公开(公告)号：US20090202843A1

公开(公告)日：2009-08-13

申请号：US12378074

申请日：2009-02-11

Applicant: Yoshiaki Oku

Inventor： Yoshiaki Oku

IPC: B32B17/08 ,  B05D1/18 ,  B32B23/04

CPC classification number: H05K1/0306 ,  H05K1/0393 ,  H05K2201/0108 ,  H05K2201/0251 ,  H05K2201/0284 ,  Y10T428/31634

Abstract: A flexible substrate of an aspect of the present invention includes a substrate made of cellulose-based nanofibers and low-melting-point glass deposited inside the substrate by impregnation. A flexible substrate of another aspect of the present invention includes a substrate made of cellulose-based nanofibers and low-melting-point glass joined to one of principal surfaces of the substrate. A glass transition temperature of the low-melting-point glass is equal to or below 300° C. The flexible substrate is optically transparent.

Abstract translation: 本发明的一个方面的柔性基板包括由基于纤维素的纳米纤维制成的基板和通过浸渍沉积在基板内的低熔点玻璃。 本发明的另一方面的柔性基板包括由基板上的一个主表面连接的基于纤维素的纳米纤维和低熔点玻璃制成的基板。 低熔点玻璃的玻璃化转变温度等于或低于300℃。柔性基板是光学透明的。

公开(公告)号：US07026033B2

公开(公告)日：2006-04-11

申请号：US10485709

申请日：2003-04-25

Applicant: Tatsushi Fujimori ,  Sadamitsu Murayama

Inventor： Tatsushi Fujimori ,  Sadamitsu Murayama

IPC: B32B5/12

CPC classification number: B32B15/14 ,  B29C70/10 ,  B29C70/12 ,  B29C70/202 ,  B32B15/20 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2305/076 ,  B32B2307/306 ,  B32B2457/08 ,  D21H13/24 ,  D21H13/26 ,  D21H21/18 ,  H05K1/0366 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2203/0594 ,  Y10T428/24116 ,  Y10T428/24124 ,  Y10T428/2419 ,  Y10T428/24264 ,  Y10T428/24994 ,  Y10T428/25 ,  Y10T428/254 ,  Y10T428/26 ,  Y10T442/2008 ,  Y10T442/696

Abstract: A heat-resistant fiber paper-like sheet comprises 40 to 97% by mass of heat-resistant organic synthetic polymers staple fibers, 3 to 60% by mass of heat resistant organic synthetic polymer fibrid and or an organic resin binder, in a portion of the staple fibers, each staple fiber having two flat end faces having an inclining angle of 10 degrees or more from a plane crossing the fiber axis at a right angles, and is useful as a base material for laminate materials for electrical circuit boards.

Abstract translation: 耐热纤维纸状片材的耐热性有机合成聚合物短纤维为40〜97质量％，耐热性有机合成聚合物纤维原纤维质为3〜60质量％，有机树脂粘合剂部分为 短纤维，每个短纤维具有从与纤维轴线成直角交叉的平面倾斜角度为10度以上的两个平坦端面，并且可用作电路板层压材料的基材。

公开(公告)号：US06929848B2

公开(公告)日：2005-08-16

申请号：US10227998

申请日：2002-08-26

Applicant: Michael R. Samuels ,  Subhotosh Khan ,  Mikhail R. Levit

Inventor： Michael R. Samuels ,  Subhotosh Khan ,  Mikhail R. Levit

IPC: B32B5/24 ,  B29B13/10 ,  B32B5/28 ,  B32B15/14 ,  B32B27/12 ,  D04H1/00 ,  D04H13/00 ,  H01L23/14 ,  H05K1/03 ,  B32B3/00 ,  B32B5/06

CPC classification number: H05K1/0366 ,  B29B13/10 ,  B32B15/14 ,  B32B27/12 ,  D04H1/4374 ,  D04H1/4382 ,  H05K1/036 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/015 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/249924 ,  Y10T428/24994 ,  Y10T428/249941 ,  Y10T442/30

Abstract: A sheet comprising thermoplastic polymer (TP) and short high tensile modulus fibers, in which the concentration of TP in the middle of the sheet is higher than at the surface of the sheet, useful for making prepregs with a thermoset resin.

Abstract translation: 包含热塑性聚合物（TP）和短的高拉伸模量纤维的片材，其中片材中部的TP浓度高于片材表面的TP浓度，可用于制备具有热固性树脂的预浸料。

公开(公告)号：US20040180185A1

公开(公告)日：2004-09-16

申请号：US10485709

申请日：2004-02-04

Inventor： Tatsushi Fujimori ,  Sadamitsu Murayama

IPC: B32B027/04

CPC classification number: B32B15/14 ,  B29C70/10 ,  B29C70/12 ,  B29C70/202 ,  B32B15/20 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2305/076 ,  B32B2307/306 ,  B32B2457/08 ,  D21H13/24 ,  D21H13/26 ,  D21H21/18 ,  H05K1/0366 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2203/0594 ,  Y10T428/24116 ,  Y10T428/24124 ,  Y10T428/2419 ,  Y10T428/24264 ,  Y10T428/24994 ,  Y10T428/25 ,  Y10T428/254 ,  Y10T428/26 ,  Y10T442/2008 ,  Y10T442/696

Abstract: A heat-resistant fiber paper-like sheet comprises 40 to 97% by mass of heat-resistant organic synthetic polymers staple fibers, 3 to 60% by mass of heat resistant organic synthetic polymer fibrid and or an organic resin binder, in a portion of the staple fibers, each staple fiber having two flat end faces having an inclining angle of 10 degrees or more from a plane crossing the fiber axis at a right angles, and is useful as a base material for laminate materials for electrical circuit boards.

Abstract translation: 耐热纤维纸状片材的耐热性有机合成聚合物短纤维为40〜97质量％，耐热性有机合成聚合物纤维原纤维质为3〜60质量％，有机树脂粘合剂部分为 短纤维，每个短纤维具有从与纤维轴线成直角交叉的平面倾斜角度为10度以上的两个平坦端面，并且可用作电路板层压材料的基材。

公开(公告)号：US20040016118A1

公开(公告)日：2004-01-29

申请号：US10326207

申请日：2002-12-19

Inventor： David Haas ,  Chengzeng Xu

IPC: B32B003/00

CPC classification number: H05K3/4673 ,  H05K1/0373 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/4644 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/0209 ,  H05K2201/0251 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49139 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T442/2008 ,  Y10T442/2049 ,  Y10T442/2475 ,  Y10T442/2762 ,  Y10T442/2861 ,  Y10T442/2926

Abstract: This invention concerns electronic substrates comprising a non-woven filler material and a resin material. The present invention also includes electronic products manufactured from the electronic substrates of this invention including, but not limited to prepregs, metal clad laminates, and printed wiring boards with and without lased via holes. The present invention further includes a method of manufacturing printed built-up wiring boards including the steps of forming a prepreg and forming at least one via in the prepreg.

Abstract translation: 本发明涉及包含无纺布填料和树脂材料的电子基片。 本发明还包括由本发明的电子基板制造的电子产品，其包括但不限于预浸料，金属包覆层压板以及带和不带通孔的印刷线路板。 本发明还包括一种制造印刷的叠层电路板的方法，包括在预浸料坯中形成预浸料并形成至少一个通孔的步骤。

公开(公告)号：US06416625B1

公开(公告)日：2002-07-09

申请号：US09988041

申请日：2001-11-16

Applicant: Shian-Yih Wang ,  Yung-Chih Chen ,  Lung-Cheng Cheng ,  Shi-Ing Huang ,  Chun-Sheng Chen

Inventor： Shian-Yih Wang ,  Yung-Chih Chen ,  Lung-Cheng Cheng ,  Shi-Ing Huang ,  Chun-Sheng Chen

IPC: B32B1902

CPC classification number: H05K1/0373 ,  B29C67/04 ,  B29C70/025 ,  B29C70/885 ,  B29L2031/3425 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0251

Abstract: In the manufacturing method of fluoro based polymer composite boards of the invention, which provides a fast process and high efficiency, a suitable amount of water soluble organic solvent is added to a fluoro based polymer suspension during the process of mixing ceramic powder and/or glass fiber to the fluoro based polymer suspension in order to improve the coagulation of the fluoro based polymer and ceramic powder, and to reduce the gelling time. During the process of mixing ceramic powder and/or glass fiber, the fluoro based polymer suspension and the organic solvent, a suitable amount of water can be added to control the ratio between the water and the organic solvent obtained from the mixture. The gelling time of the mixture can thus be reduced. By controlling the ratio between the water and the organic solvent obtained from the mixture, there is still enough time to allow homogeneous mixing after the gelling speed is increased.

Abstract translation: 在本发明的氟基聚合物复合板的制造方法中，其提供了快速的工艺和高效率，在混合陶瓷粉末和/或玻璃的过程中，向氟基聚合物悬浮液中加入适量的水溶性有机溶剂 纤维与氟基聚合物悬浮液的混合，以改善氟基聚合物和陶瓷粉末的凝结，并减少胶凝时间。 在混合陶瓷粉末和/或玻璃纤维的过程中，氟基聚合物悬浮液和有机溶剂可以加入适量的水以控制从混合物中获得的水和有机溶剂之间的比例。 因此可以降低混合物的胶凝时间。 通过控制从混合物获得的水和有机溶剂之间的比例，在胶凝速度增加之后仍然有足够的时间允许均匀混合。

公开(公告)号：US20010050130A1

公开(公告)日：2001-12-13

申请号：US09755082

申请日：2001-01-08

Applicant: Ahlstrom Glassfibre Oy.

Inventor： Kay Rokman ,  Rod Komlenic ,  Kelly Rennels ,  Hakan Sabel

IPC: B32B031/00

CPC classification number: C08J5/046 ,  B32B5/28 ,  C08J5/24 ,  D21F11/002 ,  D21H13/18 ,  D21H13/22 ,  D21H13/24 ,  D21H13/26 ,  D21H13/40 ,  D21H25/005 ,  D21H25/04 ,  D21H25/06 ,  H05K1/0366 ,  H05K2201/0145 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/28 ,  Y10T442/2008 ,  Y10T442/2738 ,  Y10T442/608 ,  Y10T442/632 ,  Y10T442/637

Abstract: A printed circuit board is made from at least one non-woven sheet or web layer comprising at least 50% by weight acrylic fibers, with any balance substantially electrically non-conductive fibers, filler, and binder. The sheet or web is preferably made by the foam process, and may contain 60-80% straight polyacrylonitrile fibers and 40-20% fibrillated (pulp) ones. The web or sheet is preferably compressed by thermal calendering so that it has a density of about 0.1-1 grams per cubic centimeter; and the web or sheet may have a basis weight of between about 20-120 grams per square meter. The web or sheet may also have a 1-40% of substantially electrically non-conductive organic or inorganic binder, or may be substantially binder free. A printed circuit board made using the layers of these non-woven webs or sheets is otherwise conventional, including a pre-preg material, electrically conductive circuit elements, and electronics, and has improved properties compared to woven glass and non-woven aramid products, including improved fiber consolidation, easy board construction, and improved MD/CD ratio and stability.

Abstract translation: 印刷电路板由至少一种包含至少50重量％的丙烯酸纤维的无纺布片材或纤维网层制成，任何平衡物基本上不导电的纤维，填料和粘合剂。 片材或纤维网优选通过泡沫方法制成，并且可以含有60-80％的直链聚丙烯腈纤维和40-20％的原纤化（纸浆）纤维。 纤维网或片材优选通过热压延来压缩，使其具有约0.1-1克/立方厘米的密度; 并且网或片可以具有介于约20-120克/平方米之间的基重。 幅材或片材还可以具有1-40％的基本上不导电的有机或无机粘合剂，或者可以是基本上不含粘合剂的。 使用这些非织造网或片的层制成的印刷电路板是常规的，包括预浸材料，导电电路元件和电子元件，并且与机织玻璃和非织造芳族聚酰胺产品相比具有改进的性能， 包括改进的纤维固结，易于板的构建，以及改善的MD / CD比和稳定性。

公开(公告)号：US06291374B1

公开(公告)日：2001-09-18

申请号：US09531947

申请日：2000-03-21

Applicant: Vincent R. Landi

Inventor： Vincent R. Landi

IPC: D03D300

CPC classification number: C08J5/24 ,  B32B15/08 ,  C08J2309/00 ,  C08K3/22 ,  C08K3/34 ,  C08K3/40 ,  C08K5/0066 ,  C08K7/14 ,  C08L9/00 ,  C08L23/16 ,  C08L53/00 ,  H05K1/0203 ,  H05K1/032 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/162 ,  H05K2201/012 ,  H05K2201/0133 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/029 ,  H05K2201/0293 ,  Y10T442/2934 ,  Y10T442/2992 ,  Y10T442/3415 ,  Y10T442/3423 ,  Y10T442/3431 ,  Y10T442/3455 ,  C08L2666/06 ,  C08L2666/24

Abstract: An electrical substrate material is presented comprising a resin matrix which includes a thermosetting polybutadiene or polyisoprene resin, an ethylene propylene rubber, and optionally a thermoplastic unsaturated butadiene- or isoprene-containing polymer; a particulate filler, a flame retardant additive, a curing agent, and a woven or unwoven fabric. The presence of the ethylene propylene rubber enhances the heat age properties of the substrate material, particularly the dielectric strength and the mechanical properties, while other electrical, chemical, and mechanical properties of the material are not adversely effected.

Abstract translation: 提供一种电气基材材料，其包括包含热固性聚丁二烯或聚异戊二烯树脂的树脂基质，乙丙橡胶和任选的含热塑性不饱和丁二烯或含异戊二烯的聚合物; 颗粒状填料，阻燃添加剂，固化剂，织造或无纺织物。 乙烯丙烯橡胶的存在增强了基材材料的热老化性能，特别是介电强度和机械性能，而材料的其它电学，化学和机械性能也不会受到不利影响。

公开(公告)号：USRE36396E

公开(公告)日：1999-11-16

申请号：US379991

申请日：1995-01-27

Applicant: David J. Arthur ,  John C. Mosko ,  Connie S. Jackson ,  G. Robert Traut

Inventor： David J. Arthur ,  John C. Mosko ,  Connie S. Jackson ,  G. Robert Traut

IPC: H01B3/44 ,  H01L23/14 ,  H05K1/03 ,  H05K3/46 ,  B32B5/16

CPC classification number: H01L23/145 ,  H01B3/445 ,  H05K1/0373 ,  H01L2924/0002 ,  H05K1/034 ,  H05K1/0366 ,  H05K2201/015 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0251 ,  H05K2201/068 ,  H05K3/4626 ,  Y10T428/252 ,  Y10T428/259 ,  Y10T428/2995 ,  Y10T428/3154 ,  Y10T428/31544 ,  Y10T428/31692

Abstract: A ceramic filled fluoropolymer-based electrical substrate material well suited for forming rigid printed wiring board substrate materials and integrated circuit chip carriers is presented which exhibits improved electrical performance over other printed wiring board materials and circuit chip carriers. Also, the low coefficients of thermal expansion and compliant nature of this electrical substrate material results in improved surface mount reliability and plated through-hole reliability. The electrical substrate material preferably comprises polytetrafluoroethylene filled with silica along with a small amount of microfiberglass. In an important feature of this invention, the ceramic filler (silica) is coated with a silane coating material which renders the surface of the ceramic hydrophobic and provides improved tensile strength, peel strength and dimensional stability.

Abstract translation: 提出了一种非常适合形成刚性印刷线路板基板材料和集成电路芯片载体的基于陶瓷填充的基于氟聚合物的电气基板材料，其表现出比其它印刷线路板材料和电路芯片载体更好的电性能。 此外，该电气基板材料的低的热膨胀系数和顺从性导致改进的表面贴装可靠性和电镀通孔可靠性。 电气基材材料优选包含填充有二氧化硅的聚四氟乙烯以及少量的微纤维。 在本发明的一个重要特征中，陶瓷填料（二氧化硅）涂有硅烷涂层材料，使陶瓷表面疏水，提供更好的拉伸强度，剥离强度和尺寸稳定性。

公开(公告)号：US5654045A

公开(公告)日：1997-08-05

申请号：US994386

申请日：1992-12-21

Applicant: Randy Douglas Jester

Inventor： Randy Douglas Jester

IPC: B29C55/00 ,  B29D7/01 ,  B32B15/08 ,  B32B27/36 ,  C08J5/18 ,  C08J11/06 ,  C08L67/00 ,  C08L67/04 ,  C08L101/00 ,  C09K19/38 ,  H05K1/03 ,  C09K19/00

CPC classification number: C08J5/18 ,  B29C55/00 ,  B29D7/01 ,  B32B15/08 ,  C08J11/06 ,  C08L67/04 ,  C09K19/3809 ,  H05K1/0366 ,  B29K2105/0079 ,  B29K2105/0088 ,  B29K2105/26 ,  C08J2367/00 ,  C08L67/00 ,  H05K1/0373 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0212 ,  H05K2201/0245 ,  H05K2201/0251 ,  H05K2201/0278 ,  Y02W30/701 ,  Y10S428/91 ,  Y10T428/1095 ,  Y10T428/24942 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31786

Abstract: A melt consolidated, multiaxially oriented liquid crystal polymer ("LCP") sheet or other article formed from LCP particles. One embodiment includes a multi-component LCP sheet in which particles of a higher melting LCP are imbedded in a matrix of a lower melting LCP. These LCP components are formed into sheet at a temperature between the melting point of the lower melting matrix LCP and the higher melting reinforcing LCP, so that the imbedded LCP particles may maintain their shape, orientation, and mechanical characteristics while the matrix LCP component flows around the particles and forms a solid sheet. In another embodiment, LCP particles are melt consolidated to form a single article in which a significant amount of LCP orientation is retained. A sheet of this invention may be formed by a variety of processes, and may be made from recycled scrap LCP.

Abstract translation: 熔融固化的多轴取向液晶聚合物（“LCP”）片或由LCP颗粒形成的其它制品。 一个实施方案包括多组分LCP片，其中较高熔点LCP的颗粒嵌入较低熔点的LCP的基质中。 这些LCP组分在低熔点基体LCP的熔点和较高熔点的增强LCP之间的温度下形成为片材，使得嵌入的LCP颗粒可以在基质LCP组分流动时保持其形状，取向和机械特性 颗粒并形成固体片。 在另一个实施方案中，将LCP颗粒熔融固化以形成其中保留显着量的LCP取向的单一制品。 本发明的片材可以通过各种方法形成，并且可以由再循环废料LCP制成。