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公开(公告)号：US09669512B2
公开(公告)日：2017-06-06
申请号：US14454785
申请日：2014-08-08
Applicant: Applied Materials, Inc.
Inventor： Rajeev Bajaj , Craig E. Bohn , Fred Conrad Redeker
IPC: B24B37/24 , B24B53/017
CPC classification number: B24B37/245
Abstract: Embodiments of the disclosure generally provides a method and apparatus for a polishing article or polishing pad having a microstructure that facilitates uniform conditioning when exposed to laser energy. In one embodiment, a polishing pad comprising a combination of a first material and a second material is provided, and the first material is more reactive to laser energy than the second material. In another embodiment, a method of texturing a composite polishing pad is provided. The method includes directing a laser energy source onto a surface of the polishing pad to affect a greater ablation rate within a first material having a greater laser absorption rate and a lesser ablation rate within a second material having a lesser laser absorption rate to provide a micro-textured surface consistent with microstructure of the composite polishing pad.
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公开(公告)号：US09457520B2
公开(公告)日：2016-10-04
申请号：US14737356
申请日：2015-06-11
Applicant: Applied Materials, Inc.
Inventor： Rajeev Bajaj , Barry Lee Chin , Terrance Y. Lee
CPC classification number: B29C64/209 , B24B37/26 , B24D18/00 , B24D18/009 , B29C35/0805 , B29C64/112 , B29C64/20 , B29C2035/0827 , B29K2075/00 , B29K2105/0002 , B29K2105/16 , B29K2509/02 , B29L2031/736 , B33Y10/00 , B33Y30/00 , B33Y50/02 , B33Y80/00
Abstract: A method of fabricating a polishing layer of a polishing pad includes successively depositing a plurality of layers with a 3D printer, each layer of the plurality of polishing layers deposited by ejecting a pad material precursor from a nozzle and solidifying the pad material precursor to form a solidified pad material.
Abstract translation: 制造抛光垫的抛光层的方法包括用3D打印机连续沉积多个层，通过从喷嘴喷射垫材料前体而沉积多个抛光层的每层，并固化焊盘材料前体以形成 固化垫材料。
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公开(公告)号：US20160040040A1
公开(公告)日：2016-02-11
申请号：US14456356
申请日：2014-08-11
Applicant: Applied Materials, Inc.
Inventor： Arup Purkayastha , Prerna Goradia , Ranga Rao Arnepalli , Robert Jan Visser , Rajeev Bajaj
IPC: C09G1/02 , H01L21/321 , B24B37/04
CPC classification number: C09G1/02 , B24B37/044 , H01L21/3212
Abstract: A slurry for selective chemical mechanical polishing of a copper layer is disclosed. The slurry includes either porous zeolite abrasive particles of substantially homogeneous composition having an average pore diameter of approximately 0.1-6 nanometers or hexagonal boron nitride abrasive particles. The slurry also includes an organic complexing compound that is 0.1-25 wt. % of the slurry, an oxidizer that is 0.1-10 wt. % of the slurry, and a solvent. A chemical mechanical polishing method for using the slurry is also disclosed.
Abstract translation: 公开了一种用于铜层的选择性化学机械抛光的浆料。 浆料包括具有约0.1-6纳米的平均孔径或六方氮化硼磨料颗粒的基本上均匀组成的多孔沸石磨料颗粒。 该浆料还包括有机配位化合物，其为0.1-25wt。 ％的浆料，氧化剂为0.1-10重量％ ％的浆料和溶剂。 还公开了一种使用该浆料的化学机械抛光方法。
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公开(公告)号：US20150336236A1
公开(公告)日：2015-11-26
申请号：US14285545
申请日：2014-05-22
Applicant: Applied Materials, Inc.
Inventor： Hung Chen , Rajeev Bajaj , Brian J. Brown , Robert T. Lum , Fred C. Redeker
IPC: B24B53/017 , H01L21/306 , B26F3/00 , H01L21/268 , B24B37/26 , B23K26/36
CPC classification number: B24B53/017 , B23K26/36 , B24B37/26 , B26D3/06 , B26F3/004
Abstract: Among other things, a method comprises polishing a surface of a substrate by applying a pressure between the surface of a substrate and a surface of a polishing pad. The surface of the polishing pad defines one or more grooves separated by one or more partition regions. The one or more grooves have an initial depth before the polishing starts and extend from an initial outer surface of the one or more partition regions to an initial bottom of the one or more grooves. The method also comprises removing material below an initial bottom of the one or more grooves such that a distance between an outer surface of the one or more partition regions and a bottom of the one or more grooves remain substantially the same as the initial depth.
Abstract translation: 除其他之外，一种方法包括通过在基板的表面和抛光垫的表面之间施加压力来抛光基板的表面。 抛光垫的表面限定了一个或多个由一个或多个分隔区隔开的槽。 一个或多个凹槽在抛光开始之前具有初始深度并且从一个或多个分隔区域的初始外表面延伸到一个或多个凹槽的初始底部。 该方法还包括在一个或多个凹槽的初始底部下方移除材料，使得一个或多个分隔区域的外表面与一个或多个凹槽的底部之间的距离保持与初始深度基本相同。
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公开(公告)号：US20250121472A1
公开(公告)日：2025-04-17
申请号：US18486094
申请日：2023-10-12
Applicant: Applied Materials, Inc.
Inventor： Liu Jiang , Prayudi Lianto , Santosh Kumar Rath , Nina Bao , Muhammad Adli Danish , Aniruddh Khanna , Pin Gian Gan , Mohammad Faizal Bin Aermie Ang , Mayu Yamamura , Sivapackia Ganapathiappan , Daniel Redfield , El Mehdi Bazizi , Yen-Chu Yang , Pang Yen Ong , Rajeev Bajaj
Abstract: Printable resin precursor compositions and polishing articles including printable resin precursors are provided that are particularly suited for polishing substrates utilized in hybrid bonding applications. Methods and articles may include a plurality of first polishing elements, where at least one of the plurality of first polymer layers forms the polishing surface; and one or more second polishing elements, where at least a region of each of the one or more second polishing elements is disposed between at least one of the plurality of first polishing elements and a supporting surface of the polishing pad. One or more first polishing elements have a Shore D hardness of greater than 60, one or more second polishing elements have a Shore D hardness of from about 20 to less than 60, and the polishing article has a total Shore D hardness of greater than or about 50.
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Patent Agency Ranking
公开(公告)号：US11986922B2
公开(公告)日：2024-05-21
申请号：US16731492
申请日：2019-12-31
Applicant: Applied Materials, Inc.
Inventor： Jason G. Fung , Rajeev Bajaj , Daniel Redfield , Aniruddh Jagdish Khanna , Mario Cornejo , Gregory E. Menk , John Watkins
IPC: B29C64/00 , B24B37/26 , B24B49/00 , B24B49/10 , B24B49/14 , B24B49/16 , B33Y10/00 , B33Y80/00 , H01L21/306 , H01L21/66 , H01L21/67 , B29L31/00
CPC classification number: B24B37/26 , B24B49/003 , B24B49/10 , B24B49/14 , B24B49/16 , B33Y10/00 , B33Y80/00 , H01L21/30625 , H01L21/67075 , H01L21/67253 , H01L21/67294 , H01L22/20 , B29K2995/0003 , B29K2995/0005 , B29L2031/736 , H01L22/12 , H01L22/26
Abstract: Chemical mechanical polishing (CMP) apparatus and methods for manufacturing CMP apparatus are provided herein. CMP apparatus may include polishing pads, polishing head retaining rings, and polishing head membranes, among others, and the CMP apparatus may be manufactured via additive manufacturing processes, such as three dimensional (3D) printing processes. The CMP apparatus may include wireless communication apparatus components integrated therein. Methods of manufacturing CMP apparatus include 3D printing wireless communication apparatus into a polishing pad and printing a polishing pad with a recess configured to receive a preformed wireless communication apparatus.
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公开(公告)号：US11964359B2
公开(公告)日：2024-04-23
申请号：US16661400
申请日：2019-10-23
Applicant: Applied Materials, Inc.
Inventor： Ashwin Chockalingham , Mahendra C. Orilall , Mayu Yamamura , Boyi Fu , Rajeev Bajaj , Daniel Redfield
CPC classification number: B24B37/20 , B24B37/22 , B24B37/24 , B24B37/26 , B24D18/0045 , B33Y80/00 , H01L21/30625
Abstract: Implementations described herein generally relate to polishing articles and methods of manufacturing polishing articles used in polishing processes and cleaning processes. More particularly, implementations disclosed herein relate to composite polishing articles having graded properties. In one implementation, a polishing article is provided. The polishing article comprises one or more exposed first regions formed from a first material and having a first zeta potential and one or more second exposed regions formed from a second material and having a second zeta potential, wherein the first zeta potential is different from the second zeta potential.
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68.发明授权公开(公告)号：US11897079B2
公开(公告)日：2024-02-13
申请号：US16831436
申请日：2020-03-26
Applicant: Applied Materials, Inc.
Inventor： Haosheng Wu , Hari Soundararajan , Jianshe Tang , Shou-Sung Chang , Brian J. Brown , Yen-Chu Yang , You Wang , Rajeev Bajaj
IPC: B24B37/015 , B24B55/03 , B24B37/10 , H01L21/306 , B24B49/14 , B24B37/04
CPC classification number: B24B37/015 , B24B37/105 , B24B55/03 , B24B37/042 , B24B49/14 , H01L21/30625
Abstract: A chemical mechanical polishing system includes a platen to support a polishing pad having a polishing surface, a source of coolant, a dispenser having one or more apertures suspended over the platen to direct coolant from the source of coolant onto the polishing surface of the polishing pad; and a controller coupled to the source of coolant and configured to cause the source of coolant to deliver the coolant through the nozzles onto the polishing surface during a selected step of a polishing operation.
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公开(公告)号：US11851570B2
公开(公告)日：2023-12-26
申请号：US16668961
申请日：2019-10-30
Applicant: Applied Materials, Inc.
Inventor： Uma Sridhar , Sivapackia Ganapathiappan , Ashwin Chockalingam , Yingdong Luo , Daniel Redfield , Rajeev Bajaj , Nag B. Patibandla , Hou T. Ng , Sudhakar Madhusoodhanan
IPC: B29C64/112 , C09D11/38 , B24B37/24 , C09D11/107 , C09D11/101 , B33Y80/00 , B33Y70/00 , B29L31/00 , B29K33/00 , B33Y10/00
CPC classification number: C09D11/38 , B24B37/245 , B33Y70/00 , B33Y80/00 , C09D11/101 , C09D11/107 , B29C64/112 , B29K2033/08 , B29L2031/736 , B33Y10/00
Abstract: Polishing articles and methods of manufacturing polishing articles used in polishing processes and cleaning processes are provided. More particularly, implementations disclosed herein relate to composite polishing articles having tunable properties such as hydrophilicity and zeta potential. 3D printed chemical-mechanical planarization (CMP) pads composed of UV curable acrylic chemistry are generally hydrophobic in nature. Such hydrophobic behavior affects the wetting properties with abrasive-based polishing slurries such as ceria-base slurries. However, in order to increase the planarization and removal rate while decreasing defects, hydrophilic pads are preferred. In addition, it is desirable that the zeta potential (Zp) of the pads be tunable over a wide range of conditions at different pH values. Implementations of the present disclosure include methods for increasing the hydrophilicity and tuning the Zp of the pads with anionic additives and pads produced using these methods.
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公开(公告)号：US11813712B2
公开(公告)日：2023-11-14
申请号：US17036623
申请日：2020-09-29
Applicant: Applied Materials, Inc.
Inventor： Aniruddh Jagdish Khanna , Jason G. Fung , Puneet Narendra Jawali , Rajeev Bajaj , Adam Wade Manzonie , Nandan Baradanahalli Kenchappa , Veera Raghava Reddy Kakireddy , Joonho An , Jaeseok Kim , Mayu Yamamura
CPC classification number: B24B37/20 , B24B37/042
Abstract: Polishing pads having discrete and selectively arranged regions of varying porosity within a continuous phase of polymer material are provided herein. In one embodiment a polishing pad features a plurality of polishing elements each comprising a polishing surface and sidewalls extending downwardly from the polishing surface to define a plurality of channels disposed between the polishing elements, wherein one or more of the polishing elements is formed of a continuous phase of polymer material having one or more first regions comprising a first porosity and a second region comprising a second porosity, wherein the second porosity is less than the first porosity.
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