利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

61 条记录 (耗时 0.016 秒)

    Bonding device
    53.
    发明授权
    Bonding device 有权
    粘接装置

    公开(公告)号：US09437571B2

    公开(公告)日：2016-09-06

    申请号：US14547912

    申请日：2014-11-19

    申请人： SHIBUYA KOGYO CO., LTD.

    发明人： Hiroyuki Yasuyoshi ,  Eiji Tanaka

    IPC分类号： H01L23/00 ,  B29C65/16 ,  B23K3/02 ,  B23K26/06

    CPC分类号： H01L24/75 ,  B23K3/02 ,  B23K26/06 ,  B23K2101/36 ,  B29C65/1664 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/75263 ,  H01L2224/78745 ,  H01L2224/81224 ,  H01L2924/00014 ,  H01L2924/4035 ,  H01L2224/13099

    摘要： A bonding device includes: a plurality of laser oscillators that oscillate laser beams; a plurality of guide beam parts that guide the laser beams oscillated from the laser oscillators; a bonding tool that is irradiated and heated by the laser beams guided from the guide beam parts so that an electronic part held on the bonding tool is heated by the laser beams and is bonded to a base plate. The bonding tool is segmented into a plurality of heat regions, each of the heat regions is irradiated by the laser beams that are guided through the guide beam parts so that some of the heat regions are heated at a temperature different from other heat regions, and an insulation part is disposed at a middle section between two of the heat regions, the insulation part suppressing a heat transfer between the heat regions.

    摘要翻译： 接合装置包括：振荡激光束的多个激光振荡器; 引导从激光振荡器振荡的激光束的多个引导光束部分; 由从引导梁部分引导的激光束照射和加热的接合工具，使得保持在接合工具上的电子部件被激光束加热并结合到基板。 接合工具被分割成多个热区域，每个热区域被引导通过引导梁部分的激光束照射，使得一些热区域在与其它热区域不同的温度下被加热，以及 绝缘部件设置在两个热区域之间的中间部分处，绝缘部件抑制热区域之间的热传递。

    BONDING SYSTEM
    56.
    发明申请
    BONDING SYSTEM 有权
    粘接系统

    公开(公告)号：US20140259648A1

    公开(公告)日：2014-09-18

    申请号：US14161958

    申请日：2014-01-23

    申请人： Eiji TANAKA

    发明人： Eiji TANAKA

    IPC分类号： H05K3/30

    CPC分类号： H05K3/303 ,  B23K26/06 ,  B23K26/0853 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/75263 ,  H01L2224/81224 ,  H01L2924/00014 ,  H01L2924/12042 ,  Y10T29/53178 ,  H01L2224/13099 ,  H01L2924/00

    摘要： A bonding system 1 includes a plurality of laser resonators 7 and a plurality of optical fibers f1 to f36 each having a laser beam inlet connected to one of the plurality of laser resonators. The optical fibers are bundled, and laser beam outlets of the optical fibers are disposed so as to optically face a heating region S of an electronic component 3, and the heating region is irradiated with spots of laser beams emitted from the laser beam outlets. The heating region S is divided into at least corner sub-regions S1 at the corners of the electronic component and an inner sub-region S2 inside the electronic component, and the laser power of the laser resonators whose laser beam outlets face the corner sub-regions is set higher than the laser power of the laser resonators whose laser beam outlets face the inner sub-region.For example, in the case where the electronic component has a rectangular shape, the four corner sub-regions S1, which tend to dissipate more heat, can be heated with higher laser power, so that the electronic component can be uniformly heated.

    摘要翻译： 接合系统1包括多个激光谐振器7和多个光纤f1至f36，每个光纤具有连接到多个激光谐振器之一的激光束入口。 光纤被捆扎，并且光纤的激光束出口​​设置成光学地面对电子部件3的加热区域S，并且从激光束出射点发射的激光束照射加热区域。 加热区域S至少分成电子部件的角部的角点子区域S1和电子部件内的内侧子区域S2，激光束出口​​面对角部分的激光谐振器的激光功率， 区域被设定为高于其激光束出口​​面对内部子区域的激光谐振器的激光功率。 例如，在电子部件为矩形的情况下，能够以更高的激光功率加热倾向于散发更多热量的四个角部子区域S1，能够均匀地加热电子部件。

    Method and device for electrically contacting terminal faces of two substrates by laser soldering using a gaseous flux medium
    58.
    发明申请
    Method and device for electrically contacting terminal faces of two substrates by laser soldering using a gaseous flux medium 有权
    使用气体通量介质通过激光焊接电接触两个基板的端面的方法和装置

    公开(公告)号：US20140027418A1

    公开(公告)日：2014-01-30

    申请号：US13982837

    申请日：2012-01-30

    申请人： Ghassem Azdasht

    发明人： Ghassem Azdasht

    IPC分类号： B23K1/005 ,  B23K26/02 ,  B23K35/362

    CPC分类号： B23K1/0056 ,  B23K26/02 ,  B23K35/362 ,  H01L24/16 ,  H01L24/75 ,  H01L24/81 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/16145 ,  H01L2224/16221 ,  H01L2224/7501 ,  H01L2224/75101 ,  H01L2224/75263 ,  H01L2224/81065 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81224 ,  H01L2224/81815 ,  H01L2224/81907 ,  H01L2224/8191 ,  H01L2224/81986 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/00

    摘要： The present invention relates to a method for electrically contacting terminal faces of two substrates (6, 7), in particular of a chip (6) and of a carrier substrate (7). Furthermore, the invention relates to a device for performing a second phase of the method according to the invention. The method according to the invention takes place in two successive phases, wherein, in a first phase, the chip (6) is positioned with its terminal faces against terminal faces of the substrate (7) and laser energy (5) is applied to the chip (6) at the rear and, in a subsequent second phase, in a housing (3), a flux medium is applied and at the same time a reflow is performed by means of laser energy (5) being applied to the chip (6) at the rear, and a process of rinsing the housing interior is subsequently performed. The device according to the invention for performing a second phase of the method comprises a carrier table (1) and a housing (3), which together with a top side of the carrier table (1) forms a housing interior, in which the component arrangement is positioned, and also a laser light source (5), which is oriented in such a way that the laser radiation impinges on the first substrate (6) on the rear side.

    摘要翻译： 本发明涉及一种用于电接触两个基片（6,7）特别是芯片（6）和载体衬底（7）的端面的方法。 此外，本发明涉及一种用于执行根据本发明的方法的第二阶段的装置。 根据本发明的方法在两个连续的阶段中进行，其中在第一阶段中，芯片（6）定位成使其端子面抵靠衬底（7）的端面，激光能量（5）被施加到 在后面的芯片（6），并且在随后的第二阶段中，在壳体（3）中，施加通量介质，并且同时通过施加到芯片上的激光能量（5）来执行回流 6），并且随后执行冲洗外壳内部的过程。 根据本发明的用于执行该方法的第二阶段的装置包括承载台（1）和壳体（3），其与承载台（1）的顶侧一起形成壳体内部，其中部件 并且还具有激光光源（5），其以使得激光辐射照射在后侧上的第一基板（6）的方式定向。