公开(公告)号：US20100187803A1

公开(公告)日：2010-07-29

申请号：US12668637

申请日：2008-07-09

Applicant: Jeong Woo Park

Inventor： Jeong Woo Park

IPC: B42D3/00

CPC classification number: B42D5/043 ,  B42D1/06 ,  B42D3/12 ,  B42D3/126 ,  B42P2241/02 ,  B42P2241/12

Abstract: A cover, which is capable of supporting multi-purpose contents and of improving portability and utility, is disclosed. The cover capable of supporting multi-purpose contents includes a front cover and a back cover which are superposed on front and back surfaces of a page unit and are bound by a binder. The front cover includes a main front cover part and a subsidiary front cover part which are separated from each other by a separation line, and an angle holding unit is provided between the main front cover part and the subsidiary front cover part to maintain an angle between the main front cover part and the subsidiary front cover part. Further, a position holding unit may be provided between the front cover and the back cover to hold the front and back covers in a folded or erected position.

Abstract translation: 公开了一种能够支持多用途内容并提高便携性和效用的封面。 能够支撑多用途内容物的盖子包括前盖和后盖，该前盖和后盖重叠在页单元的前表面和后表面上并且由粘合剂约束。 前盖包括通过分隔线彼此分离的主前盖部分和辅助前盖部分，并且在主前盖部分和辅助前盖部分之间设置有角度保持单元， 主前盖部分和辅助前盖部分。 此外，位置保持单元可以设置在前盖和后盖之间，以将前盖和后盖保持在折叠或竖立的位置。

公开(公告)号：US20100013094A1

公开(公告)日：2010-01-21

申请号：US12503274

申请日：2009-07-15

Applicant: Chajea JO ,  Uihyoung LEE ,  Jae-hyun PHEE ,  Jeong-Woo PARK ,  Ha-Young YIM

Inventor： Chajea JO ,  Uihyoung LEE ,  Jae-hyun PHEE ,  Jeong-Woo PARK ,  Ha-Young YIM

IPC: H01L23/498

CPC classification number: H01L21/563 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/17 ,  H01L2224/0401 ,  H01L2224/05558 ,  H01L2224/06051 ,  H01L2224/06102 ,  H01L2224/1146 ,  H01L2224/11472 ,  H01L2224/11505 ,  H01L2224/11902 ,  H01L2224/11912 ,  H01L2224/13027 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/13169 ,  H01L2224/14104 ,  H01L2224/1411 ,  H01L2224/14131 ,  H01L2224/17107 ,  H01L2224/73204 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01105 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor package and a method of manufacturing the semiconductor package. The semiconductor package include a substrate including a plurality of pads and a plurality of bumps evenly disposed on an entire region of the substrate regardless of an arrangement of the plurality of pads. According to the present invention, a simplification of a process can be accomplished, a cost of a process can be reduced, reliability can be improved and an under-filling can become easy.

Abstract translation: 半导体封装以及半导体封装的制造方法。 半导体封装包括基板，其包括多个焊盘和均匀地设置在基板的整个区域上的多个凸块，而与多个焊盘的布置无关。 根据本发明，可以实现工艺的简化，可以降低工艺成本，可以提高可靠性，并且能够容易地进行填充不足。

公开(公告)号：US20090100115A1

公开(公告)日：2009-04-16

申请号：US12015878

申请日：2008-01-17

Applicant: Jeong-woo Park ,  Gwang-ok Go ,  Jun-young Cho

Inventor： Jeong-woo Park ,  Gwang-ok Go ,  Jun-young Cho

IPC: G06F12/02

CPC classification number: G06F17/30218 ,  G06F3/0608 ,  G06F3/0643 ,  G06F3/0679 ,  G06F12/0246 ,  G06F2212/1044 ,  G06F2212/7207

Abstract: Management of files in a memory, such as a flash memory, includes storing in the memory a first node including a first type of metadata of the file, a second node including data of the file and a third node including a second type of metadata of the file including file status and memory location information for the first and second nodes. The third node may include a node including memory location information for the second node and a node including an index table that cross-references a memory location for the memory location information for the second node to a memory location of the first node. Methods and devices may be provided.

Abstract translation: 管理诸如闪速存储器的存储器中的文件包括在存储器中存储包括文件的第一类型的元数据的第一节点，包括文件的数据的第二节点和包括文件的第二类型的第二类型的元数据 该文件包括用于第一和第二节点的文件状态和存储位置信息。 第三节点可以包括包括用于第二节点的存储器位置信息的节点和包括索引表的节点，所述索引表将用于第二节点的存储器位置信息的存储器位置交叉引用到第一节点的存储器位置。 可以提供方法和装置。

公开(公告)号：US20090011220A1

公开(公告)日：2009-01-08

申请号：US12153155

申请日：2008-05-14

Applicant: Jung-Hyun Park ,  Jeong-Woo Park ,  Sang-Duck Kim ,  Jong-Gyu Choi ,  Ji-Eun Kim ,  Myung-Sam Kang

Inventor： Jung-Hyun Park ,  Jeong-Woo Park ,  Sang-Duck Kim ,  Jong-Gyu Choi ,  Ji-Eun Kim ,  Myung-Sam Kang

IPC: H05K1/05 ,  B29C65/42 ,  B32B7/00 ,  B32B7/12

CPC classification number: H05K3/205 ,  H05K3/108 ,  H05K3/4602 ,  H05K2203/1536 ,  Y10T428/249984 ,  Y10T428/31504 ,  Y10T428/31511 ,  Y10T428/3154 ,  Y10T428/31678 ,  Y10T428/31721 ,  Y10T428/31993

Abstract: A carrier and a method for manufacturing a printed circuit board are disclosed. The method for manufacturing a printed circuit board may include: forming a first circuit pattern on each of a pair of release layers, which are attached respectively to either side of a base layer by adhesive layers; detaching the pair of release layers from the base layer; stacking and pressing the pair of release layers onto either side of an insulation substrate such that the first circuit patterns are buried in the insulation substrate; and separating the pair of release layers. By forming a circuit pattern on each of a pair of release layers with a single process, and transferring the circuit pattern into each side of an insulation substrate, the manufacturing process can be shortened and circuit patterns can be formed to a high density.

Abstract translation: 公开了载体和制造印刷电路板的方法。 制造印刷电路板的方法可以包括：在一对剥离层中的每一个上形成第一电路图案，其分别通过粘合剂层附着在基层的任一侧; 将一对释放层从基层分离; 堆叠并将一对释放层压在绝缘基板的任一侧上，使得第一电路图案被埋在绝缘基板中; 并分离一对释放层。 通过利用单一工艺在一对释放层的每一个上形成电路图案，并将电路图案转移到绝缘基板的每一侧，可以缩短制造工艺并且可以以高密度形成电路图案。

公开(公告)号：US20080310909A1

公开(公告)日：2008-12-18

申请号：US12094978

申请日：2005-12-08

Applicant: Jeong-Woo Park

Inventor： Jeong-Woo Park

IPC: B42F13/20

CPC classification number: B42F13/26

Abstract: A ring binder includes at least two first and second pipes which are hollow inside; a first ring positioned at an end of the first pipe to be opened and closed; a second ring positioned between the first pipe and the second pipe to be opened and closed; a third ring positioned at an end of the second pipe to be opened and closed; and a support bar passing through the first and second pipes and the first through third rings and holding the first and third rings so that the first and third rings are not separated from the first and second pipes, wherein ends of first, second, and third stationary half rings are combined with and separated from ends of first, second, and third rotating half rings.

Abstract translation: 环形活页夹包括至少两个在内部是中空的第一和第二管道; 第一环，其位于所述第一管的端部以被打开和关闭; 位于第一管和第二管之间的第二环，其被打开和关闭; 位于所述第二管的端部以打开和关闭的第三环; 以及支撑杆，其穿过第一和第二管和第一至第三环并保持第一和第三环，使得第一和第三环不与第一和第二管分离，其中第一，第二和第三环的端部 固定半环与第一，第二和第三旋转半环的端部组合并与其分离。

公开(公告)号：US20080101045A1

公开(公告)日：2008-05-01

申请号：US11976070

申请日：2007-10-19

Applicant: Hoe-Ku Jung ,  Je-Gwang Yoo ,  Myung-Sam Kang ,  Ji-Eun Kim ,  Jeong-Woo Park ,  Jung-Hyun Park

Inventor： Hoe-Ku Jung ,  Je-Gwang Yoo ,  Myung-Sam Kang ,  Ji-Eun Kim ,  Jeong-Woo Park ,  Jung-Hyun Park

IPC: H05K1/18 ,  H05K3/20

CPC classification number: H05K3/205 ,  H01L21/4846 ,  H01L23/49816 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2924/15311 ,  H05K3/4007 ,  H05K2201/09745 ,  H05K2201/10674 ,  H05K2203/0338 ,  H05K2203/0435 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A method of manufacturing a circuit board, which includes a bump pad on which a solder bump may be placed, may include forming a solder pad on a surface of a first carrier; forming a metal film, which covers the solder pad and which extends to a bump pad forming region; forming a circuit layer and a circuit pattern, which are electrically connected with the metal film, on a surface of the first carrier; pressing the first carrier and an insulator such that a surface of the first carrier and the insulator faces each other; and removing the first carrier. Utilizing this method, the amount of solder for the contacting of a flip chip can be adjusted, and solder can be filled inside the board, so that after installing a chip, the overall thickness of the package can be reduced.

Abstract translation: 一种制造电路板的方法，包括可以放置焊锡凸块的凸块焊盘，可以包括在第一载体的表面上形成焊盘; 形成覆盖焊盘并延伸到凸块焊盘形成区域的金属膜; 在所述第一载体的表面上形成与所述金属膜电连接的电路层和电路图案; 按压所述第一载体和绝缘体，使得所述第一载体和所述绝缘体的表面彼此面对; 并移除第一载体。 利用这种方法，可以调节用于接合倒装芯片的焊料的量，并且可以在板内填充焊料，使得在安装芯片之后，可以减小封装的整体厚度。

公开(公告)号：US09459687B2

公开(公告)日：2016-10-04

申请号：US14300495

申请日：2014-06-10

Applicant: Jeong-Woo Park ,  Sangyoon Oh

Inventor： Jeong-Woo Park ,  Sangyoon Oh

IPC: G06F1/32 ,  G06F3/06 ,  G06F13/00 ,  G11C16/00

CPC classification number: G06F1/3268 ,  G06F3/0625 ,  G06F3/0634 ,  G06F3/0659 ,  G06F3/0688 ,  G06F13/00 ,  G11C16/00 ,  Y02D10/154 ,  Y02D50/20

Abstract: A storage system includes a host and a storage device. The storage device includes a device controller and a device interface. The device controller is configured to generate interface idle time information in response to a command received from a host, the interface idle time information being determined based on an estimated time to execute at least one operation at the memory storage device. The device interface is configured to output the interface idle time information to the host.

Abstract translation: 存储系统包括主机和存储设备。 存储设备包括设备控制器和设备接口。 设备控制器被配置为响应于从主机接收到的命令来生成接口空闲时间信息，基于估计时间来确定接口空闲时间信息以在存储器存储设备上执行至少一个操作。 设备接口配置为向主机输出接口空闲时间信息。

公开(公告)号：US20120061132A1

公开(公告)日：2012-03-15

申请号：US13373388

申请日：2011-11-14

Applicant: Myung Sam Kang ,  Jeong Woo Park ,  Ok Tae Kim ,  Kil Yong Yun

Inventor： Myung Sam Kang ,  Jeong Woo Park ,  Ok Tae Kim ,  Kil Yong Yun

IPC: H05K1/09 ,  H05K1/11 ,  H05K1/02

CPC classification number: H05K1/111 ,  H05K1/09 ,  H05K1/115 ,  H05K3/205 ,  H05K3/28 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2203/0323 ,  H05K2203/0376 ,  Y02P70/611 ,  Y10T29/49124 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49204 ,  Y10T29/49222

Abstract: A printed circuit board having a metal bump, including: an upper circuit layer including a circuit pattern embedded in an upper part of an insulating layer, the circuit pattern being made of electroconductive metal; wherein the metal bump is integrally formed with the circuit pattern and protruding from the circuit pattern and above the insulating layer.

Abstract translation: 一种具有金属凸块的印刷电路板，包括：上电路层，包括嵌入在绝缘层的上部的电路图案，所述电路图案由导电金属制成; 其中所述金属凸块与所述电路图形一体地形成并且从所述电路图案突出并且在所述绝缘层上方突出。

公开(公告)号：US07994549B2

公开(公告)日：2011-08-09

申请号：US12375343

申请日：2007-04-24

Applicant: Hyun-Soo Kim ,  Jeong-Woo Park ,  Bongki Mheen ,  Gyungock Kim

Inventor： Hyun-Soo Kim ,  Jeong-Woo Park ,  Bongki Mheen ,  Gyungock Kim

IPC: H01L29/76

CPC classification number: G02F1/025 ,  G02F1/225 ,  G02F1/3132 ,  H01L31/105

Abstract: Provided is an optical device with improved phase shift and propagation loss of light without decreasing the dynamic characteristics of the optical device. The optical device includes a first semiconductor layer which is doped with a first type of conductive impurities and has a uniform thickness; a gate insulating layer which has a shape and is formed on a portion of the first semiconductor layer and has a thin center portion; and a second semiconductor layer which covers an upper surface of the gate insulating layer and is doped with a second type of conductive impurities opposite to the first type of conductive type impurities.

Abstract translation: 提供了一种具有改善的相移和光传播损耗的光学器件，而不会降低光学器件的动态特性。 光学器件包括掺杂有第一类导电杂质并具有均匀厚度的第一半导体层; 栅极绝缘层，其具有形状并且形成在所述第一半导体层的一部分上并且具有薄的中心部分; 以及第二半导体层，其覆盖所述栅极绝缘层的上表面并且掺杂有与所述第一类型的导电类型杂质相反的第二类型的导电杂质。

公开(公告)号：US20110135243A1

公开(公告)日：2011-06-09

申请号：US12816550

申请日：2010-06-16

Applicant: Jeong Woo Park ,  Jongbum You ,  Gyungock Kim

Inventor： Jeong Woo Park ,  Jongbum You ,  Gyungock Kim

IPC: G02F1/035 ,  G02B6/26

CPC classification number: G02F1/2257 ,  G02F1/015 ,  G02F2001/212

Abstract: Provided is an electro-optic device. The electro-optic device includes an input Y-branch comprising a first input branch and a second input branch, an output Y-branch comprising a first output branch and a second output branch, a first optical modulator and a second optical modulator connected in series between the first input branch and the first output branch, and a third optical modulator connecting the second input branch to the second output branch. The first optical modulator comprises a PIN diode, and each of the second optical modulator and the third optical modulator comprises a PN diode.

Abstract translation: 提供了一种电光装置。 电光装置包括：输入Y分支，包括第一输入分支和第二输入分支，包括第一输出分支和第二输出分支的输出Y分支，串联连接的第一光调制器和第二光调制器 在第一输入分支和第一输出分支之间，以及将第二输入分支连接到第二输出分支的第三光调制器。 第一光调制器包括PIN二极管，并且第二光调制器和第三光调制器中的每一个包括PN二极管。