公开(公告)号：US20100050345A1

公开(公告)日：2010-03-04

申请号：US12432391

申请日：2009-04-29

申请人： Pyoung Hwan Kim ,  Eun Jin Park ,  Dong Woo Kang ,  Myoung Suk You ,  Deug Hee Lee ,  Kyu Won Lee ,  Hyung Yong Kim

发明人： Pyoung Hwan Kim ,  Eun Jin Park ,  Dong Woo Kang ,  Myoung Suk You ,  Deug Hee Lee ,  Kyu Won Lee ,  Hyung Yong Kim

IPC分类号： D06F33/00

CPC分类号： D06F39/004 ,  D06F35/006

摘要： A control method of a laundry machine comprising a water supply, washing and rinsing cycle, the control method includes first determination step performed prior to the rinsing cycle and determining a kind of detergent, second determination step performed during a first rinsing course of the rinsing cycle and determining an amount of remained detergent in a rinsing water, and condition determination step of at least one following rinsing course based on the kind and amount of the remained detergent.

摘要翻译： 一种洗衣机的控制方法，包括供水，洗涤和漂洗循环，所述控制方法包括在漂洗循环之前执行的第一确定步骤和确定洗涤剂的种类，在漂洗循环的第一漂洗过程期间执行的第二确定步骤 以及确定冲洗水中剩余洗涤剂的量，以及基于剩余洗涤剂的种类和量的至少一个后续漂洗过程的条件测定步骤。

公开(公告)号：US08375495B2

公开(公告)日：2013-02-19

申请号：US12432391

申请日：2009-04-29

申请人： Pyoung Hwan Kim ,  Eun Jin Park ,  Dong Woo Kang ,  Myoung Suk You ,  Deug Hee Lee ,  Kyu Won Lee ,  Hyung Yong Kim

发明人： Pyoung Hwan Kim ,  Eun Jin Park ,  Dong Woo Kang ,  Myoung Suk You ,  Deug Hee Lee ,  Kyu Won Lee ,  Hyung Yong Kim

IPC分类号： D06F33/00

CPC分类号： D06F39/004 ,  D06F35/006

摘要： A control method of a laundry machine comprising a water supply, washing and rinsing cycle, the control method includes first determination step performed prior to the rinsing cycle and determining a kind of detergent, second determination step performed during a first rinsing course of the rinsing cycle and determining an amount of remained detergent in a rinsing water, and condition determination step of at least one following rinsing course based on the kind and amount of the remained detergent.

摘要翻译： 一种洗衣机的控制方法，包括供水，洗涤和漂洗循环，所述控制方法包括在漂洗循环之前执行的第一确定步骤和确定洗涤剂的种类，在漂洗循环的第一漂洗过程期间执行的第二确定步骤 以及确定冲洗水中剩余洗涤剂的量，以及基于剩余洗涤剂的种类和量的至少一个后续漂洗过程的条件测定步骤。

公开(公告)号：US20100095465A1

公开(公告)日：2010-04-22

申请号：US12425645

申请日：2009-04-17

申请人： Pyoung Hwan KIM ,  Eun Jin Park ,  Dong Woo Kang ,  Myoung Suk You ,  Deug Hee Lee ,  Kyu Won Lee ,  Hyung Yong Kim

发明人： Pyoung Hwan KIM ,  Eun Jin Park ,  Dong Woo Kang ,  Myoung Suk You ,  Deug Hee Lee ,  Kyu Won Lee ,  Hyung Yong Kim

IPC分类号： D06L1/00

CPC分类号： D06F35/006 ,  D06F39/005 ,  D06F2202/02 ,  D06F2216/00

摘要： The present invention relates to a method for controlling a washing machine, in which functioning of a safe rinsing is shown to a user visibly for improving user's reliability. The method, having a detergent amount calculating step for calculating a remained detergent amount at the time of finishing a washing course or a starting of a rinsing course by means of a conductivity sensor, and a determining step for determining whether an additional rinsing is performed or not according to the remained detergent amount calculated thus, the method includes a user informing step for informing a change of the rinsing pattern to the user if the rinsing pattern which is a parameter that gives influence to the rinsing course with reference to the remained detergent amount calculated in the detergent amount calculating step.

摘要翻译： 本发明涉及一种用于控制洗衣机的方法，其中用户可视地显示安全冲洗的功能，以提高用户的可靠性。 该方法具有洗涤剂量计算步骤，用于通过电导率传感器计算清洗过程完成时的残留洗涤剂量或冲洗过程的开始，以及用于确定是否进行附加冲洗的确定步骤， 不是根据由此计算的剩余洗涤剂量，所以该方法包括用户通知步骤，用于通知参照剩余洗涤剂量对冲洗过程产生影响的参数的漂洗图案给用户通知漂洗图案的改变 在洗涤剂量计算步骤中计算。

公开(公告)号：US08476751B2

公开(公告)日：2013-07-02

申请号：US13096143

申请日：2011-04-28

申请人： Kyu Won Lee ,  Cheol Ho Joh ,  Eun-Hye Do ,  Ji Eun Kim ,  Hee Min Shin

发明人： Kyu Won Lee ,  Cheol Ho Joh ,  Eun-Hye Do ,  Ji Eun Kim ,  Hee Min Shin

IPC分类号： H01L23/02

CPC分类号： H01L23/481 ,  H01L21/561 ,  H01L23/3128 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L25/03 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1064 ,  H01L2225/1076 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A stacked semiconductor package includes a semiconductor package module including a plurality of semiconductor packages each of which has a first surface, a second surface facing away from the first surface, side surfaces connecting the first surface and the second surface and through-holes formed on the side surfaces to pass through the first surface and the second surface and which are stacked such that their through-holes vertically connect with one another, and adhesive members which are formed between the semiconductor packages and attach the semiconductor packages to one another, a main substrate supporting the semiconductor package module and formed, on a third surface thereof facing the semiconductor package module, with main connection pads which are aligned with the through-holes, and conductive connection members formed in the through-holes and electrically connecting the semiconductor packages with the main connection pads.

摘要翻译： 堆叠半导体封装包括半导体封装模块，其包括多个半导体封装，每个半导体封装具有第一表面，背离第一表面的第二表面，连接第一表面和第二表面的侧表面和形成在第一表面上的通孔 侧表面通过第一表面和第二表面并且堆叠成使得它们的通孔彼此垂直连接;以及粘合构件，其形成在半导体封装之间并将半导体封装彼此附接，主基板 支撑半导体封装模块，并在其面向半导体封装模块的第三表面上形成与通孔对准的主连接焊盘，以及形成在通孔中的导电连接构件，并将半导体封装与 主连接垫

公开(公告)号：US07950257B2

公开(公告)日：2011-05-31

申请号：US11657727

申请日：2007-01-25

申请人： Jae Mun Kim ,  Jong Deuk Bae ,  Heung Gi Kim ,  Ki Chul Woo ,  In Geun Ahn ,  Kyeong Hwan Kim ,  Kyung Chul Woo ,  Kyu Won Lee ,  Young Soo Kim ,  Ji Maeng Kim

发明人： Jae Mun Kim ,  Jong Deuk Bae ,  Heung Gi Kim ,  Ki Chul Woo ,  In Geun Ahn ,  Kyeong Hwan Kim ,  Kyung Chul Woo ,  Kyu Won Lee ,  Young Soo Kim ,  Ji Maeng Kim

IPC分类号： D06F39/04 ,  F26B19/00

CPC分类号： D06F39/008 ,  F22B1/284

摘要： A dryer or a washing machine includes a cabinet which forms an exterior of the dryer or the washing machine. A drum is rotatably mounted in the cabinet and a steam generator is provided outside the drum to supply steam to the drum, where the steam generator includes a water chamber to hold water, the water chamber having a heater mounted thereto for heating the water. The steam chamber is provided above the water chamber to hold steam generated as the water is heated, where the steam chamber has a steam discharge opening for discharging the steam, where the steam discharge opening is provided with a separator for isolating a steam discharge area from other areas and where the water chamber has a vertical direction length relatively greater than a horizontal direction length.

摘要翻译： 干衣机或洗衣机包括形成干衣机或洗衣机的外部的橱柜。 鼓可旋转地安装在机壳中，并且蒸汽发生器设置在滚筒的外侧，以向滚筒供应蒸汽，其中蒸汽发生器包括用于保持水的水室，水室具有安装在其上的加热器用于加热水。 蒸汽室设置在水室上方，以保持随着加热而产生的蒸汽，其中蒸汽室具有用于排出蒸汽的蒸汽排放口，其中蒸汽排出口设置有隔离蒸汽排放区域的分离器 其他区域和水室具有相对大于水平方向长度的垂直方向长度的位置。

公开(公告)号：US06853060B1

公开(公告)日：2005-02-08

申请号：US10420977

申请日：2003-04-22

申请人： Jae Wook Seok ,  Kyu Won Lee ,  Yong Suk Yoo

发明人： Jae Wook Seok ,  Kyu Won Lee ,  Yong Suk Yoo

IPC分类号： H01L21/48 ,  H01L23/16 ,  H01L23/31 ,  H01L23/498 ,  H05K3/24 ,  H05K3/28 ,  H01L23/02 ,  H01L23/04 ,  H01L21/44

CPC分类号： H05K3/28 ,  H01L21/4857 ,  H01L23/16 ,  H01L23/3128 ,  H01L23/498 ,  H01L23/49822 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107 ,  H05K3/243 ,  H05K3/284 ,  H05K2201/09881 ,  H05K2203/025 ,  H05K2203/1476 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00

摘要： A semiconductor package has a substrate comprising a thermosetting resin layer of an approximate planar plate, a plurality of copper patterns formed at top and bottom surfaces of the resin layer, and protective layers coated on predetermined regions of the copper patterns and the thermosetting layer and having a same height at a surface of the resin layer. A semiconductor die is coupled to a center of the top surface of the substrate. A plurality of conductive wires for electrically coupling the semiconductor die to the copper patterns is positioned at the top surface of the resin layer. An encapsulant is used for covering the semiconductor die located at the top surface of the substrate and the conductive wires in order to protect them from the external environment. A plurality of solder balls is coupled to the bottom surface of the substrate.

摘要翻译： 半导体封装具有包括近似平板的热固性树脂层，形成在树脂层的顶表面和底表面处的多个铜图案的基板和涂覆在铜图案和热固化层的预定区域上的保护层，并且具有 在树脂层的表面具有相同的高度。 半导体管芯耦合到衬底顶表面的中心。 用于将半导体管芯电耦合到铜图案的多个导线定位在树脂层的顶表面。 密封剂用于覆盖位于基板的顶表面和导线的半导体管芯，以便保护它们免受外部环境的影响。 多个焊球联接到基板的底表面。

公开(公告)号：US08674485B1

公开(公告)日：2014-03-18

申请号：US12963431

申请日：2010-12-08

申请人： Gi Jeong Kim ,  Jae Yoon Kim ,  Kyu Won Lee

发明人： Gi Jeong Kim ,  Jae Yoon Kim ,  Kyu Won Lee

IPC分类号： H01L23/495

CPC分类号： H01L23/49575 ,  H01L23/49541 ,  H01L23/49551 ,  H01L23/49558 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

摘要： In one embodiment, a semiconductor package includes a generally planar die paddle or die pad that defines multiple peripheral edge segments, and includes one or more tie bars protruding therefrom. In addition, the semiconductor package includes a plurality of leads, portions of which protrude from respective side surfaces of a package body of the semiconductor package. Connected to the top surface of the die pad is at least one semiconductor die which is electrically connected to at least some of the leads. At least portions of the die pad, the leads, and the semiconductor die are encapsulated by the package body. The one or more tie bars and the plurality of leads include downsets that are sized and oriented relative to each other to facilitate enhanced manufacturing.

摘要翻译： 在一个实施例中，半导体封装包括限定多个周边边缘段的大致平面的管芯焊盘或管芯焊盘，并且包括从其突出的一个或多个连接杆。 此外，半导体封装包括多个引线，其多个引线从半导体封装的封装主体的相应侧表面突出。 连接到管芯焊盘的顶表面的是至少一个半导体管芯，其电连接到至少一些引线。 芯片焊盘，引线和半导体管芯的至少一部分被封装体封装。 一个或多个连接杆和多个引线包括相对于彼此定尺寸和定向的下沉，以有助于增强制造。

公开(公告)号：US20130249076A1

公开(公告)日：2013-09-26

申请号：US13424710

申请日：2012-03-20

申请人： Soo Won Lee ,  Kyu Won Lee ,  Eun Jin Jeong

发明人： Soo Won Lee ,  Kyu Won Lee ,  Eun Jin Jeong

IPC分类号： H01L23/498 ,  H01L21/60

CPC分类号： H01L24/13 ,  H01L21/4846 ,  H01L23/498 ,  H01L23/49838 ,  H01L24/11 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/0346 ,  H01L2224/0347 ,  H01L2224/0401 ,  H01L2224/05027 ,  H01L2224/0508 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/05171 ,  H01L2224/05172 ,  H01L2224/05181 ,  H01L2224/05552 ,  H01L2224/05554 ,  H01L2224/05572 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/1132 ,  H01L2224/1145 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13184 ,  H01L2224/16112 ,  H01L2224/16237 ,  H01L2224/16238 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81385 ,  H01L2224/81815 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3841 ,  H01L2924/00 ,  H01L2224/11 ,  H01L2224/03 ,  H01L2924/01007 ,  H01L2924/01074 ,  H01L2924/01029 ,  H01L2924/01023 ,  H01L2924/014 ,  H01L2924/00012

摘要： A semiconductor device has a substrate. A first conductive layer is formed over the substrate. A duplex plated bump on lead pad is formed over the substrate. An insulating layer is formed over the first conductive layer and the substrate. A portion of the insulating over the duplex plated bump on lead pad is removed using a laser direct ablation process. The insulating layer is a lamination layer. The duplex plated bump on lead pad has a wide bump on lead pad. A semiconductor die is mounted over the substrate. The semiconductor die has a composite conductive interconnect structure. The semiconductor die has a first bump and a second bump with a pitch ranging from 90-150 micrometers between the first bump and the second bump. A duplex plated contact pad is formed on a surface of the substrate opposite the duplex plated bump-on-lead pad.

摘要翻译： 半导体器件具有基板。 第一导电层形成在衬底上。 引线板上的双面电镀凸块形成在衬底上。 在第一导电层和基板之上形成绝缘层。 使用激光直接烧蚀工艺去除铅焊盘上的双面电镀凸块上绝缘层的一部分。 绝缘层是层叠层。 导线焊盘上的双面电镀凸块在导线焊盘上有一个很大的凹凸。 半导体管芯安装在衬底上。 半导体管芯具有复合导电互连结构。 半导体管芯具有第一凸块和在第一凸块和第二凸块之间具有从90-150微米的间距的第二凸块。 双面电镀接触焊盘形成在与双面电镀凸块焊盘相对的基板的表面上。

公开(公告)号：US08461696B2

公开(公告)日：2013-06-11

申请号：US12647953

申请日：2009-12-28

申请人： Kyu Won Lee ,  Qwan Ho Chung

发明人： Kyu Won Lee ,  Qwan Ho Chung

IPC分类号： H01L23/12 ,  H01L23/48 ,  H01L29/40

CPC分类号： H01L24/27 ,  H01L21/561 ,  H01L23/3128 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/28 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/24225 ,  H01L2224/24226 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/92 ,  H01L2224/97 ,  H01L2225/1058 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/078 ,  H01L2924/07802 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3511 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2924/3512

摘要： A substrate for a semiconductor package is provided having first and second core layers defining a cavity having an adhesive member and sized and shaped to receive a semiconductor chip. The semiconductor package further having a connection member formed on a bond finger and connected to a via pattern formed through the first and second core layers. A stack package is also provided having multiple substrates.

摘要翻译： 提供了一种用于半导体封装的衬底，其具有限定具有粘合构件的空腔的第一和第二芯层，并且其尺寸和形状用于容纳半导体芯片。 所述半导体封装还具有连接构件，所述连接构件形成在接合指状物上并且连接到通过所述第一和第二芯层形成的通孔图案。 还提供具有多个基板的堆叠封装。

公开(公告)号：US08334590B1

公开(公告)日：2012-12-18

申请号：US12204692

申请日：2008-09-04

申请人： Yoon Ha Jung ,  Kyu Won Lee ,  Chan Yok Park

发明人： Yoon Ha Jung ,  Kyu Won Lee ,  Chan Yok Park

IPC分类号： H01L23/04

CPC分类号： H01L21/568 ,  H01L23/3135 ,  H01L2924/0002 ,  H05K1/186 ,  H05K3/4652 ,  H01L2924/00

摘要： A semiconductor device for use in a printed circuit board is provided. In the semiconductor device, metal pillars are disposed perpendicular to bond pads of a semiconductor die. This configuration eliminates the need to form via holes for the connection of interconnection layers and the bond pads of the semiconductor die, thus simplifying the fabrication procedure of the semiconductor device. In addition, the semiconductor die is embedded in the semiconductor device. Based on this configuration, the use of the semiconductor device in a printed circuit board facilitates the stacking of a plurality of semiconductor dies and can reduce the thickness required for the stack, which make the semiconductor device light in weight and small in thickness and size.

摘要翻译： 提供了一种用于印刷电路板的半导体器件。 在半导体器件中，金属柱垂直于半导体管芯的焊盘设置。 这种配置消除了形成用于连接互连层和半导体管芯的接合焊盘的通孔的需要，从而简化了半导体器件的制造过程。 此外，半导体管芯被嵌入在半导体器件中。 基于这种配置，在印刷电路板中使用半导体器件有助于多个半导体管芯的堆叠，并且可以减小堆叠所需的厚度，这使得半导体器件重量轻，厚度和尺寸小。