公开(公告)号：US06218213B1

公开(公告)日：2001-04-17

申请号：US09325262

申请日：1999-06-03

申请人： Joseph Fjelstad ,  John W. Smith

发明人： Joseph Fjelstad ,  John W. Smith

IPC分类号： H01L2144

CPC分类号： H01L23/49572 ,  H01L21/4821 ,  H01L23/49548 ,  H01L24/48 ,  H01L2224/48472 ,  H01L2924/00014 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Flexible leads for making electrical connection in microelectronic components include a frangible intermediate section. The frangible intermediate section is formed by a region within the lead having weakened mechanical integrity. The frangible intermediate section is made by providing a sacrificial metal layer and forming a projection on the surface of the metal layer from a portion thereof. Lead forming material is deposited onto the surface of the sacrificial metal layer and over the projection. A dielectric layer is formed on the surface of the lead forming material. Upon removing the sacrificial metal layer, a frangible intermediate section is formed within the lead forming material at the location of the projection.

摘要翻译： 用于在微电子部件中进行电连接的柔性引线包括易碎中间部分。 易碎中间部分由引线内的区域形成，机械完整性降低。 易碎的中间部分是通过提供牺牲金属层制成的，并从金属层的一部分在金属层的表面上形成突起。 引线形成材料沉积在牺牲金属层的表面上并且在突起上。 在引线形成材料的表面上形成介电层。 在去除牺牲金属层时，在突起的位置处，在引线形成材料内形成易碎的中间部分。

公开(公告)号：US5989936A

公开(公告)日：1999-11-23

申请号：US989312

申请日：1997-12-12

申请人： John W. Smith ,  Joseph Fjelstad

发明人： John W. Smith ,  Joseph Fjelstad

IPC分类号： H01L21/48 ,  H01L23/22 ,  H01L23/48 ,  H01L23/485 ,  H01L23/498 ,  H01L23/64 ,  H05K1/11 ,  H05K3/36 ,  H05K3/40 ,  H01L21/44 ,  H01L21/50

CPC分类号： H01L23/22 ,  H01L21/4839 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L23/642 ,  H01L24/13 ,  H05K3/4084 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15174 ,  H01L2924/351 ,  H05K1/118 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2203/063 ,  H05K3/361

摘要： A structure including a conductive, preferably metallic conductive layer is provided with leads on a bottom surface. The leads have fixed ends permanently attached to the structure and free ends detachable from the structure. The structure is engaged with a microelectronic element such as a semiconductor chip or wafer, the free ends of the leads are bonded to the microelectronic element, and the leads are bent by moving the structure relative to the microelectronic element. Portions of the conductive layer are removed, leaving residual portions of the conductive layer as separate electrical terminals connected to at least some of the leads. The conductive layer mechanically stabilizes the structure before bonding, and facilitates precise registration of the leads with the microelectronic element. After the conductive layer is converted to separate terminals, it does not impair free movement of the terminals relative to the microelectronic element.

摘要翻译： 包括导电优选金属导电层的结构在底表面上设置有引线。 引线具有永久地附接到结构的固定端部和从结构可拆卸的自由端。 该结构与诸如半导体芯片或晶片的微电子元件接合，引线的自由端接合到微电子元件，并且通过相对于微电子元件移动结构而使引线弯曲。 导电层的一部分被去除，导致导电层的剩余部分作为分开的电端子连接到至少一些引线。 导电层在结合之前机械稳定结构，并且有助于引线与微电子元件的精确对准。 在将导电层转换成单独的端子之后，它不会损害端子相对于微电子元件的自由移动。

公开(公告)号：US5679194A

公开(公告)日：1997-10-21

申请号：US434552

申请日：1995-05-04

申请人： Joseph Fjelstad ,  John W. Smith

发明人： Joseph Fjelstad ,  John W. Smith

IPC分类号： H01L21/60 ,  H01L23/498 ,  H05K3/40

CPC分类号： H05K3/4092 ,  H01L23/4985 ,  H01L24/80 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  Y10T29/49121

摘要： A substantially continuous layer of a first metal such as copper is provided with strips of a second metal such as gold by selective electroplating of the second metal. A dielectric support layer is provided in contact with the first metal layer, and the first metal layer is etched to leave strips of the first metal contiguous with the strips of the second metal, thereby providing composite leads with the first and second metal strips connected in series. The process provides simple end economical methods of making microelectronic connection components with leads having a flexible, fatigue resistant lead potion formed from a precious metal.

摘要翻译： 第一金属（例如铜）的基本连续的层通过第二金属的选择性电镀为第二金属（例如金）提供条。 提供与第一金属层接触的电介质支撑层，并且蚀刻第一金属层以留下与第二金属的条带相邻的第一金属的条带，由此提供复合引线，其中第一和第二金属条连接在 系列。 该方法提供了简单的最终经济的方法，使微电子连接部件与具有由贵金属形成的柔性，耐疲劳的铅部分的引线相结合。

公开(公告)号：US06329607B1

公开(公告)日：2001-12-11

申请号：US08715571

申请日：1996-09-18

申请人： Joseph Fjelstad ,  John W. Smith

发明人： Joseph Fjelstad ,  John W. Smith

IPC分类号： H01R909

CPC分类号： H01L24/50 ,  H01L23/3107 ,  H01L23/49572 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/3011

摘要： A microelectronic connection component has flexible leads formed by polymeric strips with metallic conductors thereon. The metallic conductors may be very thin, desirably less than 5 microns thick, and provide good fatigue resistance. Each strip may have two conductors thereon, one serving as a principal or signal conductor for connection to a contact on a chip or other microelectronic element and the other serving as potential reference or ground conductor. The potential reference conductor on the lead provides enhanced resistance to crosstalk.

摘要翻译： 微电子连接部件具有由其上具有金属导体的聚合物条形成的柔性引线。 金属导体可以非常薄，期望小于5微米厚，并且提供良好的耐疲劳性。 每个条带可以在其上具有两个导体，一个用作主体或信号导体，用于连接到芯片或其他微电子元件上的触点，另一个用作电位参考或接地导体。 引线上的电位参考导体提供增强的串扰电阻。

公开(公告)号：US06239384B1

公开(公告)日：2001-05-29

申请号：US09020754

申请日：1998-02-09

申请人： John W. Smith ,  Joseph Fjelstad

发明人： John W. Smith ,  Joseph Fjelstad

IPC分类号： H01R909

CPC分类号： H01L23/3107 ,  H01L23/49572 ,  H01L23/498 ,  H01L23/52 ,  H01L23/538 ,  H01L24/50 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/3011 ,  H05K1/118

摘要： A microelectronic connection component has flexible leads formed by polymeric strips with metallic conductors thereon. The metallic conductors may be very thin, desirably less than 5 microns thick, and provide good fatigue resistance. Each strip may have two conductors thereon, one serving as a principal or first signal conductor for connection to a first contact on a chip or other microelectronic element and the other serving as potential reference or ground conductor, or as a second signal conductor connected to a second contact on the chip. The system provides enhanced resistance to crosstalk and rapid signal transmission, and is compatible with differential signal transmission.

摘要翻译： 微电子连接部件具有由其上具有金属导体的聚合物条形成的柔性引线。 金属导体可以非常薄，期望小于5微米厚，并且提供良好的耐疲劳性。 每个条带可以在其上具有两个导体，一个用作连接到芯片或其他微电子元件上的第一触点的另一个用作主要信号导体或第一信号导体，另一个用作电位参考或接地导体，或者作为连接到 第二次接触芯片。 该系统提供增强的串扰阻抗和快速信号传输，并且与差分信号传输兼容。

公开(公告)号：US20160037623A1

公开(公告)日：2016-02-04

申请号：US13573309

申请日：2012-09-07

申请人： Joseph Fjelstad

发明人： Joseph Fjelstad

IPC分类号： H05K1/02 ,  H05K1/09 ,  H05K1/18

CPC分类号： H05K1/148 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/24137 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/83192 ,  H01L2924/15153 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/1579 ,  H05K1/0203 ,  H05K1/0283 ,  H05K1/185 ,  H05K3/0044 ,  H05K3/445 ,  H05K3/4691 ,  H05K2201/055 ,  H05K2201/09745 ,  H05K2203/1469

摘要： A rigid flex circuit comprised of high thermal conductivity sections, said sections having components disposed so as to have their contacts substantially planar with the surface of the thermally conductive section and wherein the contacts are interconnected directly to the traces without the use of solder and further having the thermally conductive sections interconnected to one another by means of flexible circuit sections.

摘要翻译： 一种由高导热部分组成的刚性柔性电路，所述部分具有设置成使其触点与导热部分的表面基本平面的部件，并且其中触头直接与迹线互连而不使用焊料并进一步具有 导热部分通过柔性电路部分彼此互连。

公开(公告)号：US08148205B2

公开(公告)日：2012-04-03

申请号：US12894732

申请日：2010-09-30

申请人： Joseph Fjelstad

发明人： Joseph Fjelstad

IPC分类号： H01L21/00

CPC分类号： H01L23/49811 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/13 ,  H01L24/72 ,  H01L2224/11 ,  H01L2224/11003 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/3025 ,  H01L2924/351 ,  Y10T29/49126 ,  H01L2224/29099 ,  H01L2924/00

摘要： A method of making a microelectronic connection component is disclosed. A plurality of portions of a conductive, etch-resistant material is provided on a surface of a metallic sheet. The sheet is etched from the surface to form posts extending generally parallel to one another aligned with the portions of the etch-resistant material. A microelectronic device is provided having one of a front face or a rear face overlying first ends of the posts. Second ends of the posts remote from the first ends face away from the microelectronic device as interconnection terminals for the connection component. At least some of the posts are electrically connected to the microelectronic device.

摘要翻译： 公开了一种制造微电子连接部件的方法。 导电耐腐蚀材料的多个部分设置在金属片的表面上。 从表面蚀刻片材以形成大致平行于彼此与抗蚀刻材料的部分对准的柱。 提供了一个微电子器件，其具有覆盖在柱的第一端上的前表面或后表面之一。 远离第一端的柱的第二端作为用于连接部件的互连端子远离微电子器件。 至少一些柱电连接到微电子器件。

公开(公告)号：US07872344B2

公开(公告)日：2011-01-18

申请号：US11474199

申请日：2006-06-23

申请人： Joseph Fjelstad ,  Konstantine Karavakis

发明人： Joseph Fjelstad ,  Konstantine Karavakis

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H01L23/3114 ,  H01L23/3121 ,  H01L23/4951 ,  H01L23/498 ,  H01L23/525 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/45 ,  H01L24/72 ,  H01L24/82 ,  H01L24/94 ,  H01L2224/0231 ,  H01L2224/02311 ,  H01L2224/02313 ,  H01L2224/0236 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/11334 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/1319 ,  H01L2224/16 ,  H01L2224/24011 ,  H01L2224/24226 ,  H01L2224/24227 ,  H01L2224/274 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/85424 ,  H01L2924/00011 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2224/48824 ,  H01L2924/00 ,  H01L2924/01004

摘要： A compliant semiconductor chip package assembly includes a a semiconductor chip having a plurality of chip contacts, and a compliant layer having a top surface, a bottom surface and sloping peripheral edges, whereby the bottom surface of the compliant layer overlies a surface of the semiconductor chip. The assembly also includes a plurality of electrically conductive traces connected to the chip contacts of the semiconductor chip, the traces extending along the sloping edges to the top surface of the compliant layer. The assembly may include conductive terminals overlying the semiconductor chip, with the compliant layer supporting the conductive terminals over the semiconductor chip. The conductive traces have first ends electrically connected with the contacts of the semiconductor chip and second ends electrically connected with the conductive terminals. The conductive terminals are movable relative to the semiconductor chip.

摘要翻译： 兼容的半导体芯片封装组件包括具有多个芯片触点的半导体芯片和具有顶表面，底表面和倾斜周边边缘的柔性层，由此柔性层的底表面覆盖在半导体芯片的表面上。 组件还包括连接到半导体芯片的芯片触点的多个导电迹线，迹线沿倾斜边缘延伸到柔性层的顶表面。 组件可以包括覆盖半导体芯片的导电端子，其中柔性层将导电端子支撑在半导体芯片上。 导电迹线具有与半导体芯片的触点电连接的第一端和与导电端子电连接的第二端。 导电端子可相对于半导体芯片移动。

公开(公告)号：US07531894B2

公开(公告)日：2009-05-12

申请号：US11257296

申请日：2005-10-24

申请人： Joseph Fjelstad

发明人： Joseph Fjelstad

IPC分类号： H01L21/44

CPC分类号： H01L23/49811 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/13 ,  H01L24/72 ,  H01L2224/11 ,  H01L2224/11003 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/3025 ,  H01L2924/351 ,  Y10T29/49126 ,  H01L2224/29099 ,  H01L2924/00

摘要： A method of electrically connecting a microelectronic component having a first surface bearing a plurality of contacts. The method including the steps of forming a subassembly by juxtaposing a connection component having a support structure and a plurality of elongated posts extending substantially parallel to one another from a first surface of the support structure with the microelectronic component so that the support structure overlies the surface of the component with the posts extending away from the component and electrically connecting the posts to the contacts of the microelectronic component.

摘要翻译： 电连接具有带有多个触点的第一表面的微电子部件的方法。 该方法包括以下步骤：通过将具有支撑结构的连接部件和由支撑结构的第一表面基本上彼此平行延伸的多个细长柱与微电子部件并置而形成子组件，使得支撑结构覆盖在表面 所述部件的柱子远离所述部件并且将所述柱电连接到所述微电子部件的触头。

公开(公告)号：US07408260B2

公开(公告)日：2008-08-05

申请号：US11487263

申请日：2006-07-14

申请人： Joseph Fjelstad ,  Konstantine Karavakis

发明人： Joseph Fjelstad ,  Konstantine Karavakis

IPC分类号： H01L29/40 ,  H01L23/48

CPC分类号： H01L23/3114 ,  H01L23/3121 ,  H01L23/4951 ,  H01L23/498 ,  H01L23/525 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/45 ,  H01L24/72 ,  H01L24/82 ,  H01L24/94 ,  H01L2224/0231 ,  H01L2224/02311 ,  H01L2224/02313 ,  H01L2224/0236 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/11334 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/1319 ,  H01L2224/16 ,  H01L2224/24011 ,  H01L2224/24226 ,  H01L2224/24227 ,  H01L2224/274 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/85424 ,  H01L2924/00011 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2224/48824 ,  H01L2924/00 ,  H01L2924/01004

摘要： A microelectronic assembly includes a microelectronic element such as a semiconductor chip or wafer having a first surface and contacts accessible at the first surface, a compliant layer overlying the first surface of the microelectronic element, and conductive protrusions overlying the compliant layer and projecting away from the first surface of the microelectronic element, wherein the conductive protrusions are electrically interconnected with the contacts of the microelectronic element. The conductive protrusions are movable relative to said microelectronic element.

摘要翻译： 微电子组件包括微电子元件，例如具有第一表面和在第一表面可接触的触点的半导体芯片或晶片的微电子元件，覆盖微电子元件的第一表面的柔性层和覆盖柔顺层的导电突起并远离 微电子元件的第一表面，其中导电突起与微电子元件的触点电互连。 导电突起可相对于所述微电子元件移动。