公开(公告)号：US20080241992A1

公开(公告)日：2008-10-02

申请号：US12109367

申请日：2008-04-25

申请人： Mou-Shiung Lin ,  Shih-Hsiung Lin

发明人： Mou-Shiung Lin ,  Shih-Hsiung Lin

IPC分类号： H01L21/60 ,  H01L21/44

CPC分类号： H01L24/12 ,  H01L24/11 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/05599 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11822 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13118 ,  H01L2224/1312 ,  H01L2224/13123 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/1357 ,  H01L2224/13609 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81011 ,  H01L2224/92247 ,  H01L2225/06513 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/09701 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2224/05552 ,  H01L2224/45099

摘要： A method of assembling chips. A first chip and a second chip are provided. At least one conductive pillar is formed on the first chip, and a conductive connecting material is formed on the conductive pillar. The second chip also comprises at least one conductive pillar. The first chip is connected to the second chip via the conductive pillars and the conductive connecting material.

摘要翻译： 一种组装芯片的方法。 提供第一芯片和第二芯片。 在第一芯片上形成至少一个导电柱，并且在导电柱上形成导电连接材料。 第二芯片还包括至少一个导电柱。 第一芯片经由导电柱和导电连接材料连接到第二芯片。

公开(公告)号：US20080211105A1

公开(公告)日：2008-09-04

申请号：US12121778

申请日：2008-05-15

申请人： Shih-Hsiung Lin ,  Mou-Shiung Lin

发明人： Shih-Hsiung Lin ,  Mou-Shiung Lin

IPC分类号： H01L23/52

CPC分类号： H01L24/12 ,  H01L24/11 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/05599 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11822 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13118 ,  H01L2224/1312 ,  H01L2224/13123 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/1357 ,  H01L2224/13609 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81011 ,  H01L2224/92247 ,  H01L2225/06513 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/09701 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2224/05552 ,  H01L2224/45099

摘要： A method of assembling chips. A first chip and a second chip are provided. At least one conductive pillar is formed on the first chip, and a conductive connecting material is formed on the conductive pillar. The second chip also comprises at least one conductive pillar. The first chip is connected to the second chip via the conductive pillars and the conductive connecting material.

公开(公告)号：US08440272B2

公开(公告)日：2013-05-14

申请号：US11949785

申请日：2007-12-04

申请人： Mou-Shiung Lin ,  Shih-Hsiung Lin

发明人： Mou-Shiung Lin ,  Shih-Hsiung Lin

IPC分类号： H01L21/66

CPC分类号： H01L22/22 ,  H01L24/05 ,  H01L2224/02166 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/00

摘要： A method for fabricating and testing a wafer includes forming metal traces with metal pads, wherein forming the metal traces include forming a TiW layer on a passivation layer and on pads, next forming a seed layer on the TiW layer, next forming a photoresist layer on the seed layer, next forming a metal layer on the seed layer exposed by openings in the photoresist layer, next removing the photoresist layer, next removing the seed layer not under the metal layer, and then etching the TiW layer not under the metal layer with an etchant containing H2O2 at a temperature of between 35 and 50° C., or with an etchant containing H2O2 and with ultrasonic waves applied to the etchant, next contacting probe tips of a probe card with some of the metal pads, next cleaning the probe tips until repeating the step of contacting the probe tips with some of the metal pads at greater than 100 times, and then after cleaning the probe tips, repeating the step of contacting the probe tips with some of the metal pads.

摘要翻译： 用于制造和测试晶片的方法包括用金属焊盘形成金属迹线，其中形成金属迹线包括在钝化层上和在焊盘上形成TiW层，接着在TiW层上形成晶种层，接着在 种子层，接着在种子层上形成通过光致抗蚀剂层中的开口暴露的金属层，接下来去除光致抗蚀剂层，接下来除去不在金属层下方的种子层，然后在不在金属层下面的TiW层上蚀刻， 在35-50℃的温度下含有H 2 O 2的蚀刻剂，或含有H 2 O 2的蚀刻剂和施加到蚀刻剂上的超声波，接下来将探针卡的探针末端与一些金属垫接触，接下来清洁探针 直到重复以大于100次的方式将探针尖端与一些金属焊盘接触的步骤，然后在清洁探针尖端之后，重复将探针尖端与其中的一些接触的步骤 e金属垫。

公开(公告)号：US08421222B2

公开(公告)日：2013-04-16

申请号：US13207350

申请日：2011-08-10

申请人： Mou-Shiung Lin ,  Shih-Hsiung Lin, I

发明人： Mou-Shiung Lin ,  Shih-Hsiung Lin, I

IPC分类号： H01L23/34 ,  H01L21/00

CPC分类号： H01L24/12 ,  H01L24/11 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/05599 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11822 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13118 ,  H01L2224/1312 ,  H01L2224/13123 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/1357 ,  H01L2224/13609 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81011 ,  H01L2224/92247 ,  H01L2225/06513 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/09701 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2224/05552 ,  H01L2224/45099

摘要： A method of assembling chips. A first chip and a second chip are provided. At least one conductive pillar is formed on the first chip, and a conductive connecting material is formed on the conductive pillar. The second chip also comprises at least one conductive pillar. The first chip is connected to the second chip via the conductive pillars and the conductive connecting material.

摘要翻译： 一种组装芯片的方法。 提供第一芯片和第二芯片。 在第一芯片上形成至少一个导电柱，并且在导电柱上形成导电连接材料。 第二芯片还包括至少一个导电柱。 第一芯片经由导电柱和导电连接材料连接到第二芯片。

公开(公告)号：US08232192B2

公开(公告)日：2012-07-31

申请号：US11124493

申请日：2005-05-05

申请人： Mou-Shiung Lin ,  Shih Hsiung Lin ,  Hsin-Jung Lo

发明人： Mou-Shiung Lin ,  Shih Hsiung Lin ,  Hsin-Jung Lo

IPC分类号： H01L21/44

CPC分类号： H01L21/563 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05572 ,  H01L2224/05655 ,  H01L2224/13022 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/29011 ,  H01L2224/29012 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83907 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2924/00012

摘要： A bonding process includes the following process. A bump is formed on a first electric device. A patterned insulation layer is formed on a second electric device, wherein the patterned insulation layer has a thickness between 5 μm and 400 μm, and an opening is in the patterned insulation layer and exposes the second electric device. The bump is joined to the second electric device exposed by the opening in the patterned insulation layer.

摘要翻译： 粘合过程包括以下过程。 在第一电气设备上形成凸块。 图案化绝缘层形成在第二电气设备上，其中图案化绝缘层具有5μm至400μm的厚度，并且在图案化绝缘层中开口并暴露第二电气设备。 凸块与由图案化的绝缘层中的开口暴露的第二电气装置接合。

公开(公告)号：US20110291275A1

公开(公告)日：2011-12-01

申请号：US13207350

申请日：2011-08-10

申请人： Shih-Hsiung Lin ,  Mou-Shiung Lin

发明人： Shih-Hsiung Lin ,  Mou-Shiung Lin

IPC分类号： H01L23/485

CPC分类号： H01L24/12 ,  H01L24/11 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/05599 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11822 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13118 ,  H01L2224/1312 ,  H01L2224/13123 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/1357 ,  H01L2224/13609 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81011 ,  H01L2224/92247 ,  H01L2225/06513 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/09701 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2224/05552 ,  H01L2224/45099

摘要： A method of assembling chips. A first chip and a second chip are provided. At least one conductive pillar is formed on the first chip, and a conductive connecting material is formed on the conductive pillar. The second chip also comprises at least one conductive pillar. The first chip is connected to the second chip via the conductive pillars and the conductive connecting material.

摘要翻译： 一种组装芯片的方法。 提供第一芯片和第二芯片。 在第一芯片上形成至少一个导电柱，并且在导电柱上形成导电连接材料。 第二芯片还包括至少一个导电柱。 第一芯片经由导电柱和导电连接材料连接到第二芯片。

公开(公告)号：US20080131983A1

公开(公告)日：2008-06-05

申请号：US11949785

申请日：2007-12-04

申请人： Mou-Shiung Lin ,  Shih-Hsiung Lin

发明人： Mou-Shiung Lin ,  Shih-Hsiung Lin

IPC分类号： H01L21/66

CPC分类号： H01L22/22 ,  H01L24/05 ,  H01L2224/02166 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/00

摘要： A method for fabricating and testing a wafer includes forming metal traces with metal pads, wherein forming the metal traces include forming a TiW layer on a passivation layer and on pads, next forming a seed layer on the TiW layer, next forming a photoresist layer on the seed layer, next forming a metal layer on the seed layer exposed by openings in the photoresist layer, next removing the photoresist layer, next removing the seed layer not under the metal layer, and then etching the TiW layer not under the metal layer with an etchant containing H2O2 at a temperature of between 35 and 50° C., or with an etchant containing H2O2 and with ultrasonic waves applied to the etchant, next contacting probe tips of a probe card with some of the metal pads, next cleaning the probe tips until repeating the step of contacting the probe tips with some of the metal pads at greater than 100 times, and then after cleaning the probe tips, repeating the step of contacting the probe tips with some of the metal pads.

摘要翻译： 用于制造和测试晶片的方法包括用金属焊盘形成金属迹线，其中形成金属迹线包括在钝化层上和在焊盘上形成TiW层，接着在TiW层上形成晶种层，接着在 种子层，接着在种子层上形成通过光致抗蚀剂层中的开口暴露的金属层，接下来去除光致抗蚀剂层，接下来除去不在金属层下方的种子层，然后在不在金属层下面的TiW层上蚀刻， 在35至50℃的温度下含有H 2 O 2 O 2的蚀刻剂，或与含有H 2 O 2的蚀刻剂 _{2，并且将超声波施加到蚀刻剂，接下来将探针卡的探针尖端与一些金属垫接触，接下来清洁探针尖端，直到重复使探针尖端与一些金属垫接触的步骤 大于100次，然后清洁探针尖端后，重复该步骤 使探头尖端与一些金属垫接触。}

公开(公告)号：US07382005B2

公开(公告)日：2008-06-03

申请号：US11123328

申请日：2005-05-06

申请人： Shih-Hsiung Lin ,  Mou-Shiung Lin

发明人： Shih-Hsiung Lin ,  Mou-Shiung Lin

IPC分类号： H01L29/94 ,  H01L21/336 ,  H05K7/00

CPC分类号： H01L24/12 ,  H01L24/11 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/05599 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/11822 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13118 ,  H01L2224/1312 ,  H01L2224/13123 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/1357 ,  H01L2224/13609 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81011 ,  H01L2224/92247 ,  H01L2225/06513 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/09701 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2224/05552 ,  H01L2224/45099

摘要： A method of assembling chips. A first chip and a second chip are provided. At least one conductive pillar is formed on the first chip, and a conductive connecting material is formed on the conductive pillar. The second chip also comprises at least one conductive pillar. The first chip is connected to the second chip via the conductive pillars and the conductive connecting material.

摘要翻译： 一种组装芯片的方法。 提供第一芯片和第二芯片。 在第一芯片上形成至少一个导电柱，并且在导电柱上形成导电连接材料。 第二芯片还包括至少一个导电柱。 第一芯片经由导电柱和导电连接材料连接到第二芯片。

公开(公告)号：US20060273435A1

公开(公告)日：2006-12-07

申请号：US11422337

申请日：2006-06-06

申请人： Mou-Shiung Lin ,  Shih-Hsiung Lin ,  Hsin-Jung Lo

发明人： Mou-Shiung Lin ,  Shih-Hsiung Lin ,  Hsin-Jung Lo

IPC分类号： H01L23/02 ,  H01L23/48 ,  H01L23/04 ,  H01L23/12

CPC分类号： H01L31/0203 ,  H01L27/14618 ,  H01L27/14683 ,  H01L27/14687 ,  H01L31/18 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A chip package includes a bump connecting said semiconductor chip and said circuitry component, wherein the semiconductor chip has a photosensitive area used to sense light. The chip package may include a ring-shaped protrusion connecting a transparent substrate and the semiconductor chip.

公开(公告)号：US20060220259A1

公开(公告)日：2006-10-05

申请号：US11307127

申请日：2006-01-24

申请人： Ke-Hung Chen ,  Shih-Hsiung Lin ,  Mou-Shiung Lin

发明人： Ke-Hung Chen ,  Shih-Hsiung Lin ,  Mou-Shiung Lin

IPC分类号： H01L23/48

CPC分类号： H01L25/0657 ,  H01L21/563 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/49575 ,  H01L24/16 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05024 ,  H01L2224/05026 ,  H01L2224/05027 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05184 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/05611 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05684 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/26145 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81193 ,  H01L2224/83051 ,  H01L2224/83365 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06582 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/09701 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01007 ,  H01L2924/01083 ,  H01L2924/00012 ,  H01L2224/29099

摘要： A method of assembling chips. A first chip and a second chip are provided. At least one conductive pillar is formed on the first chip, and a conductive connecting material is formed on the conductive pillar. The second chip also comprises at least one conductive pillar. The first chip is connected to the second chip via the conductive pillars and the conductive connecting material.

摘要翻译： 一种组装芯片的方法。 提供第一芯片和第二芯片。 在第一芯片上形成至少一个导电柱，并且在导电柱上形成导电连接材料。 第二芯片还包括至少一个导电柱。 第一芯片经由导电柱和导电连接材料连接到第二芯片。