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公开(公告)号：US20180171066A1
公开(公告)日：2018-06-21
申请号：US15571119
申请日：2016-04-14
发明人： Peter Gröppel , Michael Nagel , Mario Brockschmidt , Regina Mühlberg , Friedhelm Pohlmann , Roland Röding , Manuel Weil
CPC分类号： C08G59/4021 , C08G59/50 , C08K3/22 , C08K3/28 , C08K3/34 , C08K3/36 , C08K2003/221 , C08K2003/2227 , C08K2003/2237 , C08K2201/011 , C08L63/00 , H01B3/40
摘要： An anhydride-free impregnating resin for an electrical insulation body, the impregnating resin has an epoxy resin, a curing agent and nanoscale and/or microscale inorganic particles. An impregnable electrical insulating tape for an electrical insulation body has a curing agent applied to the electrical insulating tape. A method includes producing an electrical insulation body An electrical insulation body includes an anhydride-free impregnating resin, where the impregnating resin has an epoxy resin, a curing agent and nanoscale and/or microscale inorganic particles.
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公开(公告)号：US20180134938A1
公开(公告)日：2018-05-17
申请号：US15574642
申请日：2016-05-18
发明人： Daigo HIRAKAWA , Masanori TAKANASHI
CPC分类号： C09K5/14 , C08K3/28 , C08K3/38 , C08K5/5415 , C08K7/16 , C08K7/18 , C08K2003/282 , C08K2003/385 , C08K2201/001 , C08K2201/003 , C08K2201/005 , C08L83/04
摘要： The present invention provides a thermally conductive composition good in thermal conductivity, low in viscosity and easy in application. The thermally conductive composition is a thermally conductive composition including (A) a spherical thermally conductive filler and (B) an alkoxysilane compound or dimethylpolysiloxane, wherein the spherical thermally conductive filler of component (A) is a mixture formulated with specific ratios of fillers having different average particle sizes, the mixture being formulated with a spherical thermally conductive filler made of a nitride and having an average particle size of 50 μm or more in an amount of 30% by mass or more.
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公开(公告)号：US09969896B2
公开(公告)日：2018-05-15
申请号：US14736789
申请日：2015-06-11
发明人： Song yun Cho , Chang Jin Lee , Young Hun Kang
CPC分类号： C09D11/52 , C08K3/28 , C08K5/56 , H01L21/02554 , H01L21/02565 , H01L21/02628 , H01L27/1292 , H01L29/66969 , H01L29/7869
摘要： The aim of the present invention is to provide an indium-zinc-oxide semiconductor ink composition in which a spontaneous combustion reaction occurs, and provide an inorganic semiconductor thin film produced thereby. To this end, the present invention provides a semiconductor ink composition which includes a complex, represented by formula 1, incorporating a nitrate of a metal A which is an oxidizing material and incorporating a metal B which is a fuel material; wherein the metal A and the metal B are each respectively a metal selected from the group consisting of indium, gallium, zinc, titanium, aluminum, lithium, and zirconium, and metal A and metal B are different from each other.
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64.发明授权公开(公告)号：US09944831B2
公开(公告)日：2018-04-17
申请号：US15021094
申请日：2014-09-24
申请人： LINTEC CORPORATION
发明人： Wataru Morita , Kunihisa Kato , Tsuyoshi Mutou
IPC分类号： C09J7/00 , C09J9/02 , H01L35/32 , C09J9/00 , C09J11/04 , C09J175/04 , C09J183/04 , C09J201/00 , H01L35/30 , H01L35/34 , C08G18/62 , C08G18/81 , C08K3/08 , C08K3/22 , C08K3/28 , C08K3/38
CPC分类号： C09J7/00 , C08G18/6229 , C08G18/6254 , C08G18/8116 , C08K3/08 , C08K3/22 , C08K3/28 , C08K2003/385 , C08K2201/001 , C09J7/10 , C09J9/00 , C09J9/02 , C09J11/04 , C09J175/04 , C09J183/04 , C09J201/00 , C09J2201/40 , C09J2203/326 , C09J2205/102 , C09J2475/00 , C09J2483/00 , H01L35/30 , H01L35/32 , H01L35/34
摘要： The present invention provides a thermally conductive adhesive sheet that can be easily laminated on an electronic device without an adhesive layer therebetween and can further selectively dissipate heat in a particular direction to provide a sufficient temperature difference to the inside of the electronic device, a method for producing the same, and an electronic device using the same. The present invention includes a thermally conductive adhesive sheet comprising a high thermally conductive portion and a low thermally conductive portion, wherein the high thermally conductive portion and the low thermally conductive portion have adhesiveness, and the high thermally conductive portion and the low thermally conductive portion each independently constitute an entire thickness of the thermally conductive adhesive sheet, or at least either the high thermally conductive portion or the low thermally conductive portion constitutes a portion of a thickness of the thermally conductive adhesive sheet, and a method for producing the thermally conductive adhesive sheet, and an electronic device using the thermally conductive adhesive sheet.
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公开(公告)号：US09922749B2
公开(公告)日：2018-03-20
申请号：US14347843
申请日：2012-09-25
申请人： RHODIA OPERATIONS
发明人： Yeong-Chool Yu , Tae-Kyun Kim
IPC分类号： C08L77/06 , C08K3/22 , C08K3/28 , C08K5/5313 , C08K5/3492 , H01B3/30 , C08K5/52 , C08K7/14 , C08K5/521 , H01L33/64 , C09K21/12
CPC分类号： H01B3/305 , C08K3/22 , C08K3/28 , C08K5/34922 , C08K5/5205 , C08K5/521 , C08K5/5313 , C08K7/14 , C08K2003/2227 , C08K2003/2248 , C08K2003/2265 , C08K2003/2296 , C08L77/06 , C09K21/12 , H01L33/641
摘要： The present invention relates to a composition containing a polyamide matrix having high thermal conductivity, and including a nitride and a metal oxide, as well as, optionally, a flame-retardant system. Said composition can be used in particular for producing components for lighting apparatuses including light-emitting diodes.
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公开(公告)号：US20170369671A1
公开(公告)日：2017-12-28
申请号：US15538296
申请日：2015-12-24
申请人： KURARAY CO., LTD.
发明人： Yasuhiro NONAKA
IPC分类号： C08K3/10 , B32B27/30 , C08K5/098 , C08K3/16 , C08K5/09 , C08K3/32 , B32B27/08 , C08K3/22 , C08K3/28 , C08K5/092
CPC分类号： C08K3/10 , B32B27/08 , B32B27/30 , B32B2307/7244 , C08K3/16 , C08K3/22 , C08K3/28 , C08K3/32 , C08K5/09 , C08K5/092 , C08K5/098 , C08K5/51 , C08K5/52 , C08K2003/329 , C08K2201/014 , C08L29/02
摘要： Provided is a resin composition containing polymethallyl alcohol (A) having a repeating structural unit represented by the following formula (1) in an amount of greater than or equal to 30 mol %, and a metal ion (B), a content of the metal ion (B) being greater than or equal to 0.05 μmol per 1 g of the polymethallyl alcohol (A); a method of producing the resin composition; and a molding containing the resin composition.
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67.发明申请公开(公告)号：US20170342264A1
公开(公告)日：2017-11-30
申请号：US15538488
申请日：2015-12-21
申请人： DOOSAN CORPORATION
发明人： Dong Hee JUNG , Jeong Don KWON , Moo Hyun KIM , Do Woong HONG
IPC分类号： C08L71/02 , C08J5/04 , H05K3/02 , B32B27/28 , C08K3/28 , C08J5/24 , C08K5/00 , C08K9/06 , H05K1/03
摘要： The present invention related to a thermosetting resin composition for high frequency, the composition containing (a) a polyphenylene ether having two or more unsaturated substituent groups selected from the group consisting of the vinyl group and the allyl group at both ends of the molecular chain thereof, or an oligomer of said polyphenylene ether; (b) three or more different types of cross-linking curing agents; and (c) a flame retardant. The present invention may provide a printed circuit board for high frequency which simultaneously exhibits low dielectric loss characteristic and good moisture-absorption heat resistance, low thermal expansion characteristics, excellent thermal stability, excellent processability, and the like.
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公开(公告)号：US20170338166A1
公开(公告)日：2017-11-23
申请号：US15429930
申请日：2017-02-10
发明人： HONAMI NAWA , HIROHISA HINO
CPC分类号： H01L23/3737 , C08K3/14 , C08K3/34 , C08K9/04 , C08K2003/222 , C08K2003/2227 , C08K2003/282 , C08K2201/001 , C08K2201/005 , C08K2201/006 , C09D5/028 , C09D5/32 , C09D7/61 , C09D7/62 , C09D7/69 , H01L23/42 , H05K7/20263
摘要： Provided herein is a structure having desirable heat dissipation, particularly a structure having high far-infrared emissivity. An electronic component including such a structure, and an electronic device including the electronic component are also provided. The structure includes a water-based coating material containing inorganic fillers that include a first filler and a second filler. The first filler is an oxide containing at least two elements selected from the group consisting of aluminum, magnesium, and silicon, and has a specific surface area of 7 m2/g to 50 m2/g, and a hydrophobic group on a filler surface. The second filler has a head conductivity of 30 W/m·K or more.
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公开(公告)号：US20170283645A1
公开(公告)日：2017-10-05
申请号：US15627532
申请日：2017-06-20
申请人： SHOWA DENKO K.K.
IPC分类号： C09D163/00 , C08K3/28 , H01L23/373 , C08K3/38 , C09D133/00 , C09J5/06 , C08K3/22 , C08K3/40
CPC分类号： C09D163/00 , C08K3/22 , C08K3/28 , C08K3/38 , C08K3/40 , C08K2003/2227 , C08K2003/2241 , C08K2003/282 , C08K2003/385 , C09D133/00 , C09D133/14 , C09J5/06 , H01L23/24 , H01L23/295 , H01L23/3107 , H01L23/36 , H01L23/3737 , H01L23/4334 , H01L23/49551 , H01L23/49575 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/48 , H01L24/73 , H01L2224/291 , H01L2224/32245 , H01L2224/33181 , H01L2224/451 , H01L2224/48091 , H01L2224/48096 , H01L2224/48106 , H01L2224/48137 , H01L2224/48247 , H01L2224/73215 , H01L2224/73265 , H01L2924/00014 , H01L2924/07802 , H01L2924/12042 , H01L2924/181 , H01L2924/19107 , H05K7/20481 , Y10T156/10 , Y10T428/2848 , Y10T428/31511 , H01L2924/00012 , H01L2924/014 , H01L2924/00 , H01L2224/05599 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The present invention relates to a curable heat radiation composition which includes two types of fillers with different compressive breaking strengths (except when the two types of fillers are the same substance) and a thermosetting resin, the compressive breaking strength ratio of the two types of fillers [compressive breaking strength of a filler (A) with a higher compressive breaking strength/compressive breaking strength of a filler (B) with a lower compressive breaking strength] being 5 to 1,500, the compressive breaking strength of the filler (A) being 100 to 1,500 MPa, and the compressive breaking strength of the filler (B) being 1.0 to 20 MPa, an adhesive sheet using the composition and a method for producing the same. An aluminum nitride is preferable as the filler (A) and hexagonal boron nitride agglomerated particles are preferable as the filler (B).
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公开(公告)号：US09779853B2
公开(公告)日：2017-10-03
申请号：US14778837
申请日：2014-03-03
发明人： Yuki Kotani , Hiroyoshi Yoden , Hajime Kishi , Takashi Saruwatari
IPC分类号： H01B3/40 , C08L63/00 , C08L81/06 , C08L101/12 , H01B3/00 , H01B3/30 , C08K3/22 , C08K3/28 , C09K5/14
CPC分类号： H01B3/40 , C08K3/22 , C08K3/28 , C08K2003/222 , C08K2003/2227 , C08L63/00 , C08L81/06 , C08L101/12 , C09K5/14 , H01B3/006 , H01B3/301
摘要： An insulating thermally conductive resin composition (1) includes a phase-separated structure including: a first resin phase (2) in which a first resin continues three-dimensionally; and a second resin phase (3) different from the first resin phase and formed of a second resin. Moreover, the insulating thermally conductive resin composition includes: small-diameter inorganic filler (4) unevenly distributed in the first resin phase; and large-diameter inorganic filler (5) that spans the first resin phase and the second resin phase and thermally connects pieces of the small-diameter inorganic filler, which is unevenly distributed in the first resin phase, to one another. Then, an average particle diameter of the small-diameter inorganic filler is 0.1 to 15 μm. Moreover, an average particle diameter of the large-diameter inorganic filler is larger than the average particle diameter of the small-diameter inorganic filler, and is 1 to 100 μm.
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