公开(公告)号：US10224229B2

公开(公告)日：2019-03-05

申请号：US15215658

申请日：2016-07-21

Applicant: International Business Machines Corporation

Inventor： Paul S. Andry ,  Russell A. Budd ,  Bing Dang ,  Li-Wen Hung ,  John U. Knickerbocker ,  Cornelia Kang-I Tsang

IPC: B23K26/57 ,  B32B43/00 ,  H01L21/683 ,  H01L21/67 ,  H01L21/78 ,  H01L23/544

Abstract: A bonded structure contains a substrate containing at least one feature, the substrate having a top surface; a first release layer overlying the top surface of the substrate, the first release layer being absorptive of light having a first wavelength for being decomposed by the light; an adhesive layer overlying the first release layer, and a second release layer overlying the adhesive layer. The second release layer is absorptive of light having a second wavelength for being decomposed by the light having the second wavelength. The bonded structure further contains a handle substrate that overlies the second release layer, where the handle substrate is substantially transparent to the light having the first wavelength and the second wavelength. Also disclosed is a debonding method to process the bonded structure to remove and reclaim the adhesive layer for re-use. In another embodiment a multi-step method optically cuts and debonds a bonded structure.

公开(公告)号：US20180323473A1

公开(公告)日：2018-11-08

申请号：US15802109

申请日：2017-11-02

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Qianwen Chen ,  Bing Dang ,  John U. Knickerbocker

IPC: H01M10/0585 ,  A61B5/00 ,  H01M10/0525

CPC classification number: H01M10/0585 ,  A61B5/681 ,  A61B5/6861 ,  A61B2560/0214 ,  H01M10/0525 ,  H01M2220/30

Abstract: A method for integrating a thin film microbattery with electronic circuitry includes forming a release layer over a handler, forming a thin film microbattery over the release layer of the handler, removing the thin film microbattery from the handler, depositing the thin film microbattery on an interposer, forming electronic circuitry on the interposer, and sealing the thin film microbattery and the electronic circuitry to create individual microbattery modules.

公开(公告)号：US20180182672A1

公开(公告)日：2018-06-28

申请号：US15903973

申请日：2018-02-23

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  Jeffrey D. Gelorme ,  John U. Knickerbocker

IPC: H01L21/78 ,  H01L23/31 ,  H01L23/00 ,  H01L23/29 ,  H01L23/48

CPC classification number: H01L21/7813 ,  H01L21/561 ,  H01L21/568 ,  H01L23/293 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/481 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L24/19 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/02331 ,  H01L2224/02335 ,  H01L2224/02379 ,  H01L2224/0239 ,  H01L2224/03002 ,  H01L2224/03416 ,  H01L2224/03452 ,  H01L2224/03515 ,  H01L2224/03831 ,  H01L2224/04105 ,  H01L2224/05008 ,  H01L2224/05147 ,  H01L2224/12105 ,  H01L2224/1301 ,  H01L2224/13024 ,  H01L2224/13025 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13118 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16235 ,  H01L2224/24137 ,  H01L2224/73267 ,  H01L2224/81005 ,  H01L2224/94 ,  H01L2924/15192 ,  H01L2924/15311

Abstract: A support structure for use in fan-out wafer level packaging is provided that includes, a silicon handler wafer having a first surface and a second surface opposite the first surface, a release layer is located above the first surface of the silicon handler wafer, and a layer selected from the group consisting of an adhesive layer and a redistribution layer is located on a surface of the release layer. After building-up a fan-out wafer level package on the support structure, infrared radiation is employed to remove (via laser ablation) the release layer, and thus remove the silicon handler wafer from the fan-out wafer level package.

公开(公告)号：US09953501B2

公开(公告)日：2018-04-24

申请号：US15466122

申请日：2017-03-22

Applicant: International Business Machines Corporation

Inventor： Paul S. Andry ,  Monty Montague Denneau ,  John U. Knickerbocker ,  Robert L. Wisnieff

IPC: G06K19/077 ,  G08B13/24 ,  H01L31/054 ,  H01L23/544 ,  H01L23/66 ,  H01L21/78

CPC classification number: G08B13/244 ,  G06K19/0704 ,  G06K19/0707 ,  G06K19/0716 ,  G06K19/0717 ,  G06K19/0723 ,  G06K19/07749 ,  G06K19/0775 ,  G06K19/07775 ,  H01L21/78 ,  H01L23/544 ,  H01L23/66 ,  H01L31/0547 ,  H01L2223/54426 ,  H01L2223/6677

Abstract: A method comprises forming a structure, the structure comprising at least one of a wafer, a panel and a roll to roll structure and forming a plurality of integrated circuit chips from the structure. At least a given one of the plurality of integrated circuit chips or a heterogeneous integrated sub-component thereof forms a smart tag comprising a processor, a non-volatile memory, an internal power source, and a transceiver configured for two-way communication with a reader external to the smart tag. The given integrated circuit chip less than 10 cubic millimeters in size.

公开(公告)号：US09947567B2

公开(公告)日：2018-04-17

申请号：US14747670

申请日：2015-06-23

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Bing Dang ,  Jeffrey D. Gelorme ,  John U. Knickerbocker

IPC: H01L21/30 ,  H01L21/46 ,  H01L21/683 ,  C08K3/04 ,  C09J9/00 ,  C09J171/12 ,  H01L21/02 ,  C08G59/06 ,  C09J163/00 ,  C09J171/00 ,  C08L63/00

CPC classification number: H01L21/6835 ,  C08G59/063 ,  C08G2650/56 ,  C08K3/04 ,  C08L63/00 ,  C08L71/00 ,  C09J9/00 ,  C09J163/00 ,  C09J171/00 ,  C09J171/12 ,  H01L21/02052 ,  H01L21/02057 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2221/68386

Abstract: A bonding material including a phenoxy resin thermoplastic component, and a carbon black filler component. The carbon black filler component is present in an amount greater than 1 wt. %. The carbon black filler converts the phenoxy resin thermoplastic component from a material that transmits infra-red (IR) wavelengths to a material that absorbs a substantial portion of infra-red (IR) wavelengths.

公开(公告)号：US09941250B2

公开(公告)日：2018-04-10

申请号：US15403430

申请日：2017-01-11

Applicant: International Business Machines Corporation

Inventor： Thomas J. Brunschwiler ,  Evan G. Colgan ,  John U. Knickerbocker ,  Bruno Michael ,  Chin Lee Ong ,  Cornelia K. Tsang

IPC: H05K7/20 ,  H01L25/065 ,  H01L25/00 ,  H01L23/427

CPC classification number: H05K7/20381 ,  H01L23/367 ,  H01L23/427 ,  H01L23/49816 ,  H01L25/0657 ,  H01L25/50 ,  H01L29/0657 ,  H01L2224/13025 ,  H01L2224/14181 ,  H01L2224/16146 ,  H01L2224/81141 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06582 ,  H01L2225/06589 ,  H01L2225/06593 ,  H05K7/20309 ,  H05K7/20327

Abstract: A package structure to implement two-phase cooling includes a chip stack disposed on a substrate, and a package lid that encloses the chip stack. The chip stack includes a plurality of conjoined chips, a central inlet manifold formed through a central region of the chip stack, and a peripheral outlet manifold. The central input manifold includes inlet nozzles to feed liquid coolant into flow cavities formed between adjacent conjoined chips. The peripheral outlet manifold outputs heated liquid and vapor from the flow cavities. The package lid includes a central coolant supply inlet aligned to the central inlet manifold, and a peripheral liquid-vapor outlet to output heated liquid and vapor that exits from the peripheral outlet manifold. Guiding walls may be included in the flow cavities to guide a flow of liquid and vapor, and the guiding walls can be arranged to form radial flow channels that are feed by different inlet nozzles of the central inlet manifold.

公开(公告)号：US20180098432A1

公开(公告)日：2018-04-05

申请号：US15821432

申请日：2017-11-22

Applicant: International Business Machines Corporation

Inventor： Paul S. Andry ,  Qianwen Chen ,  Bing Dang ,  John U. Knickerbocker ,  Minhua Lu ,  Robert J. Polastre ,  Bucknell C. Webb

IPC: H05K1/18 ,  H05K1/02 ,  H05K3/00 ,  H05K1/11 ,  H05K3/30 ,  H05K1/03 ,  H05K3/34

CPC classification number: H05K1/189 ,  G01R31/2818 ,  G01R31/309 ,  G01R31/44 ,  H05K1/0268 ,  H05K1/0274 ,  H05K1/0393 ,  H05K1/111 ,  H05K3/0026 ,  H05K3/0052 ,  H05K3/305 ,  H05K3/341 ,  H05K3/3494 ,  H05K13/0069 ,  H05K2201/09072 ,  H05K2201/10015 ,  H05K2201/10037 ,  H05K2201/1006 ,  H05K2201/10098 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10522 ,  H05K2203/107 ,  H05K2203/162

Abstract: An electro-optical module assembly is provided that includes a flexible substrate having a first surface and a second surface opposite the first surface, wherein the flexible substrate contains an opening located therein that extends from the first surface to the second surface. An optical component is located on the second surface of the flexible substrate and is positioned to have a surface exposed by the opening. At least one electronic component is located on a first portion of the first surface of the flexible substrate, and at least one micro-energy source is located on a second portion of the first surface of the flexible substrate.

公开(公告)号：US09935009B2

公开(公告)日：2018-04-03

申请号：US15085099

申请日：2016-03-30

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  Jeffrey D. Gelorme ,  John U. Knickerbocker

IPC: H01L21/78 ,  H01L23/00 ,  H01L23/31 ,  H01L23/29 ,  H01L23/48

CPC classification number: H01L21/7813 ,  H01L21/561 ,  H01L21/568 ,  H01L23/293 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/481 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L24/19 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/02331 ,  H01L2224/02335 ,  H01L2224/02379 ,  H01L2224/0239 ,  H01L2224/03002 ,  H01L2224/03416 ,  H01L2224/03452 ,  H01L2224/03515 ,  H01L2224/03831 ,  H01L2224/04105 ,  H01L2224/05008 ,  H01L2224/05147 ,  H01L2224/12105 ,  H01L2224/1301 ,  H01L2224/13024 ,  H01L2224/13025 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13118 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16235 ,  H01L2224/24137 ,  H01L2224/73267 ,  H01L2224/81005 ,  H01L2224/94 ,  H01L2924/15192 ,  H01L2924/15311

Abstract: A support structure for use in fan-out wafer level packaging is provided that includes, a silicon handler wafer having a first surface and a second surface opposite the first surface, a release layer is located above the first surface of the silicon handler wafer, and a layer selected from the group consisting of an adhesive layer and a redistribution layer is located on a surface of the release layer. After building-up a fan-out wafer level package on the support structure, infrared radiation is employed to remove (via laser ablation) the release layer, and thus remove the silicon handler wafer from the fan-out wafer level package.

公开(公告)号：US20180052377A1

公开(公告)日：2018-02-22

申请号：US15239972

申请日：2016-08-18

Applicant: International Business Machines Corporation

Inventor： Michael S. Gordon ,  John U. Knickerbocker ,  Minhua Lu ,  Robert Polastre

IPC: G02F1/29 ,  G02F1/1343 ,  G02B3/12 ,  G02F1/137

CPC classification number: G02F1/29 ,  G02B3/12 ,  G02F1/13439 ,  G02F1/137

Abstract: A lens structure includes a transparent cell containing a liquid crystal material. The cell is thicker in a center region thereof than at peripheral regions. The structure further includes transparent electrically conductive electrodes coupled with opposing top and bottom surfaces of the cell and configured to establish an electric field through the cell that is strongest at the peripheral regions where the cell is thinner relative to the center region so that a value of the index of refraction of the liquid crystal material changes across the cell from the center region towards the peripheral regions to change an effective focal length of the lens structure. In some embodiments the top surface of the cell has a first curvature C1 and the bottom surface of the cell has a second curvature C2 that differs from the first curvature.

公开(公告)号：US09900677B2

公开(公告)日：2018-02-20

申请号：US14974860

申请日：2015-12-18

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Li-Wen Hung ,  John U. Knickerbocker

IPC: H04R1/04 ,  A61B5/02 ,  A61B5/00 ,  A61B7/00 ,  A61B5/024 ,  H04R19/01

CPC classification number: H04R1/04 ,  A61B5/0022 ,  A61B5/02 ,  A61B5/02028 ,  A61B5/02438 ,  A61B5/02444 ,  A61B5/6833 ,  A61B7/00 ,  A61B2560/0214 ,  A61B2560/0412 ,  A61B2562/0204 ,  A61B2562/0271 ,  A61B2562/028 ,  A61B2562/12 ,  A61B2562/164 ,  A61B2562/166 ,  H04R19/016 ,  H04R2201/003 ,  H04R2420/07

Abstract: A wearable monitoring system includes a microelectromechanical (MEMS) microphone to receive acoustic signal data through skin of a user. An integrated circuit chip is bonded to and electrically connected to the MEMS microphone. A portable power source is connected to at least the integrated circuit chip. A flexible substrate is configured to encapsulate and affix the MEMS microphone and the integrated circuit chip to the skin of the user.