the width direction of the Al ribbon bonded to the pad should contact the pressure bonding surface of the wedge tool.

摘要翻译： 在涉及将金属带接合到半导体芯片的焊盘的步骤的半导体器件的制造方法中，即使当金属带变薄时，也可以确保金属带的断裂，同时确保接合强度，同时尺寸减小 半导体芯片。 通过使楔形工具的压接面与Al带压接，同时对位于焊盘上的带施加超声波振动，将Al带接合到半导体芯片的焊盘，在两端部预先形成有凹部10a 分别与楔形工具接合的Al带的宽度方向上的两个端部应接触楔形工具的压接表面。

公开(公告)号：US07705443B2

公开(公告)日：2010-04-27

申请号：US11872867

申请日：2007-10-16

申请人： Toshiyuki Yokomae ,  Katsumichi Ueyanagi ,  Eiji Mochizuki ,  Yoshinari Ikeda

发明人： Toshiyuki Yokomae ,  Katsumichi Ueyanagi ,  Eiji Mochizuki ,  Yoshinari Ikeda

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L23/495 ,  H01L29/40

CPC分类号： H01L25/072 ,  H01L23/3735 ,  H01L23/49811 ,  H01L24/29 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/84 ,  H01L25/162 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/05553 ,  H01L2224/37011 ,  H01L2224/371 ,  H01L2224/37111 ,  H01L2224/37144 ,  H01L2224/37147 ,  H01L2224/3754 ,  H01L2224/40137 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48175 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2224/73219 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/83224 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2224/85205 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/0106 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An electrical connection inside a semiconductor device is established by lead frames formed of plural conductor plates. The lead frames are disposed three-dimensionally so that the respective weld parts thereof are exposed toward a laser light source used in the laser welding. The laser welding is then performed by irradiating a laser beam. According to the above, welding can be performed readily in a reliable manner. The productivity of the semiconductor device and the manufacturing method of the semiconductor device can be thus enhanced. In addition, because the lead frames have the cooling effect, they have the capability of a heat spreader. It is thus possible to provide a semiconductor device and a manufacturing method of the semiconductor device with high productivity.

摘要翻译： 通过由多个导体板形成的引线框架建立半导体器件内部的电连接。 引线框架三维地设置，使得其各个焊接部分朝向激光焊接中使用的激光源曝光。 然后通过照射激光束来进行激光焊接。 根据上述，可以容易地以可靠的方式进行焊接。 因此可以提高半导体器件的生产率和半导体器件的制造方法。 另外，由于引线框具有冷却效果，因此具有散热器的能力。 因此，可以以高生产率提供半导体器件的半导体器件和制造方法。