利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

174 条记录 (耗时 0.025 秒)

    ULTRA WIDEBAND SYSTEM-ON-PACKAGE AND METHOD OF MANUFACTURING THE SAME
    82.
    发明申请
    ULTRA WIDEBAND SYSTEM-ON-PACKAGE AND METHOD OF MANUFACTURING THE SAME 有权
    超宽带系统封装及其制造方法

    公开(公告)号：US20100102425A1

    公开(公告)日：2010-04-29

    申请号：US12604354

    申请日：2009-10-22

    申请人： In-Kwon JU ,  In-Bok Yom ,  Ho-Jin Lee

    发明人： In-Kwon JU ,  In-Bok Yom ,  Ho-Jin Lee

    IPC分类号： H01L23/52 ,  H01L21/70

    CPC分类号： H01L23/66 ,  H01L23/552 ,  H01L2223/6616 ,  H01L2223/6622 ,  H01L2223/6627 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/1423 ,  H01L2924/19032 ,  H01L2924/19033 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

    摘要： This research discloses an ultra wideband system-on-package (SoP). The SoP includes a package body; a first integrated circuit mounted on the package body; a first signal transmission unit connected to the first integrated circuit; a signal via connected to the first signal transmission unit and including a slab line and a trough line; and a second signal transmission unit connected to the signal via. The technology of the present research can transmit ultra broadband signals by minimizing discontinuity of signals appearing during vertical transition that occurs in the course of a signal transmission to/from an external circuit, and a fabrication method thereof.

    摘要翻译： 该研究公开了一种超宽带系统级封装（SoP）。 SoP包括一个包装体; 安装在封装主体上的第一集成电路; 连接到第一集成电路的第一信号传输单元; 连接到第一信号传输单元并包括板条线和槽线的信号通路; 以及连接到信号通道的第二信号传输单元。 本研究的技术可以通过最小化在向外部电路传输信号的过程中发生的垂直转换期间出现的信号的不连续性来传输超宽带信号及其制造方法。

    High speed electronics interconnect and method of manufacture
    89.
    发明授权
    High speed electronics interconnect and method of manufacture 有权

    公开(公告)号：US07372144B2

    公开(公告)日：2008-05-13

    申请号：US10793576

    申请日：2004-03-04

    申请人： Achyut Dutta

    发明人： Achyut Dutta

    IPC分类号： H01L21/00

    CPC分类号： H01L23/66 ,  H01L23/5383 ,  H01L25/0655 ,  H01L2223/6627 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/13091 ,  H01L2924/1903 ,  H01L2924/19032 ,  H01L2924/19033 ,  H01L2924/3011 ,  H01P1/2005 ,  H01P3/08 ,  H05K1/0224 ,  H05K1/0236 ,  H05K1/024 ,  H05K1/0253 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/0313 ,  H05K2201/0187 ,  H05K2201/0191 ,  H05K2201/0715 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/09681 ,  Y02P80/30 ,  H01L2924/00 ,  H01L2224/05599

    摘要： Fundamental interconnect systems for connecting high-speed electronics elements are provided. Interconnect system has the means, which could reduce the microwave loss by reducing the effective dielectric loss and dielectric constant of the interconnect system, and increase the bandwidth of the interconnects and also reduce the signal propagation delay, respectively. Ideally, the speed of the electrical signal on the signal line can be reached to speed of the light in the air, and the bandwidth can be reached to closer to the optical fiber. The interconnect systems consists of the signal line, dielectric system with opened trench or slot filled up with the air or lower dielectric loss material, and the ground plan. The signal line proposed in this invention could be made any type of signal line configuration for example, microstripline, strip line or coplanar line. The signal line can also be made as single ended or differential pairs of any configurations. The interconnect system based on the fundamental techniques provided in this invention, can be used for on-chip interconnects where the high speed electronics devices are connected by the signal line laid on the oxide or dielectric material. Again, the interconnect system based on the fundamental techniques provided in this invention, can also be used for off-chip interconnects (chip-to-chip interconnects), where the whole portion or portion of the PCB on which high speed chips are to be connected, are having the dielectric system with opened trench or slot to reduce the microwave loss. High scale chip-to-chip interconnection using of the multilayered PCB is possible. The fundamental techniques provided in this invention can also be used for high-speed connectors and high-speed cables. The main advantages of this invention are to make high speed interconnects systems for on-chip and off-chip interconnects. More over, this fundamental technology is also used for the high sped die package, high speed connector, and high speed cables where conventional manufacturing technology can be used and yet to increase the bandwidth of the interconnects.

    HIGH FREQUENCY MODULE
    90.
    发明申请
    HIGH FREQUENCY MODULE 有权
    高频模块

    公开(公告)号：US20070232247A1

    公开(公告)日：2007-10-04

    申请号：US11535329

    申请日：2006-09-26

    申请人： Fumio YAMAMOTO

    发明人： Fumio YAMAMOTO

    IPC分类号： H01Q11/12

    CPC分类号： H01P1/047 ,  H01L23/552 ,  H01L23/66 ,  H01L25/165 ,  H01L2223/6627 ,  H01L2924/0002 ,  H01L2924/19032 ,  H01L2924/3011 ,  H01L2924/00

    摘要： A high frequency module includes: a line substrate having a first high-frequency signal line on a first surface thereof and a second high-frequency signal line on a second surface being a surface on the opposite side of the first surface, the second high-frequency signal line being electrically connected with the first high-frequency signal line; and a base substrate which is provided to the second surface of the line substrate, and which is formed in a manner that the base substrate is located away from the second high-frequency signal line.

    摘要翻译： 高频模块包括：线基板，其第一表面上具有第一高频信号线，第二表面上的第二高频信号线是第一表面相反侧的表面， 所述高频信号线与所述第一高频信号线电连接; 以及基板，其设置在所述线基板的第二面上，并且以基底基板位于远离所述第二高频信号线的方式形成。