公开(公告)号：US5268260A

公开(公告)日：1993-12-07

申请号：US781542

申请日：1991-10-22

申请人： Nageshwer R. Bantu ,  Anilkumar C. Bhatt ,  Ashwinkumar C. Bhatt ,  Joseph A. Kotylo ,  Gerald W. Jones ,  Robert J. Owen ,  Kostas Papathomas ,  Anaya K. Vardya

发明人： Nageshwer R. Bantu ,  Anilkumar C. Bhatt ,  Ashwinkumar C. Bhatt ,  Joseph A. Kotylo ,  Gerald W. Jones ,  Robert J. Owen ,  Kostas Papathomas ,  Anaya K. Vardya

IPC分类号： G03F7/32 ,  G03F7/42 ,  H05K3/06 ,  G03F7/30

CPC分类号： G03F7/422 ,  G03F7/325

摘要： Simple, environmentally friendly developers and strippers are disclosed for free radical-initiated, addition polymerizable resists, cationically cured resists and solder masks and Vacrel photoresists. In all cases both the developers and the strippers include gamma butyrolactone, propylene carbonate and benzyl alcohol, optionally also including a minor amount of methanol, ethanol, isopropyl alcohol, propylene glycol monomethylacetate, ethylene glycol monomethyl ether, formamide, nitromethane, propylene oxide, or methyl ethyl ketone, acetone and water.

摘要翻译： 公开了简单的，环保的显影剂和剥离剂，用于自由基引发的可加聚合的抗蚀剂，阳离子固化的抗蚀剂和焊接掩模以及Vacrel光致抗蚀剂。 在所有情况下，显影剂和剥离剂都包括γ-丁内酯，碳酸亚丙酯和苄醇，任选地还包括少量甲醇，乙醇，异丙醇，丙二醇单甲基乙酸酯，乙二醇单甲醚，甲酰胺，硝基甲烷，环氧丙烷或 甲基乙基酮，丙酮和水。

公开(公告)号：US5281723A

公开(公告)日：1994-01-25

申请号：US925349

申请日：1992-08-04

申请人： Nageshwer R. Bantu ,  Anilkumar C. Bhatt ,  Ross W. Keesler ,  Konstantinos Papathomas ,  Terry D. Sinclair ,  Jerome J. Wagner

发明人： Nageshwer R. Bantu ,  Anilkumar C. Bhatt ,  Ross W. Keesler ,  Konstantinos Papathomas ,  Terry D. Sinclair ,  Jerome J. Wagner

IPC分类号： B01D3/00 ,  C07D317/36 ,  G03F7/30 ,  G03F7/42 ,  H01L21/02 ,  H01L21/027 ,  H01L21/30 ,  C07D317/08

CPC分类号： C07D317/36

摘要： Disclosed is a method of recovering a cyclic alkylene carbonate, such as propylene carbonate, from an effluent stream of a process in which the cyclic alkylene carbonate removes an organic photoresist material from a substrate. The effluent is a cyclic alkylene carbonate effluent, e.g., a propylene carbonate effluent, of the carbonate, water, and polymeric solids. In the recovery process the cyclic alkylene carbonate effluent is fed to a heat exchanger, and separated into (i) water and volatiles, and (ii) cyclic carbonate. This lowers the concentration of water in the cyclic alkylene carbonate to a level that is low enough to substantially avoid hydrolysis of cyclic alkylene carbonate to the corresponding glycol. The dewatered cyclic alkylene carbonate is evaporated to separate the cyclic alkylene carbonate from high boiling materials and polymeric solids. The dewatered cyclic alkylene carbonate is separated into (i) a cyclic alkylene carbonate fraction, and (ii) a photoresist solids fraction. The photoresist materials fractions contains photoresist material in the alkylene carbonate. The cyclic alkylene carbonate fraction is further separated in a fractionation means into a higher vapor pressure alkylene glycol fraction, and a lower vapor pressure alkylene carbonate fraction.

摘要翻译： 公开了从循环碳酸亚烃酯从底物去除有机光致抗蚀剂材料的方法的流出物流中回收碳酸亚环己基碳酸酯的方法。 流出物是碳酸酯，水和聚合物固体的环状碳酸亚烃酯流出物，例如碳酸亚丙酯流出物。 在回收过程中，将环状碳酸亚烃酯流出物进料到热交换器中，并分离成（i）水和挥发物，和（ii）环状碳酸酯。 这将环状​​碳酸亚烃酯中的水的浓度降低至足以基本上避免环状亚烷基碳酸酯水解成相应的二醇的水平。 将脱水的环状碳酸亚烃酯蒸发以从环烷烃碳酸酯与高沸点物质和聚合物固体分离。 将脱水的环状碳酸亚烃酯分离成（i）环状碳酸亚烷基酯馏分，（ii）光致抗蚀剂固体分数。 光致抗蚀剂材料部分在碳酸亚烷基酯中含有光致抗蚀剂材料。 环状亚烷基碳酸酯部分在分馏装置中进一步分离成较高蒸气压亚烷基二醇馏分和较低蒸气压的碳酸亚烃酯馏分。

公开(公告)号：US06740819B2

公开(公告)日：2004-05-25

申请号：US10421272

申请日：2003-04-23

申请人： Anilkumar C. Bhatt ,  Ashwinkumar C. Bhatt ,  Subahu D. Desai ,  John M. Lauffer ,  Voya R. Markovich ,  Thomas R. Miller

发明人： Anilkumar C. Bhatt ,  Ashwinkumar C. Bhatt ,  Subahu D. Desai ,  John M. Lauffer ,  Voya R. Markovich ,  Thomas R. Miller

IPC分类号： H05K706

CPC分类号： H05K3/445 ,  H05K1/056 ,  H05K3/0023 ,  H05K3/0082 ,  H05K3/4641 ,  H05K2203/143

摘要： Via holes are formed in an electrically conductive power plane. Photo-imageable dielectric (PID) material is applied to one side of the power plane filling the via holes. The power plane side with no PID material is exposed to light energy to cure the PID material in the via holes. A developer is used to remove any uncured PID material. Signal plane assemblies comprising a conductive signal plane and a dielectric layer are laminated onto the filled power plane forming a two signal and one power plane (2S1P) structure. In another embodiment, the power plane has PID material applied from both sides. A photo-mask is applied to the power plane and the PID material in the via holes is cured with light energy. A developer is used to remove uncured PID material. Signal plane assemblies, as described above, are laminated onto the filled power plane forming a 2S1P structure.

摘要翻译： 通孔形成在导电电力平面中。 可光成像电介质（PID）材料被施加到填充通孔的电源平面的一侧。 没有PID材料的电源平面侧暴露于光能以固化通孔中的PID材料。 开发人员用于去除任何未固化的PID材料。 包括导电信号平面和电介质层的信号平面组件层压到形成两个信号和一个功率平面（2S1P）结构的填充的电源平面上。 在另一实施例中，动力平面具有从两侧施加的PID材料。 将光掩模应用于电源平面，通孔中的PID材料用光能固化。 开发人员用于清除未固化的PID材料。 如上所述的信号平面组件被层压到形成2S1P结构的填充的电源平面上。

公开(公告)号：US06608757B1

公开(公告)日：2003-08-19

申请号：US10101277

申请日：2002-03-18

申请人： Anilkumar C. Bhatt ,  Ashwinkumar C. Bhatt ,  Subahu D. Desai ,  John M. Lauffer ,  Voya R. Markovich ,  Thomas R. Miller

发明人： Anilkumar C. Bhatt ,  Ashwinkumar C. Bhatt ,  Subahu D. Desai ,  John M. Lauffer ,  Voya R. Markovich ,  Thomas R. Miller

IPC分类号： H05K716

CPC分类号： H05K3/445 ,  H05K1/056 ,  H05K3/0023 ,  H05K3/0082 ,  H05K3/4641 ,  H05K2203/143

摘要： Via holes are formed in an electrically conductive power plane. Photo-imageable dielectric (PID) material is applied to one side of the power plane filling the via holes. The power plane side with no PID material is exposed to light energy to cure the PID material in the via holes. A developer is used to remove any uncured PID material. Signal plane assemblies comprising a conductive signal plane and a dielectric layer are laminated onto the filled power plane forming a two signal and one power plane (2S1P) structure. In another embodiment, the power plane has PID material applied from both sides. A photo-mask is applied to the power plane and the PID material in the via holes is cured with light energy. A developer is used to remove uncured PID material. Signal plane assemblies, as described above, are laminated onto the filled power plane forming a 2S1P structure.

摘要翻译： 通孔形成在导电电力平面中。 可光成像电介质（PID）材料被施加到填充通孔的电源平面的一侧。 没有PID材料的电源平面侧暴露于光能以固化通孔中的PID材料。 开发人员用于去除任何未固化的PID材料。 包括导电信号平面和电介质层的信号平面组件层压到形成两个信号和一个功率平面（2S1P）结构的填充的电源平面上。 在另一实施例中，动力平面具有从两侧施加的PID材料。 将光掩模应用于电源平面，通孔中的PID材料用光能固化。 开发人员用于清除未固化的PID材料。 如上所述的信号平面组件被层压到形成2S1P结构的填充的电源平面上。

公开(公告)号：US06931722B2

公开(公告)日：2005-08-23

申请号：US10395944

申请日：2003-03-24

申请人： Edward L. Arrington ,  Anilkumar C. Bhatt ,  Edmond O. Fey ,  Kevin T. Knadle ,  John J. Konrad ,  Joseph A Kotylo ,  Jeffrey McKeveny ,  Jose A. Rios ,  Amit K. Sarkhel ,  Andrew M. Seman ,  Timothy L. Wells

发明人： Edward L. Arrington ,  Anilkumar C. Bhatt ,  Edmond O. Fey ,  Kevin T. Knadle ,  John J. Konrad ,  Joseph A Kotylo ,  Jeffrey McKeveny ,  Jose A. Rios ,  Amit K. Sarkhel ,  Andrew M. Seman ,  Timothy L. Wells

IPC分类号： H05K3/24 ,  H05K3/28 ,  H05K3/34 ,  H05K3/42 ,  H05K3/02

CPC分类号： H05K3/243 ,  H05K3/28 ,  H05K3/3452 ,  H05K3/3473 ,  H05K3/42 ,  H05K2201/0391 ,  H05K2203/0315 ,  H05K2203/0574 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

摘要： A method of fabricating a printed circuit device including an electrically insulating substrate, and first, second, and third sets of conductors formed on a top surface of the substrate is disclosed. The method includes forming an oxide layer on the set of second conductors; forming a solder mask on the oxide layer; forming a composite layer on the first set of conductors; and forming a solder layer on at least a portion of the third set of conductors.

摘要翻译： 公开了一种制造印刷电路器件的方法，该印刷电路器件包括电绝缘衬底以及形成在衬底顶表面上的第一组，第二组和第三组导体。 该方法包括在第二导体组上形成氧化物层; 在氧化物层上形成焊料掩模; 在第一组导体上形成复合层; 以及在所述第三组导体的至少一部分上形成焊料层。

公开(公告)号：US06586683B2

公开(公告)日：2003-07-01

申请号：US09844814

申请日：2001-04-27

申请人： Edward L. Arrington ,  Anilkumar C. Bhatt ,  Edmond O. Fey ,  Kevin T. Knadle ,  John J. Konrad ,  Joseph A. Kotylo ,  Jeffrey McKeveny ,  Jose A. Rios ,  Amit K. Sarkhel ,  Andrew M. Seman ,  Timothy L. Wells

发明人： Edward L. Arrington ,  Anilkumar C. Bhatt ,  Edmond O. Fey ,  Kevin T. Knadle ,  John J. Konrad ,  Joseph A. Kotylo ,  Jeffrey McKeveny ,  Jose A. Rios ,  Amit K. Sarkhel ,  Andrew M. Seman ,  Timothy L. Wells

IPC分类号： H05K103

CPC分类号： H05K3/243 ,  H05K3/28 ,  H05K3/3452 ,  H05K3/3473 ,  H05K3/42 ,  H05K2201/0391 ,  H05K2203/0315 ,  H05K2203/0574 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

摘要： A method of fabricating a printed circuit device including an electrically insulating substrate, and first, second, and third sets of conductors formed on a top surface of the substrate is disclosed. The method includes forming an oxide layer on the set of second conductors; forming a solder mask on the oxide layer; forming a composite layer on the first set of conductors; and forming a solder layer on at least a portion of the third set of conductors.

公开(公告)号：US06781064B1

公开(公告)日：2004-08-24

申请号：US09342584

申请日：1999-06-29

申请人： Bernd K. Appelt ,  Anilkumar C. Bhatt ,  James W. Fuller, Jr. ,  John M. Lauffer ,  Voya R. Markovich ,  William J. Rudik ,  William E. Wilson

发明人： Bernd K. Appelt ,  Anilkumar C. Bhatt ,  James W. Fuller, Jr. ,  John M. Lauffer ,  Voya R. Markovich ,  William J. Rudik ,  William E. Wilson

IPC分类号： H05K103

CPC分类号： H01L23/564 ,  H01L21/481 ,  H01L23/498 ,  H01L23/49894 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/036 ,  H05K1/0366 ,  H05K3/429 ,  H05K3/4626 ,  H05K3/4641 ,  H05K2201/0195 ,  H05K2201/0769 ,  H05K2201/09718 ,  H05K2201/09881 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A printed circuit board for use in an electronic device package such as a ball grid array package or organic chip carrier package. This printed circuit board includes a glass-free dielectric for separating and insulating power cores, circuitry or plated through holes from each other to prevent shorts caused by a migration of conductive material along glass-based prepreg substrates.

摘要翻译： 一种用于诸如球栅阵列封装或有机芯片载体封装的电子器件封装中的印刷电路板。 该印刷电路板包括一个无玻璃的电介质，用于分离和绝缘电源芯，电路或电镀通孔，以防止导电材料沿玻璃基预浸料衬底迁移引起的短路。

公开(公告)号：US06495239B1

公开(公告)日：2002-12-17

申请号：US09458291

申请日：1999-12-10

申请人： Anilkumar C. Bhatt ,  Stephen J. Fuerniss ,  Roy H. Magnuson ,  Voya R. Markovich

发明人： Anilkumar C. Bhatt ,  Stephen J. Fuerniss ,  Roy H. Magnuson ,  Voya R. Markovich

IPC分类号： B32B310

CPC分类号： B32B7/04 ,  B32B27/26 ,  B32B27/32 ,  B32B2250/40 ,  B32B2305/72 ,  H05K3/0023 ,  H05K3/4602 ,  H05K3/4623 ,  H05K3/4626 ,  H05K3/4641 ,  H05K2201/09509 ,  H05K2201/09536 ,  Y10S428/901 ,  Y10T428/24273 ,  Y10T428/28 ,  Y10T428/31511

摘要： A dielectric structure, wherein two fully cured photoimageable dielectric (PID) layers of the structure are nonadhesively interfaced by a partially cured PID layer. The partially cured PID layer includes a power plane sandwiched between a first partially cured PID sheet and a second partially cured PID sheet. The fully cured PID layers each include an internal power plane, a plated via having a blind end conductively coupled to the internal power plane, and a plated via passing through the fully cured PID layer. The dielectric structure may further include a first PID film partially cured and nonadhesively coupled to one of the fully cured PID layers. The dialectric structure may further include a second PID film partially cured and nonadhesively coupled to the other fully cured PID layer.

摘要翻译： 一种电介质结构，其中该结构的两个完全固化的可光成像电介质（PID）层通过部分固化的PID层非粘性地接合。 部分固化的PID层包括夹在第一部分固化的PID片和第二部分固化的PID片之间的动力平面。 完全固化的PID层各自包括内部电源平面，具有导电耦合到内部电源平面的盲端的电镀通孔以及穿过完全固化的PID层的电镀通孔。 电介质结构还可以包括部分固化并非粘性地耦合到完全固化的PID层之一的第一PID膜。 所述方程式结构还可以包括部分固化并非粘性地耦合到另一完全固化的PID层的第二PID膜。

公开(公告)号：US06221694B1

公开(公告)日：2001-04-24

申请号：US09343080

申请日：1999-06-29

申请人： Anilkumar C. Bhatt ,  Michael J. Cummings ,  Thomas R. Miller ,  Kristen A. Stauffer ,  Michael Wozniak

发明人： Anilkumar C. Bhatt ,  Michael J. Cummings ,  Thomas R. Miller ,  Kristen A. Stauffer ,  Michael Wozniak

IPC分类号： H01L2144

CPC分类号： H01L21/4803 ,  H01L21/4846 ,  H01L21/486 ,  H01L23/13 ,  H01L23/49805 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/181 ,  H05K1/021 ,  H05K1/182 ,  H05K3/0061 ,  H05K3/427 ,  H05K2201/09554 ,  H05K2201/09981 ,  H05K2203/049 ,  H01L2224/05599 ,  H01L2924/00

摘要： A method of making a circuitized substrate which may be utilized as a chip carrier structure. The method involves the steps of providing a dielectric member and routing out a preselected portion of the base member to form an aperture. Metallization of the dielectric member and the walls of the aperture then occurs, followed by circuitization of the surfaces of the dielectric member. Direct metallization of the aperture walls eliminates many manufacturing steps previously required to metallize the aperture walls.

摘要翻译： 制造可用作芯片载体结构的电路化衬底的方法。 该方法包括以下步骤：提供电介质构件并布置出基底构件的预选部分以形成孔。 然后发生电介质构件和孔的壁的金属化，随后电介质构件的表面被电路化。 孔壁的直接金属化消除了先前为孔壁金属化所需的许多制造步骤。

公开(公告)号：US06187965B1

公开(公告)日：2001-02-13

申请号：US09188007

申请日：1998-11-06

申请人： Anilkumar C. Bhatt ,  Jerome J. Wagner

发明人： Anilkumar C. Bhatt ,  Jerome J. Wagner

IPC分类号： C07C2980

CPC分类号： C07D307/33 ,  C07C29/80 ,  C07C33/20 ,  C07C33/22 ,  C07C33/24

摘要： A method of recovering benzyl alcohol, gamma butyrolactone, or propylene carbonate from an impure effluent stream of an industrial process is provided. The effluent waste stream contains greater than about 10 percent by weight of monomeric units that are reacted to form larger oligomers and polymers. The first step in the recovery process involves polymerizing the monomeric units present in the effluent waste stream under conditions effective to reduce the concentration of monomeric units in the waste stream to less than about 10 weight percent. The waste stream then is fed to a first separation stage where it is separated into (i) a gaseous stream of water, soluble gases, and volatile contaminants and (ii) a suspension comprising the high boiling solvent, semi-volatile materials, and non-volatile contaminants and materials. Then the dewatered, low vapor pressure, high boiling solvent-containing suspension is either distilled or evaporated to separate the high boiling solvent from non-volatile materials. In this second separation stage, the solvent-containing suspension is separated into (i) a solvent-containing fraction, and (ii) a sludge fraction. The sludge fraction contains non-volatile materials in the high boiling solvent.

摘要翻译： 提供了从工业过程不纯的流出物流中回收苄醇，γ-丁内酯或碳酸亚丙酯的方法。 流出物废物流含有大于约10重量％的单体单元，其被反应以形成较大的低聚物和聚合物。 回收过程中的第一步包括在有效降低废物流中的单体单元浓度至小于约10重量％的条件下聚合存在于流出物废物流中的单体单元。 然后将废物流送入第一分离阶段，在该分离阶段将其分离为（i）气态的水流，可溶性气体和挥发性污染物，和（ii）包含高沸点溶剂，半挥发性物质和非挥发性物质的悬浮液 挥发性污染物和材料。 然后将脱水，低蒸气压，高沸点溶剂的悬浮液蒸馏或蒸发，以将高沸点溶剂与非挥发性物质分离。 在该第二分离阶段，将含溶剂的悬浮液分离成（i）含溶剂的级分，和（ii）污泥馏分。 污泥级分在高沸点溶剂中含有非挥发性物质。