公开(公告)号：US20180219143A1

公开(公告)日：2018-08-02

申请号：US15933135

申请日：2018-03-22

Applicant: Aledia

Inventor： Tiphaine Dupont ,  Yohan Desieres

IPC: H01L33/56 ,  H01L33/00 ,  H01L33/46 ,  H01L33/42 ,  H01L33/14 ,  H01L33/06 ,  H01L33/20 ,  H01L33/08 ,  H01L33/32

CPC classification number: H01L33/56 ,  H01L25/0753 ,  H01L27/153 ,  H01L27/156 ,  H01L33/0008 ,  H01L33/0075 ,  H01L33/06 ,  H01L33/08 ,  H01L33/145 ,  H01L33/20 ,  H01L33/24 ,  H01L33/32 ,  H01L33/42 ,  H01L33/44 ,  H01L33/46 ,  H01L33/52 ,  H01L33/54 ,  H01L33/58

Abstract: An optoelectronic device including a semiconductor substrate having a face, light-emitting diodes arranged on the face and including wired conical or frustoconical semiconductor elements, and an at least partially transparent dielectric layer covering the light-emitting diodes, the refractive index of the dielectric layer being between 1.6 et 1.8.

公开(公告)号：US20180206298A1

公开(公告)日：2018-07-19

申请号：US15116214

申请日：2016-07-15

Applicant: SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.

Inventor： Lixuan CHEN

IPC: H05B33/02 ,  H01L51/52 ,  H01L27/32 ,  H01L33/52

CPC classification number: H05B33/02 ,  G09G3/32 ,  H01L25/0753 ,  H01L27/32 ,  H01L33/52 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L51/5275 ,  H01L2933/0091

Abstract: The invention provides a micro LED display panel, with sub-pixel area (2) disposed with a micro LED (3) of a size smaller than the size of the sub-pixel area (2), and using a reflective lens layer (5) disposed below the micro LED (3) to reflect the light emitted by micro LED (3) to the area surrounding the micro LED (3) inside the sub-pixel area (2), and thereby expanding the illuminating area inside the sub-pixel area (2) to enhance the display quality and reduce cost.

公开(公告)号：US20180197912A1

公开(公告)日：2018-07-12

申请号：US15738093

申请日：2016-06-16

Applicant: Lumileds Holding B.V.

Inventor： Norbertus Antonius Maria Sweegers ,  Marc De Samber

IPC: H01L27/15 ,  H01L25/075 ,  H01L33/60 ,  H01L33/52 ,  H01L33/00

CPC classification number: H01L27/153 ,  F21K9/60 ,  F21Y2115/10 ,  G02B6/0073 ,  H01L25/0753 ,  H01L33/005 ,  H01L33/52 ,  H01L33/58 ,  H01L33/60 ,  H01L2933/0033

Abstract: The invention provides an LED module having a concentrated light output window. Light output from a first output window of an LED assembly (e.g. from a plurality of LEDs) is passed to an input window of a light directing element and redirected to be emitted from a second, smaller output window of a light directing element. This difference in size thereby concentrates the light output by the light directing element. The second output window (of the light directing element) is substantially perpendicular to the first output window, allowing for the size of the LED assembly in a particular dimension to not be necessarily constrained by the size of the second output window.

公开(公告)号：US20180182939A1

公开(公告)日：2018-06-28

申请号：US15389308

申请日：2016-12-22

Applicant: RayVio Corporation

Inventor： Saijin Liu ,  Douglas A. Collins ,  Yitao Liao

IPC: H01L33/58

CPC classification number: H01L33/58 ,  H01L33/0095 ,  H01L33/52 ,  H01L2933/005 ,  H01L2933/0058

Abstract: Embodiments of the invention include a light emitting diode (UVLED), the UVLED including a semiconductor structure with an active layer disposed between an n-type region and a p-type region. The active layer emits UV radiation. The UVLED is attached to a mount. A lens is disposed over the UVLED. A surface of the lens closest to the UVLED is the same width as the mount.

公开(公告)号：US20180182746A1

公开(公告)日：2018-06-28

申请号：US15850862

申请日：2017-12-21

Applicant: Apple Inc

Inventor： Andreas Bibl ,  Charles R. Griggs

IPC: H01L25/16 ,  H01L33/48 ,  H01L25/075 ,  H01L27/12 ,  H01L33/00 ,  H01L33/62 ,  H01L33/60 ,  H01L33/56 ,  H01L33/54 ,  H01L33/52 ,  H01L23/00 ,  H01L33/44 ,  H01L33/30 ,  H01L33/20 ,  H01L33/08 ,  H01L33/06

CPC classification number: H01L25/167 ,  H01L24/95 ,  H01L25/0753 ,  H01L25/165 ,  H01L27/0203 ,  H01L27/124 ,  H01L27/1244 ,  H01L33/0008 ,  H01L33/06 ,  H01L33/08 ,  H01L33/20 ,  H01L33/30 ,  H01L33/44 ,  H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00

Abstract: Light emitting devices and methods of integrating micro LED devices into light emitting device are described. In an embodiment a light emitting device includes a reflective bank structure within a bank layer, and a conductive line atop the bank layer and elevated above the reflective bank structure. A micro LED device is within the reflective bank structure and a passivation layer is over the bank layer and laterally around the micro LED device within the reflective bank structure. A portion of the micro LED device and a conductive line atop the bank layer protrude above a top surface of the passivation layer.

公开(公告)号：US20180158996A1

公开(公告)日：2018-06-07

申请号：US15578518

申请日：2016-12-20

Applicant: Shenzhen Jufei Optoelectronics Co., Ltd.

Inventor： Zhikuan Zhang ,  Qibin Xing ,  Danpeng Gao ,  Ni Zhang

IPC: H01L33/50 ,  C09K11/08

CPC classification number: H01L33/504 ,  B82Y20/00 ,  C09K11/08 ,  H01L33/50 ,  H01L33/52 ,  H01L2933/0041 ,  H01L2933/0083 ,  Y02B20/181 ,  Y10S977/774 ,  Y10S977/95

Abstract: A packaging method of high color gamut white light quantum dot (QD) light emitting diodes (LEDs). The method includes: a. add an organic solvent to red light QD phosphor powder and blue light QD phosphor powder, respectively; b. perform ultrasonic processing for the solutions; c. prepare a mixed QD solution; d. add mixed packaging glue to the mixed QD solution; e. remove the organic solvent; f. add green light rare earth phosphor powder; g. drip the mixed phosphor glue into an LED stent fixed with ultraviolet chips, and bake and solidify the LED stent to obtain LED beads. The method produces high gamut white light LEDs and greatly improves the color gamut value of LED backlight beads, which reaches above NTSC 92%. With an organic solvent as a connecting bridge, QDs and the packaging glue are mixed uniformly, QD phosphor powder failure resulted from agglomeration is avoided, and quality of high color gamut white light LED beads is significantly improved.

公开(公告)号：US20180151781A1

公开(公告)日：2018-05-31

申请号：US15881802

申请日：2018-01-29

Applicant: Genesis Photonics Inc.

Inventor： Hao-Chung Lee ,  Yu-Feng Lin

IPC: H01L33/48 ,  H01L33/50 ,  H01L33/38 ,  H01L33/62 ,  H01L33/52 ,  H01L33/56

CPC classification number: H01L33/486 ,  H01L21/568 ,  H01L33/38 ,  H01L33/50 ,  H01L33/502 ,  H01L33/52 ,  H01L33/56 ,  H01L33/62 ,  H01L2224/04105 ,  H01L2224/18 ,  H01L2224/19 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/9222 ,  H01L2924/18162 ,  H01L2933/0016 ,  H01L2933/0041 ,  H01L2933/005

Abstract: A light emitting device package structure and a manufacturing method thereof are provided. The light emitting device package structure includes a light emitting device and a protecting element. The light emitting device has an upper surface and a lower surface opposite to each other, a side surface connecting the upper surface and the lower surface and a first electrode pad and a second electrode pad located on the lower surface and separated from each other. The protecting element encapsulates the side surface of the light emitting device and exposes at least portion of the upper surface, at least portion of a first bottom surface of the first electrode pad and at least portion of a second bottom surface of the second electrode pad.

公开(公告)号：US20180130931A1

公开(公告)日：2018-05-10

申请号：US15865299

申请日：2018-01-09

Applicant: HITACHI CHEMICAL COMPANY, LTD.

Inventor： Naoyuki Urasaki ,  Kanako Yuasa

IPC: H01L33/60

CPC classification number: H01L33/60 ,  H01L24/45 ,  H01L24/73 ,  H01L33/38 ,  H01L33/486 ,  H01L33/50 ,  H01L33/52 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An optical semiconductor element mounting package that has good adhesion between the resin molding and the lead electrodes and has excellent reliability is provided, as well as an optical semiconductor device using the package is also provided. The optical semiconductor element mounting package having a recessed part that serves as an optical semiconductor element mounting region, wherein the package is formed by integrating: a resin molding composed of a thermosetting light-reflecting resin composition, which forms at least the side faces of the recessed part; and at least a pair of positive and negative lead electrodes disposed opposite each other so as to form part of the bottom face of the recessed part, and there is no gap at a joint face between the resin molding and the lead electrodes.

公开(公告)号：US09960325B2

公开(公告)日：2018-05-01

申请号：US14576105

申请日：2014-12-18

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Takahiro Fukunaga ,  Yasuko Imanishi

IPC: H01L33/52 ,  C07D249/12 ,  C07D251/20 ,  C07D251/38 ,  C07D487/04 ,  C08G61/10 ,  C23C28/00 ,  H01L23/29 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L33/52 ,  C07D249/12 ,  C07D251/20 ,  C07D251/38 ,  C07D487/04 ,  C08G61/10 ,  C08G2261/1646 ,  C08G2261/312 ,  C08G2261/3221 ,  C23C28/00 ,  H01L23/296 ,  H01L23/3142 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01037 ,  H01L2924/07802 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  Y10T428/31678 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor device and manufacturing method therefor, provided with the aims of constraining resin burr formation while having good electric connectivity and joining strength, and LED device, provided with the aim of improving adhesion between silicon resin and leads while having good luminescent characteristics. For these purposes, an organic film is formed through self-assembly by functional organic molecules at surface border regions of outer leads of a QFP. The functional organic molecules consist of a first functional group bonding with metals, a principal chain, and a second functional group inducing hardening in thermosetting resins. The principal chain consists of a glycol chain, or else of a glycol chain and one or more among methylene, fluoromethylene, or siloxane chains. The principal chain also preferably includes one or more among a hydroxyl radical, ketone, thioketone, primary amine, secondary amine, and aromatic compounds.

公开(公告)号：US09953956B2

公开(公告)日：2018-04-24

申请号：US15073707

申请日：2016-03-18

Applicant: Genesis Photonics Inc.

Inventor： Hao-Chung Lee ,  Yu-Feng Lin ,  Xun-Xain Zhan

IPC: H01L33/50 ,  H01L25/065 ,  H01L33/60 ,  H01L23/00 ,  H01L33/10 ,  H01L23/60 ,  H01L29/866 ,  H01L33/48 ,  H01L27/15 ,  H01L33/64 ,  H01L25/075 ,  H01L33/56

CPC classification number: H01L25/0655 ,  H01L23/562 ,  H01L23/60 ,  H01L25/0657 ,  H01L25/0753 ,  H01L25/0756 ,  H01L27/0248 ,  H01L27/15 ,  H01L29/866 ,  H01L33/08 ,  H01L33/10 ,  H01L33/48 ,  H01L33/486 ,  H01L33/50 ,  H01L33/502 ,  H01L33/508 ,  H01L33/52 ,  H01L33/56 ,  H01L33/60 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2924/18161 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/0058 ,  H01L2924/00014

Abstract: A package substrate is provided. The package substrate includes a base layer having a first surface and a second surface opposite to the first surface, a plurality of through holes penetrating the base layer, a first metal layer disposed on the first surface, and a second metal layer disposed on the second surface. The first metal layer includes a closed-loop trench. A part of the second metal layer is electrically connected to the first metal layer via the through holes. The through holes are positioned at an inner part the closed-loop trench.