公开(公告)号：US20170347456A1

公开(公告)日：2017-11-30

申请号：US15165813

申请日：2016-05-26

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Yushuang YAO ,  Atapol PRAJUCKAMOL ,  Chee Hiong CHEW ,  Francis J. CARNEY ,  Yusheng LIN

IPC: H05K1/18 ,  H05K1/02 ,  H05K1/09 ,  H05K3/34 ,  H05K1/03

CPC classification number: H05K1/181 ,  H01L23/48 ,  H05K1/0203 ,  H05K1/0306 ,  H05K1/09 ,  H05K3/341 ,  H05K3/3431 ,  H05K3/3494 ,  H05K3/4015 ,  H05K2201/10189 ,  H05K2201/10257 ,  H05K2201/10333 ,  H05K2203/1316 ,  H05K2203/1327 ,  H05K2203/16

Abstract: A method, in some embodiments, comprises: providing a direct bonded copper (DBC) substrate including a plurality of copper traces; providing a guide plate having protrusions on a surface of the guide plate; mounting hollow bush rings onto the protrusions; mounting the bush rings onto the copper traces by aligning the protrusions of the guide plate with solder units on said copper traces; attaching the bush rings and one or more dies to the copper traces by simultaneously reflowing said solder units and other solder units positioned between the dies and the copper traces; and after said simultaneous reflow, removing the protrusions from the bush rings.

公开(公告)号：US09661753B1

公开(公告)日：2017-05-23

申请号：US15366158

申请日：2016-12-01

Applicant: HARRIS CORPORATION

Inventor： Gregory M. Jandzio ,  Brinnan C. Riley ,  Charlie Dull ,  Jason Naylor

IPC: H01R9/00 ,  H05K1/18 ,  H05K3/34

CPC classification number: H05K1/182 ,  H05K3/34 ,  H05K3/3426 ,  H05K2201/10287 ,  H05K2201/1031 ,  H05K2201/10333 ,  H05K2201/2027 ,  Y02P70/611 ,  Y02P70/613

Abstract: Microclip appliance formed from a single conductive planar metal sheet includes portions defined along an elongated length including a pin receiver, a solder paddle and a bridge. The pin receiver includes first and second planar rings, and a spring bar extending from a periphery of the first ring to a periphery of the second ring. The solder paddle is comprised of a portion of the conductive metal sheet distal from the pin receiver and the bridge extends from a peripheral portion of the solder paddle to the second ring. Lateral bends are disposed along a length of the conductive planar metal sheet to facilitate the various portions of the microclip.

公开(公告)号：US20170025770A1

公开(公告)日：2017-01-26

申请号：US15288538

申请日：2016-10-07

Applicant: AVX Corporation

Inventor： Peter BISHOP

IPC: H01R4/24 ,  H01R4/48 ,  H05K1/11 ,  H01R12/71 ,  H01R13/62 ,  H01R4/18 ,  H01R12/53

CPC classification number: H01R4/2404 ,  H01R4/183 ,  H01R4/4836 ,  H01R12/53 ,  H01R12/70 ,  H01R12/7076 ,  H01R12/718 ,  H01R13/62 ,  H01R2101/00 ,  H05K1/111 ,  H05K3/325 ,  H05K3/3421 ,  H05K2201/09072 ,  H05K2201/10287 ,  H05K2201/10333 ,  H05K2201/10962

Abstract: A single element electrical connector includes a single conductive contact element formed into a cage structure having a wire insert end and a wire contact end along a longitudinal centerline axis of the connector. The cage structure defines an upper pick-up surface having a surface area suitable for placement of a suction nozzle of a vacuum transfer device, as well as a pair of contact tines biased towards the centerline axis to define a contact pinch point for an exposed core of a wire inserted into the connector. A contact surface is defined by a member of the cage structure for electrical mating contact with a respective contact element on a component on which the connector is mounted.

Abstract translation: 单元件电连接器包括形成为笼式结构的单个导电接触元件，其具有线插入端和沿着连接器的纵向中心线轴的线接触端。 笼结构限定了具有适于放置真空传送装置的吸嘴的表面积的上拾取表面，以及朝向中心线轴线偏置的一对接触尖齿，以限定暴露芯的接触夹点 插入连接器的电线。 接触表面由笼结构的构件限定，用于与安装有连接器的部件上的相应接触元件电配合接触。

公开(公告)号：US20150380835A1

公开(公告)日：2015-12-31

申请号：US14844160

申请日：2015-09-03

Applicant: AVX Corporation

Inventor： Peter BISHOP

IPC: H01R4/24 ,  H01R12/70

CPC classification number: H01R4/2404 ,  H01R4/183 ,  H01R4/4836 ,  H01R12/53 ,  H01R12/70 ,  H01R12/7076 ,  H01R12/718 ,  H01R13/62 ,  H01R2101/00 ,  H05K1/111 ,  H05K3/325 ,  H05K3/3421 ,  H05K2201/09072 ,  H05K2201/10287 ,  H05K2201/10333 ,  H05K2201/10962

Abstract: A single element electrical connector includes a single conductive contact element formed into a cage structure having a wire insert end and a wire contact end along a longitudinal centerline axis of the connector. The cage structure defines an upper pick-up surface having a surface area suitable for placement of a suction nozzle of a vacuum transfer device, as well as a pair of contact tines biased towards the centerline axis to define a contact pinch point for an exposed core of a wire inserted into the connector. A contact surface is defined by a member of the cage structure for electrical mating contact with a respective contact element on a component on which the connector is mounted.

Abstract translation: 单元件电连接器包括形成为笼式结构的单个导电接触元件，其具有线插入端和沿着连接器的纵向中心线轴的线接触端。 笼结构限定了具有适于放置真空传送装置的吸嘴的表面积的上拾取表面，以及朝向中心线轴线偏置的一对接触尖齿，以限定暴露芯的接触夹点 插入连接器的电线。 接触表面由笼结构的构件限定，用于与安装有连接器的部件上的相应接触元件进行电配合接触。

公开(公告)号：US20140120786A1

公开(公告)日：2014-05-01

申请号：US13927231

申请日：2013-06-26

Applicant: AVX Corporation

Inventor： Peter BISHOP

IPC: H01R12/75

CPC classification number: H01R4/2404 ,  H01R4/183 ,  H01R4/4836 ,  H01R12/515 ,  H01R12/53 ,  H01R12/70 ,  H01R12/7076 ,  H01R12/718 ,  H01R13/62 ,  H01R2101/00 ,  H05K1/111 ,  H05K3/325 ,  H05K3/3421 ,  H05K2201/09072 ,  H05K2201/10287 ,  H05K2201/10333 ,  H05K2201/10962

Abstract: A single element electrical connector includes a single conductive contact element formed into a cage structure having a wire insert end and a wire contact end along a longitudinal centerline axis of the connector. The cage structure defines an upper pick-up surface having a surface area suitable for placement of a suction nozzle of a vacuum transfer device, as well as a pair of contact tines biased towards the centerline axis to define a contact pinch point for an exposed core of a wire inserted into the connector. A contact surface is defined by a member of the cage structure for electrical mating contact with a respective contact element on a component on which the connector is mounted.

公开(公告)号：US08253236B2

公开(公告)日：2012-08-28

申请号：US13086499

申请日：2011-04-14

Applicant: Takeshi Oi ,  Seiji Oka ,  Yoshiko Obiraki ,  Osamu Usui ,  Yasushi Nakayama

Inventor： Takeshi Oi ,  Seiji Oka ,  Yoshiko Obiraki ,  Osamu Usui ,  Yasushi Nakayama

IPC: H01L23/48

CPC classification number: H05K3/32 ,  H01L23/3121 ,  H01L24/28 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/072 ,  H01L25/162 ,  H01L2224/05553 ,  H01L2224/0603 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/48699 ,  H01L2224/4911 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01061 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/12032 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19043 ,  H01L2924/30107 ,  H05K3/284 ,  H05K2201/1031 ,  H05K2201/10333 ,  H05K2201/10962 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512

Abstract: A power semiconductor device includes power semiconductor elements joined to wiring patterns of a circuit substrate, cylindrical external terminal communication sections, and wiring means for forming electrical connection between, for example, the power semiconductor elements and the cylindrical external terminal communication sections. The power semiconductor elements, the cylindrical external terminal communication sections, and the wiring means are sealed with transfer molding resin. The cylindrical external terminal communication sections are arranged on the wiring patterns so as to be substantially perpendicular to the wiring patterns, such that external terminals are insertable and connectable to the cylindrical external terminal communication sections, and such that a plurality of cylindrical external terminal communication sections among the cylindrical external terminal communication sections are arranged two-dimensionally on each of wiring patterns that act as main circuits.

Abstract translation: 功率半导体器件包括接合到电路基板的布线图案的电力半导体元件，圆柱形外部端子连通部分和用于形成例如功率半导体元件和圆筒形外部端子连接部分之间的电连接的布线装置。 功率半导体元件，圆筒形外部端子连通部分和布线装置用传递模塑树脂密封。 圆筒形的外部端子连通部分布置在布线图案上，以便大致垂直于布线图案，使得外部端子可插入并可连接到圆柱形外部端子连通部分，并且使得多个圆柱形外部端子连通部分 在作为主电路的每个布线图案上，圆柱形外部端子通信部分二维布置。

公开(公告)号：US07909480B2

公开(公告)日：2011-03-22

申请号：US12193470

申请日：2008-08-18

Applicant: Eun-Jeong Kang ,  Seok-Won Kang ,  Young-Keun Lee ,  Ho-Sik Shin

Inventor： Eun-Jeong Kang ,  Seok-Won Kang ,  Young-Keun Lee ,  Ho-Sik Shin

IPC: F21V33/00

CPC classification number: H05K3/323 ,  G02B6/0073 ,  G02B6/0083 ,  H05K3/28 ,  H05K3/301 ,  H05K3/32 ,  H05K2201/0129 ,  H05K2201/0224 ,  H05K2201/10106 ,  H05K2201/1031 ,  H05K2201/10333 ,  Y02P70/611 ,  Y10S362/80 ,  Y10T29/4913

Abstract: A light source module includes a mounting substrate including at least two exposed metal lines, a light-emitting diode (LED) including two electrodes disposed corresponding to the at least two exposed metal lines, and an anisotropic conductive film (ACF) provided on the mounting substrate, the ACF electrically connecting the at least two exposed metal lines to the two electrodes, wherein the ACF comprises an insulation body, and a plurality of conductive particles dispersed in the insulation body and insulated from each other, and an insulation of the conductive particles disposed between the two exposed metal lines and the two electrodes of the LED is prevented in at least a first direction.

Abstract translation: 一种光源模块，包括：至少包括两个暴露的金属线的安装基板;包括对应于所述至少两个暴露的金属线设置的两个电极的发光二极管（LED）;以及设置在所述安装件上的各向异性导电膜 基板，ACF将至少两个暴露的金属线电连接到两个电极，其中ACF包括绝缘体和分散在绝缘体中并彼此绝缘的多个导电颗粒，并且导电颗粒的绝缘 设置在两个暴露的金属线之间，并且至少在第一方向上防止LED的两个电极。

公开(公告)号：US20110008974A1

公开(公告)日：2011-01-13

申请号：US12501408

申请日：2009-07-11

Applicant: IOAN ALEXANDRU SALOMIE

Inventor： IOAN ALEXANDRU SALOMIE

IPC: H01R12/00 ,  G06F17/50 ,  H05K3/00

CPC classification number: H01R9/28 ,  G06F17/5068 ,  G06F2217/40 ,  H05K1/0286 ,  H05K3/103 ,  H05K3/222 ,  H05K3/4046 ,  H05K2201/09609 ,  H05K2201/09963 ,  H05K2201/1028 ,  H05K2201/10333 ,  H05K2201/1059 ,  Y10T29/49124

Abstract: Circuit design assemblies, referred to herein as a “SpinBoard” and “SpinConnector” assemblies, are disclosed. The assemblies may include any of a variety of advantageous structures, including for example a board with a grid defining circuit point positions, and SpinConnector structures for building circuits. The disclosed SpinConnector structures may include advantageous features such as pin and plate structures that allow building fixed or articulating connector chains, and improved contact structures for conductive contact with electronic components. Software for designing the provided assemblies is also disclosed.

Abstract translation: 公开了电路设计组件，这里称为“SpinBoard”和“SpinConnector”组件。 组件可以包括各种有利的结构中的任何一种，包括例如具有限定电路点位置的网格的板以及用于构建电路的SpinConnector结构。 所公开的旋转连接器结构可以包括有利特征，例如能够构建固定或铰接连接器链的销和板结构，以及用于与电子部件的导电接触的改进的接触结构。 还公开了用于设计所提供的组件的软件。

公开(公告)号：US20100219536A1

公开(公告)日：2010-09-02

申请号：US12734192

申请日：2008-10-16

Applicant: Toshio Kazama ,  Shigeki Ishikawa

Inventor： Toshio Kazama ,  Shigeki Ishikawa

IPC: H01L23/48 ,  H01B5/00 ,  H05K1/11

CPC classification number: H05K3/326 ,  H01L23/49811 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/1461 ,  H01R12/714 ,  H01R13/2407 ,  H05K3/32 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0311 ,  H05K2201/0379 ,  H05K2201/0397 ,  H05K2201/1031 ,  H05K2201/10333 ,  H05K2201/1059 ,  H05K2201/10734 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A connecting terminal, a semiconductor package, a wiring board, a connector, and a microcontactor that can achieve a stable contact with a contact target are provided. To achieve the object and to establish an electrical connection to a contact target by making a physical contact with the contact target, there are provided a plurality of conductive terminal-forming members each having a terminal portion, which is extended in a band shape and at least a part of a surface of which forms a curved surface. Each terminal portion is configured so that a part of which is laminated on a part of at least one terminal portion in a thickness direction. All the terminal portions may be laminated at respective tip portions in the thickness direction.

Abstract translation: 提供了可以实现与接触目标的稳定接触的连接端子，半导体封装，布线板，连接器和微控制器。 为了实现该目的并通过与接触目标物理接触来建立与接触靶的电连接，提供了多个导电端子形成部件，每个导体端子形成部件具有端部，该端子部分延伸成带状， 其表面的至少一部分形成曲面。 每个端子部分被构造为使得其一部分层压在厚度方向上的至少一个端子部分的一部分上。 所有端子部分可以在厚度方向的各个尖端部分层叠。

公开(公告)号：US20100022105A1

公开(公告)日：2010-01-28

申请号：US12506974

申请日：2009-07-21

Applicant: Thomas H. Di Stefano

Inventor： Thomas H. Di Stefano

IPC: H01R12/00

CPC classification number: H05K3/32 ,  H01R12/52 ,  H01R13/11 ,  H05K3/3436 ,  H05K7/1061 ,  H05K2201/0379 ,  H05K2201/10234 ,  H05K2201/10242 ,  H05K2201/10333 ,  H05K2201/10424 ,  H05K2201/10734 ,  Y02P70/613

Abstract: One embodiment is a connector for making electrical connection to a bulbous terminal, the connector including: a metal tube with a cylindrical wall extending from a mating end, wherein: (a) two or more slots perforate the wall and extend from the mating end along the tube; (b) two or more apertures perforate the wall and are disposed in a circumferential array disposed a distance from the mating end; and (c) each of the two or more slots transects one of the two or more apertures to divide the mating end of the tube into resilient prongs.

Abstract translation: 一个实施例是用于与球根端子进行电连接的连接器，该连接器包括：金属管，其具有从配合端延伸的圆柱形壁，其中：（a）两个或更多个狭缝在壁上穿孔并从配合端沿着 管子 （b）两个或更多个孔穿过该壁并设置在与配合端一定距离设置的圆周阵列中; 和（c）两个或更多个槽中的每一个横切两个或更多个孔中的一个，以将管的配合端分成弹性插脚。