公开(公告)号：US07193531B2

公开(公告)日：2007-03-20

申请号：US10914222

申请日：2004-08-10

申请人： Hayuru Ito ,  Shigeru Yamada ,  Yuji Kijima

发明人： Hayuru Ito ,  Shigeru Yamada ,  Yuji Kijima

IPC分类号： G08G1/123

CPC分类号： G08B25/08 ,  G06Q30/02 ,  G08B13/19621 ,  G08B13/19658 ,  G08B21/0269 ,  G08B21/0283 ,  G08B21/0297 ,  G08B25/016

摘要： Using a mobile terminal while moving, a user has a voice conversation with a security terminal provided by a security service provider. This conversation creates a situation in which it is possible to immediately send an alarm if an emergency occurs, thus repelling assaulters or abductors lurking near the user. The mobile terminal is provided with GPS or the like, and position information of the mobile terminal is sent to the security terminal. The security service provider takes advertisements from advertisers selling goods or services, and prepares conversation scenarios that are the content of the conversations for automatic response based on those advertisements. The security terminal firstly provides the user with a voice conversation partner proxy service based on the conversation scenarios and secondly detects emergencies by detecting emergency messages from the mobile terminal or detecting the interruption of the conversation. After that, the security service provider can restrict the danger to the user to a minimum by undertaking emergency measures such as dispatching someone to the location where the mobile terminal is located.

摘要翻译： 在移动时使用移动终端，用户与由安全服务提供商提供的安全终端进行语音对话。 这种对话创造了一种情况，即在紧急情况发生的情况下立即发出警报，从而排斥潜在的用户附近的救生员或绑架者。 移动终端设置有GPS等，移动终端的位置信息被发送到安全终端。 安全服务提供商从销售商品或服务的广告商那里获得广告，并准备作为基于这些广告的自动响应对话内容的会话场景。 安全终端首先基于会话情况向用户提供语音对话伙伴代理服务，其次通过从移动终端检测紧急消息或检测对话中断来检测紧急情况。 之后，安全服务提供商可以通过采取应急措施来将用户的危险限制在最小限度，例如派人到移动终端所在的位置。

公开(公告)号：US20050167834A1

公开(公告)日：2005-08-04

申请号：US11077152

申请日：2005-03-11

申请人： Shinji Ohuchi ,  Shigeru Yamada ,  Yasushi Shiraishi

发明人： Shinji Ohuchi ,  Shigeru Yamada ,  Yasushi Shiraishi

IPC分类号： H01L25/18 ,  H01L21/60 ,  H01L23/12 ,  H01L23/13 ,  H01L23/31 ,  H01L25/065 ,  H01L25/10 ,  H01L25/11 ,  H01L27/01

CPC分类号： H01L24/81 ,  H01L23/13 ,  H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2221/6834 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05024 ,  H01L2224/05548 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/15156 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15321 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2224/05599

摘要： The invention provides a semiconductor device and a method for manufacturing the same, enabling the semiconductor device to be high-densely packaged without lowering the final manufacturing yield of products. A semiconductor device 100 includes the first semiconductor device 110 having a plurality of bumps 3 which are formed on the backside surface thereof, and the second semiconductor device 120 having a plurality of terminals 2 which are formed on the front surface thereof and are to be electrically connected with the bumps, the second semiconductor device being mounted on an area which is located on the backside surface of the first semiconductor device 110 without having any bump formed therein. The height of the second semiconductor device measured from the backside surface of the first semiconductor device is made lower than the height of the bump. The second semiconductor device is mounted on the first semiconductor device such that the surface provided with no terminal of the second semiconductor device is joined to the backside surface of the first semiconductor device with the help of an adhesive 115.

摘要翻译： 本发明提供一种半导体器件及其制造方法，能够使半导体器件高密封地封装，而不会降低产品的最终制造成品率。 半导体器件100包括第一半导体器件110，其具有形成在其背面上的多个凸块3，第二半导体器件120具有形成在其前表面上并且将被电连接的多个端子2 与所述凸块连接，所述第二半导体器件安装在位于所述第一半导体器件110的背面上的区域上，而不形成任何凸点。 从第一半导体器件的背面测量的第二半导体器件的高度被制成低于凸点的高度。 第二半导体器件安装在第一半导体器件上，使得没有第二半导体器件的端子的表面借助粘合剂115接合到第一半导体器件的背面。

公开(公告)号：US20050021985A1

公开(公告)日：2005-01-27

申请号：US10482846

申请日：2003-03-18

申请人： Takatoshi Ono ,  Yoji Kumazaki ,  Shigeru Yamada ,  Hiroki Murakami ,  Tetsuya Inoue ,  Motoji Ohmori

发明人： Takatoshi Ono ,  Yoji Kumazaki ,  Shigeru Yamada ,  Hiroki Murakami ,  Tetsuya Inoue ,  Motoji Ohmori

IPC分类号： H04L9/08 ,  G06F21/10 ,  H04N5/913 ,  H04N7/16 ,  H04N7/167 ,  H04N21/266 ,  H04N21/4623 ,  H04N21/81 ,  G06F12/14

CPC分类号： H04N21/42684 ,  H04N5/913 ,  H04N7/163 ,  H04N7/1675 ,  H04N21/4334 ,  H04N21/4623 ,  H04N21/63345

摘要： The present invention provides a technique which makes it possible to eliminate unauthorized playback of contents where unauthorized apparatuses are used and enable only authorized playback apparatuses to play back contents properly. The playback apparatus of the present invention obtains encrypted key information that has been encrypted by a first secret-key encrypting method, and decrypt the encrypted key information into key information using a secret key stored in a storing unit. When the key information is key-updating information, the playback apparatus updates the secret key according to the key-updating information. When the key information is a decryption key, the playback apparatus (i) obtains an encrypted content key that has been encrypted by a second secret-key encrypting method, (ii) decrypts the encrypted content key into a content key using the decryption key, (iii) obtains a scrambled content that has been scrambled by a scramble encrypting method, (iv) descramble the scrambled content using the decrypted content key, and (v) plays back the descrambled content.

摘要翻译： 本发明提供一种技术，其可以消除使用未经授权的装置的内容的未经授权的再现，并且只允许授权的播放装置适当地播放内容。 本发明的播放装置获得已经通过第一秘密密钥加密方法加密的加密密钥信息，并且使用存储在存储单元中的秘密密钥将加密的密钥信息解密成密钥信息。 当密钥信息是密钥更新信息时，重放装置根据密钥更新信息更新密钥。 当密钥信息是解密密钥时，重放装置（i）获得已经通过第二秘密密钥加密方法加密的加密内容密钥，（ii）使用解密密钥将加密的内容密钥解密成内容密钥， （iii）通过加密加密方法获得被加扰的加密内容，（iv）使用解密的内容密钥解密加密的内容，（v）回放解扰的内容。

公开(公告)号：US06569755B2

公开(公告)日：2003-05-27

申请号：US10223484

申请日：2002-08-20

申请人： Shigeru Yamada ,  Yasufumi Uchida ,  Noriko Murakami ,  Yoshinori Shizuno

发明人： Shigeru Yamada ,  Yasufumi Uchida ,  Noriko Murakami ,  Yoshinori Shizuno

IPC分类号： H01L2144

CPC分类号： H01L24/11 ,  H01L23/055 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/3677 ,  H01L23/49503 ,  H01L23/49531 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/78 ,  H01L24/81 ,  H01L24/85 ,  H01L24/91 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05556 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/16 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48599 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85205 ,  H01L2224/8592 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2224/13099 ,  H01L2224/48227 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

摘要： According to a typical invention of the inventions disclosed in the present application, a semiconductor chip with an electronic circuit formed therein is fixed to a die pad for a lead frame having projections formed on the back thereof, with an organic dies bonding agent. Pads on the semiconductor chip, and inner leads are respectively electrically connected to one another by metal thin lines. These portions are sealed with a molding resin. Further, each inner lead extends to the outside of the molding resin and is processed into gull-wing form for substrate mounting. Moreover, the inner lead is processed by soldering so that an external terminal is formed. Thus, since the projections are provided on the back of the die pad, the back of a packing material is brought into point contact with that of the die pad as compared with the conventional face-to-face contact. It is therefore possible to minimize the transfer of organic substances from the packing material. Further, since such transfer that a reduction in adhesive property occurs in the back of the die pad, is greatly reduced, the adhesiveness between the upper surface of the die pad and the molding resin is improved, whereby the resistance of SMD to the reflow is enhanced.

公开(公告)号：US06437430B2

公开(公告)日：2002-08-20

申请号：US09276118

申请日：1999-03-25

申请人： Shigeru Yamada

发明人： Shigeru Yamada

IPC分类号： H01L23495

CPC分类号： H01L23/36 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/15311

摘要： A semiconductor apparatus includes an insulation tape provided with a device hole therein and a semiconductor chip mounted in the device hole and is provided at a first surface with electrode pads. The apparatus also includes a wiring pattern including leads connected at one ends to the electrode pads; and a heat-radiation member provided on the first surface of the semiconductor chip so that heat generated in the semiconductor chip is radiated outwardly through the heat-radiation member.

摘要翻译： 半导体装置包括在其中设置有器件孔的绝缘带和安装在器件孔中的半导体芯片，并且在第一表面处设置有电极焊盘。 该装置还包括布线图案，其包括在一端连接到电极焊盘的引线; 以及设置在半导体芯片的第一表面上的散热构件，使得在半导体芯片中产生的热量通过散热构件向外辐射。

公开(公告)号：US06227776B1

公开(公告)日：2001-05-08

申请号：US09173740

申请日：1998-10-16

申请人： Akihiro Kitamura ,  Kousaku Kitamura ,  Shigeru Yamada

发明人： Akihiro Kitamura ,  Kousaku Kitamura ,  Shigeru Yamada

IPC分类号： B23C900

CPC分类号： F16H37/124 ,  B23Q1/44 ,  B23Q1/4861 ,  B23Q1/4885 ,  B23Q1/5468 ,  B23Q1/58 ,  B23Q5/22 ,  B23Q5/34 ,  B23Q5/54 ,  Y10T74/20341 ,  Y10T409/30532

摘要： A machine tool in which a feed member is fed in a feeding direction relative to a fixed member wherein the feed member is guided by a linear linkage mechanism including a first arm linked to the fixed member at its one end so as to swivel about a first axis, a second arm having the same length as the first arm and being linked to the first arm at its one end so as to swivel about a second axis and also linked to the feed member at its other end so as to swivel about a third axis. A first gear is secured on the fixed member at the one end of the first arm and is coaxial with the first axis. A second gear is secured on the second arm at the other end thereof and is coaxial with the second axis. A chain is provided around the first and the second gears. The first gear has a diameter twice that of the second gear.

摘要翻译： 一种机床，其中进给构件相对于固定构件沿进给方向进给，其中进给构件由线性联动机构引导，该线性联动机构包括在其一端连接到固定构件的第一臂，以便围绕第一 第二臂具有与第一臂相同的长度并且在其一端处连接到第一臂，以便围绕第二轴线旋转并且在其另一端处连接到进给构件，以便绕第三臂 轴。 第一齿轮固定在第一臂的一端处的固定构件上并且与第一轴线同轴。 第二齿轮在其另一端固定在第二臂上并与第二轴同轴。 在第一和第二齿轮周围设置链条。 第一档具有两倍于第二档的直径。

公开(公告)号：US6121690A

公开(公告)日：2000-09-19

申请号：US110965

申请日：1998-07-07

申请人： Shigeru Yamada ,  Youichi Kohara

发明人： Shigeru Yamada ,  Youichi Kohara

IPC分类号： H01L21/60 ,  H01L23/485 ,  H01L23/48

CPC分类号： H01L24/06 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/0603 ,  H01L2224/45144 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/4943 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082

摘要： In order to solve the aforementioned problems, a semiconductor device according to the present invention comprises a semiconductor chip, a plurality of first electrode pads respectively placed along a peripheral edge portion of the semiconductor chip and having first and second transverse ends, and a plurality of second electrode pads respectively having transverse ends near from center lines of the semiconductor chip, the transverse ends being respectively placed at the same distances from the center lines as the first transverse ends of the first electrode pads along the peripheral edge portion of the semiconductor chip, and having widths broader than those of the first electrode pads.The width of each second electrode pad is formed to 1.5 to 2 times as long as that of each first electrode pad.Wires for electrically connecting the first and second electrode pads and leads are formed so as to be bonded at substantially the same intervals.The heights of the wires are formed so as to be substantially identical to each other.

摘要翻译： 为了解决上述问题，本发明的半导体装置包括：半导体芯片，分别沿着半导体芯片的周边部分放置并具有第一和第二横向端的多个第一电极焊盘，以及多个 第二电极焊盘分别具有靠近半导体芯片的中心线的横向端部，横向端部分别与沿着半导体芯片的周缘部分的第一电极焊盘的第一横向端部的中心线的距离相等， 并且具有比第一电极焊盘更宽的宽度。 每个第二电极焊盘的宽度形成为每个第一电极焊盘的宽度的1.5至2倍。 用于电连接第一和第二电极焊盘和引线的导线形成为以大致相同的间隔结合。 电线的高度形成为彼此基本相同。

公开(公告)号：US5810342A

公开(公告)日：1998-09-22

申请号：US720725

申请日：1996-10-01

申请人： Akihiro Kitamura ,  Katsuji Taniguchi ,  Kousaku Kitamura ,  Shigeru Yamada ,  Takashi Saitou

发明人： Akihiro Kitamura ,  Katsuji Taniguchi ,  Kousaku Kitamura ,  Shigeru Yamada ,  Takashi Saitou

IPC分类号： B23Q1/00 ,  B23Q1/42 ,  B23Q1/58 ,  B23Q1/62 ,  B23Q5/40 ,  B23Q17/22 ,  F16C29/02 ,  F16C41/00 ,  B23Q3/18

CPC分类号： F16C29/02 ,  B23Q1/58 ,  B23Q17/22 ,  B23Q5/40 ,  F16C41/00

摘要： A table apparatus for a machine tool for moving a table along a guide member by a driving mechanism, feeding of the table being controlled by a feedback scale in cooperation with the driving mechanism, the feedback scale having a scale portion and a detecting portion, with opposed vicinal surfaces for accepting the feedback scale defined on the guide member and the table, respectively, the scale portion of the feedback scale being mounted on one of the surfaces, while the detecting portion is mounted on the other.

摘要翻译： 一种用于通过驱动机构沿着引导构件移动工作台的工作台的工作台装置，与驱动机构协作地由反馈标尺控制的工作台的供给，反馈标尺具有标尺部分和检测部分，具有 分别在反射标尺的刻度部分安装在其中一个表面上，同时检测部分安装在另一个表面上，用于分别接受限定在引导部件和工作台上的反馈标尺的相邻连续表面。

公开(公告)号：US5327022A

公开(公告)日：1994-07-05

申请号：US885363

申请日：1992-05-19

申请人： Shigeru Yamada ,  Isao Abe ,  Tsutomu Takahashi

发明人： Shigeru Yamada ,  Isao Abe ,  Tsutomu Takahashi

IPC分类号： H01L21/822 ,  G09G3/36 ,  H01L27/04 ,  H03K17/693 ,  G11C8/00 ,  H03K19/20

CPC分类号： G09G3/3674 ,  G09G3/3685 ,  H03K17/693

摘要： A multiplexer circuit comprises a plurality of circuits for decoding digital timing signals, and a plurality of circuits for passing an one of the analogue voltage potentials to an output terminal corresponding to the decoded result of the decoding circuits, and preventing the passing circuits from passing more than one signal simultaneously.

摘要翻译： 多路复用器电路包括用于解码数字定时信号的多个电路，以及用于将模拟电压电位之一传递到对应于解码电路的解码结果的输出端的多个电路，并且防止通过电路通过更多 比一个信号同时。

公开(公告)号：US5187846A

公开(公告)日：1993-02-23

申请号：US722327

申请日：1991-07-02

申请人： Koichiro Kitamura ,  Shigeru Yamada

发明人： Koichiro Kitamura ,  Shigeru Yamada

IPC分类号： B23Q7/00 ,  B23Q5/28 ,  B23Q7/14 ,  H02K41/025

CPC分类号： B23Q5/28 ,  B23Q7/1426 ,  B23Q7/1431 ,  H02K41/025 ,  Y10T29/5196

摘要： A pallet changer includes at least one pallet (4, 14) for holding a workpiece (5, 15); a first guide (41) for guiding the pallet (4, 14); a first support (2) for supporting the first guide (41); a second guide (51) for guiding the pallet (4, 14); a second support (30) for supporting the second guide (51); a first linear motor (40) associated with the first guide (41); a second linear motor (50) associated with the second guide (51). The pallet (4, 14) is made of conductive material so as to serve as a secondary conductor for the first linear motor (40) and the second linear motor (50) for performing changing of the pallet (4, 14) between the first linear motor (40) and the second linear motor (50) along a desired direction (Y).