公开(公告)号：US4157284A

公开(公告)日：1979-06-05

申请号：US864639

申请日：1977-12-27

申请人： Marina Bujatti ,  Carlo Misiano ,  Enrico Simonetti

发明人： Marina Bujatti ,  Carlo Misiano ,  Enrico Simonetti

IPC分类号： H01L21/70 ,  H05K1/16 ,  H05K3/06 ,  H05K3/38 ,  C25D5/02 ,  C25D5/10

CPC分类号： H01L21/707 ,  H05K1/167 ,  H05K3/062 ,  H05K2201/0317 ,  H05K2203/0361 ,  H05K2203/0384 ,  H05K3/388 ,  Y10T29/49099

摘要： A process for obtaining conductive and resistive elements in microwave circuits in which sequentially a layer of a thin film constituted by a high resistive material is deposited on an insulating substrate, a thin film of conductive material is deposited over the high resistence material, the high resistive film is removed by photoetching from areas which are to constitute resistive elements, a masking material is electrolytically grown on the areas constituting the resistive elements, a thick film of conductive material is electrolytically grown over the entire surface, a protecting material is deposited on areas to constitute conductive elements, the thick film of conductive material is removed by ionic erosion from areas unprotected in the previous step and residual protecting material is removed by differential chemical attack.

摘要翻译： 一种用于在微波电路中获得导电和电阻元件的方法，其中依次将由高电阻材料构成的薄膜层沉积在绝缘基板上，导电材料薄膜沉积在高电阻材料上，高电阻 通过从构成电阻元件的区域进行光刻处理除去膜，在构成电阻元件的区域电解生长掩模材料，在整个表面上电解生长导电材料的厚膜，将保护材料沉积在 构成导电元件，导电材料的厚膜由前一步骤中未受保护的区域的离子侵蚀除去，残留的保护材料通过差别化学侵蚀被去除。

公开(公告)号：US3955068A

公开(公告)日：1976-05-04

申请号：US509883

申请日：1974-09-27

申请人： Joseph M. Shaheen

发明人： Joseph M. Shaheen

IPC分类号： B41J2/335 ,  H01C1/084 ,  H05K1/00 ,  H05K1/05 ,  H05K1/16 ,  H05K3/00 ,  H05K3/06 ,  H05K3/20 ,  H05K3/38 ,  H05K7/20 ,  H05B3/16

CPC分类号： H05K1/167 ,  B41J2/3351 ,  B41J2/33515 ,  B41J2/33525 ,  B41J2/3355 ,  B41J2/3357 ,  B41J2/3359 ,  H01C1/084 ,  H05K1/0393 ,  H05K1/05 ,  H05K2201/0317 ,  H05K2201/0355 ,  H05K2201/09881 ,  H05K2201/2009 ,  H05K2203/0156 ,  H05K2203/0361 ,  H05K2203/1453 ,  H05K3/007 ,  H05K3/06 ,  H05K3/20 ,  H05K3/386 ,  H05K3/388 ,  Y10T29/49099

摘要： A composite comprising a flexible substrate structure including a base and support members projecting therefrom; a network of resistor segments; a conductor network interposed between the resistor network and the base of the substrate structure for cooperating with the projecting support members of the substrate structure to support the resistor segments and for supplying power to the resistor segments; and, a backup board affixed to the substrate on the side thereof opposite the resistor segments. The composite can be used, e.g., as the printing element in thermal print heads. The resistor network can be formed on top of the conductor network by casting the flexible projecting support members on the base between the conductors flush with the outer surfaces of the conductors for supporting the resistor network thereon. Alternatively, the projecting support members and the base can be formed as one piece.

摘要翻译： 一种复合材料，包括柔性基底结构，其包括基底和从其突出的支撑构件; 电阻器段网络; 介于电阻器网络和衬底结构的基座之间的导体网络，用于与衬底结构的突出支撑构件协作以支撑电阻器段并向电阻器段供电; 以及在与电阻器段相对的一侧固定到基板的备用板。 复合材料可以用作例如热敏打印头中的印刷元件。 电阻网络可以形成在导体网络的顶部，通过将导体之间的柔性突起支撑件浇铸在与导体的外表面齐平的导体之间，以支撑其上的电阻网络。 或者，突出的支撑构件和基座可以形成为一体。

公开(公告)号：US3904461A

公开(公告)日：1975-09-09

申请号：US50718474

申请日：1974-09-09

申请人： BENDIX CORP

发明人： ESTEP GORDON J ,  BURTON BERNARD LEE

IPC分类号： H01L21/00 ,  H01L21/60 ,  H01L21/607 ,  H01L21/70 ,  H01L23/498 ,  H01L23/522 ,  H05K1/03 ,  H05K1/16 ,  H05K3/06 ,  H05K3/38 ,  C23F1/02

CPC分类号： H05K1/167 ,  H01L21/00 ,  H01L21/707 ,  H01L23/49866 ,  H01L23/522 ,  H01L24/81 ,  H01L2224/45124 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/0306 ,  H05K3/064 ,  H05K3/388 ,  H05K2201/0317 ,  H05K2201/0347 ,  H05K2203/0361 ,  H05K2203/072 ,  Y10T29/49099 ,  Y10T29/49128 ,  H01L2924/00 ,  H01L2224/48

摘要： A metalization process for the manufacture of hybrid integrated circuit elements including boards and semiconductors to be attached thereto involves applying to a substrate of insulating material such as aluminum oxide, successive layers of sputtered nickel-chromium and nickel, an electroless deposit of nickelboron and, frequently, an electro-deposited layer of gold. The assembly is then normally heat-treated to stabilize the resistive layer. The addition of the nickel-boron layer provides many advantages in that reliable low-temperature solder connections may be made to it, ultrasonic wire bonds of high reliability may be accomplished with the usual aluminum wire supplied with most discrete components, the heat-treating step is considerably shortened in time with greater stability of resistance values, and the assemblies thus manufactured are capable of operating in comparatively high-temperature environments. The same metalization process applied to semiconductors renders them easily solderable and avoids using high temperature eutectic bonding with the accompanying exposure of the semiconductors to elevated temperatures, often for prolonged periods. As a result, circuit assemblies thus manufactured are readily repairable, in most instances, since no high-temperature bonds are required.

摘要翻译： 用于制造包括要附着在其上的板和半导体的混合集成电路元件的金属化工艺包括将诸如氧化铝的绝缘材料的衬底，溅射的镍 - 铬和镍的连续层，镍 - 硼的无电沉积和 经常是电沉积的金层。 然后通常对组件进行热处理以稳定电阻层。 镍 - 硼层的添加提供了许多优点，因为可以制造出可靠的低温焊料连接，高可靠性的超声波引线接合可以用大多数分立元件提供的通常的铝线来实现，热处理步骤 大大缩短了电阻值的稳定性，并且由此制造的组件能够在较高温度的环境中工作。 应用于半导体的相同的金属化工艺使得它们易于焊接，并避免使用高温共晶结合，伴随着半导体的暴露于升高的温度，通常是长时间的。 结果，如此制造的电路组件在大多数情况下易于修复，因为不需要高温键。

公开(公告)号：US3857683A

公开(公告)日：1974-12-31

申请号：US38308873

申请日：1973-07-27

申请人： MICA CORP

发明人： CASTONGUAY R

IPC分类号： C22C19/05 ,  C22C19/07 ,  C22C27/06 ,  C25D7/00 ,  H01C7/00 ,  H01C17/14 ,  H05K1/16 ,  H05K3/02 ,  B32B15/04

CPC分类号： H01C7/006 ,  H05K1/167 ,  H05K3/022 ,  H05K2201/0355 ,  H05K2203/0361 ,  H05K2203/0723 ,  Y10T428/12444 ,  Y10T428/12549 ,  Y10T428/12569 ,  Y10T428/12674 ,  Y10T428/12681 ,  Y10T428/12743 ,  Y10T428/1275 ,  Y10T428/12778

摘要： A novel printed circuit board material in the form of a layered stock comprising an insulating support, at least one layer of electrical resistance material adhering to said support, and a layer of a highly conductive material adhering to the resistance material and in intimate contact therewith, said layer of electrical resistance material being selected from the group consisting of chromium-antimony, chromium-manganese, chromiumphosphorus, chromium-selenium, chromium-tellurium, cobaltantimony, cobalt-boron, cobalt-germanium, cobalt-indium, cobaltmolybdenum, cobalt-phosphorus, cobalt-rhenium, cobalt-ruthenium, cobalt-tungsten, cobalt-vanadium, iron-vanadium, nickel-antimony, nickel-boron, nickel-chromium, nickel-germanium, nickel-indium, nickel-molybdenum, nickel-phosphorus, nickel-rhenium, nickelvanadium and palladium-molybdenum.

摘要翻译： 一种分层原料形式的新型印刷电路板材料，包括绝缘支撑体，附着在所述支撑体上的至少一层电阻材料和附着在电阻材料上并与其紧密接触的高导电材料层， 所述电阻材料层选自铬 - 锑，铬 - 锰，铬 - 磷，铬 - 硒，铬 - 碲，钴 - 锑，钴 - 硼，钴 - 锗，钴 - 铟，钴 钼，钴 - 磷，钴 - 铼，钴钌，钴 - 钨，钴 - 钒，铁 - 钒，镍锑，镍 - 硼，镍 - 铬，镍 - 锗，镍 - 铟，镍 - 钼 ，镍 - 磷，镍 - 铼，镍 - 钒和钯 - 钼。

公开(公告)号：US3778530A

公开(公告)日：1973-12-11

申请号：US3778530D

申请日：1972-07-05

申请人： REIMANN W

发明人： REIMANN W

IPC分类号： H05K1/11 ,  H05K3/06 ,  H05K3/10 ,  H05K3/24 ,  H05K3/34 ,  H05K7/10

CPC分类号： H05K3/3421 ,  H05K1/111 ,  H05K3/062 ,  H05K3/064 ,  H05K3/108 ,  H05K3/243 ,  H05K7/1023 ,  H05K2201/0305 ,  H05K2201/0338 ,  H05K2201/09745 ,  H05K2201/10689 ,  H05K2203/0361 ,  H05K2203/0384 ,  H05K2203/048 ,  H05K2203/058 ,  H05K2203/167 ,  Y02P70/611 ,  Y02P70/613

摘要： A printed circuit board for mounting integrated circuit and resistor network packages commonly referred to as flatpack components and a process for fabricating the circuit board. The printed circuit board has a conductive pattern of electrical connection pads for connecting to electrical leads from flatpack components and electrical conductors for connecting the pads to circuitry external to the board. A channel for receiving and aligning each electrical lead from a flatpack component is formed by printed circuit techniques. The surface layer of each channel is formed of solder which simplifies the process of electrically connecting flatpack leads and reduces errors occuring in the soldering process.

摘要翻译： 用于安装通常称为扁平封装部件的集成电路和电阻器网络封装的印刷电路板以及用于制造电路板的工艺。 印刷电路板具有电连接焊盘的导电图案，用于连接到来自扁平封装部件和电导体的电引线，用于将焊盘连接到板外部的电路。 用于通过印刷电路技术形成用于从扁平封装部件接收和对准每个电引线的通道。 每个通道的表面层由焊料形成，这简化了电连接扁平封装引线的过程，并减少了焊接过程中发生的错误。

公开(公告)号：US3485665A

公开(公告)日：1969-12-23

申请号：US3485665D

申请日：1967-08-22

申请人： WESTERN ELECTRIC CO

发明人： ANGELO MICHAEL ANTHONY DE ,  SAGAL MATTHEW WARREN ,  SHARP DONALD JEX

IPC分类号： C23C18/16 ,  C23C18/30 ,  C25D5/02 ,  H01L49/02 ,  H05K3/24 ,  B44D1/18 ,  C23B5/50

CPC分类号： H05K3/243 ,  C23C18/1608 ,  C25D5/02 ,  H01L49/02 ,  H05K2201/0175 ,  H05K2201/0338 ,  H05K2203/0315 ,  H05K2203/0361 ,  H05K2203/0582 ,  H05K2203/072

公开(公告)号：US3240602A

公开(公告)日：1966-03-15

申请号：US12482861

申请日：1961-07-18

申请人： HONEYWELL INC

发明人： JOHNSTON DONALD C

IPC分类号： H05K1/16 ,  H05K3/04 ,  H05K3/06 ,  H05K3/14

CPC分类号： H05K1/167 ,  H05K3/048 ,  H05K3/06 ,  H05K3/143 ,  H05K2201/0317 ,  H05K2203/0361 ,  H05K2203/1184

公开(公告)号：US20240334599A1

公开(公告)日：2024-10-03

申请号：US18619348

申请日：2024-03-28

申请人： Taiyo Yuden Co., Ltd.

发明人： Takayuki Arai ,  Tomoo Kashiwa

IPC分类号： H05K1/11 ,  H05K1/18

CPC分类号： H05K1/111 ,  H05K1/181 ,  H05K2203/0361

摘要： Provided is an electronic component including a base body, a first internal element, a first external electrode, and a second external electrode. The first external electrode has a first outer metal layer and a first inner metal layer that is provided between the first outer metal layer and the first internal element, the second external electrode has a second outer metal layer and a second inner metal layer that is provided between the second outer metal layer and the first internal element, and the first inner metal layer has a lower laser absorption rate than any of the first outer metal layer and the second outer metal layer, and the second inner metal layer has a lower laser absorption rate than any of the first outer metal layer and the second outer metal layer.

公开(公告)号：US20240306296A1

公开(公告)日：2024-09-12

申请号：US18599671

申请日：2024-03-08

申请人： IBIDEN CO., LTD.

发明人： Toshiki FURUTANI ,  Masashi KUWABARA ,  Jun SAKAI ,  Takuya INISHI

IPC分类号： H05K1/11 ,  H05K1/03 ,  H05K3/16

CPC分类号： H05K1/115 ,  H05K1/0306 ,  H05K3/16 ,  H05K2201/0209 ,  H05K2201/0245 ,  H05K2201/0323 ,  H05K2201/09536 ,  H05K2203/0361

摘要： A wiring substrate includes a core substrate including a glass substrate and a through-hole conductor formed in the glass substrate, a resin insulating layer formed on the core substrate and including resin and inorganic particles, a conductor layer formed on the insulating layer and including a seed layer and an electrolytic plating layer, and a via conductor formed in the insulating layer such that the via conductor is electrically connected to the through-hole conductor formed in the glass substrate and includes the seed layer and electrolytic plating layer extending from the conductor layer. The conductor layer and the via conductor are formed such that the seed layer is formed by sputtering, and the resin insulating layer has an opening in which the via conductor is formed such that the inorganic particles include first particles forming an inner wall surface in the opening and second particles embedded in the insulating layer.

公开(公告)号：US09622352B2

公开(公告)日：2017-04-11

申请号：US14429741

申请日：2012-09-26

申请人： MEIKO ELECTRONICS CO., LTD.

发明人： Ryoichi Shimizu ,  Mitsuo Iwamoto ,  Mitsuaki Toda

IPC分类号： H05K3/30 ,  H05K1/18 ,  H05K1/11 ,  H05K1/02 ,  H05K1/09

CPC分类号： H05K1/188 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/544 ,  H01L24/19 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L2221/68359 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/04105 ,  H01L2224/2741 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/32245 ,  H01L2224/82039 ,  H01L2224/82132 ,  H01L2224/83005 ,  H01L2224/83132 ,  H01L2224/8314 ,  H01L2224/83192 ,  H01L2224/92144 ,  H01L2924/14 ,  H05K1/0269 ,  H05K1/0284 ,  H05K1/09 ,  H05K1/115 ,  H05K3/305 ,  H05K3/4007 ,  H05K2201/0335 ,  H05K2201/09154 ,  H05K2201/0939 ,  H05K2201/09472 ,  H05K2201/09918 ,  H05K2203/0353 ,  H05K2203/0361 ,  H05K2203/063 ,  Y02P70/613 ,  Y10T29/49131

摘要： In a mark forming step in a manufacturing method for a component incorporated substrate in which an electronic component is positioned with reference to a mark formed in a copper layer, when an imaginary line extending from a search center of a search range of a sensor, to an edge side of the search range is represented as a search reference line and an imaginary line extending, in a state in which a mark center, is matched with the search center, from the mark center in the same direction as the search reference line to an outer ridgeline of the mark is represented as a mark reference line, the mark formed in a shape in which the outer ridgeline of the mark is present in a position where a length of the mark reference line is in a range of 30% or more of the search reference line.