Abstract:
Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include forming a package structure comprising a discrete antenna disposed on a back side of a device, wherein the discrete antenna comprises an antenna substrate, a through antenna substrate via vertically disposed through the antenna substrate. A through device substrate via that is vertically disposed within the device is coupled with the through antenna substrate via, and a package substrate is coupled with an active side of the device.
Abstract:
Techniques are described related to digital radio control and operation. The various techniques described herein enable high-frequency local oscillator (LO) signal generation using injection locked cock multipliers (ILCMs). The techniques also include the use of LO signals for carrier aggregation applications for phased array front ends. Furthermore, the disclosed techniques include the use of array element-level control using per-chain DC-DC converters. Still further, the disclosed techniques include the use of adaptive spatial filtering and optimal combining of analog-to-digital converters (ADCs) to maximize dynamic range in digital beamforming systems.
Abstract:
Among other things, embodiments of the present disclosure help to overcome environment-specific dependency issues of conventional Wi-Fi-based sensing systems, thus allowing a neural network to make better proximity predictions in an unseen environment. Other embodiments may be described and claimed.
Abstract:
Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.
Abstract:
A wireless communication device for asymmetrical frequency spreading including a processor configured to receive a frequency band message comprising a maximum difference and a minimum difference, wherein the maximum difference is between a maximum frequency of a sub-band and a signal frequency, and wherein the minimum difference is between the minimum frequency of the sub-band and the signal frequency compare the maximum difference and the minimum difference with each other; and generate a frequency shift based on the comparison.
Abstract:
For example, an apparatus may include an input to receive an input signal in a first voltage domain; a multi-mode power amplifier switchable between a plurality of power modes to generate an output signal based on the input signal; and an output to provide the output signal. For example, the multi-mode power amplifier may be configured to provide the output signal in the first voltage domain at a first power mode, and to provide the output signal in a second voltage domain at a second power mode. For example, a maximal voltage of the second voltage domain may be at least two times a maximal voltage of the first voltage domain.
Abstract:
A communication device may include a millimeter wave (mm-wave) antenna array having antenna elements, a mm-wave element (e.g. lens), and one or more transceivers (e.g. first and second transceivers). The mm-wave lens may be configured to adjust the first beam and the second beam as the first and second beams pass through the mm-wave lens. The first transceiver can selectively couple to the antenna elements, the first transceiver being configured to drive a first selected antenna element of the antenna elements to transmit a beam from the selected first antenna element. The second transceiver may selectively couple to the antenna elements, the second transceiver being configured to drive a second selected antenna element of the antenna elements to transmit a second beam from the selected second antenna element.
Abstract:
In various aspects, a radio communication device is described including a housing, a plurality of radiohead circuits attached to the housing, baseband circuitry connected to the plurality of radiohead circuits via a digital interface; and one or more processors configured to select one or more radiohead circuits of the plurality of radiohead circuits for communication with another radio communication device to fulfill one or more predefined selection criteria with respect to a quality of a communication with the other radio communication device using the one or more selected radiohead circuits and to control the baseband circuitry to perform communication with the other radio communication device using the one or more selected radiohead circuits.
Abstract:
Techniques are described to address P-MOS bias temperature instability (BTI) stress issues within capacitive radio frequency digital-to-analog converter (CDAC) using a circuit architecture solution that functions to protect the transistors in various operating conditions. Techniques are disclosed that function to float one or both of the negative and positive power supply rail voltages higher or lower, respectively, for CDAC cells depending upon various operating scenarios. These scenarios include the transmitting state of individual CDAC cells and the transmitting state of the CDAC array in which the CDAC cell is implemented.
Abstract:
Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.