Abstract:
Accelerometer and sensor assemblies for implantable medical devices such as pacemakers, cardioverters, IPGs, PCDs, defibrillators, ICDs, and the like includes at least one intermediate metallization layer sandwiched between a first lower surface of at least one upper sheet formed from a piezoelectric material surface, and a second upper surface of at least one lower sheet formed from a piezoelectric material. The at least one upper sheet has a first outer edge disposed between its first upper and first lower surfaces. The at least one lower sheet has a second outer edge disposed between its second upper and second lower surfaces. The at least one intermediate metallization layer is not disposed at all locations between the first lower surface and the second upper surface, but extends to an external region disposed between the first outer edge and the second outer edge, and is electrically connected to the external region. Various embodiments of the sensor or accelerometer are capable of providing high amplitude output signals and reducing parts and manufacturing costs.
Abstract:
An accelerometer and sensor assemblies for medical implantable devices such as pacemakers, cardioverters, IPGs, PCDs, defibrillators, ICDs, and the like, includes at least one intermediate metallization layer sandwiched between a first lower surface of at least one upper sheet formed from a piezoelectric material surface, and a second upper surface of at least one lower sheet formed from a piezoelectric material. The at least one upper sheet has a first outer edge disposed between its first upper and first lower surfaces. The at least one lower sheet has a second outer edge disposed between its second upper and second lower surfaces. The at least one intermediate metallization layer is not disposed at all locations between the first lower surface and the second upper surface, but extends to an external region disposed between the first outer edge and the second outer edge, and is electrically connected to the external region. Various embodiments of the sensor or accelerometer are capable of providing high amplitude output signals and reducing parts and manufacturing costs.
Abstract:
The present invention is directed to an interconnect for an implantable medical device. The interconnect includes a pad and a first layer introduced over the pad. At least one of the pad or the first layer comprise a negative coefficient of thermal expansion (CTE) material.
Abstract:
An implantable medical device (IMD) is disclosed. The IMD includes a first substrate having a front side and a backside. A first via is formed in the front side, the via extending from a bottom point in the front side to a first height located at a surface of the front side. A first conductive pad is formed in the first via, the first conductive pad having an exposed top surface lower than first height. A second substrate is coupled to the first substrate, the second substrate having a second via formed in the front side, the via extending from a bottom point in the front side to a second height located at a surface of the front side. A second conductive pad is formed in the second via, the second conductive pad having an exposed top surface lower than second height. The coupled substrates are heated until a portion of one or both conductive pads reflow, dewet, agglomerate, and merge to form an interconnect, hermetic seal, or both depending on the requirements of the device.
Abstract:
A bonding tool for use in a laser bonding apparatus comprises an elongated body portion and a foot portion coupled thereto. The foot portion extends substantially transversely from the body portion and has a laser aperture and a guide channel therethrough. The guide channel is disposed between the body portion and the laser aperture.
Abstract:
An implantable medical device substrate is free form cut to the shape of the interior of the device. The free form shape allows more efficient use of not only the interior space of the device but also of the substrate itself. Integrated circuit components are formed to fit the shape of the substrate, freeing areas in the device for additional components, or allowing the device to be made smaller through a maximized use of the available space-volume.
Abstract:
An implantable medical device substrate is free form cut to the shape of the interior of the device. The free form shape allows more efficient use of not only the interior space of the device but also of the substrate itself. Integrated circuit components are formed to fit the shape of the substrate, freeing areas in the device for additional components, or allowing the device to be made smaller through a maximized use of the available space-volume.
Abstract:
A medical system includes a sensor location module, a first module, and a second module. The sensor location module determines a location of a magnetic field sensor within a magnetic field. The first module determines an acceleration of the magnetic field sensor. The second module indicates a modified location of the magnetic field sensor in an image of a medical patient based on the acceleration and one or more previously determined locations.
Abstract:
Arrays of planar solid state batteries are stacked in an aligned arrangement for subsequent separation into individual battery stacks. Prior to stacking, a redistribution layer (RDL) is formed over a surface of each wafer that contains an array; each RDL includes first and second groups of conductive traces, each of the first extending laterally from a corresponding positive battery contact, and each of the second extending laterally from a corresponding negative battery contact. Conductive vias, formed before or after stacking, ultimately couple together corresponding contacts of aligned batteries. If before, each via extends through a corresponding battery contact of each wafer and is coupled to a corresponding conductive layer that is included in another RDL formed over an opposite surface of each wafer. If after, each via extends through corresponding aligned conductive traces and, upon separation of individual battery stacks, becomes an exposed conductive channel of a corresponding battery stack.