公开(公告)号：US10101631B2

公开(公告)日：2018-10-16

申请号：US15239972

申请日：2016-08-18

Applicant: International Business Machines Corporation

Inventor： Michael S. Gordon ,  John U. Knickerbocker ,  Minhua Lu ,  Robert Polastre

IPC: G02F1/29 ,  G02F1/1343 ,  G02B3/12 ,  G02F1/137

Abstract: A lens structure includes a transparent cell containing a liquid crystal material. The cell is thicker in a center region thereof than at peripheral regions. The structure further includes transparent electrically conductive electrodes coupled with opposing top and bottom surfaces of the cell and configured to establish an electric field through the cell that is strongest at the peripheral regions where the cell is thinner relative to the center region so that a value of the index of refraction of the liquid crystal material changes across the cell from the center region towards the peripheral regions to change an effective focal length of the lens structure. In some embodiments the top surface of the cell has a first curvature C1 and the bottom surface of the cell has a second curvature C2 that differs from the first curvature.

公开(公告)号：US20180146272A1

公开(公告)日：2018-05-24

申请号：US15857203

申请日：2017-12-28

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Li-Wen Hung ,  John U. Knickerbocker

IPC: H04R1/04 ,  A61B5/02 ,  A61B5/024 ,  A61B5/00 ,  A61B7/00 ,  H04R19/01

CPC classification number: H04R1/04 ,  A61B5/0022 ,  A61B5/02 ,  A61B5/02028 ,  A61B5/02438 ,  A61B5/02444 ,  A61B5/6833 ,  A61B7/00 ,  A61B2560/0214 ,  A61B2560/0412 ,  A61B2562/0204 ,  A61B2562/0271 ,  A61B2562/028 ,  A61B2562/12 ,  A61B2562/164 ,  A61B2562/166 ,  H04R19/016 ,  H04R2201/003 ,  H04R2420/07

Abstract: A wearable monitoring system includes a microelectromechanical (MEMS) microphone to receive acoustic signal data through skin of a user. An integrated circuit chip is bonded to and electrically connected to the MEMS microphone. A portable power source is connected to at least the integrated circuit chip. A flexible substrate is configured to encapsulate and affix the MEMS microphone and the integrated circuit chip to the skin of the user.

公开(公告)号：US20180133152A1

公开(公告)日：2018-05-17

申请号：US15852943

申请日：2017-12-22

Applicant: International Business Machines Corporation

Inventor： S. Jay Chey ,  Bing Dang ,  John U. Knickerbocker ,  Kenneth F. Latzko ,  Joana Sofia Branquinho Teresa Maria ,  Lavanya Turlapati ,  Bucknell C. Webb ,  Steven L. Wright

IPC: A61K9/00 ,  A61N1/04 ,  A61M31/00

CPC classification number: A61K9/0097 ,  A61M31/002 ,  A61M2205/0244 ,  A61N1/0428 ,  A61N1/0444 ,  A61N1/0448

Abstract: Electromechanical substance delivery devices are provided which implement low-power electromechanical release mechanisms for controlled delivery of substances such as drugs and medication. For example, an electromechanical device includes a substrate having a cavity formed in a surface of the substrate, a membrane disposed on the surface of the substrate covering an opening of the cavity, and a seal disposed between the membrane and the surface of the substrate. The seal surrounds the opening of the cavity, and the seal and membrane are configured to enclose the cavity and retain a substance within the cavity. An electrode structure is configured to locally heat a portion of the membrane in response to a control voltage applied to the electrode structure, and create a stress that causes a rupture in the locally heated portion of the membrane to release the substance from within the cavity.

公开(公告)号：US20180120288A1

公开(公告)日：2018-05-03

申请号：US15854994

申请日：2017-12-27

Applicant: International Business Machines Corporation

Inventor： John U. Knickerbocker ,  Effendi Leobandung

IPC: G01N33/487

CPC classification number: G01N33/48721

Abstract: A nanopore FET sensor device and method of making. The nanopore FET sensor device includes a FET device stack of material layers including a source, channel and drain layers, and a nanoscale hole through the FET device stack to permit flow of strands of molecular material, e.g., DNA, therethrough. The perimeter of the nanoscale hole forms a FET device gate surface. The source and drain layers are provided with respective contacts for connection with measuring instruments that measure a flow of current therebetween. The molecular strands having charged portions pass from one side of a wafer substrate to the other side through the (nanopore) gate and modulate the current flow sensed at the source or drain terminals. The sensor collects real-time measurements of the current flow modulations for use in identifying the type of molecule. Multiple measurements by the same nanopore FET sensor are collected and compared for enhanced detection.

公开(公告)号：US20180113969A1

公开(公告)日：2018-04-26

申请号：US15626582

申请日：2017-06-19

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Qianwen Chen ,  Li-Wen Hung ,  Wanki Kim ,  John U. Knickerbocker ,  Kenneth P. Rodbell ,  Robert L. Wisnieff

IPC: G06F17/50 ,  G06F15/78

CPC classification number: G06F17/5027 ,  G06F15/7803 ,  G06F15/7807 ,  G06F15/7857 ,  G06F15/803 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L24/17 ,  H01L25/065 ,  H01L25/0655 ,  H01L25/071 ,  H01L25/112 ,  H01L25/115 ,  H01L25/18 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/08225 ,  H01L2224/11002 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/80006 ,  H01L2224/81005 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/13051 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1421 ,  H01L2924/1432 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19105

Abstract: A method of forming an electrical device is provided that includes forming microprocessor devices on a microprocessor die; forming memory devices on an memory device die; forming component devices on a component die; and forming a plurality of packing devices on a packaging die. Transferring a plurality of each of said microprocessor devices, memory devices, component devices and packaging components to a supporting substrate, wherein the packaging components electrically interconnect the memory devices, component devices and microprocessor devices in individualized groups. Sectioning the supporting substrate to provide said individualized groups of memory devices, component devices and microprocessor devices that are interconnected by a packaging component.

公开(公告)号：US09945836B2

公开(公告)日：2018-04-17

申请号：US14694316

申请日：2015-04-23

Applicant: International Business Machines Corporation

Inventor： John U. Knickerbocker ,  Effendi Leobandung

IPC: G01N33/487

CPC classification number: G01N33/48721

Abstract: A nanopore FET sensor device and method of making. The nanopore FET sensor device includes a FET device stack of material layers including a source, channel and drain layers, and a nanoscale hole through the FET device stack to penult flow of strands of molecular material, e.g., DNA, therethrough. The perimeter of the nanoscale hole forms a FET device gate surface. The source and drain layers are provided with respective contacts for connection with measuring instruments that measure a flow of current therebetween. The molecular strands having charged portions pass from one side of a wafer substrate to the other side through the (nanopore) gate and modulate the current flow sensed at the source or drain terminals. The sensor collects real-time measurements of the current flow modulations for use in identifying the type of molecule. Multiple measurements by the same nanopore FET sensor are collected and compared for enhanced detection.

公开(公告)号：US20180095125A1

公开(公告)日：2018-04-05

申请号：US15821403

申请日：2017-11-22

Applicant: International Business Machines Corporation

Inventor： Paul S. Andry ,  Qianwen Chen ,  Bing Dang ,  John U. Knickerbocker ,  Minhua Lu ,  Robert J. Polastre ,  Bucknell C. Webb

IPC: G01R31/28 ,  G01R31/309 ,  H05K1/11 ,  H05K1/18 ,  H05K1/03 ,  H05K1/02 ,  H05K3/34 ,  H05K3/30 ,  H05K3/00

CPC classification number: G01R31/2818 ,  G01R31/309 ,  H05K1/0268 ,  H05K1/0274 ,  H05K1/0393 ,  H05K1/111 ,  H05K1/189 ,  H05K3/0026 ,  H05K3/305 ,  H05K3/341 ,  H05K3/3494 ,  H05K13/0069 ,  H05K2201/09072 ,  H05K2201/10015 ,  H05K2201/10037 ,  H05K2201/1006 ,  H05K2201/10098 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10522 ,  H05K2203/107 ,  H05K2203/162

Abstract: An electro-optical module assembly is provided that includes a flexible substrate having a first surface and a second surface opposite the first surface, wherein the flexible substrate contains an opening located therein that extends from the first surface to the second surface. An optical component is located on the second surface of the flexible substrate and is positioned to have a surface exposed by the opening. At least one electronic component is located on a first portion of the first surface of the flexible substrate, and at least one micro-energy source is located on a second portion of the first surface of the flexible substrate.

公开(公告)号：US09798886B2

公开(公告)日：2017-10-24

申请号：US14794399

申请日：2015-07-08

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  John U. Knickerbocker ,  Joana Sofia Branquinho Teresa Maria ,  Sufi Zafar

IPC: G06F21/00 ,  G06F21/60 ,  H04W12/02

CPC classification number: G06F21/606 ,  H04W4/38 ,  H04W4/80 ,  H04W12/02

Abstract: Methods, devices, systems, and computer program products for implementing a bio-medical sensing platform are provided herein. A method includes receiving one or more items of sensed biological data and/or sensor-related information from one or more sensor devices via a communication link established with the one or more sensor devices, wherein the one or more sensor devices are associated with a given user; analyzing the one or more items of sensed biological data and/or sensor-related information to perform one or more characterization functions pertaining to the one or more items of biological data and/or the given user; and transferring the one or more items of sensed biological data and/or sensor-related information and/or a result of the one or more characterization functions to a private storage component via a communication link established with the private storage component, wherein said transferring comprises implementing one or more security functions in conjunction with said transferring.

公开(公告)号：US09748131B2

公开(公告)日：2017-08-29

申请号：US14943691

申请日：2015-11-17

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Robert D. Allen ,  Paul S. Andry ,  Jeffrey D. Gelorme ,  Li-wen Hung ,  John U. Knickerbocker ,  Cornelia K. Tsang

IPC: H01L21/00 ,  H01L23/34 ,  H01L21/683 ,  H01L25/03 ,  H01L21/762 ,  H01L23/00 ,  H01L21/463 ,  H01L21/306 ,  H01L21/304 ,  H01L21/768

CPC classification number: H01L21/6836 ,  H01L21/304 ,  H01L21/30604 ,  H01L21/463 ,  H01L21/6835 ,  H01L21/76256 ,  H01L21/76898 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L25/03 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68359 ,  H01L2221/68381

Abstract: A method for adhesive bonding in microelectronic device processing is provided that includes bonding a handling wafer to a front side of a device wafer with an adhesive comprising phenoxy resin; and thinning the device wafer from the backside of the device wafer while the device wafer is adhesively engaged to the handling wafer. After the device wafer has been thinned, the adhesive comprising phenoxy resin may be removed by laser debonding, wherein the device wafer is separated from the handling wafer.

公开(公告)号：US20170199222A1

公开(公告)日：2017-07-13

申请号：US15469501

申请日：2017-03-25

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  John U. Knickerbocker ,  Jae-Woong Nah ,  Robert E. Trzcinski ,  Cornelia Kang-I Tsang

IPC: G01R1/04 ,  H01L21/66 ,  H01L23/498 ,  G01R1/067

CPC classification number: G01R1/0408 ,  G01R1/06761 ,  G01R3/00 ,  H01L22/30 ,  H01L22/34 ,  H01L23/49838 ,  H01L2224/0401 ,  H01L2224/32145 ,  H01L2224/73265 ,  H01L2924/014

Abstract: A test probe structure having a planar surface and contact locations matched to test hardware is provided. The fabrication of the test probe structure addresses problems related to the possible deformation of base substrates during manufacture. Positional accuracy of contact locations and planarity of base substrates is achieved using dielectric layers, laser ablation, injection molded solder or redistribution layer wiring, and planarization techniques.