摘要:
A switch operating unit 10 has operating switches for operating loads. A load control unit controls the corresponding loads in accordance with the operation of the operating switches according to information, which is stored in first storage device, as to the correlation between the operating switches and the loads. A total rated capacity computation device computes the total rated capacity of the loads to be driven under the control of the load control unit according to information, which is stored in second storage device, as to the rated capacity of each load. When the total rated capacity exceeds a predetermined allowable capacity, the load control unit operates to restrict the driving of the low-priority loads in the order of analog-controlled loads and on-off controlled loads according to the information stored in the second storage device.
摘要:
An overcurrent breaking circuit includes a semiconductor switch inserted in a main current path; a current detector circuit for detecting a current passing through the main current path; a logic circuit for switching off the semiconductor switch when the current detector circuit detects a current exceeding a set value for an overcurrent level; a first unit for prohibiting the logic circuit from performing an operation for switching off the semiconductor switch even if the current detector circuit detects a current exceeding the set value for a first short time period immediately after the semiconductor switch is switched from a breaking state to a conductive state; and a second unit for prohibiting the logic circuit from performing an operation for switching off the semiconductor switch for a second short time period even if the current detector circuit detects a current exceeding the set value when the semiconductor switch remains in a conductive state.
摘要:
In a multiplex communication system for a bus vehicle, including: a plurality of loads disposed in the bus vehicle and connected to a wire harness; a switch unit for inputting signals to operate the loads and generating multiplex data; a first load drive unit for controlling the loads placed mainly on a floor of the bus vehicle; and a second load drive unit for controlling the loads placed mainly on a ceiling of the bus vehicle, the multiplex communication system further includes a multiplex line interconnecting the switch unit, the first load drive unit and the second load drive unit, and transmitting the multiplex data to the first and second load drive units to execute a multiplex communication, each the first and second load drive units controlling the loads in accordance with the multiplex data received through the multiplex line from the switch unit. The wire harness can be formed with high assembling performance or productivity in the bus vehicle.
摘要:
A manufacturing of a semiconductor device includes forming one of a layer with a first metal and the layer with a second metal on one of a semiconductor chip mounting area of a support plate and a back surface of the semiconductor chip; forming the other of the layer with the first metal and the layer with the second metal on an area corresponding to a part of the area, in which one of the layer with the first metal and the layer with the second metal, of the other one of the semiconductor chip mounting area and the back surface of the semiconductor chip; and forming a layer which includes an alloy with the first metal and the second metal after positioning the semiconductor chip in the semiconductor chip mounting area to bond the semiconductor chip with the semiconductor chip mounting area.
摘要:
A semiconductor device includes: a semiconductor chip including a nitride semiconductor layered structure including a carrier transit layer and a carrier supply layer; a first resin layer on the semiconductor chip, the first resin layer including a coupling agent; a second resin layer on the first resin layer, the second resin layer including a surfactant; and a sealing resin layer to seal the semiconductor chip with the first resin layer and the second resin layer.
摘要:
The present invention realizes a semiconductor device of high reliability which allows metal terminals which have a uniform height, are flat and smooth to be formed under low load and at low costs and to be mounted with low damage. The electrodes 5 and the insulating film 6 are both formed of materials having the property that they are solid and do not exhibit the adhesiveness at room temperature and exhibit the adhesiveness at a temperature not lower than a first temperature and cure at a temperature not lower than a second temperature higher than the first temperature. The surfaces of the electrodes 5 and the insulating film 6 of a semiconductor chip 1a are planarized in continuously flat with a hard cutting tool, as of diamond or others.
摘要:
The present invention realizes a semiconductor device of high reliability which allows metal terminals which have a uniform height, are flat and smooth to be formed under low load and at low costs and to be mounted with low damage. The electrodes 5 and the insulating film 6 are both formed of materials having the property that they are solid and do not exhibit the adhesiveness at room temperature and exhibit the adhesiveness at a temperature not lower than a first temperature and cure at a temperature not lower than a second temperature higher than the first temperature. The surfaces of the electrodes 5 and the insulating film 6 of a semiconductor chip 1a are planarized in continuously flat with a hard cutting tool, as of diamond or others.
摘要:
The present invention realizes a semiconductor device of high reliability which allows metal terminals which have a uniform height, are flat and smooth to be formed under low load and at low costs and to be mounted with low damage. The electrodes 5 and the insulating film 6 are both formed of materials having the property that they are solid and do not exhibit the adhesiveness at room temperature and exhibit the adhesiveness at a temperature not lower than a first temperature and cure at a temperature not lower than a second temperature higher than the first temperature. The surfaces of the electrodes 5 and the insulating film 6 of a semiconductor chip 1a are planarized in continuously flat with a hard cutting tool, as of diamond or others.
摘要:
A single-liquid type adhesive composition contains a main agent, an imidazole serving as a hardener, and a hardening promoter for increased hardening speed. The imidazole has its surface covered by a thermoplastic resin, and the hardening promoter is provided by a modified imidazole composition with its imino group (—NH—) having the H replaced by a specific reaction retarder group.
摘要:
A process of making an electrode-to-electrode bond structure includes a step of forming a resin coating on a first bonding object having a first electrode portion in a manner such that the resin coating covers the first electrode portion. Then, an opening is formed in the resin coating to expose the first electrode portion. Then, the opening is filled with a metal paste containing a metal and a resin component. Then, the first bonding object is placed on a second bonding object having a second electrode portion in a manner such that the metal paste filled in the opening faces the second electrode portion while the resin coating contacts the second bonding object. Finally, heat-treatment is performed to cause the first electrode portion and the second electrode portion to be electrically connected with each other via the metal while causing the resin coating to harden.