公开(公告)号：US20100153280A1

公开(公告)日：2010-06-17

申请号：US12636330

申请日：2009-12-11

申请人： Christina A. Fox ,  Jeffrey K. Wagner ,  Patrick J. Allin ,  John W. Smith

发明人： Christina A. Fox ,  Jeffrey K. Wagner ,  Patrick J. Allin ,  John W. Smith

IPC分类号： G06Q10/00 ,  G06Q30/00 ,  G06Q50/00 ,  G06F15/16

CPC分类号： G06Q10/00 ,  G06Q30/0282 ,  G06Q50/188

摘要： A networked computer system for acquiring prequalification information and comparing that prequalification information to a set of minimum requirements for a plurality of reviewing organizations. In some embodiments, the networked computer system also facilitates the project bidding process between prequalified organizations. The networked computer system receives bids from a prequalified bidding organization and assigns a rank to the bidding organization relative to other prequalified bidding organizations. In some embodiments, the networked computer system assigns a rank to the bid proposal based, in part, on the bidding organization's prequalification information and the information from the bid proposal.

摘要翻译： 一种网络计算机系统，用于获取资格预审信息，并将资格预审信息与多个审查组织的一组最低要求进行比较。 在一些实施例中，联网计算机系统还有助于资格预审组织之间的项目招标过程。 联网计算机系统从资格预审的投标组织收到投标书，并向竞标机构相对于其他资格预审的投标机构分配等级。 在一些实施例中，联网的计算机系统部分地基于投标组织的资格预审信息和投标方案的信息来为投标方案分配等级。

公开(公告)号：US07413926B2

公开(公告)日：2008-08-19

申请号：US11197247

申请日：2005-08-04

申请人： John W. Smith

发明人： John W. Smith

IPC分类号： H01L21/00

CPC分类号： H01L24/73 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/25 ,  H01L24/48 ,  H01L24/49 ,  H01L24/82 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/24137 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/49112 ,  H01L2224/73227 ,  H01L2224/73267 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/19107 ,  Y10T29/49121 ,  H01L2224/82 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of making a microelectronic package includes providing a first substrate having a top surface, providing a second substrate having a top surface including a plurality of conductive pads, a bottom surface remote therefrom and an opening extending between the top and bottom surfaces, and securing the second substrate over the first substrate so that the bottom surface of the second substrate confronts the top surface of the first substrate, wherein the first and second substrates have coefficients of thermal expansion that are substantially similar to one another. The method also includes placing a microelectronic element having a front face with contacts and a back face remote therefrom in the opening of the second substrate and securing the microelectronic element over the first substrate so that the back face of the microelectronic element confronts the top surface of the first substrate, and electrically interconnecting the contacts of the microelectronic element with the conductive pads of the second substrate.

摘要翻译： 制造微电子封装的方法包括提供具有顶表面的第一衬底，提供第二衬底，其具有包括多个导电焊盘的顶表面，远离其的底表面和在顶表面和底表面之间延伸的开口，并且固定 所述第二基板在所述第一基板上方，使得所述第二基板的底表面面对所述第一基板的顶表面，其中所述第一和第二基板具有基本上彼此相似的热膨胀系数。 该方法还包括将具有触点的前表面和远离其的背面的微电子元件放置在第二基板的开口中，并将微电子元件固定在第一基板上，使得微电子元件的背面面对 并且将微电子元件的触点与第二基板的导电焊盘电连接。

公开(公告)号：US07152311B2

公开(公告)日：2006-12-26

申请号：US10032886

申请日：2001-12-26

申请人： Masud Beroz ,  Thomas H. DiStefano ,  Matthew T. Hendrickson ,  David Light ,  John W. Smith

发明人： Masud Beroz ,  Thomas H. DiStefano ,  Matthew T. Hendrickson ,  David Light ,  John W. Smith

IPC分类号： B23P19/04

CPC分类号： H01L24/86 ,  B29C2043/5825 ,  H01L21/67144 ,  H01L2224/7965 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/30105 ,  Y10S269/909 ,  Y10T29/53265 ,  Y10T29/53435 ,  Y10T428/23 ,  Y10T428/239 ,  H01L2924/00

摘要： A flexible sheet used in manufacture of microelectronic components is held on a frame formed from a rigid material so that the frame maintains the sheet under tension during processing and thereby stabilizes the dimensions of the sheet. The frame may be formed from a rigid, light-transmissive material such as a glass, and the bond between the frame and sheet may be made or released by light transmitted through the frame. Preferred features of the framed sheet minimize entrapment of processing liquids such as etch solutions, thereby minimizing carryover of processing solutions between steps. The frame may have contact openings which permit engagement of a metallic layer on the sheet by an electrode carrying electroplating or etching current without disturbing the main portion of the sheet where features are to be formed or treated.

公开(公告)号：US06939735B2

公开(公告)日：2005-09-06

申请号：US10235102

申请日：2002-09-05

申请人： John W. Smith ,  Mitchell Koblis

发明人： John W. Smith ,  Mitchell Koblis

IPC分类号： H01L23/31 ,  H01L23/498 ,  H01R12/57 ,  H01L21/48 ,  H01L21/302 ,  H01L21/44 ,  H01L23/48 ,  H01L23/52

CPC分类号： H01L23/49816 ,  H01L23/3114 ,  H01L23/4985 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48472 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/19107 ,  H01L2924/3025 ,  Y10T29/49126 ,  Y10T29/49144 ,  H01L2924/00014

摘要： A first microelectronic element is provided with leads having anchor ends connected to contacts and tip ends moveable with respect to the first microelectronic element. The leads can be provided on a carrier sheet that is assembled to the first microelectronic element, or may be formed in situ on the surface of the first element. The leads may be unitary strips of a conductive material, and the anchor ends of the leads may be bonded to the contacts of the first microelectronic element by processes such as thermosonic or ultrasonic bonding. Alternatively, stub leads may be provided on a separate carrier sheet or formed in situ on the front surface of the first microelectronic element, and these stub leads may be connected by wire bonds to the contacts of the first microelectronic element so as to form composite leads. The tip ends of the leads are joined to a second microelectronic element that is moved away from the first microelectronic element so as to deform the leads.

公开(公告)号：US06897090B2

公开(公告)日：2005-05-24

申请号：US10430986

申请日：2003-05-07

申请人： Thomas H. DiStefano ,  Konstantine Karavakis ,  Craig Mitchell ,  John W. Smith

发明人： Thomas H. DiStefano ,  Konstantine Karavakis ,  Craig Mitchell ,  John W. Smith

IPC分类号： H01L21/56 ,  H01L23/31 ,  H01L21/44

CPC分类号： H01L24/50 ,  H01L21/565 ,  H01L23/3121 ,  H01L2224/50 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  Y10T29/49146 ,  H01L2924/00 ,  H01L2924/00012

摘要： A component incorporating a dielectric element such as a polymeric film with leads and terminals thereon is assembled with a semiconductor chip and bond regions of the leads are connected to contacts of the chip. At least one lead incorporates a plural set of connecting regions connecting the bond region of that lead to a plurality of terminals. One or more of the connecting regions in each such plural set are severed so as to leave less than all of the terminals associated with each such plural set connected to the contacts of the chip.

摘要翻译： 将包含诸如其上具有引线和端子的聚合物膜的电介质元件的部件与半导体芯片组装，并且引线的接合区域连接到芯片的触点。 至少一个引线包括将该引线的键合区域连接到多个端子的多组连接区域。 每个这样的多个组中的一个或多个连接区域被切断，以便留下少于与连接到芯片的触点的每个这样的多个组相关联的所有终端。

公开(公告)号：US06821815B2

公开(公告)日：2004-11-23

申请号：US10353737

申请日：2003-01-29

申请人： John W. Smith ,  Joseph Fjelstad

发明人： John W. Smith ,  Joseph Fjelstad

IPC分类号： H01L2144

CPC分类号： H01L23/3107 ,  H01L21/56 ,  H01L24/37 ,  H01L24/40 ,  H01L24/73 ,  H01L24/81 ,  H01L24/84 ,  H01L24/92 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/37599 ,  H01L2224/4024 ,  H01L2224/92122 ,  H01L2224/84 ,  H01L2924/00014

摘要： A method of encapsulating a microelectronic assembly comprises providing a microelectronic assembly having an element defining exterior surfaces and an array of terminals exposed at the exterior surfaces. The element defines an aperture through the exterior surfaces. A layer of a curable barrier material is screen printed onto a supporting element. The supporting element is assembled with the microelectronic assembly so that the layer of curable barrier material contacts the exterior surfaces and covers said one or more apertures. An encapsulant is applied to the microelectronic assembly.

摘要翻译： 封装微电子组件的方法包括提供具有限定外表面的元件和暴露在外表面处的端子阵列的微电子组件。 该元件通过外表面限定孔。 将一层可固化的阻挡材料丝网印刷到支撑元件上。 支撑元件与微电子组件组装，使得可固化阻挡材料层与外表面接触并覆盖所述一个或多个孔。 将密封剂施加到微电子组件。

公开(公告)号：US06518662B1

公开(公告)日：2003-02-11

申请号：US09713527

申请日：2000-11-15

申请人： John W. Smith ,  Joseph Fjelstad

发明人： John W. Smith ,  Joseph Fjelstad

IPC分类号： H01L2334

CPC分类号： H01L23/3107 ,  H01L21/56 ,  H01L24/37 ,  H01L24/40 ,  H01L24/73 ,  H01L24/81 ,  H01L24/84 ,  H01L24/92 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/37599 ,  H01L2224/4024 ,  H01L2224/92122 ,  H01L2224/84 ,  H01L2924/00014

摘要： A method of encapsulating a microelectronic assembly comprises providing a microelectronic assembly having an element defining exterior surfaces and an array of terminals exposed at the exterior surfaces. The element defines an aperture through the exterior surfaces. A layer of a curable barrier material is screen printed onto a supporting element. The supporting element is assembled with the microelectronic assembly so that the layer of curable barrier material contacts the exterior surfaces and covers said one or more apertures. An encapsulant is applied to the microelectronic assembly.

摘要翻译： 封装微电子组件的方法包括提供具有限定外表面的元件和暴露在外表面处的端子阵列的微电子组件。 该元件通过外表面限定孔。 将一层可固化的阻挡材料丝网印刷到支撑元件上。 支撑元件与微电子组件组装，使得可固化阻挡材料层与外表面接触并覆盖所述一个或多个孔。 将密封剂施加到微电子组件。

公开(公告)号：US06370032B1

公开(公告)日：2002-04-09

申请号：US09399209

申请日：1999-09-17

申请人： Thomas H. DiStefano ,  John W. Smith ,  Zlata Kovac ,  Konstantine Karavakis

发明人： Thomas H. DiStefano ,  John W. Smith ,  Zlata Kovac ,  Konstantine Karavakis

IPC分类号： H05K118

CPC分类号： H01L24/81 ,  H01L21/4839 ,  H01L21/563 ,  H01L23/22 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L23/642 ,  H01L24/72 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/83136 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/3025 ,  H05K1/118 ,  H05K3/361 ,  H05K3/4084 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2203/063 ,  Y10T29/49124 ,  Y10T29/49144 ,  Y10T29/49149

摘要： The present invention provides an interconnection scheme having complaint contacts arranged in an array to connect conductive surfaces on a microelectronic device and a supporting substrate, such as a printed circuit board. This invention accommodates for the difference in thermal coefficients of expansion between the device and the supporting substrate. Typically, an area array of conductive contact pads are connected into rows by conductive leads on a flexible, intermediate substrate. Each of the conductive leads bridges a bonding hole in the intermediate substrate which is situated between successive contact pads. Each of the conductive leads further has a frangible portion within or near each bonding hole. A stand-off between the intermediate substrate and the device is create by compliant dielectric pads, typically composed of an elastomer material, positioned under each contact pad. The frangible portions allow the leads to be cleanly broken, bent and secured into electrical contact with chip contacts on the device. Each of these connections may be supported by a compliant layer, typically an uncured elastomer which fills the area around the compliant dielectric pads and is then cured.

摘要翻译： 本发明提供了一种具有布置成阵列中的投诉触点的互连方案，以连接微电子装置上的导电表面和诸如印刷电路板的支撑基板。 本发明适用于器件和支撑衬底之间的热膨胀系数的差异。 通常，导电接触焊盘的区域阵列通过柔性中间衬底上的导电引线连接成行。 每个导电引线桥接位于连续接触焊盘之间的中间衬底中的结合孔。 每个导电引线还在每个结合孔内或附近还具有易碎部分。 中间基板和器件之间的间隔是通过位于每个接触垫下方的通常由弹性体材料组成的柔性介电垫产生的。 易碎部分允许引线被干净地折断，弯曲并固定成与设备上的芯片触点电接触。 这些连接中的每一个可以由柔性层（通常为填充柔性介电垫周围区域的未固化的弹性体）支撑，然后固化。

公开(公告)号：US06294040B1

公开(公告)日：2001-09-25

申请号：US08879922

申请日：1997-06-20

申请人： Kurt Raab ,  John W. Smith

发明人： Kurt Raab ,  John W. Smith

IPC分类号： B32B3100

CPC分类号： H01L21/6835 ,  H01L23/16 ,  H01L23/3107 ,  H01L23/4985 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/8319 ,  H01L2224/83856 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802

摘要： A method for making a microelectronic package includes providing first and second microelectronic elements having electrically conductive parts, juxtaposing the first and second microelectronic elements with one another, bonding electrically conductive parts of the microelectronic elements together to form electrical interconnection, providing a resilient element having one or more tacky surface regions in contact with one or more liners separately from the first and second microelectronic elements, assembling the resilient element with at least one of said microelectronic elements, and removing the resilient element from the one or more liners prior to the juxtaposing step so that the resilient element is disposed between the microelectronic elements after the juxtaposing and bonding steps. In other embodiments, the method of making a microelectronic package includes providing a resilient element having one or more tacky surface regions separately from the first and second microelectronic elements, and assembling the resilient elements with at least one of the microelectronic elements prior to the juxtaposing step so that the resilient element is disposed between the microelectronic elements after the juxtaposing and bonding steps, wherein the step of assembling the resilient element with at least one of the microelectronic elements is performed less than 24 hours prior to the bonding step. In certain embodiments the resilient elements include an adhesive at one or more tacky surface regions thereof. In other embodiments, the resilient elements include partially-cured surfaces at the one or more tacky surface regions. Also disclosed is a method of fabricating a resilient element of a microelectronic package having one or more tacky surface regions. The method includes the steps of providing a first liner, providing a mass of a curable material on the liner, and curing the mass so that a region of the mass in contact with the liner is tacky.

公开(公告)号：US06239386B1

公开(公告)日：2001-05-29

申请号：US08695642

申请日：1996-08-12

申请人： Thomas H. DiStefano ,  John W. Smith ,  Konstantine N. Karavakis ,  Zlata Kovac ,  Joseph Fjelstad

发明人： Thomas H. DiStefano ,  John W. Smith ,  Konstantine N. Karavakis ,  Zlata Kovac ,  Joseph Fjelstad

IPC分类号： H01R909

CPC分类号： H01R13/2414 ,  H01R12/714 ,  H05K1/0272 ,  H05K1/036 ,  H05K1/056 ,  H05K1/116 ,  H05K3/0032 ,  H05K3/445 ,  H05K3/462 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/0382 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/10378 ,  H05K2203/0554 ,  H05K2203/0582 ,  H05K2203/135 ,  H05K2203/308 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

摘要： An interposer for interconnection between microelectronic circuit panels has contacts at its surfaces. Each contact has a central axis normal to the surface and a peripheral portion adapted to expand radially outwardly from the central axis responsive to a force applied by a pad on the engaged circuit panel. Thus, when the circuit panels are compressed with the interposers, the contacts expand radially and wipe across the pads. The wiping action facilitates bonding of the contacts to the pads, as by conductive bonding material carried on the contacts themselves.