摘要:
There are provided sensitizers for electrophotographic light-sensitive materials including organic photoconductors and electrophotographic light-sensitive materials containing same. The sensitizers are reaction products comprising benzopyrylium salt and benzopyran.
摘要:
An electrode pad for use on a living organism can measure an electrocardiographic signal without being hindered by body-motion noise. The electrode pad is attached to the skin of the living organism, detects an electrical signal, and supplies the electrical signal to an electrocardiograph. The electrode pad for use on a living organism is characterized by the provision of a mesh-like electrode that extends along the skin, a conductive gel sheet that is layered on top of the electrode and extends along the surface of the skin, and a soft protective sheet that covers the layered electrode and conductive gel sheet.
摘要:
The invention provides an electronic apparatus having a metal core substrate including a metal plate, an insulating layer formed on the metal plate and a conductive layer formed on the insulating layer, and an electronic part, and to which the conductive layer and a terminal of the electronic part are connected. In the electronic apparatus, a member having a high thermal conductivity is arranged so as to be in contact with both of the metal plate and the electronic part. Accordingly, a heat radiating property of the electronic apparatus is increased.
摘要:
An electronic device comprises a circuit board which has a through hole and uses a resin with a glass transition temperature exceeding 150° C. as a base member, a metal casing which has an opening, and a connector which is fitted to the opening of the metal casing in which a pin of the connector is inserted into the through hole, the pin and the through hole are connected with a conductive member, and a reinforcement member for securing the connector and the board is further provided on the conductive member, thereby improving the reliability of the electronic device.
摘要:
A solder bonding metal layer which is formed on a circuit board comprises a metal layer having a mixture of first metal which is easily wetted with metals constituting the solder and which easily forms alloy or intermetallic compounds and of second metal which is not wetted easily with the above solder and not melted. In this case, a concentration gradient that the concentration of the first metal is high on the bonding surface may be formed in the metal layer. A circuit board having a solder bonding metal layer which keeps good bonding even after many times of repairs and improves the reliability is realized.
摘要:
An electric detonator of the delay type including a housing having a metal portion and an insulating portion, a pair of leg wires extending outside through the housing, a delay circuit connected across the leg wires and generating an ignition current at a predetermined timing, and an igniting resistor connected to an output terminal of the delay circuit and one of the leg wires. In order to check the resistance value of the igniting resistor even after the detonator has been assembled, a by-pass resistor is connected between the other of the leg wires and a junction point between the delay circuit and the igniting resistor. A small measuring current is conducted through the igniting resistor via the by-pass resistor to generate a voltage drop across the igniting resistor. This voltage drop is measured by connecting a voltage measuring device between the leg wire and the metal portion of the housing.
摘要:
An electrode pad for use on a living organism can measure an electrocardiographic signal without being hindered by body-motion noise. The electrode pad is attached to the skin of the living organism, detects an electrical signal, and supplies the electrical signal to an electrocardiograph. The electrode pad for use on a living organism is characterized by the provision of a mesh-like electrode that extends along the skin, a conductive gel sheet that is layered on top of the electrode and extends along the surface of the skin, and a soft protective sheet that covers the layered electrode and conductive gel sheet.
摘要:
The present invention provides an electric power steering apparatus, in which reduction and thickness thereof can be achieved, radiation performance thereof can concurrently be ensured, and manufacturing and running costs thereof can also be reduced, even when the apparatus includes a structure having a motor and a motor control device integrated therewith. The apparatus includes a motor which assists in steering operations, a motor control device which controls the motor, and a housing which accommodates the motor and the motor control device. The housing includes a motor accommodation portion which accommodates the motor, and a control device accommodation portion which accommodates the motor control device. The motor control device includes a drive unit which drives the motor, and a control unit which controls the motor. The drive unit is disposed in a position in the control device accommodation portion, the position being in proximity to the motor accommodation portion.
摘要:
In an electronic device having an interposer substrate as an MCM structure, heat dissipation properties are enhanced while the reliability of joint between the interposer substrate and a motherboard is maintained. In the invention, a metal core base material of great heat capacity and high thermal conductivity is used for both the interposer substrate and the motherboard. Furthermore, a part where a core metal is exposed is provided on at least one of the interposer substrate and the motherboard. A solder joint pad is directly formed on the core metal exposed part, and the interposer substrate is solder-joined to the motherboard.
摘要:
Since an electronic device of the present invention has a pair of joint pieces thereof formed (extended) on both sides with respect to one end of the body thereof, the pair of joint pieces both connected to one of the substrates improves the joining strength between the lead frame connector and the one of substrates and ensures the reliability of electrical connection between the lead frame connector and the one of the substrates.