公开(公告)号：US20060033216A1

公开(公告)日：2006-02-16

申请号：US11252305

申请日：2005-10-17

Applicant: L. Pflughaupt ,  David Gibson ,  Young-Gon Kim ,  Craig Mitchell ,  Wael Zohni ,  Ilyas Mohammed

Inventor： L. Pflughaupt ,  David Gibson ,  Young-Gon Kim ,  Craig Mitchell ,  Wael Zohni ,  Ilyas Mohammed

IPC: H01L23/52

CPC classification number: H01L23/528 ,  H01L23/50 ,  H01L23/66 ,  H01L24/10 ,  H01L24/13 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/0603 ,  H01L2224/06505 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/14 ,  H01L2224/1403 ,  H01L2224/14505 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/78301 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/0652 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2225/06586 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/023 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10636 ,  H05K2201/10674 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2924/00014

Abstract: A stacked chip assembly includes individual units having chips mounted on dielectric layers and traces on the dielectric layers interconnecting the contacts of the chips with terminals disposed in peripheral regions of the dielectric layers. At least some of the traces are multi-branched traces which connect chip select contacts to chip select terminals. The units are stacked one above the other with corresponding terminals of the different units being connected to one another by solder balls or other conductive elements so as to form vertical buses. Prior to stacking, the multi-branched traces of the individual units are selectively connected, as by forming solder bridges, so as to leave chip select contacts of chips in different units connected to different chip select terminals and thereby connect these chips to different vertical buses. The individual units desirably are thin and directly abut one another so as to provide a low-height assembly with good heat transfer from chips within the stack.

Abstract translation: 堆叠式芯片组件包括具有安装在电介质层上的芯片的单独单元和在将芯片的触点与布置在电介质层的周边区域中的端子互连的电介质层上的迹线。 至少一些迹线是将分片选择触点连接到芯片选择端子的多分支迹线。 这些单元彼此堆叠，不同单元的相应端子通过焊球或其它导电元件彼此连接，以形成垂直总线。 在堆叠之前，通过形成焊接桥，各个单元的多分支迹线被选择性地连接，以便在连接到不同的芯片选择端子的不同单元中留下芯片的芯片选择触点，从而将这些芯片连接到不同的垂直总线 。 各个单元期望地是薄的并且直接地彼此邻接，以便提供具有来自堆叠内的芯片的良好热传递的低高度组件。

公开(公告)号：US20050266263A1

公开(公告)日：2005-12-01

申请号：US11155990

申请日：2005-06-17

Applicant: John Campbell ,  Sandeep Tonapi ,  Ananth Prabhakumar ,  David Gibson ,  Slawomir Rubinsztajn

Inventor： John Campbell ,  Sandeep Tonapi ,  Ananth Prabhakumar ,  David Gibson ,  Slawomir Rubinsztajn

IPC: B32B15/00

CPC classification number: H01L23/293 ,  B82Y30/00 ,  C01P2004/64 ,  C01P2006/12 ,  C01P2006/22 ,  C08G59/3218 ,  C08G59/68 ,  C08K9/06 ,  C08L63/00 ,  C09C1/3081 ,  C09C3/12 ,  C09J163/00 ,  H01L24/81 ,  H01L2224/274 ,  H01L2224/81011 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01068 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  Y10T428/12556 ,  Y10T428/12569 ,  Y10T428/12771 ,  Y10T428/12812 ,  H01L2924/00

Abstract: A finely divided refractory solid and an associated method are provided. The solid may have a surface area that is greater than about 5 square meters per gram. The solid may have a density of active surface termination sites per square nanometer of surface area sufficiently low that a curable composition comprising a curable resin that comprises less than about 99 percent by weight of the solid has a stability ratio of less than about 3 after a period of about two weeks. Also, a curable composition, a cured layer, and an electronic device that includes the cured layer are provided.

Abstract translation: 提供细碎的耐火固体和相关方法。 该固体可具有大于约5平方米/克的表面积。 固体可以具有每平方毫米表面积的活性表面终止位置的密度足够低，使得包含小于约99重量％的固体的可固化树脂的可固化组合物在a以后的稳定比小于约3 期间约两周。 此外，提供了包含固化层的固化性组合物，固化层和电子器件。

公开(公告)号：US20050136276A1

公开(公告)日：2005-06-23

申请号：US10744227

申请日：2003-12-23

Applicant: Stephen Borup ,  David Gibson ,  Robert Haupt ,  John Spanburg

Inventor： Stephen Borup ,  David Gibson ,  Robert Haupt ,  John Spanburg

IPC: B27D5/00 ,  B32B7/12 ,  B32B21/00 ,  B32B21/06 ,  B32B21/14 ,  B32B29/00 ,  D21H17/48 ,  D21H19/16 ,  D21H27/34

CPC classification number: B32B21/06 ,  B32B21/14 ,  B32B29/00 ,  B32B38/08 ,  B32B2305/72 ,  B32B2307/50 ,  B32B2317/125 ,  B32B2419/00 ,  B32B2479/00 ,  B32B2607/00 ,  D21H17/48 ,  D21H19/16 ,  D21H27/34 ,  Y10T428/31957 ,  Y10T428/31964

Abstract: A synthetic crossband is disclosed. The synthetic crossband comprises impregnated paper, which is impregnated with a saturating resin which includes phenolic resin, such as phenolic-formaldehyde resin, that is then cured. At least a portion of one side of the impregnated paper includes a layer of partially cured adhesive resin, which includes melamine-formaldehyde resin, urea-formaldehyde resin, or a mixture thereof.

Abstract translation: 公开了合成交联带。 合成交联带包括用饱和树脂浸渍的浸渍纸，其包括酚醛树脂如酚醛树脂，然后固化。 浸渍纸的一侧的至少一部分包括一部分固化的粘合剂树脂，其包括三聚氰胺 - 甲醛树脂，脲醛树脂或其混合物。

公开(公告)号：US06888229B2

公开(公告)日：2005-05-03

申请号：US10872105

申请日：2004-06-18

Applicant: Thomas H. DiStefano ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan Mathieu ,  Jason Sweis ,  Laurie Union ,  David Gibson

Inventor： Thomas H. DiStefano ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan Mathieu ,  Jason Sweis ,  Laurie Union ,  David Gibson

IPC: H01L21/60 ,  H01L23/31 ,  H01L23/495 ,  H01L23/498 ,  H05K3/36 ,  H05K3/40

CPC classification number: H01L24/86 ,  H01L23/3107 ,  H01L23/49572 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/49861 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H05K3/361 ,  H05K3/4084 ,  H01L2924/00

Abstract: A semiconductor chip mounting component includes a support structure adapted to engage a semiconductor chip. The support structure has a top surface, a bottom surface, and a gap extending through the support structure for defining first and second portions of the support structure on opposite sides of the gap. The support structure includes at least one elongated bus disposed alongside the gap, on the second portion of the support structure. The support structure includes a plurality of electrically conductive leads, each lead having a connection section extending across the gap, the connection section having a first end disposed on the first portion of the support structure, and a second end secured to the bus. Each lead includes a frangible section disposed between the first and second ends of the connection section, the frangible section having a cross-sectional area that is smaller than a cross-sectional area of the connection section. The gap is open at the bottom surface of the support structure. A semiconductor chip is disposed beneath the bottom surface of the support structure. The leads are adapted to be bonded to contacts on the semiconductor chip by breaking the frangible sections of the leads so as to disconnect the second ends of the leads from the bus and engage the leads with the contacts of the semiconductor chip.

Abstract translation: 半导体芯片安装部件包括适于接合半导体芯片的支撑结构。 支撑结构具有顶表面，底表面和延伸穿过支撑结构的间隙，用于限定支撑结构在间隙的相对侧上的第一和第二部分。 支撑结构包括在支撑结构的第二部分上沿着间隙布置的至少一个细长总线。 支撑结构包括多个导电引线，每个引线具有跨越间隙延伸的连接部分，连接部分具有设置在支撑结构的第一部分上的第一端和固定到总线的第二端。 每个引线包括设置在连接部分的第一和第二端之间的易碎部分，该易碎部分的横截面积小于连接部分的横截面面积。 间隙在支撑结构的底部表面开口。 半导体芯片设置在支撑结构的底表面下方。 引线适于通过断开引线的易碎部分而与半导体芯片上的触点接合，从而将引线的第二端与母线断开，并与半导体芯片的触点接合引线。

公开(公告)号：US20050049334A1

公开(公告)日：2005-03-03

申请号：US10654378

申请日：2003-09-03

Applicant: Slawomir Rubinsztain ,  Sandeep Tonapi ,  David Gibson ,  John Campbell ,  Ananth Prabhakumar

Inventor： Slawomir Rubinsztain ,  Sandeep Tonapi ,  David Gibson ,  John Campbell ,  Ananth Prabhakumar

IPC: C08K9/06 ,  C08L63/00 ,  C09C1/30 ,  H01L21/56 ,  H01L23/29

CPC classification number: B82Y30/00 ,  C01P2004/64 ,  C08K9/06 ,  C08L63/00 ,  C09C1/3081 ,  H01L21/563 ,  H01L23/293 ,  H01L23/295 ,  H01L2224/73203 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/00

Abstract: A solvent modified resin underfill material comprising a resin in combination with a filler of functionalized colloidal silica and solvent to form a transparent B-stage resin composition, which may then be cured to form a low CTE, high Tg thermoset resin. Embodiments of the disclosure include use as a wafer level filler, and an encapsulant for electronic chips.

Abstract translation: 一种溶剂改性树脂底部填充材料，其包括与官能化胶体二氧化硅和溶剂的填料结合的树脂，以形成透明的B阶树脂组合物，然后可将其固化以形成低CTE，高Tg热固性树脂。 本公开的实施例包括用作晶片级填充物，以及用于电子芯片的密封剂。

公开(公告)号：US5915752A

公开(公告)日：1999-06-29

申请号：US374559

申请日：1995-05-08

Applicant: Thomas H. DiStefano ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan Mathieu ,  Jason Sweis ,  Laurie Union ,  David Gibson

Inventor： Thomas H. DiStefano ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan Mathieu ,  Jason Sweis ,  Laurie Union ,  David Gibson

IPC: H01L21/60 ,  H01L23/31 ,  H01L23/495 ,  H01L23/498 ,  H01L23/50 ,  H05K1/18 ,  H05K3/36 ,  H05K3/40 ,  H01R43/00

CPC classification number: H01L23/49572 ,  H01L23/3107 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/49861 ,  H01L24/01 ,  H01L2924/01082 ,  H01L2924/12042 ,  H05K3/361 ,  H05K3/4084 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/49218 ,  Y10T29/49222

Abstract: A connection component for electrically connecting a semiconductor chip to support substrate incorporates a preferably dielectric supporting structure (70) defining gaps (40). Leads extend across these gaps so that the leads are supported both sides of the gap (66, 70). The leads therefore can be positioned approximately in registration to contacts on the chip by aligning the connection component with the chip. Each lead is arranged so that one end can be displaced relative to the supporting structure when a downward force is applied to the lead. This allows the leads to be connected to the contacts on the chip by engaging each lead with a tool and forcing the lead downwardly against the contact. Preferably, each lead incorporates a frangible section (72) adjacent one side of the gap and the frangible section is broken when the lead is engaged with the contact. Final alignment of the leads with the contacts on the chip is provided by the bonding tool which has features adapted to control the position of the lead.

Abstract translation: PCT No.PCT / US93 / 06930 Sec。 371日期1995年5月8日 102（e）日期1995年5月8日PCT提交1993年7月23日PCT公布。 出版物WO94 / 03036 日期1994年2月3日用于将半导体芯片电连接到支撑衬底的连接部件包含限定间隙（40）的优选电介质支撑结构（70）。 引线延伸穿过这些间隙，使得引线被支撑在间隙（66,70）的两侧。 因此，引线可以通过将连接部件与芯片对准而大致对准芯片上的触点。 每个引线被布置成使得当向引线施加向下的力时，一端可相对于支撑结构移位。 这允许引线通过使每个引线与工具接合并将引线向下抵靠接触件而连接到芯片上的触点。 优选地，每个引线包括与间隙的一侧相邻的易碎部分（72），并且当引线与触点接合时，易碎部分断裂。 引线与芯片上的触点的最终对准由具有适于控制引线位置的特征的焊接工具提供。

公开(公告)号：US5053388A

公开(公告)日：1991-10-01

申请号：US542678

申请日：1990-06-25

Applicant: David Gibson ,  Michael Lerner ,  Robert Nordquist ,  Cary Reich

Inventor： David Gibson ,  Michael Lerner ,  Robert Nordquist ,  Cary Reich

IPC: A61K38/39 ,  A61K45/06 ,  A61L26/00

CPC classification number: A61L26/0047 ,  A61K38/39 ,  A61K45/06 ,  Y10S514/912 ,  Y10S514/913 ,  Y10S514/914 ,  Y10S514/915

Abstract: Improved healing of wounds, particularly wounds of the eye, such as keratorefractive surgical incisions, is obtained by coating the wound surfaces with a solution containing a protein crosslinking compound such as dimethyl pimelimidate dihydrochloride, followed by treatment with a composition containing an extracellular matrix material such as fibronectin, a biologically active fragment or an analog thereof.

Abstract translation: 通过用含有蛋白质交联化合物如二甲基亚胺嘧啶二盐酸盐的溶液涂覆伤口表面，然后用含有细胞外基质材料的组合物（例如，包含细胞外基质材料）进行治疗，获得伤口愈合，特别是眼睛伤口，例如角膜屈光手术切口 作为纤连蛋白，生物活性片段或其类似物。

公开(公告)号：US20140069040A1

公开(公告)日：2014-03-13

申请号：US14024387

申请日：2013-09-11

Applicant: David Gibson

Inventor： David Gibson

IPC: E04B1/76

CPC classification number: E04B1/76 ,  E04B1/14 ,  E04C2/22 ,  E04C2/292 ,  E04C2/52

Abstract: Some embodiments provide a construction system that includes a plurality of panels. Moreover, at least some of the plurality of panels may include an upper side, a lower side, an insulation member, and at least one support member that is coupled to the insulation member. In some aspects, the support member may be coupled to the insulation member such that the support member extends from the upper side to the lower side of the panel. In some embodiments, the construction system may also include a plurality of engagement elements that are configured to engage at least some of the panels to assemble the panels into at least a portion of a structure.

Abstract translation: 一些实施例提供了包括多个面板的构造系统。 此外，多个面板中的至少一些面板可以包括上侧，下侧，绝缘构件以及耦合到绝缘构件的至少一个支撑构件。 在一些方面，支撑构件可以联接到绝缘构件，使得支撑构件从面板的上侧延伸到下侧。 在一些实施例中，构造系统还可以包括多个接合元件，其被构造成接合至少一些面板以将面板组装成结构的至少一部分。

公开(公告)号：US08255904B2

公开(公告)日：2012-08-28

申请号：US11635906

申请日：2006-12-08

Applicant: Robert F. Sheppard ,  Stuart De Wavrin ,  David Gibson ,  Drew Dubber

Inventor： Robert F. Sheppard ,  Stuart De Wavrin ,  David Gibson ,  Drew Dubber

IPC: G06F9/445

CPC classification number: G06F8/61

Abstract: A system, method, and computer program product for generating a distributable software package, including loading a template/profile; loading at least one module; receiving configuration options over a network connection; and assembling a distributable software package according to the profile, template(s), modules, and the configuration options.

Abstract translation: 一种用于生成可分发软件包的系统，方法和计算机程序产品，包括加载模板/简档; 加载至少一个模块; 通过网络连接接收配置选项; 并根据配置文件，模板，模块和配置选项组装可分发的软件包。

公开(公告)号：US07939934B2

公开(公告)日：2011-05-10

申请号：US11315466

申请日：2005-12-22

Applicant: Belgacem Haba ,  David Gibson

Inventor： Belgacem Haba ,  David Gibson

IPC: H01L23/48 ,  H01L23/14

CPC classification number: G01R1/0483 ,  G01R1/0735 ,  G01R1/07378 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/4985 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05147 ,  H01L2224/05548 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/3011 ,  H05K3/3436 ,  H05K3/3447 ,  H05K2201/0367 ,  H05K2203/0455 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/05599

Abstract: An assembly for testing microelectronic devices includes a microelectronic element having faces and contacts, a flexible substrate spaced from and overlying a first face of the microelectronic element, and a plurality of conductive posts extending from the flexible substrate and projecting away from the first face of the microelectronic element, at least some of the conductive posts being electrically interconnected with the microelectronic element. The assembly also includes a plurality of support elements disposed between the microelectronic element and the substrate for supporting the flexible substrate over the microelectronic element. At least some of the conductive posts are offset from the support elements.

Abstract translation: 用于测试微电子器件的组件包括具有面和触点的微电子元件，与微电子元件的第一面间隔开并且覆盖微电子元件的第一面的柔性基板，以及从柔性基板延伸并远离第一面 微电子元件，至少一些导电柱与微电子元件电互连。 组件还包括设置在微电子元件和衬底之间的多个支撑元件，用于将柔性衬底支撑在微电子元件上。 至少一些导电柱从支撑元件偏移。