公开(公告)号：US09510447B2

公开(公告)日：2016-11-29

申请号：US14799860

申请日：2015-07-15

申请人： IBIDEN CO., LTD.

发明人： Toshiki Furutani ,  Yasushi Inagaki

IPC分类号： H05K1/09 ,  H05K1/11 ,  H05K3/10 ,  H05K3/40 ,  H05K3/00

CPC分类号： H05K1/09 ,  H05K1/0271 ,  H05K1/111 ,  H05K1/115 ,  H05K3/0017 ,  H05K3/103 ,  H05K3/205 ,  H05K3/4007 ,  H05K3/4038 ,  H05K2201/0341 ,  H05K2201/094 ,  H05K2203/0384 ,  Y02P70/611

摘要： A printed wiring board includes an insulation layer, a first conductive layer embedded into first surface of the insulation layer, a second conductive layer formed on second surface of the insulation layer, a via conductor penetrating through the insulation layer and electrically connecting the first and second layers, and a solder-resist layer covering the first layer and having an opening structure forming an exposed structure of the first layer. The exposed structure is formed to connect an electronic component to the first layer, and the first layer has a barrier-metal layer and a metal layer on the first layer such that the barrier-metal layer is on surface of the first layer and includes metal different from metal forming the metal layer and that the metal layer is on surface of the barrier-metal layer in the exposed structure and protruding from the first surface of the insulation layer.

摘要翻译： 印刷布线板包括绝缘层，嵌入绝缘层的第一表面中的第一导电层，形成在绝缘层的第二表面上的第二导电层，穿过绝缘层的通孔导体，并将第一和第二 层，以及覆盖第一层并具有形成第一层的暴露结构的开口结构的阻焊层。 形成暴露结构以将电子部件连接到第一层，并且第一层在第一层上具有阻挡金属层和金属层，使得阻挡金属层在第一层的表面上并且包括金属 与形成金属层的金属不同，并且金属层位于暴露结构中的阻挡金属层的表面上并且从绝缘层的第一表面突出。

公开(公告)号：US09491853B2

公开(公告)日：2016-11-08

申请号：US14486815

申请日：2014-09-15

申请人： Sinovia Technologies

发明人： Whitney Gaynor ,  George Burkhard

IPC分类号： H05K1/09 ,  H05K1/02 ,  H05K1/03 ,  H05K3/10 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/00 ,  G03F7/004 ,  G03F7/16 ,  H01B1/22 ,  G06F3/044 ,  H01L51/44 ,  H01L51/52 ,  G03F7/038 ,  B82Y20/00

CPC分类号： G06F3/041 ,  B05D3/007 ,  B82Y10/00 ,  B82Y20/00 ,  B82Y40/00 ,  G03F1/24 ,  G03F7/0002 ,  G03F7/0047 ,  G03F7/038 ,  G03F7/0388 ,  G03F7/161 ,  G06F3/044 ,  G06F2203/04103 ,  H01B1/22 ,  H01B5/14 ,  H01B13/0013 ,  H01L51/444 ,  H01L51/5203 ,  H05K1/0271 ,  H05K1/0274 ,  H05K1/036 ,  H05K1/09 ,  H05K3/103 ,  H05K2201/0108 ,  H05K2201/0137 ,  H05K2203/10 ,  Y10T428/24355 ,  Y10T442/188 ,  Y10T442/191

摘要： A composite conductive film is provided that includes a layer of cross-linked polymer having a surface and an inorganic mesh comprising a plurality of inorganic nanowires. The plurality of inorganic nanowires is embedded throughout at least a region of the layer of cross-linked polymer. The region is continuous from the surface of the layer of cross-linked polymer. The layer of cross-linked polymer and the inorganic mesh are arranged to form the composite conductive film. The composite conductive film has a pencil test hardness in a range of 2H to 9H.

摘要翻译： 提供一种复合导电膜，其包括具有表面的交联聚合物层和包含多个无机纳米线的无机网。 多个无机纳米线被嵌入到交联聚合物层的至少一个区域内。 该区域从交联聚合物层的表面连续。 布置交联聚合物层和无机网以形成复合导电膜。 复合导电膜的铅笔测试硬度在2H〜9H的范围内。

公开(公告)号：US20160272132A1

公开(公告)日：2016-09-22

申请号：US15034446

申请日：2014-10-15

申请人： SUMITOMO WIRING SYSTEMS, LTD. ,  AutoNetworks Technologies, Ltd. ,  Sumitomo Electric Industries, Ltd.

发明人： Yoshikazu HACHIYA

IPC分类号： B60R16/03 ,  H02G3/08

CPC分类号： B60R16/03 ,  B60R16/0239 ,  H02G3/081 ,  H02G3/088 ,  H05K1/0256 ,  H05K1/0265 ,  H05K3/103 ,  H05K3/24 ,  H05K3/4617 ,  H05K3/4626 ,  H05K2201/09063 ,  H05K2201/09945 ,  H05K2201/10272

摘要： Provided is an electrical junction box having a novel structure capable of preventing vehicle fire after the infiltration of water without depending on a waterproofing structure of the electrical junction box. An electrical junction box includes a bus bar circuit unit obtained by arranging a plurality of bus bars including a power source-side bus bar to be connected to a power source line and a ground-side bus bar to be connected to a ground line on insulated boards. In the electrical junction box, the power source-side bus bar and the ground-side bus bar are arranged adjacent to each other, and an oxide deposition inhibiting structure is provided in exposed portions of the insulated board exposed through a gap between the power source-side bus bar and the ground-side bus bar.

摘要翻译： 本发明提供一种具有新颖结构的电接线盒，其能够在不依赖于电接线盒的防水结构的情况下防止水渗透后的车辆起火。 电接线盒包括汇流条电路单元，其通过布置多个汇流条而获得，所述汇流条包括要连接到电源线的电源侧汇流条和要与绝缘的地线连接的接地侧汇流条 董事会 在电接线盒中，电源侧汇流条和接地侧汇流条彼此相邻布置，并且在绝缘板的暴露部分中设置氧化物沉积抑制结构，该绝缘板通过电源 旁边的巴士酒吧和地面侧的巴士吧。

公开(公告)号：US20160270217A1

公开(公告)日：2016-09-15

申请号：US15052527

申请日：2016-02-24

申请人： Samsung Display Co., Ltd.

发明人： Sang-il Park ,  Hyun joon Oh ,  Hye-jin Oh ,  Jeoungsub Lee ,  Min-hoon Choi

IPC分类号： H05K1/02 ,  G01R27/02 ,  G01L1/00 ,  H05K5/00

CPC分类号： H05K1/0283 ,  B32B2457/20 ,  B32B2457/202 ,  B32B2457/206 ,  C09J7/00 ,  C09J2201/626 ,  C09J2203/318 ,  G02F1/133305 ,  G02F2202/28 ,  G09F15/00 ,  H05K1/0284 ,  H05K1/09 ,  H05K3/103 ,  H05K5/0017 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/097 ,  H05K2201/10022 ,  H05K2201/10151 ,  Y10T428/1059 ,  Y10T428/1068 ,  Y10T428/1086

摘要： A display device is disclosed. In one aspect, the display device includes a flexible display configured to display an image and a flexible adhesive layer formed on a side of the display and configured to adhere the display to an object that is not part of the display device. The adhesive layer includes a base layer and a plurality of adhesive projections extending from an outer surface of the base layer and configured to be adhered to the object.

摘要翻译： 公开了一种显示装置。 一方面，显示装置包括被配置为显示图像的柔性显示器和形成在显示器的一侧上的柔性粘合剂层，并且被配置为将显示器粘附到不是显示装置的一部分的对象。 粘合剂层包括基底层和从基底层的外表面延伸并被构造成粘附到物体上的多个粘合突起。

公开(公告)号：US20160262268A1

公开(公告)日：2016-09-08

申请号：US14639789

申请日：2015-03-05

申请人： Invensas Corporation

发明人： Reynaldo CO ,  Grant VILLAVICENCIO ,  Wael ZOHNI

IPC分类号： H05K3/10 ,  H05K1/02 ,  H05K3/00 ,  B29C45/14

CPC分类号： H05K3/103 ,  B29C45/14065 ,  B29C45/14221 ,  B29C45/14655 ,  B29C45/14754 ,  B29C2045/1477 ,  B29L2031/3425 ,  H01L21/566 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H05K1/0296 ,  H05K3/0014 ,  H05K2201/10757 ,  H05K2201/10818 ,  H01L2924/00014 ,  H01L2924/00012

摘要： In a method for forming a microelectronic device, a substrate is loaded into a mold press. The substrate has a first surface and a second surface. The second surface is placed on an interior lower surface of the mold press. The substrate has a plurality of wire bond wires extending from the first surface toward an interior upper surface of the mold press. An upper surface of a mold film is indexed to the interior upper surface of the mold press. A lower surface of the mold film is punctured with tips of the plurality of wire bond wires for having the tips of the plurality of wire bond wires extending above the lower surface of the mold film into the mold film. The tips of the plurality of wire bond wires are pressed down toward the lower surface of the mold film to bend the tips over.

摘要翻译： 在形成微电子器件的方法中，将基底装载到模压机中。 基板具有第一表面和第二表面。 第二表面放置在模压机的内下表面上。 衬底具有从第一表面延伸到模压机的内部上表面的多个引线接合线。 模具膜的上表面被分配到模压机的内部上表面。 模具薄膜的下表面被多根线接合线的尖端刺穿，使得多个线接合线的顶端在模具薄膜的下表面上延伸到模制薄膜中。 多个线接合线的尖端朝向模制薄膜的下表面压下以使尖端弯曲。

公开(公告)号：US20160184141A1

公开(公告)日：2016-06-30

申请号：US14982645

申请日：2015-12-29

申请人： ElastiMed Ltd.

发明人： Omer Zelka

IPC分类号： A61F13/08 ,  H05K3/10 ,  H05K3/20 ,  H05K3/00

CPC分类号： H05K3/207 ,  A61B17/1322 ,  A61B2017/00402 ,  A61F13/085 ,  B29C53/04 ,  B29C55/14 ,  B32B3/06 ,  B32B3/08 ,  B32B27/08 ,  B32B2255/10 ,  B32B2264/105 ,  B32B2264/108 ,  B32B2307/202 ,  B32B2307/514 ,  B32B2307/518 ,  B32B2307/5825 ,  B32B2307/75 ,  B32B2535/00 ,  H01L41/0478 ,  H01L41/053 ,  H01L41/193 ,  H01L41/253 ,  H01L41/29 ,  H05K3/0044 ,  H05K3/103 ,  H05K2203/12 ,  H05K2203/163

摘要： In some embodiments, the present invention is directed to an actuator which includes at least the following: a pre-stretched electro-active polymer film being pre-stretched in a single or biaxial planar directions; at least one first semi-stiff conductor attached to a first surface of the pre-stretched electro-active polymer film, wherein the first surface is parallel to the single or biaxial planar stretch directions; at least one second semi-stiff conductor attached to a second surface of the pre-stretched electro-active polymer film, wherein the second surface is opposite to the first surface; where the semi-stiff conductors are configured to: fix the pre-stretched electro-active polymer film in a pre-stretched state and allow the pre-stretched electro-active polymer film to expand; a pair of mechanical connectors coupled to each end of an active region of the pre-stretched electro-active polymer film.

公开(公告)号：US20160183400A1

公开(公告)日：2016-06-23

申请号：US14701940

申请日：2015-05-01

申请人： Bothhand Enterprise Inc.

发明人： Yung-Ming PAN ,  Chung-Cheng FAN

IPC分类号： H05K7/02 ,  H05K5/03

CPC分类号： H05K7/026 ,  H01F27/02 ,  H01F27/04 ,  H01L25/105 ,  H05K3/103 ,  H05K5/03 ,  H05K2201/1003

摘要： An electronic device package box includes a first base unit including a first base and multiple first connecting pins, and a second base unit including a second base and multiple second connecting pins inserted into the first and second bases. The first base has a first abutment surface and a first pin-protruding surface. Each of the first connecting pins has a first wire-connecting portion projecting from the first pin-protruding surface. The second base has a second abutment surface abutting against the first abutment surface, and a second pin-protruding surface. Each of the second connecting pins has a second wire-connecting portion projecting from the second pin-protruding surface and a protrusion portion projecting from the first pin-protruding surface.

摘要翻译： 一种电子设备封装盒包括：第一基座单元，包括第一基座和多个第一连接引脚;以及第二基座单元，包括插入第一和第二基座中的第二基座和多个第二连接引脚。 第一基座具有第一邻接表面和第一销突出表面。 每个第一连接销具有从第一销突出表面突出的第一线连接部分。 第二基座具有抵靠第一邻接表面的第二抵接表面和第二销突出表面。 每个第二连接销具有从第二销突出表面突出的第二线连接部分和从第一销突出表面突出的突出部分。

公开(公告)号：US20150356399A1

公开(公告)日：2015-12-10

申请号：US14714290

申请日：2015-05-16

申请人： David Finn ,  Jan Thomas Czornack

发明人： David Finn ,  Jan Thomas Czornack

IPC分类号： G06K19/077

CPC分类号： G06K19/07794 ,  G06K19/07769 ,  G06K19/07783 ,  H01F38/14 ,  H01Q1/2216 ,  H01Q1/2225 ,  H01Q1/2283 ,  H01Q7/00 ,  H01Q21/29 ,  H05K1/165 ,  H05K3/103 ,  H05K2201/10098 ,  Y10T29/49018 ,  Y10T29/49162

摘要： A booster antenna (BA) for a smart card comprises a card antenna (CA) component extending around a periphery of a card body (CB), a coupler coil (CC) component at a location for an antenna module (AM), and an extension antenna (EA) contributing to the inductance of the booster antenna (BA). A method of wire embedding is also disclosed, by controlling a force and ultrasonic power applied by an embedding tool at different positions on the card body (CB).

摘要翻译： 用于智能卡的增强天线（BA）包括围绕卡体（CB）的周边延伸的卡片天线（CA）部件，在天线模块（AM）的位置处的耦合线圈（CC）部件，以及 扩展天线（EA）有助于增强天线（BA）的电感。 还公开了一种通过控制由嵌入工具在卡体（CB）上的不同位置施加的力和超声功率的电线嵌入方法。

公开(公告)号：US20150265214A1

公开(公告)日：2015-09-24

申请号：US14284532

申请日：2014-05-22

申请人： Samsung Electronics Co., Ltd.

发明人： Margreet De Kok ,  Lindsay Brown ,  Gert Van Heck ,  Sheldon George Phillips ,  Joseph J. Kopp, JR.

IPC分类号： A61B5/00 ,  H05K3/10 ,  A61B5/1455 ,  A61B5/0205 ,  A61B5/0408

CPC分类号： A61B5/6843 ,  A61B5/0015 ,  A61B5/0205 ,  A61B5/0408 ,  A61B5/14552 ,  A61B5/681 ,  A61B5/742 ,  A61B5/7475 ,  H05K1/189 ,  H05K3/103 ,  H05K2201/10151 ,  Y10T29/49155 ,  Y10T29/49826

摘要： Exemplary embodiments provide an adjustable sensor support structure for optimal skin contact. Aspects of the exemplary embodiments include a sensor array comprising a plurality of sensor units arranged on a band such that the sensor array straddles or otherwise addresses a blood vessel when worn on a measurement site of a user; and a pressure exertion apparatus attached between the sensor units and the band that exerts outward pressure on the sensor units towards the measurement site causing the sensor units to maintain contact with skin of the user independent of motion activity of the band, thereby improving contact quality, wherein the pressure exertion apparatus comprises at least one of: a flexible bridge structure, a flexible foam structure, and a sensor trampoline structure.

摘要翻译： 示例性实施例提供了用于最佳皮肤接触的可调传感器支撑结构。 示例性实施例的方面包括传感器阵列，其包括布置在带上的多个传感器单元，使得传感器阵列在佩戴在用户的测量位置时跨过或以其他方式解决血管; 以及附着在传感器单元和带之间的压力消耗装置，所述带在传感器单元上​​朝向测量位置施加向外的压力，导致传感器单元与带的运动活动无关地保持与使用者皮肤的接触，从而提高接触质量， 其中所述压力消耗装置包括柔性桥结构，柔性泡沫结构和传感器蹦床结构中的至少一个。

公开(公告)号：US20150264817A1

公开(公告)日：2015-09-17

申请号：US14723520

申请日：2015-05-28

申请人： IBIDEN CO., LTD.

发明人： Makoto TERUI ,  Daiki KOMATSU ,  Masatoshi KUNIEDA ,  Takashi KARIYA

IPC分类号： H05K3/30 ,  H01L23/00 ,  H05K3/32 ,  H05K3/20 ,  H05K3/10 ,  H05K3/46 ,  H01L25/00 ,  H01L23/498

CPC分类号： H05K3/305 ,  H01L21/563 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49894 ,  H01L23/5382 ,  H01L23/5383 ,  H01L23/5384 ,  H01L24/03 ,  H01L24/16 ,  H01L24/81 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2924/12042 ,  H01L2924/1436 ,  H01L2924/15192 ,  H01L2924/15311 ,  H05K1/115 ,  H05K3/10 ,  H05K3/103 ,  H05K3/20 ,  H05K3/32 ,  H05K3/4602 ,  H05K3/4658 ,  H05K3/4694 ,  H05K2201/10159 ,  H05K2201/10378 ,  H05K2201/1053 ,  Y10T29/49128 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2924/014

摘要： A method for manufacturing a wiring board includes positioning on a first insulation layer a wiring structure including an insulation layer and conductive patterns formed on the insulation layer, forming a second insulation layer on the first insulation layer and the wiring structure such that the wiring structure is interposed between the first insulation layer and the second insulation layer, forming a via conductor through the second insulation layer, and forming conductive patterns on the second insulation layer such that one of the conductive patterns on the second insulation layer is connected to the via conductor in the second insulation layer.

摘要翻译： 一种布线基板的制造方法，其特征在于，在第一绝缘层上具有绝缘层和形成于绝缘层上的导电图案的布线结构，在第一绝缘层和布线结构上形成第二绝缘层，使布线结构为 插入在第一绝缘层和第二绝缘层之间，通过第二绝缘层形成通孔导体，并且在第二绝缘层上形成导电图案，使得第二绝缘层上的导电图案之一连接到通孔导体 第二绝缘层。