摘要:
A semiconductor package with a heat dissipating device and a fabrication method of the semiconductor package are provided. A chip is mounted on a substrate. The heat dissipating device is mounted on the chip, and includes an accommodating room, and a first opening and a second opening that communicate with the accommodating room. An encapsulant is formed between the heat dissipating device and the substrate to encapsulate the chip. A cutting process is performed to remove a non-electrical part of structure and expose the first and second openings from the encapsulant. A cooling fluid is received in the accommodating room to absorb and dissipate heat produced by the chip. The heat dissipating device covers the encapsulant and the chip to provide a maximum heat transfer area for the semiconductor package.
摘要:
The present invention provides a semiconductor package and a fabrication method thereof. The method includes the steps of: providing a chip carrier module having a plurality of chip carriers, disposing a plurality of electrical connecting points on the chip carriers, performing chip mounting and molding on the chip carrier module to form an encapsulant encapsulating the semiconductor chip, exposing the electrical connecting points from the encapsulant; forming a patterned circuit layer on the encapsulant, electrically connecting the patterned circuit layer to the electrical connecting points, cutting and separating the chip carriers to form a plurality of semiconductor packages each having a circuit layer formed on the encapsulant such that the circuit layer provides extra electrical connecting points and thereby enhances electrical performance of electrical products. During a package stacking process, no package is limited by the design of another package below.
摘要:
A heat sink package structure and a method for fabricating the same are disclosed. The method includes mounting and electrically connecting a semiconductor chip to a chip carrier, forming an interface layer or a second heat dissipating element having the interface layer on the semiconductor chip and installing a first heat dissipating element having a heat dissipating portion and a supporting portion onto the chip carrier. The method further includes forming openings corresponding to the semiconductor chip in the heat dissipating portion, and forming an encapsulant for covering the semiconductor chip, the interface layer or the second heat dissipating element, and the first heat dissipating element. A height is reserved on top of the interface layer for the formation of the encapsulant for covering the interface layer. The method further includes cutting the encapsulant along edges of the interface layer, and removing the redundant encapsulant on the interface layer. Therefore, the drawbacks of the prior art of the burrs caused by a cutting tool for cutting the heat dissipating element and wearing of the cutting tool are overcome.
摘要:
A multi-chip semiconductor package and a fabrication method thereof are provided. At least one first chip is mounted on and electrically connected to an upper surface of a substrate via solder bumps. A preformed package structure having a second chip and a first encapsulation body is mounted on the upper surface of the substrate, wherein outer leads of the preformed package structure are exposed from the first encapsulation body and electrically connected to the upper surface of the substrate. The first encapsulation body, outer leads and substrate form a space where the first chip is received, and a gap is present between the first chip and the first encapsulation body. A second encapsulation body is formed on the upper surface of the substrate to encapsulate the first chip, solder bumps and preformed package structure. A plurality of solder balls are implanted on the lower surface of the substrate.
摘要:
A semiconductor element with under bump metallurgy (UBM) structures and a fabrication method thereof are proposed. When UBM structures are formed on signal pads and ground pads on a surface of the semiconductor element that is completely fabricated with a circuit layout, a metallic layer for defining the UBM structures is retained, wherein the UBM structures on the ground pads are electrically connected to the metallic layer, and the UBM structures on the signal pads are electrically insulated from the metallic layer. This allows the metallic layer for defining the UBM structures to directly serve as a grounding layer for the semiconductor element.
摘要:
A semiconductor device having a flip-chip package and a method for fabricating the same are provided. A flip-chip package after being tested to be functionally workable is mounted on a carrier and is electrically connected to the carrier by a plurality of first conductive elements, the flip-chip package having a first chip mounted on a substrate in a flip-chip manner. At least a second chip is mounted on the flip-chip package and is electrically connected to the carrier by a plurality of second conductive elements. An encapsulant is formed on the carrier for encapsulating the flip-chip package and the second chip. A plurality of solder balls are implanted on a bottom surface of the carrier, such that the first and second chips can be electrically connected to an external device via the solder balls. The above arrangement can effectively improve the yield of a fabricated product and reduce packaging costs.
摘要:
A semiconductor package with a heat sink is provided in which at least one chip is mounted on the substrate and covered by a heat sink. The heat sink is formed with a plurality of grooves or holes at positions in contact with the substrate, allowing an adhesive material to be applied between the heat sink and the substrate and filled into the grooves or holes for attaching the heat sink onto the substrate. The adhesive material filled into the grooves or holes provides an anchoring effect for firmly positioning the heat sink on the substrate. Therefore, it is not necessary to form predetermined holes on the substrate for being coupled to fixing members such as bolts, and incorporation of the heat sink would not affect trace routability and arrangement of input/output connections such as solder balls on the substrate and would not lead to cracks of the chip.
摘要:
A semiconductor package and a fabrication method thereof are provided in which a chip is mounted on a substrate, and a dielectric layer is applied over the substrate and chip, with bond fingers formed on the substrate and electric contacts formed on the chip being exposed outside. A metal layer is formed over the dielectric layer and the exposed bond fingers and electric contacts, and patterned to form a plurality of conductive traces that electrically connect the electric contacts of the chip to the bond fingers of the substrate. The conductive traces replace conventional wire bonding technology and thus eliminate the occurrence of wire sweep or short circuits in fabrication processes. Therefore, a low profile chip with a reduced pitch between adjacent electric contacts can be used without being limited to feasibility of the wire bonding technology.
摘要:
A substrate and a fabrication method thereof are proposed, with at least a check point being formed on the substrate. Prior to wire bonding and/or molding processes, cleanness of the substrate (cleaned by plasma) is determined according to color variation of the check point, so as to allow only cleaned and contamination-free substrates to be subsequently formed with bonding wires and encapsulants thereon. Thereby, qualities of wire-bonded electrical connection and encapsulant adhesion for the substrate can be assured, which helps prevent the occurrence of delamination between the encapsulant and the substrate. Moreover, the check point formed on the substrate is made during general substrate fabrication by using current equipment and technique, and in a manner as not to interfere with trace routability on the substrate; thereby, costs and complexity of substrate fabrication would not undesirably increased.
摘要:
A chip carrier for a semiconductor chip is provided. A plurality of solder pads for bump soldering are formed on a chip mounting surface of the chip carrier, to allow a flip chip to be mounted and electrically connected to the chip carrier. A solder mask layer is formed on the chip carrier, wherein a plurality of openings are provided in the solder mask layer to expose the solder pads, and an outwardly opening extended portion is formed respectively from the openings corresponding to the solder pads having a relatively narrower pitch therebetween, so as to prevent formation of voids during an underfill process for filing a gap between the flip chip and the chip carrier.