公开(公告)号：US07126164B2

公开(公告)日：2006-10-24

申请号：US10672165

申请日：2003-09-26

申请人： Michael E. Johnson ,  Peter Elenius ,  Deok Hoon Kim

发明人： Michael E. Johnson ,  Peter Elenius ,  Deok Hoon Kim

IPC分类号： H01L33/00

CPC分类号： H01L24/13 ,  H01L23/3114 ,  H01L23/3171 ,  H01L23/3192 ,  H01L24/03 ,  H01L24/05 ,  H01L2224/0401 ,  H01L2224/05567 ,  H01L2224/10126 ,  H01L2224/10145 ,  H01L2224/11334 ,  H01L2224/13007 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2224/05552 ,  H01L2924/00

摘要： A wafer-level CSP (200) includes at least one die (202) from a wafer. The wafer-level CSP has a plurality of solder ball pads (206), a solder ball (308) at each solder ball pad and a polymer collar (310) around each solder ball. A moat (204) is formed in the surface of a polymer layer (412) disposed on the wafer during manufacturing of the wafer-level CSP. A temporarily liquified residual (502) from the polymer collar, which occurs while the wafer is heated to the reflow temperature of the solder ball, flows from the polymer collar. The moat acts as a barrier to material flow, limiting the distance that the residual spreads while liquified. The residual from the polymer collar remains within a region (314) defined by the moat. A full-depth moat (312) extends completely through the polymer layer. Alternatively, a partial-depth moat (712 and 912) extends partially through the polymer layer. The abstract is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims pursuant to 37 C.F.R. §1.72(b).

摘要翻译： 晶片级CSP（200）包括来自晶片的至少一个管芯（202）。 晶片级CSP具有多个焊球垫（206），每个焊球垫处的焊球（308）和围绕每个焊球的聚合物环（310）。 在晶片级CSP的制造期间，在设置在晶片上的聚合物层（412）的表面中形成护城河（204）。 当晶片被加热到焊球的回流温度时，从聚合物套环的临时液化残余物（502）从聚合物套环流出。 护城河充当材料流动的障碍，限制了液化时残留物扩散的距离。 来自聚合物套环的残余物保留在由护城河限定的区域（314）内。 全深的护城河（312）完全延伸穿过聚合物层。 或者，部分深度护城河（712和912）部分地延伸穿过聚合物层。 提交摘要的理解是，根据37 C.F.R.不会将其用于解释或限制权利要求的范围或含义。 §1.72（b）。

公开(公告)号：US08487437B2

公开(公告)日：2013-07-16

申请号：US12885233

申请日：2010-09-17

申请人： Peter Elenius ,  Deok Hoon Kim ,  Young Sang Cho

发明人： Peter Elenius ,  Deok Hoon Kim ,  Young Sang Cho

IPC分类号： H01L23/48

CPC分类号： H01L23/10 ,  H01L23/3128 ,  H01L23/564 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14683 ,  H01L31/0203 ,  H01L2224/13 ,  H01L2224/13082 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13147 ,  H01L2224/14155 ,  H01L2224/16237 ,  H01L2224/16503 ,  H01L2224/29011 ,  H01L2224/29014 ,  H01L2224/29035 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/32 ,  H01L2224/32227 ,  H01L2224/32503 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81447 ,  H01L2224/8181 ,  H01L2224/8182 ,  H01L2224/83 ,  H01L2224/83102 ,  H01L2224/83191 ,  H01L2224/83447 ,  H01L2224/8381 ,  H01L2224/83825 ,  H01L2224/9211 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15321 ,  H01L2924/15788 ,  H01L2224/81 ,  H01L2924/00014 ,  H01L2224/73103 ,  H01L2924/00012 ,  H01L2924/00

摘要： An electronic device package includes a substrate assembly, an electronic device disposed to face the substrate assembly, and a sealing ring or rings including a sealing layer and a bonding layer that is disposed between the substrate assembly and the electronic device, wherein the sealing ring(s) has a closed loop shape surrounding a sealing region of the electronic device, and the bonding layer is formed through a reaction of the sealing layer and sealing layer pad with a low-melting-point material layer whose melting point is lower than that of the sealing layer and sealing ring pad. The bonding layer is formed of an intermetallic compound of the sealing layer, sealing ring pad and low-melting-point material that melts at a temperature greater than the melting temperature of the low-melting-point material. The device package also includes electrical connections in the form of joints between the substrate assembly and electronic device.

摘要翻译： 电子器件封装包括衬底组件，设置为面对衬底组件的电子器件，以及密封环或环，其包括设置在衬底组件和电子器件之间的密封层和接合层，其中密封环 s）具有围绕电子器件的密封区域的闭环形状，并且通过密封层和密封层焊盘与熔点低于熔点的低熔点材料层的反应形成接合层 密封层和密封环垫。 接合层由密封层，密封环垫和低熔点材料的金属间化合物形成，其熔点高于低熔点材料的熔融温度。 器件封装还包括在衬底组件和电子器件之间的接合形式的电连接。

公开(公告)号：US20120231689A1

公开(公告)日：2012-09-13

申请号：US13075147

申请日：2011-03-29

申请人： Deok Hoon Kim ,  Kyung Wook Paik ,  Kyoung Lim Suk ,  Jae Ok Kim

发明人： Deok Hoon Kim ,  Kyung Wook Paik ,  Kyoung Lim Suk ,  Jae Ok Kim

IPC分类号： D03D15/00 ,  H01B1/22 ,  C09K11/08 ,  H01B1/20 ,  H01F1/01

CPC分类号： H01R4/04 ,  C08G2650/40 ,  C08L71/00 ,  C08L71/02 ,  C08L77/00 ,  C08L77/10 ,  C08L79/04 ,  C08L81/02 ,  C08L81/06 ,  C09J133/08 ,  C09J133/20 ,  C09J133/24 ,  C09J135/06 ,  C09J143/04 ,  D01D5/0007 ,  D01F1/10 ,  H01R12/52 ,  H05K3/323 ,  H05K2201/0278 ,  H05K2201/029 ,  Y10T428/254 ,  Y10T428/28 ,  Y10T428/2852 ,  Y10T428/287 ,  Y10T428/2874 ,  Y10T428/2878 ,  Y10T428/2887 ,  Y10T428/2891 ,  Y10T428/2896 ,  Y10T442/30

摘要： Provided is a functional fiber and a fiber aggregate for realizing various functions, an adhesive for easily bonding electronic components, and a method for manufacturing the same. Particularly, a fiber extended in a length direction includes a carrier polymer and a plurality of functional particles, wherein the plurality of functional particles are embedded in the carrier polymer and physically fixed to the carrier polymer to be integrated.

公开(公告)号：US20100237498A1

公开(公告)日：2010-09-23

申请号：US12599298

申请日：2008-10-28

申请人： Deok Hoon Kim ,  Young Sang Cho ,  Hwan Chul Lee

发明人： Deok Hoon Kim ,  Young Sang Cho ,  Hwan Chul Lee

IPC分类号： H01L23/488 ,  H01L21/60

CPC分类号： H01L24/29 ,  H01L23/49811 ,  H01L24/13 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/81054 ,  H01L2224/81136 ,  H01L2224/81191 ,  H01L2224/81211 ,  H01L2224/81801 ,  H01L2224/8191 ,  H01L2224/83191 ,  H01L2224/83194 ,  H01L2224/83801 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/1532 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/00 ,  H01L2224/83205 ,  H01L2224/05599

摘要： A semiconductor device package and a method thereof are able to reliably package a semiconductor device on a substrate without using flux. The semiconductor device package includes a semiconductor device and a substrate reciprocally disposed with respect to the semiconductor device, wherein the substrate includes a side reciprocal to the semiconductor device on which there are formed a plurality of prominences surrounding an accommodation region where the semiconductor device is to be disposed. The method of packaging a semiconductor device includes preparing the semiconductor device, preparing a substrate, forming a plurality of prominences to surround an accommodation region on the substrate where the semiconductor device is to be disposed, dropping the semiconductor device within the accommodation region, and packaging the semiconductor device on the substrate.

摘要翻译： 半导体器件封装及其方法能够将半导体器件可靠地封装在基板上而不使用焊剂。 半导体器件封装包括半导体器件和相对于半导体器件相互配置的衬底，其中衬底包括与半导体器件往复的一侧，在该半导体器件上形成有围绕半导体器件的容纳区域的多个突起 被处置 封装半导体器件的方法包括制备半导体器件，制备衬底，形成多个突出部以围绕要放置半导体器件的衬底上的容纳区域，将半导体器件放置在容纳区域内，以及封装 衬底上的半导体器件。

公开(公告)号：US06864116B1

公开(公告)日：2005-03-08

申请号：US10692816

申请日：2003-10-27

申请人： Deok Hoon Kim ,  John J. H. Reche

发明人： Deok Hoon Kim ,  John J. H. Reche

IPC分类号： H01L23/48 ,  H01L21/00 ,  H01L21/30 ,  H01L21/46 ,  H01L23/00 ,  H01L27/14 ,  H01L27/148 ,  H01L29/40 ,  H01L31/0203

CPC分类号： H01L31/0203 ,  H01L27/14618 ,  H01L2224/48091 ,  H01L2924/16195 ,  H01L2924/00014

摘要： A photo-sensing device package and the method of packaging such device is provided. The package includes an assembly portion having a substrate formed of a material substantially transparent to light within a predetermined range of wavelengths; a sensing portion including at least one photo-sensing die photo-electronically transducing light within the predetermined range of wavelengths; and, a plurality of first solder joints joining the sensing and assembly portions. The assembly portion is formed with at least a first metal layer disposed on the substrate about a front surface region thereof; and, at least one passivation layer formed to extend over the first metal layer. The passivation layer is patterned to define a plurality of first and second access openings which respectively describe on the first metal layer a plurality of first and second solder bump pads, each of which is interconnected to at least one of the second solder bump pads. The sensing portion's photo-sensing die is positioned with its photo-sensing area opposing the front surface region of the assembly portion's substrate, and has formed thereon a plurality of solder bump pads electrically coupled to the photo-sensing area. Each of the first solder joints extends between one of the sensing portion's solder bump pads and one of the assembly portion's first solder bump pads.

公开(公告)号：US08486318B2

公开(公告)日：2013-07-16

申请号：US13111850

申请日：2011-05-19

申请人： Deok Hoon Kim ,  Kyung Wook Paik ,  Kyoung Lim Suk ,  Jae Ok Kim

发明人： Deok Hoon Kim ,  Kyung Wook Paik ,  Kyoung Lim Suk ,  Jae Ok Kim

IPC分类号： B29C47/02

CPC分类号： H01R4/04 ,  C08G2650/40 ,  C08L71/00 ,  C08L71/02 ,  C08L77/00 ,  C08L77/10 ,  C08L79/04 ,  C08L81/02 ,  C08L81/06 ,  C09J133/08 ,  C09J133/20 ,  C09J133/24 ,  C09J135/06 ,  C09J143/04 ,  D01D5/0007 ,  D01F1/10 ,  H01R12/52 ,  H05K3/323 ,  H05K2201/0278 ,  H05K2201/029 ,  Y10T428/254 ,  Y10T428/28 ,  Y10T428/2852 ,  Y10T428/287 ,  Y10T428/2874 ,  Y10T428/2878 ,  Y10T428/2887 ,  Y10T428/2891 ,  Y10T428/2896 ,  Y10T442/30

摘要： Provided is a functional fiber and a fiber aggregate for realizing various functions, an adhesive for easily bonding electronic components, and a method for manufacturing the same. Particularly, a fiber extended in a length direction includes a carrier polymer and a plurality of functional particles, wherein the plurality of functional particles are embedded in the carrier polymer and physically fixed to the carrier polymer to be integrated.

摘要翻译： 提供了用于实现各种功能的功能性纤维和纤维聚集体，用于容易地结合电子部件的粘合剂及其制造方法。 特别地，沿长度方向延伸的纤维包括载体聚合物和多个功能性颗粒，其中多个功能性颗粒嵌入载体聚合物中并且物理地固定到载体聚合物上以使其一体化。

公开(公告)号：US07038287B2

公开(公告)日：2006-05-02

申请号：US11002100

申请日：2004-12-03

申请人： Deok Hoon Kim ,  John J. H. Reche

发明人： Deok Hoon Kim ,  John J. H. Reche

IPC分类号： H01L31/0203

CPC分类号： H01L31/0203 ,  H01L27/14618 ,  H01L2224/48091 ,  H01L2924/16195 ,  H01L2924/00014

摘要： A photo-sensing device package and the method of packaging such device is provided. The package includes an assembly portion having a substrate formed of a material substantially transparent to light within a predetermined range of wavelengths; a sensing portion including at least one photo-sensing die photo-electronically transducing light within the predetermined range of wavelengths; and, a plurality of first solder joints joining the sensing and assembly portions. The assembly portion is formed with at least a first metal layer disposed on the substrate about a front surface region thereof; and, at least one passivation layer formed to extend over the first metal layer. The passivation layer is patterned to define a plurality of first and second access openings which respectively describe on the first metal layer a plurality of first and second solder bump pads, each of which is interconnected to at least one of the second solder bump pads. The sensing portion's photo-sensing die is positioned with its photo-sensing area opposing the front surface region of the assembly portion's substrate, and has formed thereon a plurality of solder bump pads electrically coupled to the photo-sensing area. Each of the first solder joints extends between one of the sensing portion's solder bump pads and one of the assembly portion's first solder bump pads.

摘要翻译： 提供了一种感光器件封装及其封装方法。 所述包装包括具有由对预定波长范围内的光基本上透明的材料形成的基板的组装部分; 感测部分，包括在预定波长范围内光电转换光的至少一个感光芯片; 以及连接感测和组装部分的多个第一焊接接头。 组装部分形成有至少第一金属层，其设置在基板的前表面区域上; 以及形成为在第一金属层上延伸的至少一个钝化层。 图案化钝化层以限定多个第一和第二存取开口，其分别在第一金属层上描述多个第一和第二焊料凸块焊盘，每个焊料凸块与第二焊料凸块焊盘中的至少一个互连。 感测部分的光敏裸片位于其感光区域与组件部分基板的前表面区域相对的位置，并且在其上形成有多个焊接凸块焊盘，电焊接电极与光敏区域耦合。 每个第一焊接接头在感测部分的焊料凸块焊盘之一和组件部分的第一焊料凸块之一之间延伸。