公开(公告)号：US07328506B2

公开(公告)日：2008-02-12

申请号：US10281463

申请日：2002-10-25

申请人： Miguel A. Jimarez ,  Ross W. Keesler ,  Voya R. Markovich ,  Rajinder S. Rai ,  Cheryl L. Tytran-Palomaki

发明人： Miguel A. Jimarez ,  Ross W. Keesler ,  Voya R. Markovich ,  Rajinder S. Rai ,  Cheryl L. Tytran-Palomaki

IPC分类号： H01K3/10

CPC分类号： H01L21/486 ,  H01L21/4853 ,  H01L21/4857 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15311 ,  H05K1/112 ,  H05K3/28 ,  H05K3/3457 ,  H05K3/3484 ,  H05K3/429 ,  H05K3/4602 ,  H05K2201/09436 ,  H05K2201/09509 ,  H05K2201/09863 ,  H05K2203/043 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00

摘要： A method for forming a plated microvia interconnect. An external dielectric layer (EDL) is mounted on a surface of the substrate and is in direct mechanical contact with a conductive element included in the surface. An opening formed in the EDL exposes the conductive element and creates a microvia in the EDL. A sidewall and bottom wall surface of the microvia is treated to promote copper adhesion to the sidewall and bottom wall surfaces. The sidewall and bottom wall surfaces are plated to form a layer of copper thereon. The layer of copper is in direct mechanical and electrical contact with the conductive element. A wet solder paste deposited on the layer of copper overfills a remaining portion of the microvia. The solder paste is reflowed to form a solder bump in and over the remaining portion of the microvia to form the plated microvia interconnect.

摘要翻译： 一种形成电镀微孔互连的方法。 外部电介质层（EDL）安装在基板的表面上，并且与包括在表面中的导电元件直接机械接触。 EDL中形成的开口露出导电元件，并在EDL中产生微孔。 处理微孔的侧壁和底壁表面以促进铜附着到侧壁和底壁表面。 侧壁和底壁表面被电镀以在其上形成一层铜层。 铜层与导电元件直接机械和电接触。 沉积在铜层上的湿焊膏过量填充微孔的剩余部分。 焊膏被回流以在微孔的剩余部分中和上方形成焊料凸块以形成电镀微孔互连。

公开(公告)号：US06492600B1

公开(公告)日：2002-12-10

申请号：US09340758

申请日：1999-06-28

申请人： Miguel A. Jimarez ,  Ross W. Keesler ,  Voya R. Markovich ,  Rajinder S. Rai ,  Cheryl L. Tytran-Palomaki

发明人： Miguel A. Jimarez ,  Ross W. Keesler ,  Voya R. Markovich ,  Rajinder S. Rai ,  Cheryl L. Tytran-Palomaki

IPC分类号： H05K109

CPC分类号： H01L21/486 ,  H01L21/4853 ,  H01L21/4857 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15311 ,  H05K1/112 ,  H05K3/28 ,  H05K3/3457 ,  H05K3/3484 ,  H05K3/429 ,  H05K3/4602 ,  H05K2201/09436 ,  H05K2201/09509 ,  H05K2201/09863 ,  H05K2203/043 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00

摘要： A chip carrier structure and method for forming the same having a receptor pad formed therein. The structure comprises a circuitized substrate having a conductive element on the surface, an External Dielectric Layer mounted on the circuitized substrate with an opening positioned above the conductive element to form a microvia. The walls of the microvia are first treated to enhance copper adhesion and then are electroplated to provide a receptor pad. Finally, a solder paste is deposited within the microvia to create a solder deposit or bump.

摘要翻译： 一种用于形成其中形成有受体垫的芯片载体结构和方法。 该结构包括在表面上具有导电元件的电路化基板，安装在电路化基板上的外部电介质层，其中开口位于导电元件上方以形成微孔。 首先处理微孔的壁以增强铜的粘附性，然后电镀以提供受体垫。 最后，在微孔内沉积焊膏以产生焊料沉积物或凸块。

公开(公告)号：US08592299B1

公开(公告)日：2013-11-26

申请号：US13358716

申请日：2012-01-26

申请人： Voya R. Markovich ,  Rabindra N. Das ,  Rajinder S. Rai ,  Michael Vincent

发明人： Voya R. Markovich ,  Rabindra N. Das ,  Rajinder S. Rai ,  Michael Vincent

IPC分类号： H01L21/44

CPC分类号： H01L21/441 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L27/14676 ,  H01L2224/03464 ,  H01L2224/0401 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05669 ,  H01L2224/1132 ,  H01L2224/11424 ,  H01L2224/13209 ,  H01L2224/13211 ,  H01L2224/13213 ,  H01L2224/13216 ,  H01L2224/13218 ,  H01L2224/1322 ,  H01L2224/13239 ,  H01L2224/13244 ,  H01L2224/13247 ,  H01L2224/1329 ,  H01L2224/13294 ,  H01L2224/13339 ,  H01L2224/13344 ,  H01L2224/13347 ,  H01L2224/13439 ,  H01L2224/13444 ,  H01L2224/16225 ,  H01L2224/81193 ,  H01L2224/8181 ,  H01L2224/81815 ,  H01L2224/8184 ,  H01L2924/12037 ,  H01L2924/00

摘要： A structure for minimizing resistance between a semi-insulating x-ray detector crystal and an electrically conducting substrate. Electrical contact pads are disposed on the detector crystal and on the substrate with an electrical interconnect between the contact pads formed from a conductive adhesive and washed solder in electrical and mechanical communication with the pads.

摘要翻译： 用于最小化半绝缘x射线检测器晶体和导电基底之间的电阻的结构。 电接触焊盘设置在检测器晶体和基板上，在由导电粘合剂形成的接触焊盘和与焊盘电气和机械连通的冲洗焊料之间具有电互连。

公开(公告)号：US08240031B2

公开(公告)日：2012-08-14

申请号：US12837640

申请日：2010-07-16

申请人： Voya R. Markovich ,  Ronald V. Smith ,  How T. Lin ,  Frank D. Egitto ,  Rabindra N. Das ,  William E. Wilson ,  Rajinder S. Rai

发明人： Voya R. Markovich ,  Ronald V. Smith ,  How T. Lin ,  Frank D. Egitto ,  Rabindra N. Das ,  William E. Wilson ,  Rajinder S. Rai

IPC分类号： H05K3/30

CPC分类号： H05K3/3436 ,  H05K1/111 ,  H05K2201/10378 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/4919

摘要： A flexible, high density decal and the use thereof methods of forming detachable electrical interconnections between a flexible chip carrier and a printed wiring board. The flexible decal has fine-pitch pads on a first surface and pads of a pitch wider than the fine pitch on a second surface, the fine-pitch pads on the first surface designed to electrically connect to a semiconductor device, and the wider-pitch pads on the second surface designed to electrically connect to a printed wiring board or the like. The pads on the first surface are conductively wired to the pads on the second surface through one or more insulating levels in the flexible decal.

摘要翻译： 柔性，高密度贴花及其在柔性芯片载体和印刷线路板之间形成可拆卸电互连的方法。 柔性贴花在第一表面上具有细间距焊盘，并且在第二表面上具有比微细间距更宽的间距的焊盘，设计成电连接到半导体器件的第一表面上的细间距焊盘和较宽间距 第二表面上的焊盘被设计成电连接到印刷线路板等。 第一表面上的焊盘通过柔性贴花中的一个或多个绝缘水平导电地连接到第二表面上的焊盘。

公开(公告)号：US20120015532A1

公开(公告)日：2012-01-19

申请号：US12837640

申请日：2010-07-16

申请人： Voya R. Markovich ,  Ronald V. Smith ,  How T. Lin ,  Frank D. Egitto ,  Rabindra N. Das ,  William E. Wilson ,  Rajinder S. Rai

发明人： Voya R. Markovich ,  Ronald V. Smith ,  How T. Lin ,  Frank D. Egitto ,  Rabindra N. Das ,  William E. Wilson ,  Rajinder S. Rai

IPC分类号： H01R12/00 ,  H01L21/66

CPC分类号： H05K3/3436 ,  H05K1/111 ,  H05K2201/10378 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/4919

摘要： A flexible, high density decal and the use thereof methods of forming detachable electrical interconnections between a flexible chip carrier and a printed wiring board. The flexible decal has fine-pitch pads on a first surface and pads of a pitch wider than the fine pitch on a second surface, the fine-pitch pads on the first surface designed to electrically connect to a semiconductor device, and the wider-pitch pads on the second surface designed to electrically connect to a printed wiring board or the like. The pads on the first surface are conductively wired to the pads on the second surface through one or more insulating levels in the flexible decal.

摘要翻译： 柔性，高密度贴花及其在柔性芯片载体和印刷线路板之间形成可拆卸电互连的方法。 柔性贴花在第一表面上具有细间距焊盘，并且在第二表面上具有比微细间距更宽的间距的焊盘，设计成电连接到半导体器件的第一表面上的细间距焊盘和较宽间距 第二表面上的焊盘被设计成电连接到印刷线路板等。 第一表面上的焊盘通过柔性贴花中的一个或多个绝缘水平导电地连接到第二表面上的焊盘。

公开(公告)号：US20090241332A1

公开(公告)日：2009-10-01

申请号：US12078206

申请日：2008-03-28

申请人： John M. Lauffer ,  Roy H. Magnuson ,  Voya R. Markovich ,  James P. Paoletti ,  Kostas I. Papathomas ,  Rajinder S. Rai

发明人： John M. Lauffer ,  Roy H. Magnuson ,  Voya R. Markovich ,  James P. Paoletti ,  Kostas I. Papathomas ,  Rajinder S. Rai

IPC分类号： H05K3/00

CPC分类号： H05K3/462 ,  H05K3/0032 ,  H05K3/4069 ,  H05K3/4623 ,  H05K2201/09318 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2203/061 ,  Y10T29/49124

摘要： A circuitized substrate and method of making same in which a first plurality of holes are formed within two bonded dielectric layers and then made conductive, e.g., plated. The substrate also includes third and fourth dielectric layers bonded to the first and second with a plurality of continuous electrically conductive thru holes extending through all four dielectric layers. Conductive paste is positioned within the thru holes for providing electrical connections between desired conductive layers of the substrate and outer layers as well. A circuitized substrate assembly and method of making same are also provided.

摘要翻译： 电路化基板及其制造方法，其中第一多个孔形成在两个接合的介电层内，然后导电，例如电镀。 衬底还包括通过延伸穿过所有四个电介质层的多个连续导电通孔与第一和第二电极结合的第三和第四电介质层。 导电浆料位于通孔内，用于在基板和外层的期望的导电层之间提供电连接。 还提供了电路化基板组件及其制造方法。

公开(公告)号：US06607613B2

公开(公告)日：2003-08-19

申请号：US09775747

申请日：2001-02-01

申请人： Frank D. Egitto ,  Edmond O. Fey ,  Luis J. Matienzo ,  David L. Questad ,  Rajinder S. Rai ,  Daniel C. Van Hart

发明人： Frank D. Egitto ,  Edmond O. Fey ,  Luis J. Matienzo ,  David L. Questad ,  Rajinder S. Rai ,  Daniel C. Van Hart

IPC分类号： C22C1106

CPC分类号： C23C8/00 ,  B23K1/206 ,  B23K35/0244 ,  B23K35/262 ,  B23K35/268 ,  B23K2101/40 ,  C23C26/00 ,  H05K3/3457 ,  H05K3/3489 ,  H05K2203/092 ,  H05K2203/095 ,  Y10T428/12 ,  Y10T428/12021 ,  Y10T428/12458 ,  Y10T428/12493 ,  Y10T428/12687

摘要： A metal alloy solder ball comprising a first metal and a second metal, the first metal having a sputtering yield greater than the second metal. The solder ball comprises a bulk portion having a bulk ratio of the first metal to the second metal, an outer surface, and a surface gradient having a depth and a gradient ratio of the first metal to the second metal that is less than the bulk ratio. The gradient ratio increases along the surface gradient depth from a minimum at the outer surface. The solder ball may be formed by the process of exposing the ball to energized ions of a sputtering gas for an effective amount of time to form the surface gradient.

摘要翻译： 一种包含第一金属和第二金属的金属合金焊球，所述第一金属的溅射产率大于所述第二金属。 焊球包括具有第一金属与第二金属的体积比的主体部分，外表面和具有小于体积比的第一金属与第二金属的深度和梯度比的表面梯度 。 梯度比沿着表面梯度深度从外表面的最小值增加。 可以通过将球暴露于溅射气体的激发离子有效时间以形成表面梯度的过程来形成焊球。

公开(公告)号：US6056831A

公开(公告)日：2000-05-02

申请号：US113445

申请日：1998-07-10

申请人： Frank D. Egitto ,  Edmond O. Fey ,  Luis J. Matienzo ,  David L. Questad ,  Rajinder S. Rai ,  Daniel C. Van Hart

发明人： Frank D. Egitto ,  Edmond O. Fey ,  Luis J. Matienzo ,  David L. Questad ,  Rajinder S. Rai ,  Daniel C. Van Hart

IPC分类号： B23K35/14 ,  B23K35/26 ,  C23C8/00 ,  C23C26/00 ,  H05K3/34

CPC分类号： C23C26/00 ,  B23K35/262 ,  B23K35/268 ,  C23C8/00 ,  H05K3/3457 ,  H05K2203/092 ,  H05K2203/095 ,  Y10S148/901 ,  Y10S148/903 ,  Y10T428/12687 ,  Y10T428/12701 ,  Y10T428/12708 ,  Y10T428/12861 ,  Y10T428/12896

摘要： A process for altering surface properties of a mass of metal alloy solder comprising a first metal and a second metal. The process comprises exposing the mass to energized ions to preferentially sputter atoms of the first metal to form a surface layer ratio of first metal to second metal atoms that is less than the bulk ratio. The solder may be located on the surface of a substrate, wherein the process may further comprise masking the substrate to shield all but a selected area from the ion beam. The sputtering gas may comprises a reactive gas such as oxygen and the substrate may be an organic substrate. The process may further comprise simultaneously exposing the organic substrate to energized ions of the reactive gas to roughen the organic substrate surface.

摘要翻译： 一种用于改变包括第一金属和第二金属的金属合金焊料块的表面性质的方法。 该方法包括将质量暴露于通电离子以优先溅射第一金属的原子，以形成小于体积比的第一金属与第二金属原子的表面层比。 焊料可以位于衬底的表面上，其中该工艺可以进一步包括掩蔽衬底以屏蔽离开所述离子束的所有区域。 溅射气体可以包括诸如氧的反应性气体，并且衬底可以是有机衬底。 该方法可以进一步包括将有机底物同时暴露于活性气体的激发离子以粗糙化有机基底表面。

公开(公告)号：US06210547B1

公开(公告)日：2001-04-03

申请号：US09382221

申请日：1999-08-24

申请人： Frank D. Egitto ,  Edmond O. Fey ,  Luis J. Matienzo ,  David L. Questad ,  Rajinder S. Rai ,  Daniel C. Van Hart

发明人： Frank D. Egitto ,  Edmond O. Fey ,  Luis J. Matienzo ,  David L. Questad ,  Rajinder S. Rai ,  Daniel C. Van Hart

IPC分类号： C23C800

CPC分类号： C23C26/00 ,  B23K35/262 ,  B23K35/268 ,  C23C8/00 ,  H05K3/3457 ,  H05K2203/092 ,  H05K2203/095 ,  Y10S148/901 ,  Y10S148/903 ,  Y10T428/12687 ,  Y10T428/12701 ,  Y10T428/12708 ,  Y10T428/12861 ,  Y10T428/12896

摘要： A process for altering surface properties of a mass of metal alloy solder comprising a first metal and a second metal. The process comprises exposing the mass to energized ions to preferentially sputter atoms of the first metal to form a surface layer ratio of first metal to second metal atoms that is less than the bulk ratio. The solder may be located on the surface of a substrate, wherein the process may further comprise masking the substrate to shield all but a selected area from the ion beam. The sputtering gas may comprises a reactive gas such as oxygen and the substrate may be an organic substrate. The process may further comprise simultaneously exposing the organic substrate to energized ions of the reactive gas to roughen the organic substrate surface.

摘要翻译： 一种用于改变包含第一金属和第二金属的金属合金焊料块的表面性质的方法。 该方法包括将质量暴露于通电离子以优先溅射第一金属的原子，以形成小于体积比的第一金属与第二金属原子的表面层比。 焊料可以位于衬底的表面上，其中该工艺可以进一步包括掩蔽衬底以屏蔽离开所述离子束的所有区域。 溅射气体可以包括诸如氧的反应性气体，并且衬底可以是有机衬底。 该方法可以进一步包括将有机底物同时暴露于活性气体的激发离子以粗糙化有机基底表面。