公开(公告)号：US20170086510A1

公开(公告)日：2017-03-30

申请号：US14865440

申请日：2015-09-25

Applicant: Aleksandar Aleksov ,  Adel Elsherbini ,  Sasha Oster ,  Braxton Lathrop ,  Nadine L. Dabby ,  Feras Eid

Inventor： Aleksandar Aleksov ,  Adel Elsherbini ,  Sasha Oster ,  Braxton Lathrop ,  Nadine L. Dabby ,  Feras Eid

IPC: A41D1/00 ,  H05K1/03 ,  H05K1/02 ,  G06F1/16

CPC classification number: A41D1/002 ,  G06F1/163 ,  H05K1/0283 ,  H05K1/0296 ,  H05K1/038 ,  H05K2201/0133 ,  H05K2201/09263 ,  H05K2201/10098 ,  H05K2201/10151

Abstract: Some forms relate to an electronic system that includes a textile. The electronic system includes a stretchable body that includes an integrated circuit that is configured to compute and communicate with an external device, wherein the stretchable body further includes at least one of (i) a power source that provides power to at least one of the electronic components; (ii) at least one sensor; (iii) a sensing node that receives signals from each sensor and sends signals to the integrated circuit; and (iv) an antenna that is configured to send and receive signals to and from the integrated circuit and the external device; and a textile attached to the stretchable body.

公开(公告)号：US09526285B2

公开(公告)日：2016-12-27

申请号：US13717909

申请日：2012-12-18

Applicant: Aleksandar Aleksov ,  Ravindranath V. Mahajan ,  Sairam Agraharam ,  Ian A. Young ,  John C. Johnson ,  Debendra Mallik ,  John S. Guzek

Inventor： Aleksandar Aleksov ,  Ravindranath V. Mahajan ,  Sairam Agraharam ,  Ian A. Young ,  John C. Johnson ,  Debendra Mallik ,  John S. Guzek

IPC: H05K1/02 ,  H05K3/30 ,  A41D31/00 ,  H05K1/03 ,  H05K1/18 ,  H05K3/32 ,  H05K3/34

CPC classification number: A41D31/00 ,  H05K1/0274 ,  H05K1/038 ,  H05K1/188 ,  H05K3/323 ,  H05K3/3436 ,  Y10T29/4913

Abstract: A flexible computing fabric and a method of forming thereof. The flexible computing fabric includes an electronic substrate including one or more channels and including at least two ends. At least one computational element is mounted on the electronic substrate between the two ends and at least one functional element is mounted on the electronic substrate between the two ends. The channels form an interconnect between the elements. In addition, the electronic substrate is flexible and exhibits a flexural modulus in the range of 0.1 GPa to 30 GPa.

Abstract translation: 一种灵活的计算结构及其形成方法。 柔性计算结构包括包括一个或多个通道并且包括至少两个端部的电子基板。 至少一个计算元件安装在两端之间的电子基板上，并且至少一个功能元件安装在两端之间的电子基板上。 通道形成元件之间的互连。 此外，电子基板是柔性的并且具有在0.1GPa至30GPa范围内的挠曲模量。

公开(公告)号：US20150325491A1

公开(公告)日：2015-11-12

申请号：US14273754

申请日：2014-05-09

Applicant: Aleksandar Aleksov ,  Dilan Seneviratne ,  Charavana K. Gurumurthy ,  Ching-Ping J. Shen ,  Daniel N. Sobieski

Inventor： Aleksandar Aleksov ,  Dilan Seneviratne ,  Charavana K. Gurumurthy ,  Ching-Ping J. Shen ,  Daniel N. Sobieski

IPC: H01L23/29 ,  H01L21/78 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L21/561 ,  H01L21/568 ,  H01L21/78 ,  H01L23/293 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/564 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L24/96 ,  H01L2224/16245 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/06 ,  H01L2924/062 ,  H01L2924/0715 ,  H01L2924/181 ,  H01L2924/1811 ,  H01L2924/186 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: Microelectronic systems encapsulated in a stretchable/flexible material, which is skin/bio-compatible and able to withstand environmental conditions. In one embodiment of the present description, the microelectronic system includes a microelectronic device that is substantially encapsulated in a non-permeable encapsulant, such as, butyl rubbers, ethylene propylene rubbers, fluoropolymer elastomers, or combinations thereof. In another embodiment, the microelectronic system includes a microelectronic device that is substantially encapsulated in a permeable encapsulant, such as polydimethylsiloxane, wherein a non-permeable encapsulant substantially encapsulates the permeable encapsulant.

Abstract translation: 微电子系统封装在可拉伸/柔性材料中，其具有皮肤/生物相容性并能够承受环境条件。 在本说明书的一个实施例中，微电子系统包括微电子器件，其基本上封装在不可渗透的密封剂中，例如丁基橡胶，乙烯丙烯橡胶，含氟聚合物弹性体或其组合。 在另一个实施方案中，微电子系统包括基本上封装在可渗透的密封剂（例如聚二甲基硅氧烷）中的微电子器件，其中非渗透性密封剂基本上封装可渗透的密封剂。

公开(公告)号：US20140357020A1

公开(公告)日：2014-12-04

申请号：US13908016

申请日：2013-06-03

Applicant: Aleksandar Aleksov ,  Ravindranath V. Mahajan ,  Omkar Karhade ,  Nitin Deshpande

Inventor： Aleksandar Aleksov ,  Ravindranath V. Mahajan ,  Omkar Karhade ,  Nitin Deshpande

IPC: H01L23/00

CPC classification number: H01L24/83 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/67709 ,  H01L21/6835 ,  H01L23/13 ,  H01L23/15 ,  H01L24/19 ,  H01L24/20 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/82 ,  H01L24/92 ,  H01L24/96 ,  H01L2221/68309 ,  H01L2221/68313 ,  H01L2221/68331 ,  H01L2221/68363 ,  H01L2224/04105 ,  H01L2224/2101 ,  H01L2224/2919 ,  H01L2224/32237 ,  H01L2224/73204 ,  H01L2224/73267 ,  H01L2224/81001 ,  H01L2224/81005 ,  H01L2224/8312 ,  H01L2224/92244 ,  H01L2224/96 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/181 ,  H01L2224/19 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The subject matter of the present description relates to methods for the precise integration of microelectronic dice within a multichip package which substantially reduce or eliminate any misalign caused by the movement of the microelectronic dice during the integration process. These methods may include the use of a temporary adhesive in conjunction with a carrier having at least one recess for microelectronic die alignment, the use of a precision molded carrier for microelectronic die alignment, the use of magnetic alignment of microelectronic dice on a reusable carrier, and/or the use of a temporary adhesive with molding processes on a reusable carrier.

Abstract translation: 本说明书的主题涉及用于在多芯片封装内精确地集成微电子管芯的方法，其基本上减少或消除了在整合过程期间由微电子管芯的移动引起的任何不对准。 这些方法可以包括使用临时粘合剂与具有用于微电子管芯对准的至少一个凹部的载体的使用，使用用于微电子管芯对准的精密模制载体，在可重复使用的载体上使用微电子骰子的磁对准， 和/或在可重复使用的载体上使用具有模制工艺的临时粘合剂。

公开(公告)号：US20140171838A1

公开(公告)日：2014-06-19

申请号：US13719336

申请日：2012-12-19

Applicant: ALEKSANDAR ALEKSOV ,  BRIAN S. DOYLE ,  RAVINDRANATH V. MAHAJAN

Inventor： ALEKSANDAR ALEKSOV ,  BRIAN S. DOYLE ,  RAVINDRANATH V. MAHAJAN

IPC: A61H1/00

CPC classification number: A61H1/024 ,  A61H1/0244 ,  A61H1/0266 ,  A61H1/0277 ,  A61H1/0281 ,  A61H1/0285 ,  A61H1/0288 ,  A61H1/0296 ,  A61H3/00 ,  A61H2201/1609 ,  A61H2201/1614 ,  A61H2201/1628 ,  A61H2201/1635 ,  A61H2201/164 ,  A61H2201/165 ,  A61H2201/5002 ,  A61H2201/501 ,  A61H2201/5097 ,  A61H2230/605

Abstract: Exoskeleton technology is described herein. Such technology includes but is not limited to exoskeletons, exoskeleton controllers, methods for controlling an exoskeleton, and combinations thereof. The exoskeleton technology may facilitate, enhance, and/or supplant the natural mobility of a user via a combination of sensor elements, processing/control elements, and actuating elements. User movement may be elicited by electrical stimulation of the user's muscles, actuation of one or more mechanical components, or a combination thereof. In some embodiments, the exoskeleton technology may adjust in response to measured inputs, such as motions or electrical signals produced by a user. In this way, the exoskeleton technology may interpret known inputs and learn new inputs, which may lead to a more seamless user experience.

Abstract translation: 本文描述了外骨骼技术。 这种技术包括但不限于外骨骼，外骨骼控制器，用于控制外骨骼的方法及其组合。 外骨骼技术可以通过传感器元件，处理/控制元件和致动元件的组合来促进，增强和/或取代使用者的自然流动性。 用户移动可以通过用户肌肉的电刺激，一个或多个机械部件的致动或其组合引起。 在一些实施例中，外骨骼技术可以响应于诸如用户产生的运动或电信号的测量输入来调整。 以这种方式，外骨骼技术可以解释已知输入并学习新的输入，这可能导致更无缝的用户体验。

公开(公告)号：US20130341076A1

公开(公告)日：2013-12-26

申请号：US13987701

申请日：2013-08-22

Applicant: Aleksandar Aleksov ,  Vladimir Noveski ,  Sujit Sharan ,  Shankar Ganapathysubramanian

Inventor： Aleksandar Aleksov ,  Vladimir Noveski ,  Sujit Sharan ,  Shankar Ganapathysubramanian

IPC: H05K1/02

CPC classification number: H05K1/0201 ,  H01L21/4807 ,  H01L23/15 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K3/06 ,  H05K3/107 ,  H05K3/205 ,  H05K3/388 ,  H05K3/4617 ,  H05K3/4629 ,  H05K3/4647 ,  H05K2201/0175 ,  H05K2201/0187 ,  H05K2201/0376 ,  H05K2201/096 ,  H05K2201/09881 ,  H05K2203/0733 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2924/00

Abstract: A layer or layers for use in package substrates and die spacers are described. The layer or layers include a plurality of ceramic wells lying within a plane and separated by metallic vias. Recesses within the ceramic wells are occupied by a dielectric filler material.

公开(公告)号：US08434668B2

公开(公告)日：2013-05-07

申请号：US12778313

申请日：2010-05-12

Applicant: Aleksandar Aleksov ,  Rajasekaran Swaminathan ,  Ting Zhong

Inventor： Aleksandar Aleksov ,  Rajasekaran Swaminathan ,  Ting Zhong

IPC: B23K31/02 ,  H01L21/44

CPC classification number: H01F1/01 ,  B23K1/0016 ,  B23K1/20 ,  H01L24/05 ,  H01L24/13 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05547 ,  H01L2224/0556 ,  H01L2224/05599 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13584 ,  H01L2224/16225 ,  H01L2224/75264 ,  H01L2224/81192 ,  H01L2224/81222 ,  H01L2224/81234 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  Y10T428/24612 ,  H01L2924/00 ,  H01L2224/05552

Abstract: The present disclosure relates to the field of fabricating microelectronic packages, wherein components of the microelectronic packages may have magnetic attachment structures comprising a magnetic component and a metal component. The magnetic attachment structure may be exposed to a magnetic field, which, through the vibration of the magnetic component, can heat the magnetic attachment structure, and which when placed in contact with a solder material can reflow the solder material and attach microelectronic components of the microelectronic package.

公开(公告)号：US20100327424A1

公开(公告)日：2010-12-30

申请号：US12459007

申请日：2009-06-24

Applicant: Henning Braunisch ,  Chia-Pin Chiu ,  Aleksandar Aleksov ,  Hinmeng Au ,  Stefanie M. Lotz ,  Johanna M. Swan ,  Sujit Sharan

Inventor： Henning Braunisch ,  Chia-Pin Chiu ,  Aleksandar Aleksov ,  Hinmeng Au ,  Stefanie M. Lotz ,  Johanna M. Swan ,  Sujit Sharan

IPC: H01L23/538 ,  H01L21/60

CPC classification number: H01L23/5385 ,  H01L21/6835 ,  H01L23/13 ,  H01L24/14 ,  H01L24/17 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/13099 ,  H01L2224/1403 ,  H01L2224/141 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/17181 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/81001 ,  H01L2224/81005 ,  H01L2224/81801 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06562 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01076 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/19107 ,  H01L2924/351 ,  H01L2924/00

Abstract: A multi-chip package includes a substrate (110) having a first side (111), an opposing second side (112), and a third side (213) that extends from the first side to the second side, a first die (120) attached to the first side of the substrate and a second die (130) attached to the first side of the substrate, and a bridge (140) adjacent to the third side of the substrate and attached to the first die and to the second die. No portion of the substrate is underneath the bridge. The bridge creates a connection between the first die and the second die. Alternatively, the bridge may be disposed in a cavity (615, 915) in the substrate or between the substrate and a die layer (750). The bridge may constitute an active die and may be attached to the substrate using wirebonds (241, 841, 1141, 1541).

Abstract translation: 多芯片封装包括具有第一侧面（111），相对的第二侧面（112）和从第一侧向第二侧延伸的第三侧面（213）的基板（110），第一模具（120） ）和附接到所述基板的第一侧的第二模具（130），以及邻近所述基板的第三侧并连接到所述第一模具和所述第二模具的桥接件（140） 。 基板的任何部分都不在桥下。 该桥在第一管芯和第二管芯之间形成连接。 或者，桥可以设置在衬底中的空腔（615,915）中，或者设置在衬底和裸片层（750）之间。 该桥可以构成一个有源管芯，并且可以使用引线键连接到衬底（241,841,1141,1541）。