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    Self-destructible molded articles
    44.
    发明授权
    Self-destructible molded articles 失效
    自毁可塑模制品

    公开(公告)号：US3697668A

    公开(公告)日：1972-10-10

    申请号：US3697668D

    申请日：1968-12-13

    Applicant: NCR CO

    Inventor： CAMPBELL HUGH W

    IPC: H05K1/03 ,  H05K1/00

    CPC classification number: H05K1/0373 ,  H05K1/0275 ,  H05K2201/0209 ,  H05K2201/0251 ,  H05K2201/09118 ,  H05K2203/1163 ,  H05K2203/178

    Abstract: This disclosure is directed to on-command, self-destructible, fibrous-reinforced molded structures, e.g., printed circuit assemblies, comprising a plastic-fibrous matrix containing encapsulated material capable of rapid yet non-explosive combustion, e.g., incendiary or pyrotechnic material. The major surfaces (faces) of said structures can be provided with an electroconductive portion(s), or conductive face, e.g., metallic, materials (facing sheets) can be secured thereto. One of the facing sheets can constitute or contain a printed circuit. All of the incendiary material must be encapsulated to render it inactive at ambient conditions until the desired time for ignition and achieve other advantages. Moreover, the structures can be provided with an igniter(s) to communicate with at least a portion of the encapsulated incendiary composition. A predominant portion of the molded structure is incendiary material and the burning temperature can be controlled in a satisfactory manner by controlling the concentration of incendiary, esp. fuel.

    PROCESS TO PRODUCE CONFORMAL NANO-COMPOSITE COATING FOR MITITGATION OF MANUFACTURING DEFECTS USING CHEMICAL VAPOR DEPOSITION AND NANO-STRUCTURES
    46.
    发明申请
    PROCESS TO PRODUCE CONFORMAL NANO-COMPOSITE COATING FOR MITITGATION OF MANUFACTURING DEFECTS USING CHEMICAL VAPOR DEPOSITION AND NANO-STRUCTURES 有权
    使用化学蒸气沉积和纳米结构生产合适的纳米复合涂层以减少制造缺陷的工艺

    公开(公告)号：US20140342097A1

    公开(公告)日：2014-11-20

    申请号：US14227391

    申请日：2014-03-27

    Applicant: The United States Navy as represented by the Secretary of the Navy

    Inventor： Nishkamraj Deshpande

    IPC: H05K3/22

    CPC classification number: H05K3/28 ,  H05K3/284 ,  H05K2201/0251 ,  H05K2201/0257 ,  H05K2201/0769 ,  H05K2201/09872

    Abstract: The present invention relates application of conformal coatings made up of nano-fiber, nano-particle, and/or nano-capsule materials to be applied on electrical component parts in general and printed circuit boards (PCB) in particular. A conformal coating material, such as Parlyne, can be combined with nano-materials to produce desired results. Benefits of this invention include enhancement of conventional conformal coatings performance in terms of properties such as mechanical, electrical, magnetic and in particular to prevent or obstruct the growth of tin whiskers or any other manufacturing defect that can develop on the surface of a PCB.

    Abstract translation: 本发明涉及将纳米纤维，纳米颗粒和/或纳米胶囊材料构成的保形涂层应用于一般的电子部件和特别是印刷电路板（PCB）上。 可将适形涂层材料（如Parlyne）与纳米材料结合以产生所需结果。 本发明的优点包括在诸如机械，电气，磁性的特性方面增强常规的保形涂层性能，特别是防止或阻碍锡晶须的生长或可能在PCB表面上发展的任何其它制造缺陷。

    Aligned nanotube bearing composite material
    49.
    发明授权
    Aligned nanotube bearing composite material 有权
    对齐纳米管轴承复合材料

    公开(公告)号：US08222750B2

    公开(公告)日：2012-07-17

    申请号：US12364435

    申请日：2009-02-02

    Applicant: Nachiket Raravikar ,  Ravindra Tanikella

    Inventor： Nachiket Raravikar ,  Ravindra Tanikella

    IPC: H01L21/00

    CPC classification number: H01L23/29 ,  B82Y10/00 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0251 ,  H05K2201/026 ,  Y10S977/70 ,  Y10T428/24 ,  Y10T428/24331 ,  H01L2924/00 ,  H01L2224/0401

    Abstract: A composite material including an arrangement of approximately aligned nanofilaments overlying at least another arrangement of approximately aligned nanofilaments, the longitudinal axis of the nanotubes of the first arrangement being approximately perpendicular to the longitudinal axis of the nanotubes of the other arrangement, and the arrangements forming at least one array. A resin material having nanoparticles dispersed throughout is disposed among the array(s) of nanofilaments, and cured, and openings may be formed into or through the composite material corresponding to spaces provided in the array of nanofilaments. A composite material according to embodiments forms a microelectronic substrate or some portion thereof, such as a substrate core.

    Abstract translation: 一种复合材料，其包括大致排列的纳米丝的布置，其覆盖至少另一布置的大致排列的纳米丝，第一布置的纳米管的纵向轴线大致垂直于另一布置的纳米管的纵向轴线，并且形成在 最少一个数组。 将具有分散在其中的纳米颗粒分散在其中的树脂材料设置在纳米丝阵列中，并固化，并且开口可以形成在复合材料中或通过复合材料，对应于在纳米丝阵列中提供的空间。 根据实施方案的复合材料形成微电子衬底或其某些部分，例如衬底芯。

    Aramid filled polyimides having advantageous thermal expansion properties, and methods relating thereto
    50.
    发明授权
    Aramid filled polyimides having advantageous thermal expansion properties, and methods relating thereto 失效
    具有有利的热膨胀性能的芳族聚酰胺填充的聚酰亚胺及其相关的方法

    公开(公告)号：US08124223B2

    公开(公告)日：2012-02-28

    申请号：US12848408

    申请日：2010-08-02

    Applicant: Kuppusamy Kanakarajan ,  Arnold Frances

    Inventor： Kuppusamy Kanakarajan ,  Arnold Frances

    IPC: C08G73/10 ,  B32B27/06

    CPC classification number: C09J179/08 ,  C08L77/10 ,  C08L2205/16 ,  C08L2666/20 ,  H05K1/0373 ,  H05K3/281 ,  H05K3/386 ,  H05K2201/0154 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/068 ,  Y10T428/1023 ,  Y10T428/24917 ,  Y10T428/28 ,  Y10T428/2804 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31721 ,  Y10T442/2361

    Abstract: The invention is directed to polyimide based adhesives having a coefficient of thermal expansion (“CTE”) equal to or below 50 ppm/° C. The adhesives of the present invention contain a polyimide base polymer present in the overall adhesive in an amount from 25 to 95 weight percent. The polyimide base polymer has a glass transition temperature (“Tg”) in a range of from about 150 to about 300° C. and typically has a coefficient of thermal expansion above 50 ppm/° C. The polyimide based adhesives of the invention also contain an aramid micro fiber filler in an amount from 5 to 75 weight percent, based upon the total weight of the polyimide based adhesive. The fiber filler can be used to lower CTE of the overall adhesive to match (or nearly match) the CTE of other materials like metal, silicon wafers, other polymers (including polyimide) and the like.

    Abstract translation: 本发明涉及具有等于或低于50ppm /℃的热膨胀系数（“CTE”）的聚酰亚胺基粘合剂。本发明的粘合剂含有总体粘合剂中聚酰亚胺基聚合物的量为25 至95重量％。 聚酰亚胺基聚合物的玻璃化转变温度（“Tg”）在约150至约300℃的范围内，并且通常具有高于50ppm /℃的热膨胀系数。本发明的聚酰亚胺基粘合剂也 基于聚酰亚胺基粘合剂的总重量，含有5至75重量％的芳族聚酰胺微纤维填料。 纤维填料可用于降低整个粘合剂的CTE以匹配（或几乎匹配）其它材料如金属，硅晶片，其它聚合物（包括聚酰亚胺）等的CTE。

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