公开(公告)号：US06812410B2

公开(公告)日：2004-11-02

申请号：US09810151

申请日：2001-03-16

申请人： Noriaki Sakamoto ,  Yoshiyuki Kobayashi ,  Junji Sakamoto ,  Yukio Okada ,  Yusuke Igarashi ,  Eiju Maehara ,  Kouji Takahashi

发明人： Noriaki Sakamoto ,  Yoshiyuki Kobayashi ,  Junji Sakamoto ,  Yukio Okada ,  Yusuke Igarashi ,  Eiju Maehara ,  Kouji Takahashi

IPC分类号： H05K116

CPC分类号： H01L24/32 ,  H01L21/4832 ,  H01L23/36 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16245 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01059 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18165 ,  H01L2924/3011 ,  H01L2924/351 ,  H05K1/0204 ,  H05K1/021 ,  H05K1/182 ,  H05K1/189 ,  H05K3/26 ,  H05K3/281 ,  H05K3/303 ,  H05K2201/10416 ,  H05K2201/10727 ,  H05K2201/10734 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/05599

摘要： A first metal film 14 made of a Cu plated film is formed on a radiation substrate 13A made of Al, and an island 15 exposed from a back surface of a semiconductor device 10 is adhered thereto. At that time, the back surface of the semiconductor device 10 is brought into contact with contact areas, and a first opening portion OP is opened larger than an arranging area of the semiconductor device 10. Accordingly, the cleaning can be executed via the first opening portion OP exposed from peripheries of the semiconductor device 10. In addition, the heat generated from semiconductor elements 16 can be radiated excellently from the island 15 via a second supporting member 13A.

摘要翻译： 在由Al制成的辐射基板13A上形成由Cu镀膜形成的第一金属膜14，并且从半导体器件10的背面露出的岛15被粘附到其上。 此时，半导体器件10的背面与接触区域接触，并且第一开口部分OP打开得比半导体器件10的布置区域大。因此，可以经由第一开口 部分OP从半导体器件10的周边露出。此外，从半导体元件16产生的热能够经由第二支撑构件13A从岛15辐射良好。

公开(公告)号：US06780676B2

公开(公告)日：2004-08-24

申请号：US10172415

申请日：2002-06-14

申请人： Yusuke Igarashi ,  Noriaki Sakamoto ,  Yoshiyuki Kobayashi ,  Takeshi Nakamura

发明人： Yusuke Igarashi ,  Noriaki Sakamoto ,  Yoshiyuki Kobayashi ,  Takeshi Nakamura

IPC分类号： H01L2144

CPC分类号： H01L21/4857 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2221/68377 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/04953 ,  H01L2924/12042 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/3011 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/00012

摘要： A conductive plated layer 4 is fanned after through holes 21 are formed in the insulation resin 2 by using an insulation resin sheet 1 overcoated on a single side of the conductive layer 3 with insulation resin 2. A multi-layer connection structure can be achieved by the second conductive path layer 6 which is connected, in multi layers, to the first conductive path layer 5 formed by etching the conductive plated layer 4. Further, since semiconductor elements 7 are adhered to and fixed at the overcoating resin 8 that covers the first conductive path layer 5, the first conductive path layer 5 is finely patterned, and routing thereof can be made free. Further, since the second conductive layer 4 that has been fanned to be thick can be thinly etched, the second conductive path layers 6 can be finely patterned.

摘要翻译： 通过使用在绝缘树脂2的导电层3的单面上涂覆的绝缘树脂片1，在绝缘树脂2中形成通孔21之后，导电镀层4被扇形化。多层连接结构可以通过 多层连接到通过蚀刻导电镀层4形成的第一导电通路层5的第二导电通路层6.此外，由于半导体元件7粘附并固定在覆盖第一导电层4的外涂层树脂8上 导电路径层5，第一导电路径层5被精细地图案化，并且可以使其布线自由。 此外，由于可以薄化地蚀刻已经被扇形成厚的第二导电层4，所以可以精细地构图第二导电路径层6。

公开(公告)号：US06624511B2

公开(公告)日：2003-09-23

申请号：US09821447

申请日：2001-03-29

申请人： Noriaki Sakamoto ,  Yoshiyuki Kobayashi ,  Eiju Maehara ,  Noriyasu Sakai ,  Hitoshi Takagishi ,  Kouji Takahashi ,  Kazuhisa Kusano

发明人： Noriaki Sakamoto ,  Yoshiyuki Kobayashi ,  Eiju Maehara ,  Noriyasu Sakai ,  Hitoshi Takagishi ,  Kouji Takahashi ,  Kazuhisa Kusano

IPC分类号： H01L2348

CPC分类号： H01L25/16 ,  H01L21/4832 ,  H01L23/3107 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2221/68377 ,  H01L2224/04042 ,  H01L2224/05556 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/48624 ,  H01L2224/48647 ,  H01L2224/48724 ,  H01L2224/48747 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2224/85424 ,  H01L2224/85447 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01059 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12035 ,  H01L2924/12036 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/2076 ,  H05K1/185 ,  H05K3/06 ,  H05K3/202 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/20754 ,  H01L2924/00015

摘要： The semiconductor elements for the small signal type circuits and the Au wire for connection are integrated as one package to produce the semiconductor devices 30A, 31A, 32, 33A, 34A and 38. In this way, the wire bonding of Au can be omitted, and the wire bonding of the small diameter Al wire and the large diameter Al wire is only required to complete the connection of the fine metal wire. These semiconductor devices have a plurality of circuit elements as one package, so that the mounting operation on the mounting board can be significantly reduced.

摘要翻译： 用于小信号电路的半导体元件和用于连接的Au线被集成为一个封装以制造半导体器件30A，31A，32,33A，34A和38.这样，可以省略Au的引线接合， 并且仅需要小直径Al线和大直径Al线的引线接合来完成细金属线的连接。这些半导体器件具有作为一个封装的多个电路元件，从而在安装上的安装操作 板可以大大减少。

公开(公告)号：US06548328B1

公开(公告)日：2003-04-15

申请号：US09671135

申请日：2000-09-27

申请人： Noriaki Sakamoto ,  Yoshiyuki Kobayashi ,  Junji Sakamoto ,  Shigeaki Mashimo ,  Katsumi Okawa ,  Eiju Maehara ,  Kouji Takahashi

发明人： Noriaki Sakamoto ,  Yoshiyuki Kobayashi ,  Junji Sakamoto ,  Shigeaki Mashimo ,  Katsumi Okawa ,  Eiju Maehara ,  Kouji Takahashi

IPC分类号： H01L2144

CPC分类号： H01L24/48 ,  H01L21/4821 ,  H01L21/4832 ,  H01L21/56 ,  H01L23/3107 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/105 ,  H01L25/165 ,  H01L25/50 ,  H01L2221/68377 ,  H01L2224/05554 ,  H01L2224/16 ,  H01L2224/29101 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48639 ,  H01L2224/48739 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83815 ,  H01L2224/83851 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2224/97 ,  H01L2225/1029 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01059 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10161 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/3511 ,  H05K1/187 ,  H05K1/188 ,  H05K3/06 ,  H05K3/202 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/07811 ,  H01L2224/83205

摘要： After a trench 54 is formed in a conductive foil 60, the circuit elements are mounted, and the insulating resin is applied on the conductive foil 60 as the support substrate. After being inverted, the conductive foil 60 is polished on the insulating resin 50 as the support substrate for separation into the conductive paths. Accordingly, it is possible to fabricate the circuit device in which the conductive paths 51 and the circuit elements 52 are supported by the insulating resin 50, without the use of the support substrate. And the interconnects L1 to L3 requisite for the circuit are formed, and can be prevented from slipping because of the curved structure 59 and a visor 58.

摘要翻译： 在导电箔60中形成沟槽54之后，安装电路元件，并且将绝缘树脂施加在作为支撑基板的导电箔60上。 反转后，将导电箔60作为用于分离的导电路径的支撑基板在绝缘树脂50上进行研磨。 因此，可以制造其中导电通路51和电路元件52由绝缘树脂50支撑的电路装置，而不使用支撑基板。 并且形成电路所需的互连L1至L3，并且可以防止由于弯曲结构59和遮阳板58而滑动。

公开(公告)号：US06545364B2

公开(公告)日：2003-04-08

申请号：US09810110

申请日：2001-03-16

申请人： Noriaki Sakamoto ,  Yoshiyuki Kobayashi ,  Junji Sakamoto ,  Shigeaki Mashimo ,  Katsumi Okawa ,  Eiju Maehara ,  Kouji Takahashi ,  Hirokazu Fukuda ,  Hiroki Etou

发明人： Noriaki Sakamoto ,  Yoshiyuki Kobayashi ,  Junji Sakamoto ,  Shigeaki Mashimo ,  Katsumi Okawa ,  Eiju Maehara ,  Kouji Takahashi ,  Hirokazu Fukuda ,  Hiroki Etou

IPC分类号： H01L2348

CPC分类号： H01L24/40 ,  H01L21/4821 ,  H01L21/4832 ,  H01L23/3107 ,  H01L23/49562 ,  H01L24/37 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2221/68377 ,  H01L2224/05599 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/49111 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8485 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01043 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01059 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3511 ,  H05K1/185 ,  H05K3/06 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： After a trench 54 is formed in a conductive foil 60, a circuit element is mounted in a flip chip method. Then, an insulating resin 50 is covered on the conductive foil 60 as a support substrate. After reversion, the conductive foil 60 is polished over the insulating resin 50 as a support substrate at this time to separate the conductive paths. Accordingly, a circuit device having the conductive paths 51 and the circuit elements 52 supported by the insulating resin 50 can be produced without employing the support substrate.

公开(公告)号：US06531370B2

公开(公告)日：2003-03-11

申请号：US09944322

申请日：2001-08-31

申请人： Noriaki Sakamoto ,  Yoshiyuki Kobayashi ,  Junji Sakamoto ,  Yukio Okada ,  Yusuke Igarashi ,  Eiju Maehara ,  Kouji Takahashi

发明人： Noriaki Sakamoto ,  Yoshiyuki Kobayashi ,  Junji Sakamoto ,  Yukio Okada ,  Yusuke Igarashi ,  Eiju Maehara ,  Kouji Takahashi

IPC分类号： H01L21331

CPC分类号： H01L22/20 ,  H01L21/4832 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01059 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/185 ,  H05K3/06 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012

摘要： After mounting portions (65) are formed in each block (62), circuit elements are mounted on the mounting portions (65) and molded with insulating resin (50). Then, the back surface of conductive foil (60) is etched to form conductive patterns 51in each block. Further, a plurality of blocks are bonded onto a adhesive sheet so that a testing step and a dicing step are carried out upon the blocks in a lump.

公开(公告)号：US06500368B1

公开(公告)日：2002-12-31

申请号：US09712163

申请日：2000-11-15

申请人： Masahiko Sameshima ,  Yoshiyuki Kobayashi ,  Kenji Yamaguchi

发明人： Masahiko Sameshima ,  Yoshiyuki Kobayashi ,  Kenji Yamaguchi

IPC分类号： B29C4402

CPC分类号： B29C44/60 ,  B29C44/3419 ,  B29C44/445 ,  Y10S264/15

摘要： Objects of the invention is to provide a practical, novel foam molding apparatus wherein mold surfaces are devoid of air orifices, and to provide an in-mold foam molding apparatus and method for the reduction of cooling time for molded articles. A mold cavity 4 is filled with prefoamed beads comprising a polyolefin synthetic resin; these are heated and fused with steam; and the molded article is cooled, during which cooling process the pressure of the foamed resin against the molds 2, 3 as it is cooled is successively measured by means of a bearing pressure sensor, and when the pressure of the foamed resin against the molds has reached a pressure predetermined for the particular molded article, cooling of the molded article is terminated, the molded article is released from the mold, and the molded article is then set in a fixture to stabilize the shape of the molded article.

摘要翻译： 本发明的目的是提供一种实用的，新颖的泡沫模制装置，其中模具表面没有空气孔，并且提供用于减少模制品的冷却时间的模内泡沫模制装置和方法。 模腔4填充有包含聚烯烃合成树脂的预发泡珠; 这些被加热并与蒸汽融合; 冷却成型品，在冷却过程中，通过轴承压力传感器连续地测量发泡树脂对模具2,3的冷却压力，当发泡树脂对模具的压力具有 达到对特定模制品预定的压力，终止模制品的冷却，模制品从模具中脱模，然后将模制品放置在固定装置中以稳定模塑制品的形状。

公开(公告)号：US5997962A

公开(公告)日：1999-12-07

申请号：US671598

申请日：1996-06-28

申请人： Masahiro Ogasawara ,  Ryo Nonaka ,  Yoshiyuki Kobayashi

发明人： Masahiro Ogasawara ,  Ryo Nonaka ,  Yoshiyuki Kobayashi

IPC分类号： B05D3/06 ,  H01L21/306 ,  H05H1/00

CPC分类号： B05D3/06 ,  H01L21/306 ,  H05H1/00

摘要： A wafer is subjected to a plasma process, using plasma generated while a process gas is fed into a process room, and a plus DC voltage is applied to an electrostatic chuck in order to attract and hold the wafer on the electrostatic chuck by an electrostatic force. A minus DC voltage is applied to the electrostatic chuck while nitrogen gas is fed into the process room in order to cause DC discharge after the processed wafer is separated from the electrostatic chuck and before a next wafer is attracted and held on the electrostatic chuck. By doing so, plus electric charge in the gas is attracted to the electrostatic chuck, so that the surface of the electrostatic chuck is charged with plus electric charge, thereby preventing its attracting function from being deteriorated.

摘要翻译： 对晶片进行等离子体处理，使用等离子体处理气体进入处理室时产生的等离子体处理，并且向静电卡盘施加正电压以便通过静电力吸引并保持晶片在静电卡盘上。 。 在将处理后的晶片与静电卡盘分离并且在下一个晶片被吸引并保持在静电卡盘之前，将氮气供给到处理室中以便产生DC放电，将负DC电压施加到静电卡盘。 通过这样做，加上气体中的电荷被吸引到静电卡盘，使得静电卡盘的表面被加上电荷，从而防止其吸附功能劣化。

公开(公告)号：US4928659A

公开(公告)日：1990-05-29

申请号：US345464

申请日：1989-04-28

申请人： Yukihiro Ohmura ,  Yoshiyuki Kobayashi ,  Keiji Hosoi ,  Kazuharu Shimoda

发明人： Yukihiro Ohmura ,  Yoshiyuki Kobayashi ,  Keiji Hosoi ,  Kazuharu Shimoda

IPC分类号： F02M29/00 ,  F02M23/10 ,  F02M29/14 ,  F02M35/104 ,  F02M69/32

CPC分类号： F02M23/10 ,  F02M29/14 ,  Y02T10/146

摘要： An apparatus for supplying an air-fuel mixture through a collecting passage of an intake manifold to a cylinder of an internal combustion engine. The flow of the air-fuel mixture from the intake passageway of a throttle body is discharged transversely into the collecting passageway so that the mixture strikes a region on a side surface of the collecting passageway. Also provided is an arrangement for supplying an auxiliary air stream into the collecting passageway from a location across the striking region from the engine cylinder, which arrangement directs the auxiliary air toward the center of the striking region.

摘要翻译： 一种用于通过进气歧管的收集通道将空气 - 燃料混合物供应到内燃机的气缸的装置。 来自节气门体的进气通道的空气 - 燃料混合物的流动横向地排放到收集通道中，使得混合物撞击收集通道的侧表面上的区域。 还提供了一种用于将辅助空气流从穿过引擎区域的位置从发动机气缸供应到集合通道中的装置，该布置将辅助空气朝向打击区域的中心引导。

公开(公告)号：US09600638B2

公开(公告)日：2017-03-21

申请号：US14117948

申请日：2012-04-13

申请人： Yoshiyuki Kobayashi ,  Motoki Kato ,  Hiroshi Kuno ,  Takamichi Hayashi

发明人： Yoshiyuki Kobayashi ,  Motoki Kato ,  Hiroshi Kuno ,  Takamichi Hayashi

IPC分类号： G06F7/04 ,  G06F21/10 ,  G11B20/00 ,  H04N5/76 ,  H04L29/06

CPC分类号： G06F21/10 ,  G11B20/0021 ,  G11B20/00253 ,  G11B20/00731 ,  H04L63/0823 ,  H04L2463/101 ,  H04N5/76

摘要： The present invention enables execution of predetermined content usage control processing without depending on a framework of a content playback program (application). Upon content playback processing, a flag which sets information of determination as to whether or not it is necessary to refer to a management information file such as a token or a usage control information file associated with content is recorded in a content file including encrypted content to be stored in a recording medium. Upon the content playback processing, a playback apparatus acquires the content file including the encrypted content stored in the recording medium, refers to a flag recorded in the content file and determines whether or not it is necessary to refer to the management information file based on a setting of the flag. When the setting of the flag indicates that it is necessary to refer to the management information file, it is possible to select a correct management information file based on a content file identifier as a search key.