公开(公告)号：US08276269B2

公开(公告)日：2012-10-02

申请号：US12214700

申请日：2008-06-20

Applicant: Houssam Jomaa ,  Omar J. Bchir

Inventor： Houssam Jomaa ,  Omar J. Bchir

IPC: H01R9/00

CPC classification number: H05K3/28 ,  H01L21/4853 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/5387 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1433 ,  H01L2924/15311 ,  H05K1/189 ,  H05K3/0035 ,  H05K3/3452 ,  H05K2201/0162 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/099 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49153 ,  Y10T29/49165 ,  Y10T29/49169 ,  H01L2224/05599

Abstract: A microelectronic device mounting substrate includes a bond pad with a side wall and an upper surface. A dielectric first layer is disposed on the mounting substrate and a solder mask second layer is disposed on the dielectric first layer. A uniform recess is disposed through the solder mask second layer and the dielectric first layer that exposes the portion of the bond pad upper surface.

Abstract translation: 微电子器件安装基板包括具有侧壁和上表面的接合焊盘。 电介质第一层设置在安装基板上，并且焊料掩模第二层设置在电介质第一层上。 通过焊接掩模第二层和暴露接合焊盘上表面的部分的电介质第一层设置均匀的凹部。

公开(公告)号：US08245393B2

公开(公告)日：2012-08-21

申请号：US12234529

申请日：2008-09-19

Applicant: Seung Hun Hong ,  Sung Myung ,  Ju Wan Kang

Inventor： Seung Hun Hong ,  Sung Myung ,  Ju Wan Kang

IPC: H01K3/00

CPC classification number: H05K1/032 ,  B82Y10/00 ,  H05K1/0393 ,  H05K1/167 ,  H05K3/207 ,  H05K2201/0162 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2203/0522 ,  H05K2203/105 ,  H05K2203/1173 ,  H05K2203/1453 ,  Y10T29/49117 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49162 ,  Y10T29/49165

Abstract: A method for fabricating a circuit board includes providing a first substrate, forming a circuit on the first substrate, the circuit having a first electrode, a second electrode and at least one nanostructure, and transferring the circuit from the first substrate to a surface of a second substrate made of a polymer.

Abstract translation: 一种制造电路板的方法，包括提供第一衬底，在第一衬底上形成电路，该电路具有第一电极，第二电极和至少一个纳米结构，并将电路从第一衬底转移到 由聚合物制成的第二基材。

公开(公告)号：US08223498B2

公开(公告)日：2012-07-17

申请号：US12616497

申请日：2009-11-11

Applicant: David J. Lima

Inventor： David J. Lima

IPC: H05K7/20 ,  H05K13/04

CPC classification number: H05K7/20418 ,  H05K1/0204 ,  H05K1/0206 ,  H05K1/0209 ,  H05K7/205 ,  H05K2201/0162 ,  Y10T29/49117

Abstract: In some embodiments, an apparatus includes a printed circuit board and a thermal interface member. The printed circuit board is configured to be coupled to an electronic device, such as, for example, a removable (or “pluggable”) optical transceiver. A first surface of the printed circuit board includes a thermally-conductive portion, and a second surface of the printed circuit board includes a thermally-conductive portion that is coupled to the thermally-conductive portion of the first surface by a thermally-conductive via between the first surface and the second surface. The thermal interface member is coupled to the first surface of the printed circuit board such that a portion of the thermal interface member is in contact with the thermally-conductive portion of the first surface. The portion of thermal interface member is deformable and thermally-conductive.

Abstract translation: 在一些实施例中，装置包括印刷电路板和热接口部件。 印刷电路板被配置为耦合到电子设备，例如可移除（或“可插拔”）光收发器。 印刷电路板的第一表面包括导热部分，并且印刷电路板的第二表面包括导热部分，该导热部分通过第二表面的导热部分之间的导热部分 第一表面和第二表面。 热接口构件联接到印刷电路板的第一表面，使得热界面构件的一部分与第一表面的导热部分接触。 热界面构件的部分是可变形和导热的。

公开(公告)号：US20120132459A1

公开(公告)日：2012-05-31

申请号：US13366184

申请日：2012-02-03

Applicant: Seung Hun Hong ,  Sung Myung ,  Ju Wan Kang

Inventor： Seung Hun Hong ,  Sung Myung ,  Ju Wan Kang

IPC: H05K1/03

CPC classification number: H05K1/032 ,  B82Y10/00 ,  H05K1/0393 ,  H05K1/167 ,  H05K3/207 ,  H05K2201/0162 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2203/0522 ,  H05K2203/105 ,  H05K2203/1173 ,  H05K2203/1453 ,  Y10T29/49117 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49162 ,  Y10T29/49165

Abstract: Circuit boards having a polymer substrate, a first electrode and a second electrode disposed on a surface of the polymer substrate, and at least one nanostructure electrically connected to the first and second electrodes are generally disclosed.

Abstract translation: 通常公开了具有聚合物基板，设置在聚合物基板的表面上的第一电极和第二电极以及与第一和第二电极电连接的至少一个纳米结构的电路板。

公开(公告)号：US20120127684A1

公开(公告)日：2012-05-24

申请号：US13388450

申请日：2010-02-24

Applicant: Hironori Matsumoto ,  Jumpei Kusukawa

Inventor： Hironori Matsumoto ,  Jumpei Kusukawa

IPC: H05K7/04 ,  H05K1/05

CPC classification number: H05K1/056 ,  H01L23/142 ,  H01L23/49844 ,  H01L23/62 ,  H01L23/647 ,  H01L25/072 ,  H01L25/18 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  H05K1/0204 ,  H05K1/0256 ,  H05K1/0257 ,  H05K1/0262 ,  H05K1/053 ,  H05K2201/0154 ,  H05K2201/0162 ,  H05K2201/0209 ,  H05K2201/0761 ,  H05K2201/09781 ,  H05K2201/10022 ,  H01L2924/00

Abstract: The invention relates to a high-voltage insulation circuit board which is used in an electric power apparatus such as an electric power converter or the like such as power semiconductor device, inverter module, or the like and provides an insulation circuit board in which electric field concentration at the end sections of a wiring pattern is reduced, partial discharging is suppressed, and a reliability is high. According to the invention, there is provided an insulation circuit board having: a metal base substrate; and wiring patterns which are formed onto at least one of the surfaces of the metal base substrate through an insulation layer, characterized in that between two adjacent wiring patterns in which an electric potential difference exists among the wiring patterns, at least one or more wiring patterns or conductors which are in contact with the insulation layer and have an electric potential in a range of the electric potential difference between the adjacent wiring patterns are arranged. According to the invention, the electric field concentration at the end sections of the wiring pattern to which a high voltage is applied is reduced and partial-discharge-resistant characteristics are improved.

Abstract translation: 本发明涉及一种用于诸如功率半导体器件，逆变器模块等的电力转换器等的电力设备中使用的高压绝缘电路板，​​并且提供了一种绝缘电路板，​​其中电场 在布线图案的端部处的浓度降低，部分放电被抑制，可靠性高。 根据本发明，提供了一种绝缘电路板，​​其具有：金属基底; 以及通过绝缘层形成在金属基底基板的至少一个表面上的布线图案，其特征在于，在布线图案之间存在电位差的两个相邻布线图案之间，至少一个或多个布线图案 或与绝缘层接触并且在相邻布线图案之间的电位差范围内具有电位的导体。 根据本发明，施加高电压的布线图案的端部处的电场浓度降低，并且提高耐局部放电特性。

公开(公告)号：US08174822B2

公开(公告)日：2012-05-08

申请号：US11978629

申请日：2007-10-30

Applicant: Chul-Hong Kim ,  Jung-Keun Ahn ,  Hyun-Mi Jeong ,  Sung-Bae Kim ,  Bu-Kyeong Mo ,  Jeong-Rok Cha

Inventor： Chul-Hong Kim ,  Jung-Keun Ahn ,  Hyun-Mi Jeong ,  Sung-Bae Kim ,  Bu-Kyeong Mo ,  Jeong-Rok Cha

IPC: H05K5/00 ,  H05K7/00 ,  G02F1/1333 ,  G09G3/28 ,  G03F1/1345

CPC classification number: H05K3/361 ,  H05K3/284 ,  H05K3/323 ,  H05K3/389 ,  H05K7/20963 ,  H05K2201/0162 ,  H05K2201/0195 ,  H05K2201/10977

Abstract: A plasma display device includes a plasma display panel (PDP) having electrodes between front and rear substrates, a chassis base on an outer surface of the PDP, a printed circuit board assembly (PBA) on the chassis base, a flexible printed circuit (FPC) connecting the PBA to the electrodes of the PDP, an anisotropic conductive film between terminals of the electrodes and a terminal of the FPC, and a sealing member surrounding the terminals of the electrodes and the terminal of the FPC, the sealing member including a surface hydrophobic modifying layer and an insulation layer.

Abstract translation: 等离子体显示装置包括在前基板和后基板之间具有电极的等离子体显示面板（PDP），PDP的外表面上的底座，底座上的印刷电路板组件（PBA），柔性印刷电路 ）将PBA连接到PDP的电极，电极的端子和FPC的端子之间的各向异性导电膜和围绕电极的端子和FPC的端子的密封构件，密封构件包括表面 疏水改性层和绝缘层。

公开(公告)号：US08092900B2

公开(公告)日：2012-01-10

申请号：US11659363

申请日：2005-08-04

Applicant: Kanji Shimoosako ,  Takashi Ito ,  Masaru Nishinaka ,  Shigeru Tanaka ,  Mutsuaki Murakami

Inventor： Kanji Shimoosako ,  Takashi Ito ,  Masaru Nishinaka ,  Shigeru Tanaka ,  Mutsuaki Murakami

IPC: B32B15/08

CPC classification number: H05K3/387 ,  C08G73/106 ,  C08G77/54 ,  C08L79/08 ,  C08L83/14 ,  C09J179/08 ,  C23C18/1641 ,  C23C18/1653 ,  C23C18/2086 ,  C23C18/31 ,  C23C18/38 ,  H05K1/0346 ,  H05K1/036 ,  H05K3/181 ,  H05K2201/0154 ,  H05K2201/0162 ,  Y10S428/901 ,  Y10T428/24355 ,  Y10T428/24917 ,  Y10T428/31681 ,  Y10T428/31721

Abstract: It is an object of the present invention to provide a component for plating suitably used in, for example, producing a printed circuit board, a solution, and a printed circuit board including the component, the component for plating having satisfactory adhesion to an electroless plating film provided on a surface of the component even when the surface roughness of the surface of the component is small. The object is achieved by a component for electroless plating including at least a surface a for electroless plating, the surface a having a surface roughness of 0.5 μm or less in terms of arithmetic average roughness measured with a cutoff value of 0.002 mm, and the surface a containing a polyimide resin having a siloxane structure.

Abstract translation: 本发明的目的是提供一种适用于例如制造印刷电路板，溶液和包括该组分的印刷电路板的电镀用部件，该电镀用部件对化学镀具有良好的粘附性 甚至当组件的表面的表面粗糙度小时也提供在组件的表面上。 该目的通过包括至少一个用于化学镀的表面a的化学镀的部件来实现，表面a具有以0.002mm的截止值测量的算术平均粗糙度为0.5μm或更小的表面粗糙度，以及表面 a含有具有硅氧烷结构的聚酰亚胺树脂。

公开(公告)号：US08033013B2

公开(公告)日：2011-10-11

申请号：US12164799

申请日：2008-06-30

Applicant: Yen Ching Chiang ,  Shih Chia Fang ,  Jun Yi Wang ,  Hsiu Lin Huang

Inventor： Yen Ching Chiang ,  Shih Chia Fang ,  Jun Yi Wang ,  Hsiu Lin Huang

IPC: H05K3/02 ,  H05K1/03

CPC classification number: H05K3/4691 ,  H05K1/118 ,  H05K3/288 ,  H05K2201/0162 ,  H05K2201/099 ,  H05K2203/0264 ,  H05K2203/0759 ,  H05K2203/308 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: The invention relates to a method of fabricating a flexible-rigid PCB which includes a flexible circuit substrate and a rigid circuit substrate. The flexible circuit substrate defines a rigid region and an exposed region and has a conductive pattern, such as conductive traces, formed on the exposed region. The method includes the steps of providing the flexible circuit substrate; printing a paste containing epoxy-silicone hybrid materials onto the conductive pattern; curing the paste; and building up the rigid circuit substrate on the rigid region of the flexible circuit substrate. Particularly, the paste having a specific composition is subjected to predetermined conditions of temperature and time in order to transform the paste into a peelable mask with heat resistance, chemical resistance and a contact angle greater than 20 degrees.

Abstract translation: 本发明涉及一种制造柔性刚性PCB的方法，其包括柔性电路基板和刚性电路基板。 柔性电路衬底限定刚性区域和暴露区域，并且具有形成在暴露区域上的导电图案，例如导电迹线。 该方法包括提供柔性电路基板的步骤; 将含有环氧 - 硅氧烷杂化材料的糊料印刷到导电图案上; 固化糊状物 以及在柔性电路基板的刚性区域上建立刚性电路基板。 特别地，具有特定组成的糊料经受预定的温度和时间条件，以便将该糊料转变成具有耐热性，耐化学性和接触角大于20度的可剥离掩模。

公开(公告)号：US20110210364A1

公开(公告)日：2011-09-01

申请号：US13104842

申请日：2011-05-10

Applicant: Robert J. Nolan ,  Jeffery D. Harman, SR.

Inventor： Robert J. Nolan ,  Jeffery D. Harman, SR.

IPC: H01L33/52 ,  H01L33/50

CPC classification number: H01L33/52 ,  H01L33/44 ,  H01L51/5253 ,  H01L2933/0025 ,  H05K3/284 ,  H05K2201/0162 ,  H05K2201/10106 ,  H05K2203/1366

Abstract: A silicone protective coating for an electronic light source and a method for applying the coating over an exposed or outer surface of the electronic light source assembled as part of or mounted to a circuit board or other substrate.

Abstract translation: 一种用于电子光源的硅氧烷保护涂层，以及将该涂层涂覆在电子光源的暴露或外表面上，作为电路板或其他基板的一部分或安装在电路板或其他基板上的方法。

公开(公告)号：US20110143103A1

公开(公告)日：2011-06-16

申请号：US12963727

申请日：2010-12-09

Applicant: Masahiro Furuya ,  Michihiro Sugo ,  Hideto Kato ,  Kazunori Kondo ,  Shohei Tagami ,  Tomoyuki Goto

Inventor： Masahiro Furuya ,  Michihiro Sugo ,  Hideto Kato ,  Kazunori Kondo ,  Shohei Tagami ,  Tomoyuki Goto

IPC: G03F7/004 ,  G03F7/20 ,  B32B3/10 ,  B32B7/12

CPC classification number: G03F7/0387 ,  C08G73/1039 ,  C08G73/1042 ,  C08G73/1046 ,  C08G73/1053 ,  C08G73/106 ,  C08K5/3445 ,  C08K5/34922 ,  C08K5/41 ,  C08K5/49 ,  C08L63/00 ,  C08L79/08 ,  C09D179/08 ,  C09J179/08 ,  G03F7/0382 ,  G03F7/0757 ,  H05K3/287 ,  H05K2201/0154 ,  H05K2201/0162 ,  Y10S430/107 ,  Y10T428/24802 ,  Y10T428/269 ,  C08L2666/22

Abstract: The invention relates to a photo-curable resin composition, which contains a polyimide silicone having a primary alcoholic hydroxyl group, as a component (A); at least one compound selected from the group consisting of an amino condensation product modified with formalin or a formalin-alcohol and a phenol compound having two or more in average of methylol group or alkoxymethylol group in one molecule thereof, as a component (B); and a photo-acid generator as a component (C). When used as an adhesive, the photo-curable resin composition further contains a multifunctional epoxy compound as a component (D).

Abstract translation: 本发明涉及含有主要醇羟基的聚酰亚胺硅氧烷作为组分（A）的光固化树脂组合物; 作为组分（B）的至少一种选自由福尔马林或福尔马林醇修饰的氨基缩合产物和在其一分子中具有两个或更多个平均羟甲基或烷氧基羟甲基的酚化合物的化合物; 和作为（C）成分的光酸发生剂。 作为粘合剂使用时，光固化性树脂组合物还含有作为（D）成分的多官能环氧化合物。